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lmp91000 PDF
lmp91000 PDF
LMP91000
SNAS506I JANUARY 2011 REVISED DECEMBER 2014
LMP91000 Sensor AFE System: Configurable AFE Potentiostat for Low-Power Chemical-
Sensing Applications
1 Features 3 Description
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LMP91000 WSON (14) 4.00 mm 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
SCL
LMP91000
CE
RE
RE
TEMP DGND
SENSOR
WE
WE + VOUT
TIA
-
RLoad
RTIA
C1 C2 AGND
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMP91000
SNAS506I JANUARY 2011 REVISED DECEMBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 13
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 19
3 Description ............................................................. 1 7.5 Programming .......................................................... 20
7.6 Registers Maps ...................................................... 21
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3 8 Application and Implementation ........................ 24
8.1 Application Information............................................ 24
6 Specifications......................................................... 4
8.2 Typical Application ................................................. 26
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4 9 Power Supply Recommendations...................... 28
9.1 Power Consumption................................................ 28
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4 10 Layout................................................................... 29
6.5 Electrical Characteristics .......................................... 5 10.1 Layout Guidelines ................................................. 29
6.6 I2C Interface .............................................................. 7 10.2 Layout Example .................................................... 29
6.7 Timing Requirements ............................................... 8 11 Device and Documentation Support ................. 30
6.8 Typical Characteristics .............................................. 9 11.1 Trademarks ........................................................... 30
7 Detailed Description ............................................ 13 11.2 Electrostatic Discharge Caution ............................ 30
7.1 Overview ................................................................. 13 11.3 Glossary ................................................................ 30
7.2 Functional Block Diagram ....................................... 13 12 Mechanical, Packaging, and Orderable
Information ........................................................... 30
4 Revision History
Changes from Revision H (March 2013) to Revision I Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 3
14-Pin WSON
Top View
DGND 1 14 CE
MENB RE
SCL WE
NC C1
VDD C2
AGND 7 8 VOUT
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
DGND 1 G Connect to ground
MENB 2 I Module Enable, Active-Low
SCL 3 I Clock signal for I2C compatible interface
SDA 4 I/O Data for I2C compatible interface
NC 5 N/A Not Internally Connected
VDD 6 P Supply Voltage
AGND 7 G Ground
VOUT 8 O Analog Output
C2 9 N/A External filter connector (Filter between C1 and C2)
C1 10 N/A External filter connector (Filter between C1 and C2)
VREF 11 I Voltage Reference input
WE 12 I Working Electrode. Output to drive the Working Electrode of the chemical sensor
RE 13 I Reference Electrode. Input to drive Counter Electrode of the chemical sensor
CE 14 I Counter Electrode. Output to drive Counter Electrode of the chemical sensor
DAP N/C Connect to AGND
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature (unless otherwise noted)
MIN MAX UNIT
Voltage between any two pins 6.0 V
Current through VDD or VSS 50 mA
Current sunk and sourced by CE pin 10 mA
Current out of other pins (2) 5 mA
(3)
Junction Temperature 150 C
Storage temperature 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All non-power pins of this device are protected against ESD by snapback devices. Voltage at such pins will rise beyond absmax if
current is forced into pin.
(3) The maximum power dissipation is a function of TJ(MAX), RJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ JA All numbers apply for packages soldered directly onto a PCB.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) The maximum power dissipation is a function of TJ(MAX), RJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ JA All numbers apply for packages soldered directly onto a PCB.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA.
(2) Limits are 100% production tested at 25C. Limits over the operating temperature range are specified through correlations using
statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(4) At such currents no accuracy of the output voltage can be expected.
Copyright 20112014, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LMP91000
LMP91000
SNAS506I JANUARY 2011 REVISED DECEMBER 2014 www.ti.com
0% VREF
Internal Zero=20% VREF
0% VREF
550 550
Internal Zero=50% VREF
0% VREF
Internal Zero=67% VREF
1% VREF 575 575
2% VREF 610 610
4% VREF 750 750
BIAS polarity 6% VREF 840 840
(7)
VOS_RW WE Voltage Offset referred to RE V
40 to 80C 8% VREF 930 930
10% VREF 1090 1090
12% VREF 1235 1235
14% VREF 1430 1430
16% VREF 1510 1510
18% VREF 1575 1575
20% VREF 1650 1650
22% VREF 1700 1700
24% VREF 1750 1750
0% VREF
Internal Zero=20% VREF
0% VREF
4 4
Internal Zero=50% VREF
0% VREF
Internal Zero=67% VREF
1% VREF 4 4
2% VREF 4 4
4% VREF 5 5
WE Voltage Offset Drift referred 6% VREF 5 5
BIAS polarity
TcVOS_RW to RE from 40C to 85C (7) V/C
(8) 8% VREF 5 5
10% VREF 6 6
12% VREF 6 6
14% VREF 7 7
16% VREF 7 7
18% VREF 8 8
20% VREF 8 8
22% VREF 8 8
24% VREF 8 8
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA.
(2) Limits are 100% production tested at 25C. Limits over the operating temperature range are specified through correlations using
statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(4) This parameter is specified by design or characterization.
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA.
(2) LMP91000 provides an internal 300-ns minimum hold time to bridge the undefined region of the falling edge of SCL.
(3) This parameter is specified by design or characterization.
70%
MENB
30%
tEN;START tEN;HIGH
tEN;STOP
70%
SDA
30%
tBUF
tf tLOW tVD;DAT tHD;STA
tSP
70%
SCL
30%
tHD;STA tSU;STA tSU;STO
tHIGH
tHD;DAT tSU;DAT tVD;ACK
-100 -100
VDD = 2.7V 85C
-120 VDD = 3.3V -120 25C
VDD = 5V -40C
-140 -140
-160 -160
VOS (V)
VOS (V)
-180 -180
-200 -200
-220 -220
-240 -240
-260 -260
-280 -280
-300 -300
-50 -25 0 25 50 75 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TEMPERATURE (C) SUPPLY VOLTAGE (V)
Figure 2. Input VOS_RW vs. Temperature (Vbias 0 mV) Figure 3. Input VOS_RW vs. VDD (Vbias 0 mV)
IWE
IWE
IWE(50A/DIV)
IWE(50A/DIV)
2.75k
3.5k
7k
2.75k
14k
3.5k
35k
7k
120k
14k
350k
35k
120k
350k
Figure 4. IWE Step Current Response (Rise) Figure 5. IWE Step Current Response (Fall)
140 1320
130
1318
120
VOUT (mV)
PSRR (dB)
1316
110
1314
100
1312
90
80 1310
10 100 1k 10k 100k 2.5 3.0 3.5 4.0 4.5 5.0 5.5
FREQUENCY (Hz) SUPPLY VOLTAGE (V)
Figure 6. AC PSRR vs. Frequency Figure 7. Temperature Sensor Output vs. VDD
(Temperature = 30C)
Figure 8. Supply Current vs. Temperature Figure 9. Supply Current vs. VDD
(Deep Sleep Mode) (Deep Sleep Mode)
7.50 7.50
VDD = 2.7V 85C
VDD = 3.3V 25C
7.25 VDD = 5V 7.25 -40C
SUPPLY CURRENT (A)
6.75 6.75
6.50 6.50
6.25 6.25
6.00 6.00
5.75 5.75
5.50 5.50
-50 -25 0 25 50 75 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TEMPERATURE (C) SUPPLY VOLTAGE (V)
Figure 10. Supply Current vs. Temperature Figure 11. Supply Current vs. VDD
(Standby Mode) (Standby Mode)
11.0 11.0
VDD = 2.7V 85C
10.8 VDD = 3.3V 10.8 25C
VDD = 5V -40C
SUPPLY CURRENT (A)
10.6
SUPPLY CURRENT (A)
10.6
10.4 10.4
10.2 10.2
10.0 10.0
9.8 9.8
9.6 9.6
9.4 9.4
9.2 9.2
9.0 9.0
-50 -25 0 25 50 75 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TEMPERATURE (C) SUPPLY VOLTAGE (V)
Figure 12. Supply Current vs. Temperature Figure 13. Supply Current vs. VDD
(3-Lead Amperometric Mode) (3-Lead Amperometric Mode)
14.5 14.8
14.6
14.0
14.4
13.5 14.2
13.0 14.0
-50 -25 0 25 50 75 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TEMPERATURE (C) SUPPLY VOLTAGE (V)
Figure 14. Supply Current vs. Temperature Figure 15. Supply Current vs. VDD
(Temp Measurement TIA On) (Temp Measurement TIA On)
13.0 13.0
VDD = 2.7V 85C
VDD = 3.3V 25C
12.5 VDD = 5V -40C
12.5
SUPPLY CURRENT (A)
11.0 11.5
10.5
11.0
10.0
10.5
9.5
9.0 10.0
-50 -25 0 25 50 75 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TEMPERATURE (C) SUPPLY VOLTAGE (V)
Figure 16. Supply Current vs. Temperature Figure 17. Supply Current vs. VDD
(Temp Measurement TIA Off) (Temp Measurement TIA Off)
7.50 9.0
VDD = 2.7V 85C
7.25 VDD = 3.3V 25C
VDD = 5V 8.5 -40C
SUPPLY CURRENT (A)
7.00
SUPPLY CURRENT (A)
8.0
6.75
6.50 7.5
6.25 7.0
6.00 6.5
5.75
6.0
5.50
5.25 5.5
5.00 5.0
-50 -25 0 25 50 75 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TEMPERATURE (C) SUPPLY VOLTAGE (V)
Figure 18. Supply Current vs. Temperature Figure 19. Supply Current vs. VDD
(2-Lead Ground-Referred Amperometric Mode) (2-Lead Ground-Referred Amperometric Mode)
EN_RW (V)
0.5
0.0 0.0
-0.5
-0.5
-1.0
-1.5
-1.0
-2.0
-1.5 -2.5
0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10
TIME (s) TIME (s)
Figure 20. 0.1-Hz to 10-Hz Noise, 0-V Bias Figure 21. 0.1-Hz to 10-Hz Noise, 300-mV Bias
2.5 2.0
LMP91000
2.0 1.9
1.5 1.8
1.0 1.7
EN_RW (V)
Figure 22. 0.1-Hz to 10-Hz Noise, 600-mV Bias Figure 23. A VOUT Step Response 100-PPM to 400-PPM CO
(CO Gas Sensor Connected to LMP91000)
7 Detailed Description
7.1 Overview
The LMP91000 is a programmable AFE for use in micropower chemical sensing applications. The LMP91000 is
designed for 3-lead single gas sensors and for 2-lead galvanic cell sensors. This device provides all of the
functionality for detecting changes in gas concentration based on a delta current at the working electrode. The
LMP91000 generates an output voltage proportional to the cell current. Transimpedance gain is user
programmable through an I2C compatible interface from 2.75 k to 350 k making it easy to convert current
ranges from 5 A to 750 A full scale. Optimized for micro-power applications, the LMP91000 AFE works over a
voltage range of 2.7 V to 5.25 V. The cell voltage is user selectable using the on board programmability. In
addition, it is possible to connect an external transimpedance gain resistor. A temperature sensor is embedded
and it can be power cycled through the interface. The output of this temperature sensor can be read by the user
through the VOUT pin. It is also possible to have both temperature output and output of the TIA at the same
time; the pin C2 is internally connected to the output of the transimpedance (TIA), while the temperature is
available at the VOUT pin. Depending on the configuration, total current consumption for the device can be less
than 10 A. For power savings, the transimpedance amplifier can be turned off and instead a load impedance
equivalent to the TIAs inputs impedance is switched in.
VREF VDD
LMP91000 SCL
CE
RE
RE
TEMP DGND
SENSOR
WE
WE + VOUT
TIA
-
RLoad
RTIA
C1 C2 AGND
Although the temperature sensor is very linear, its response does have a slight downward parabolic shape. This
shape is very accurately reflected in Table 1. For a linear approximation, a line can easily be calculated over the
desired temperature range from Table 1 using the two-point equation:
V-V1=((V2V1)/(T2T1))*(T-T1)
where
V is in mV, T is in C, T1 and V1 are the coordinates of the lowest temperature
T2 and V2 are the coordinates of the highest temperature. (1)
For example, to determine the equation of a line over a temperature range of 20C to 50C, proceed as follows:
V-1399mV=((1154 mV - 1399 mV)/(50C -20C))*(T-20C) (2)
V-1399mV= -8.16 mV/C*(T-20C) (3)
V=(-8.16 mV/C)*T+1562.2 mV (4)
Using this method of linear approximation, the transfer function can be approximated for one or more
temperature ranges of interest.
VREF VDD
LMP91000 SCL
CE
RE
RE
TEMP DGND
SENSOR
WE
WE + VOUT
TIA
-
RLoad
RTIA
C1 C2 AGND
VE-
2-wire
NC Sensor
such as
Oxygen
VE+
VREF VDD
SCL
LMP91000
I2C INTERFACE
AND
SDA
CONTROL
REGISTERS
VARIABLE VREF
+
BIAS DIVIDER
CE A1 MENB
-
RE
DGND
TEMP
SENSOR
WE + VOUT
TIA
-
RLoad
RTIA
C1 C2 AGND
LMP91000 SCL
I2C INTERFACE
AND
2-wire Sensor SDA
CONTROL
such as Oxygen REGISTERS
CE VARIABLE VREF
+
A1 BIAS DIVIDER MENB
-
VE-
RE
NC
TEMP DGND
SENSOR
VE+
WE + VOUT
TIA
-
RLoad
RTIA
C1 C2 AGND
7.5 Programming
7.5.1 I2C Interface
The I2C compatible interface operates in Standard mode (100kHz). Pull-up resistors or current sources are
required on the SCL and SDA pins to pull them high when they are not being driven low. A logic zero is
transmitted by driving the output low. A logic high is transmitted by releasing the output and allowing it to be
pulled-up externally. The appropriate pull-up resistor values will depend upon the total bus capacitance and
operating speed. The LMP91000 comes with a 7 bit bus fixed address: 1001 000.
MENB
1 9 1 9
SCL
SDA
A6 A5 A4 A3 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0
Start by Ack Ack
Master by by
Frame 1 LMP91000 Frame 2 LMP91000
Serial Bus Address Byte Internal Address Register
from Master Byte from Master
MENB
(continued)
1 9
SCL
(continued)
SDA
D7 D6 D5 D4 D3 D2 D1 D0
(continued)
Ack Stop by
by Master
LMP91000
Frame 3
Data Byte
Programming (continued)
MENB
1 9 1 9
SCL
SDA A6 A5 A4 A3 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0
Start by Ack Ack Stop by
Master by by Master
Frame 1 LMP91000 Frame 2 LMP91000
Serial Bus Address Byte Internal Address Register
from Master Byte from Master
MENB
1 9 1 9
SCL
SDA A6 A5 A4 A3 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0
Start by Ack No Ack Stop
Master by by by
Frame 1 LMP91000 Frame 2 Master Master
Serial Bus Address Byte Data Byte from
from Master Slave
When the LMP91000 is in Temperature measurement (TIA ON) mode, the output of the temperature sensor is
present at the VOUT pin, while the output of the potentiostat circuit is available at pin C2.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
MENB
MENB
MENB
SDA
SDA
SDA
SCL
SCL
SCL
SDA
SCL
MENB
SDA
SDA
SCL
SCL
A0
MENB SCL SDA
MENB
MENB
SDA
SDA
SDA
SDA
SDA
SDA
SCL
SCL
SCL
SCL
SCL
SCL
A0
A0
A0
SMART SENSOR AFE SMART SENSOR AFE SMART SENSOR AFE
GND
GND
GAS
GND GND DONE GPIO GND MENB
SENSOR
GPIO GPIO
GPIO GPIO
DISPLAY
KEYBOARD
LMP91000 OUTPUT
TEST PULSE
OUTPUTT VOLTTAGE (1V/DIV)
10 Layout
11.3 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 3-Sep-2014
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LMP91000SD/NOPB ACTIVE WSON NHL 14 1000 Green (RoHS CU SN Level-3-260C-168 HR -40 to 85 L91000
& no Sb/Br)
LMP91000SDE/NOPB ACTIVE WSON NHL 14 250 Green (RoHS CU SN Level-3-260C-168 HR -40 to 85 L91000
& no Sb/Br)
LMP91000SDX/NOPB ACTIVE WSON NHL 14 4500 Green (RoHS CU SN Level-3-260C-168 HR -40 to 85 L91000
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 3-Sep-2014
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 2
MECHANICAL DATA
NHL0014B
SDA14B (Rev A)
www.ti.com
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