IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 61, NO.

4, APRIL 2013 1557

Bonding Wire Loop Antenna in Standard Ball

Grid Array Package for 60-GHz Short-Range
Wireless Communication
Yukako Tsutsumi, Takayoshi Ito, Koh Hashimoto, Member, IEEE, Shuichi Obayashi, Member, IEEE,
Hiroki Shoki, Senior Member, IEEE, and Hideo Kasami

AbstractHigh-speed short-range wireless communication sys-

tems are expected to utilize the 60-GHz band. This paper presents
a bonding wire loop antenna in a standard ball grid array (BGA)
package for 60-GHz short-range wireless communication. The
proposed antenna has a loop shape and consists of two bonding
wires connecting to a complementary metaloxidesemiconductor
(CMOS) chip and a metal plate on an interposer in a BGA package.
The antenna can be fabricated at low cost by a conventional BGA
package fabrication process. The BGA package is mounted on a
printed circuit board (PCB) that consists of resin substrate, such
Fig. 1. Usage model of data transfer application.
as FR-4. The broadband impedance characteristic is achieved
by adjusting the position of the metal pad for wire bonding. The
antenna gain is improved by forming cranked ledges and notches
in the metal patterns of the PCB, and the wide-angle radiation large propagation loss in the 60-GHz band for long-distance
characteristic is realized. The sizes of the fabricated antenna and
BGA package are approximately 0.6 mm 1.0 mm 0.3 mm and
communication [3][6]. Meanwhile, small antennas with rel-
9.0 mm 9.0 mm 0.9 mm, respectively. Performing measure- atively low gain are suitable for short-range communication.
ments, the antenna gain with the PCB is from 2.4 to 4.9 dBi over As small antenna solutions, antenna-on-chip and antenna-in-
the 57- to 65-GHz frequency range and over an angular range of package have attracted attention [7]. It is possible to integrate an
60 in the horizontal plane. antenna into an IC package, since the wavelength is only several
Index TermsAntenna-in-package, BGA package, bonding millimeters in the 60-GHz band.
wire, millimeter-wave, short-range wireless communication, Antenna-on-chip solutions generally have low radiation effi-
60 GHz, transceivers, TX/RX switch. ciency, however, because a semiconductor substrate induces a
major dielectric loss [8], [9]. In order to improve the radiation
efficiency, there are several approaches that use a high-resis-
I. INTRODUCTION
tance substrate [10] and an artificial magnetic conductor (AMC)

T HE 60-GHz band is an unlicensed broadband in many

countries worldwide. It is a promising medium for high-
speed wireless communication systems with transmission rates
of over 1 Gb/s, such as those for data transfers, streaming, and
content downloads.
Gallium arsenide integrated circuits (ICs) for mil-
limeter-wave modules had been designed in the past because
of their high performance. However, they are unsuitable for
integration and too costly to become widespread in the con-
sumer products market. Recent advances in complementary
metaloxidesemiconductor (CMOS) process technologies
have opened up an avenue to low-cost millimeter-wave solu-
tions [1], [2].
Antennas are important components in 60-GHz radio systems
in terms of size, cost, and performance. Large, high-gain an-
tennas have usually been used in order to compensate for the
Manuscript received April 25, 2012; revised September 26, 2012; accepted
November 10, 2012. Date of publication December 11, 2012; date of current
version April 03, 2013. This work is partially supported by the Ministry of In-
ternal Affairs and Communications of Japan.
The authors are with Toshiba Corporation, Kanagawa 212-8582, Japan
(e-mail: yukako.tsutsumi@toshiba.co.jp).
Digital Object Identifier 10.1109/TAP.2012.2232262
[11], [12]. However, the former needs additional processes, and
the latter needs extra area on the IC chip. In [13], antenna formed
by bonding wires on an IC chip is presented. Various antenna-in-
package solutions have also been investigated [14][24]. There
are low-cost approaches using embedded wafer level ball grid
array (eWLB) package [14][16] and plastic package [17][20].
This paper presents a bonding wire loop antenna [25] in an
IC package for 60-GHz short-range wireless communication. It
can be added to a standard ball grid array (BGA) package by a
conventional fabrication process. Moreover, the BGA package
is mounted on a printed circuit board (PCB) that consists of gen-
eral resin substrate, such as FR-4. Combination of this PCB
with a CMOS process can provide a low-cost 60-GHz-band
radio solution. A usage model of the data transfer application
is shown in Fig. 1. A wide-angle radiation characteristic in the
horizontal plane is preferable for an easy-to-use interface. The
communication distance is assumed to be several centimeters.
The required antenna gain is higher than 2 dBi over the an-
gular range of 30 to 30 with reference to the -axis in the
horizontal plane as shown in Fig. 2, considering the system de-
sign for this usage. The antenna in the BGA package on the PCB
is fabricated and measured. The broadband impedance charac-
teristic is achieved by adjusting the position of the metal pad for

0018-926X/$31.00 2012 IEEE

1558 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 61, NO. 4, APRIL 2013
Fig. 2. Structure of proposed antenna in BGA package.
wire bonding. The antenna gain is improved by forming cranked
ledges and notches in the metal patterns of the PCB, and the
wide-angle radiation characteristic is realized.
Section II describes the structure of the proposed bonding
wire loop antenna in the BGA package and the method for im-
provement of impedance matching characteristics. Section III
presents simulation and measurement results of the antenna
in the BGA package on the PCB. We conclude the paper in
Section IV.
II. ANTENNA IN STANDARD BGA PACKAGE
A. Antenna Structure
Fig. 2 illustrates the proposed bonding wire loop antenna built
into a standard BGA package. The proposed antenna forms a
three-dimensional triangle. This antenna has a differential feed
point on a CMOS IC chip, which is mounted on an interposer in
a BGA package. The feed point and a metal plate on the inter-
poser are connected with bonding wires. Because of the direct
connection with the power amplifier and low-noise amplifier,
there is no feed loss. The antenna and CMOS IC chip are sealed
by an encapsulation resin, and grid-arrayed solder balls are lo-
cated on the back side of the interposer. The degradation in an-
tenna efficiency is smaller than for an antenna-on-chip because
the radiation element is at a distance from the IC chip, which
consists of a silicon semiconductor with low resistivity.
B. Improvement of Matching Characteristics
The total length of a typical loop antenna is approximately
one wavelength. In that case, the antenna input impedance is low
because the current intensity is strong at the feed point. Conse-
quently, impedance matching to the differential impedance of
100 is difficult. Impedance matching stubs formed on the IC
chip cause degradation of radiation efficiency. To overcome this
problem, the proposed antenna is formed so that its total length
is one-and-a-half wavelengths. Thus, the current intensity at the
feed point is low, and the antenna input impedance is higher.
In order to clarify the relationship between the location of
the metal pad and the resonant frequency, the current distribu-
tion of a rectangular loop antenna with one wavelength length is
first explained before the proposed antenna with one-and-a-half
wavelengths length. Fig. 3 shows a configuration of a rectan-
gular loop antenna with metal pads and the current distribution
of this antenna when its total length is equal to one wavelength.
Fig. 3. Configuration of rectangular loop antenna with total length of one wave-
length and its current distribution.
Fig. 4. (a) Simplified configuration and current distribution of the antenna,
(b) input impedance on Smith chart, and (c) simulation model in the case that
the length (A-B) between the metal pads is approximately one-quarter of total
loop length.
Parasitic capacitance exists between the two metal pads attached
to the loop element, as illustrated in Fig. 3. The electrical length
of the antenna element becomes longer than that of the same
element without the metal pads if the pads are located at the
positions with minimal current intensity. This means that when
the location of a metal pad coincides with that of a current node
which is a point where a current standing wave has minimal
amplitude, the frequency shifts to the lower region. Thus, in the
case of Fig. 3, the first series resonant frequency shifts to the
lower region.
From the view point of manufacturing, the distance between
a metal pad and the IC chip must be of a certain value to
guarantee connection with a bonding wire. Therefore, in the
case where the total length needs to be short, the two metal
pads should be connected by a straight line like the straight
line between A and B shown in Fig. 4(a). If the two metal pads
are connected by the straight line shown in Fig. 4, the length
(O-A) of the bonding wire becomes longer than the length
(A-B) between the metal pads. When the length (A-B) between
the metal pads is approximately one-quarter of the total loop
length, the second-series resonant frequency shifts to the lower
region because the location of the metal pads coincides with
that of the current node [see Fig. 4(a)]. In contrast, the first-se-
ries resonant frequency remains unchanged. As a result, the
frequency range between the first- and second-series resonant
frequency decreases, and the size of the loop formed in the
TSUTSUMI et al.: BONDING WIRE LOOP ANTENNA IN STANDARD BALL GRID ARRAY PACKAGE
Fig. 5. (a) Simplified configuration and current distribution of the antenna,
(b) input impedance on Smith chart, and (c) simulation model in the case that
the length (A-C-D-B) between the metal pads is approximately one-half of total
loop length.
Fig. 6. Simulated input impedances on Smith chart (4080 GHz): (a) Fig. 4
model and (b) Fig. 5 model.
impedance locus decreases to form a kink. This leads to a low
input impedance characteristic. To solve this problem, a novel
configuration is proposed. Fig. 5 shows a simplified configura-
tion of the proposed antenna. The length (A-C-D-B) between
the metal pads is approximately one-half of the total loop length
so as not to change the distance between the metal pad and the
IC chip. In this case, the first-series resonant frequency shifts
to the lower region, and the second-series resonant frequency
does not shift. Consequently, the frequency range between the
first- and second-series resonant frequency increases, and the
loop size in the impedance locus increases. This provides a
high input impedance characteristic.
Figs. 6 and 7 illustrate the Smith chart and reflection coeffi-
cient ( ), respectively. They are simulated using the models
in Figs. 4(c) and 5(c), respectively. These simulation models do
not include encapsulation resin. The antenna impedance of the
Fig. 4 model is small, and is 10. In contrast, the an-
tenna impedance of the Fig. 5 model is large, and is 10
over a wideband with a fractional bandwidth of 17%.
1559
Fig. 7. Simulation results of : (a) Fig. 4 model and (b) Fig. 5 model.
Fig. 8. Simulation model of antenna in the BGA package.
C. Antenna Characteristics
The simulation model of the proposed antenna in a BGA
package is shown in Fig. 8. The size of the BGA package is
9.0 mm 9.0 mm 0.9 mm and that of the antenna is approx-
imately 0.6 mm 1.0 mm 0.3 mm. The solder balls are lo-
cated on the back side of the interposer. The ground plane is
positioned just under the CMOS IC chip on the back side of the
interposer. The dielectric constant and dielectric loss tangent are
summarized in Table I. Figs. 9 and 10 illustrate the simulation
results of the impedance characteristics and antenna gain pat-
tern, respectively. In the frequency band from 59.9 to 70.3 GHz
(fractional bandwidth: 16%), is suppressed such that it
is below 10. The loop size in the impedance locus becomes
larger compared to Fig. 6 due to the encapsulation resin. An-
tenna gains are kept at 0 dBi over a wide azimuth range of
100 in the plane.
III. ANTENNA IN PACKAGE ON PCB
A. Structure of PCB
The radiation characteristics of the antenna in the BGA
package vary when it is mounted on the PCB. Fig. 11 illustrates
the antenna in the BGA package on a four-layer PCB. The
metal patterns in the PCB are configured to reduce the antenna
gain degradation. The dielectric constant and dielectric loss
tangent are summarized in Table I.
1560 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 61, NO. 4, APRIL 2013

Fig. 9. Simulated impedance characteristics: (a) and (b) Smith chart

(4575 GHz).

Fig. 10. Simulated antenna gain patterns: (a) plane and (b) plane.

TABLE I
DIELECTRIC CONSTANT AND DIELECTRIC LOSS TANGENT

Fig. 11. Simulation model of antenna in BGA package on PCB: (a) overall
view, (b) top view of PCB, and (c) cross-sectional view along the line A-A.

There are cranked ledges on the edges of the metal patterns

of the PCB on both sides of the BGA package. These cranked
ledges cause discontinuous current pathways. Fig. 12 shows the
current distribution on the back of the PCB in Fig. 11 on the con-
dition that the power of 1 W is fed to the differential feed point.
The current intensity is suppressed outside cranked ledges be-
cause of reflection at the cranked ledge. Without cranked ledges,
standing waves are observed up to the edge of the metal pattern
in the -axis. The standing waves up to the edge of the metal
pattern cause many ripples in the radiation pattern.
Notches are formed in the first to third metal layers of the
PCB. The notches are 2.65 mm 2.00 mm in size. These
notches lead to suppression of the out-of-phase current under
the antenna. There is no notch in the fourth metal layer so
that the direction in which the directivity is high does not lean
Fig. 12. Simulation results of current distribution: (a) with and (b) without
toward the -axis. If there are no notches, the directivity in cranked ledges.
the undesired -axis direction becomes high.
Only two solder balls are connected to the ground pattern of
the fourth metal layer through via holes in the PCB around the and ground patterns in the interposer and the PCB. A conductive
antenna. One of the two solder balls is shown with hatching in line that consists of the via hole, and the ball connected to the
Fig. 11(c). Other solder balls around the antenna are floating, via hole operates as an open stub. Because its length is approx-
that is, they are not connected to any conductive wiring lines imately one-quarter of the effective wavelength, the impedance
TSUTSUMI et al.: BONDING WIRE LOOP ANTENNA IN STANDARD BALL GRID ARRAY PACKAGE 1561

Fig. 15. Measured and simulated impedance characteristics: (a) and

(b) Smith chart (4566 GHz).

Fig. 13. Simulation results of current distribution (a) with and (b) without
notches and via holes.

Fig. 14. Photographs of prototype antenna.

Fig. 16. Simulated antenna gain patterns: (a) plane and (b) plane.

of the conductive line seen from the ground pattern of the fourth
metal layer is low. Therefore, the current on the ground pattern
of the fourth metal layer flows into the conductive line with low
impedance. As a result, since the out-of-phase current under the
antenna is reduced, the radiation efficiency improves.
Fig. 13 shows the current distribution of the PCBs metal
layer in Fig. 11(b) on the condition that the power of 1 W is
fed to the differential feed point. The radiation efficiency at 60
GHz is increased by 9.0% from 34% to 43% compared with
the case without notches and without via holes connected to the
two balls and the ground pattern, because of suppression of the
out-of-phase current.

B. Measured and Simulated Results
Fig. 14 shows photographs of the prototype antenna in the
BGA package on the PCB. The bonding wire antenna is fully
sealed by encapsulation resin. The prototype antenna includes
wires on the interposer, wires on the PCB, and bonding wires
other than the antenna itself. After removing the central part of
the encapsulation resin, the antenna is measured by using an
on-wafer probe.
Fig. 15 illustrates the impedance characteristics. The mea-
sured and simulated impedance characteristics are in good
agreement, although measured shifts to a slightly lower
frequency compared with the simulated one. is below
10 from 56 to 64 GHz in measurement.
The antenna gain patterns are measured in an anechoic
chamber [26]. The simulated and measured antenna gain pat-
terns are shown in Figs. 16 and 17, respectively. They have
Fig. 17. Measured antenna gain patterns: (a) plane and (b) plane.
similar characteristics regardless of whether the prototype an-
tenna shown in Fig. 14 includes the wires on the interposer, the
wires on the PCB, and the bonding wires other than the antenna
itself. For comparison, the simulated antenna gain pattern of
the antenna on a PCB without cranked ledges, notches, and
via holes is shown in Fig. 18. There are many ripples in the
antenna gain pattern in Fig. 18(a) due to the combination of
electromagnetic waves radiated from the antenna and those
from standing waves up to the edge of the metal pattern in the
-axis. In contrast, there are fewer ripples in the antenna gain
pattern in Figs. 16(a) and 17(a) because of the cranked ledges.
Table II shows the simulated radiation efficiencies. The antenna
gain in Fig. 18(a) is low because of low radiation efficiency and
radiation to the undesired direction. In contrast, the antenna
1562 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 61, NO. 4, APRIL 2013
Fig. 18. Simulated antenna gain patterns (without cranked ledges, notches, and
via-holes): (a) plane and (b) plane.
TABLE II
SIMULATED RADIATION EFFICIENCIES
Fig. 19. Simulated antenna gain patterns at 60 GHz (parameter: ).
Fig. 20. Simulated antenna gain patterns at 60 GHz (parameter: ).
gains in Figs. 16(a) and 17(a) are higher than that in Fig. 18(a)
over a wide angle because of the notched and via holes.
Figs. 19 and 20 show the radiation characteristics for the vari-
ation of the dimensions of the cranked ledge. Parameters
and are shown in Fig. 11. is the distance between the
package and the cranked ledge. is the height of the cranked
ledge. As shown in Figs. 19 and 20, the radiation characteristics
drastically change by using different metal pattern of the PCB.
On the contrary, the radiation characteristics are hardly influ-
enced by the wires on the interposer, the wires on the PCB, or
the bonding wires other than the antenna. This can be justified
by the fact that the simulation results without them are in good
agreement with the measurement results with them. For these
reasons, it is more important to design the metal pattern of the
PCB than to design the wires on the interposer, the wires on the
PCB, or the bonding wires other than the antenna itself.
Performing measurements, the antenna gain with the PCB is
from 2.4 to 4.9 dBi over the 5665-GHz frequency range and
over the angular range of 60 from 60 to 120 in the plane.
IV. CONCLUSION
A bonding wire loop antenna in a standard BGA package
on a PCB has been proposed for 60-GHz short-range wireless
communication. The size of the fabricated BGA package is 9.0
mm 9.0 mm 0.9 mm. The antenna fully sealed in an encap-
sulation resin and mounted on the PCB, was fabricated and mea-
sured. Performing measurements, was below 10 from
56 to 64 GHz, and the antenna gain with the PCB was from
2.4 to 4.9 dBi over the 5765-GHz range and over an an-
gular range of 60 in the horizontal plane. This wide-angle ra-
diation characteristic is preferable for an easy-to-use interface.
The proposed bonding wire antenna on resin PCB when com-
bined with CMOS process can provide a low-cost 60-GHz-band
radio solution.
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Yukako Tsutsumi was born in Nagasaki, Japan, on
October 16, 1980. She received the B.E. and M.E.
degrees in electronics engineering from Kyushu
University, Fukuoka, Japan, in 2003 and 2005,
respectively.
In 2005, she joined the R&D Center, Toshiba Cor-
poration, Kawasaki, Japan, where she has been en-
gaged in the research and development of mobile an-
tennas and millimeter-wave antennas.
Ms. Tsutsumi is a member of the Institute of Elec-
trical, Information and Communication Engineers
(IEICE), Japan.
Takayoshi Ito was born in Kumamoto, Japan, on
August 9, 1975. He received the B.E. and M.E.
degrees in electrical and electronic engineering from
the Tokyo Institute of Technology, Tokyo, Japan, in
1998 and 2000, respectively.
In 2000, he joined the R&D Center, Toshiba
Corporation, Kawasaki, Japan, where he has been
engaged in the research and development of reflector
antennas, mobile antennas, and millimeter-wave
antennas.
Mr. Ito is a member of the Institute of Electrical,
Information and Communication Engineers (IEICE), Japan.
1563
Koh Hashimoto (S06M11) was born in Tokyo,
Japan, on January 28, 1982. He received the B.S.,
M.S., and D.E. degrees in electrical and electronic
engineering from the Tokyo Institute of Technology,
Tokyo, Japan, in 2005, 2007, and 2010, respectively.
He joined the R&D Center, Toshiba Corporation,
Kawasaki, Japan, in 2010. His main interests have
been millimeter-wave antennas.
Dr. Hashimoto is a Member of the Institute of
Electrical, Information and Communication Engi-
neers (IEICE), Japan.
Shuichi Obayashi (M91) was born in Kawanishi,
Hyogo, Japan, in 1962. He received the B.E. and
M.E. degrees from Kyoto University, Japan, in 1985
and 1987, respectively.
He joined Toshiba Corporation, Kawasaki, Japan,
in 1987. From 1995 to 1996, he was a Guest
Researcher of the Royal Institute of Technology
(KTH), Stockholm, Sweden. From 2002 to 2005,
he was a Research Director of Toshiba America
Research, Inc., Piscataway, NJ, USA. Since 2005, he
has been with the Wireless System Laboratory at the
Corporate R&D Center of Toshiba Corporation, Kawasaki, Japan. His current
research interests are in the area of indoor and mobile radio propagation,
RF/microwave antennas, wireless power transfer system, and RF/microwave
components.
Mr. Obayashi is a Senior Member of the Institute of Electrical, Information
and Communication Engineers (IEICE) of Japan. He received the Young En-
gineers Award from the IEICE in 1995 and the Invention Award at the Kanto
Commendation for Invention in 2009.
Hiroki Shoki (M89SM08) was born in Hokkaido,
Japan, in 1960. He received the B.E., M.E., and D.E.
degrees from Hokkaido University, Sapporo, Japan,
in 1982, 1984, and 1992, respectively.
In 1984, he joined the R&D Center, Toshiba
Corporation, Kawaski, Japan, where he has been
engaged in the research and development of satellite
antennas, base station antennas, mobile antennas,
radar systems, and other wireless communication
systems. Currently, his research and development
interests focus on wireless power transfer tech-
nologies. He is currently a Chief Research Scientist at the Wireless System
Laboratory, Corporate R&D Center, Toshiba Corporation.
Dr. Shoki is the General Chair of the IEEE MTT-S International Microwave
Workshop Series on Innovative Wireless Power Transmission: Technologies,
Systems, and Applications (IMWS-IWPT) 2012. In addition, he will be the
Chair of the Technical Program Committee, IEEE Tokyo Chapter, from 2013 to
2014. He is a member of the International Symposium on Antennas and Prop-
agation (ISAP) 2012 Steering Committee. Furthermore, he is the Leader of the
Wireless Power Transmission Working Group (WPT-WG), Wireless Broadband
Forum (BWF), Japan.
Hideo Kasami was born in Yokohama, Kanagawa,
Japan, in 1973. He received the B.E. and M.E.
degrees from Keio University, Yokohama, Japan, in
1996 and 1998, respectively.
He joined Toshiba Corporation, Kawasaki, Japan,
in 1998. He was a visiting researcher of the Berkeley
Wireless Research Center (BWRC), Berkeley,
CA, USA, in 20062007. He is currently a Senior
Research Scientist at the Wireless System Labora-
tory, Corporate R&D Center, Toshiba Corporation.
His research interests are in the area of adaptive
array antennas, WLAN systems, digital terrestrial broadcasting systems, and
millimeter-wave communication systems.
Mr. Kasami is a member of the Institute of Electrical, Information and Com-
munication Engineers (IEICE) of Japan.