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Lm3241 6-Mhz, 750-Ma Miniature, Adjustable, Step-Down DC-DC Converter For RF Power Amplifiers
Lm3241 6-Mhz, 750-Ma Miniature, Adjustable, Step-Down DC-DC Converter For RF Power Amplifiers
Lm3241 6-Mhz, 750-Ma Miniature, Adjustable, Step-Down DC-DC Converter For RF Power Amplifiers
LM3241
SNOSB38C JANUARY 2009 REVISED NOVEMBER 2017
LM3241 6-MHz, 750-mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power
Amplifiers
1 Features 3 Description
1 6-MHz (typ.) PWM Switching Frequency The LM3241 is a DC-DC converter optimized for
powering RF power amplifiers (PAs) from a single
Operates from a Single Li-Ion Cell (2.7 V to 5.5 V) Lithium-Ion cell. The device can also be used in many
Adjustable Output Voltage (0.6 V to 3.4 V) other applications. The device steps down an input
750-mA Maximum Load Capability voltage from 2.7 V to 5.5 V to an adjustable output
High Efficiency (95% typ. at 3.9 VIN, 3.3 VOUT at voltage from 0.6 V to 3.4 V. The output voltage is set
using a VCON analog input for controlling power
500 mA)
levels and efficiency of the RF PA.
Automatic Eco-mode and PWM Mode Change
The LM3241 offers three modes of operation. In
6-Bump DSBGA Package PWM mode the device operates at a fixed frequency
Current Overload Protection of 6 MHz (typical) which minimizes RF interference
Thermal Overload Protection when driving medium-to-heavy loads. At light-load
Soft Start Function conditions, the device enters into Eco-mode
automatically and operates with reduced switching
CIN and COUT are 0402 (1005) Case Size and 6.3 frequency. In Eco-mode, the quiescent current is
V of Rated-Voltage Ceramic Capacitor reduced and extends the battery life. Shutdown mode
Small Chip Inductor in 0805 (2012) Case Size turns the device off and reduces battery consumption
to 0.1 A (typical).
2 Applications The LM3241 is available in a 6-bump lead-free
Battery-Powered 3G and 4G Power Amplifiers DSBGA package. A high-switching frequency (6
MHz) allows use of tiny surface-mount components.
Hand-Held Radios
Only three small external surface-mount components,
RF PC Cards an inductor and two ceramic capacitors are required.
Battery-Powered RF Devices
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM3241 DSBGA (6) 1.50 mm 1.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
VIN
2.7 V to 5.5 V
VOUT
VIN 0.47 H 0.6 V to 3.4 V
SW
10 F EN VOUT = 2.5 VCON
LM3241 FB
VCON
4.7 F
GND
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM3241
SNOSB38C JANUARY 2009 REVISED NOVEMBER 2017 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes........................................ 15
2 Applications ........................................................... 1 8 Application and Implementation ........................ 16
3 Description ............................................................. 1 8.1 Application Information............................................ 16
4 Revision History..................................................... 2 8.2 Typical Application ................................................. 16
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 19
6 Specifications......................................................... 4 10 Layout................................................................... 19
6.1 Absolute Maximum Ratings ...................................... 4 10.1 Layout Guidelines ................................................. 19
6.2 ESD Ratings.............................................................. 4 10.2 Layout Example .................................................... 21
6.3 Recommended Operating Conditions....................... 4 11 Device and Documentation Support ................. 22
6.4 Thermal Information .................................................. 4 11.1 Documentation Support ........................................ 22
6.5 Electrical Characteristics........................................... 5 11.2 Receiving Notification of Documentation Updates 22
6.6 System Characteristics ............................................. 6 11.3 Community Resources.......................................... 22
6.7 Typical Characteristics .............................................. 7 11.4 Trademarks ........................................................... 22
7 Detailed Description ............................................ 12 11.5 Electrostatic Discharge Caution ............................ 22
7.1 Overview ................................................................. 12 11.6 Glossary ................................................................ 22
7.2 Functional Block Diagram ....................................... 13 12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 13 Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added the Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes
section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................... 1
Deleted the maximum lead temperature parameter from the Absolute Maximum Ratings table........................................... 4
Changed the minimum TJ and TA from 30C to 40C in the Recommended Operating Conditions table ......................... 4
Added the Thermal Information table ..................................................................................................................................... 4
Added maximum values for VOUT step rise and fall times under 40C to 85C TA range in the System
Characteristics table ............................................................................................................................................................... 6
Added maximum value for turnon time under 40C to 85C TA range in the System Characteristics table ........................ 6
A EN VIN
B VCON SW
C FB GND
Not to scale
Pin Functions
PIN
TYPE DESCRIPTION
NO. NAME
Enable Input. Set this digital input high for normal operation. For shutdown, set low. Do not
A1 EN I
leave EN pin floating.
A2 VIN PWR Power supply input. Connect to the input filter capacitor (see Figure 29).
Voltage Control Analog input. VCON controls VOUT in PWM mode. Do not leave VCON pin
B1 VCON I
floating. VOUT = 2.5 VCON.
Switching Node connection to the internal PFET switch and NFET synchronous rectifier.
B2 SW PWR Connect to an inductor with a saturation current rating that exceeds the maximum Switch
Peak Current Limit specification of the LM3241.
C1 FB I Feedback Analog Input. Connect to the output at the output inductor.
C2 GND Ground
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
See and .
MIN MAX UNIT
VIN to GND 0.2 6
Pin voltage V
EN, FB, VCON, SW (GND 0.2) (VIN + 0.2) (3)
Continuous power dissipation (4) Internally limited
Junction temperature, TJ-MAX 150 C
Storage temperature, Tstg 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) All pins are limited to the 6-V maximum stated for the VIN supply.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150C (typ.) and
disengages at TJ = 125C (typical).
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human body model is a 100-pF capacitor discharged through a 1.5-k resistor into each pin. (MIL-STD-883 3015.7).
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) All voltages are with respect to the potential at the GND pins.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (RJA), as given by the following equation: TA-MAX = TJ-MAX-OP (RJA PD-MAX).
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Figure 3. Eco-mode Supply Current vs Output Voltage Figure 4. Switching Frequency vs Temperature
2.006 3.46
3.45
2.004
TA = -30C 3.44
VIN = 3.9V
OUTPUT VOLTAGE (V)
TA = +25C 3.43
2.002
3.42
VIN = 3.6V
2.000 3.41
3.40
1.998
3.39
TA = +85C VIN = 4.2V
3.38
1.996
3.37
1.994 3.36
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 100 200 300 400 500 600 700 800
Figure 5. Output Voltage vs Supply Voltage Figure 6. Output Voltage vs Output Current
0.62 2.02
OUTPUT VOLTAGE (V)
0.60 2.00
0.58 1.98
0 25 50 75 100 125 150 0 25 50 75 100 125 150
Figure 7. Output Voltage vs Output Current Figure 8. Output Voltage vs Output Current
Figure 9. ECO-PWM Mode Threshold Current vs Output Figure 10. PWM-Eco-Mode Threshold Current vs Output
voltage voltage
100
VIN = 3.6V
VIN = 3.0V
95
EFFICIENCY (%)
90
85
VIN = 4.2V
80
75
70
0 100 200 300 400 500 600 700 800
OUTPUT CURRENT(mA)
VOUT = 2 V VOUT = 2 V
Figure 11. Closed-loop Current Limit vs Temperature Figure 12. Efficiency vs Output Current
EFFICIENCY (%)
90
VIN = 4.2V 85
85 VIN = 3.9V
80
80
75 VIN = 4.2V
75 70
70 65
0 100 200 300 400 500 600 700 800 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Figure 13. Efficiency vs Output Current Figure 14. Efficiency vs Output Voltage
Figure 15. PFET RDSON vs Supply Voltage Figure 16. NFET RDSON vs Supply Voltage
Figure 17. Low VCON Voltage vs Output Voltage Figure 18. VIN-VOUT vs Output Current
Figure 19. EN High Threshold vs Supply Voltage Figure 20. Output Voltage Ripple in PWM Mode
Figure 21. Output Voltage Ripple in Eco-Mode Figure 22. Line Transient Response
Figure 23. Load Transient Response Figure 24. Load Transient Response
VIN = 4.2 V VOUT = 3.4 V RLOAD = 3.6 k VIN = 4.2 V VOUT = 3.4 V RLOAD = 10 k
VOUT = 2 V RLOAD = 10
7 Detailed Description
7.1 Overview
The LM3241 is a simple, step-down DC-DC converter optimized for powering RF power amplifiers (PAs) in
mobile phones, portable communicators, and similar battery-powered RF devices. The device is designed to
allow the RF PA to operate at maximum efficiency over a wide range of power levels from a single Li-Ion battery
cell. The design is based on a voltage-mode buck architecture, with synchronous rectification for high efficiency.
The device is designed for a maximum load capability of 750 mA in PWM mode. Maximum load range may vary
from this depending on input voltage, output voltage, and the inductor chosen.
Three modes of operation are available depending on the current required: pulse width modulation (PWM), Eco-
mode (economy mode), and shutdown. The LM3241 operates in PWM mode at higher load-current conditions.
Lighter loads cause the device to automatically switch into Eco-mode. Shutdown mode turns off the device and
reduces battery consumption to 0.1 A (typical).
Precision of the DC PWM-mode output voltage is 2% for 3.4 VOUT. Efficiency is around 95% (typical) for a 500-
mA load with a 3.3-V output and 3.9-V input. The output voltage is dynamically programmable from 0.6 V to 3.4
V by adjusting the voltage on the control pin (VCON) without the need for external feedback resistors. This
feature ensures longer battery life by being able to change the PA supply voltage dynamically depending on its
transmitting power.
Additional features include current overload protection and thermal overload shutdown.
The LM3241 is constructed using a chip-scale, 6-bump DSBGA package. This package offers the smallest
possible size for space-critical applications, such as cell phones, where board area is an important design
consideration. Use of a high switching frequency (6 MHz, typical) reduces the size of external components. As
shown in Figure 29, only three external power components are required for implementation. Use of a DSBGA
package requires special design considerations for implementation (for more information see the DSBGA
Package Assembly and Use section.) The fine-bump pitch of the package requires careful board design and
precision assembly equipment. Use of this package is best suited for opaque-case applications, where its edges
are not subject to high-intensity ambient red or infrared light. Also, the system controller should set EN low during
power-up and other low supply voltage conditions (see the Shutdown Mode section).
EN VIN
ECO
COMPARATOR
OLP
Ref1
OVERVOLTAGE
DETECTOR
VCON
DELAY
PWM
COMPARATOR CONTROL LOGIC DRIVER
ERROR
AMP
FB SW
RAMP
GENERATOR
NCP
EN Ref2
OSCILLATOR
Ref3
LIGHT-LOAD
OUTPUT SHORT THERMAL CHECK COMP
PROTECTION SHUTDOWN
GND
Copyright 2017, Texas Instruments Incorporated
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
C1 L1 VOUT
10 F VIN 0.47 H 0.8 V
EN SW
EN VOUT = 2.5 VCON
VCON LM3241
0.32 V FB
VCON C2
4.7 F
GND
8.2.2.2.1 Method 1
The saturation current should be greater than the sum of the maximum load current and the worst case average
to peak inductor current. Use Equation 2 to find the saturation current (ISAT).
ISAT > IOUT_MAX + IRIPPLE
where
IOUT_MAX is the maximum load current (750 mA).
IRIPPLE is the average-to-peak inductor current. Use Equation 3 to calculate the IRIPPLE value. (2)
VIN VOUT VOUT 1
IRIPPLE u u
2 u L VIN f
where
VIN is the maximum input voltage in application.
VOUT is the output voltage
L is the minimum inductor value including worst-case tolerances (30% drop can be considered for Method 1)
f is the minimum switching frequency (5.7 MHz) (3)
8.2.2.2.2 Method 2
A more conservative and recommended approach is to choose an inductor that can support the maximum
current limit of 1600 mA.
The resistance of the inductor should be less than approximately 0.1 for good efficiency. Table 3 lists
recommended inductors and suppliers.
The input filter capacitor supplies AC current drawn by the PFET switch of the LM3241 in the first part of each
cycle and reduces the voltage ripple imposed on the input power source. The output filter capacitor absorbs the
AC inductor current, helps maintain a steady output voltage during transient load changes, and reduces output
voltage ripple. These capacitors must be selected with sufficient capacitance and sufficiently low equivalent
series resistance (ESR) to perform these functions. The ESR of the filter capacitors is generally a major factor in
voltage ripple.
100
95
90 VIN = 4.2V
EFFICIENCY (%)
VIN = 3.6V
85 VIN = 3.0V
80
75
70
65
60
0 50 100 150 200 250
VOUT = 0.6 V/3.4 V RLOAD = 10
OUTPUT CURRENT(mA)
VOUT = 0.8 V Figure 31. VCON Transient Response
10 Layout
VIN
VOUT
7. Place noise-sensitive circuitry, such as radio IF blocks, away from the DC-DC converter, CMOS digital
blocks, and other noisy circuitry. Interference with noise-sensitive circuitry in the system can be reduce
through distance.
In mobile phones, for example, a common practice is to place the DC-DC converter on one corner of the board,
arrange the CMOS digital circuitry around it (because this also generates noise), and then place sensitive
preamplifiers and IF stages on the diagonally opposing corner. Often, the sensitive circuitry is shielded with a
metal pan and power to it is post-regulated to reduce conducted noise, using low-dropout linear regulators.
11.4 Trademarks
Eco-mode, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 25-Oct-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM3241TLE/NOPB ACTIVE DSBGA YZR 6 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 H
& no Sb/Br)
LM3241TLX/NOPB ACTIVE DSBGA YZR 6 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 H
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 25-Oct-2017
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Oct-2017
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Oct-2017
Pack Materials-Page 2
MECHANICAL DATA
YZR0006xxx
D
0.6000.075
TLA06XXX (Rev C)
4215044/A 12/12
NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
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