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REF50xx
Low-Noise, Very Low Drift, Precision Voltage Reference
1 Features 3 Description
1 Low Temperature Drift: The REF50xx is a family of low-noise, low-drift, very
high precision voltage references. These references
High-Grade: 3 ppm/C (Max) are capable of both sinking and sourcing current, and
Standard-Grade: 8 ppm/C (Max) have excellent line and load regulation.
High Accuracy: Excellent temperature drift (3 ppm/C) and high
High-Grade: 0.05% (Max) accuracy (0.05%) are achieved using proprietary
Standard-Grade: 0.1% (Max) design techniques. These features, combined with
very low noise, make the REF50xx family ideal for
Low Noise: 3 VPP/V use in high-precision data acquisition systems.
Excellent Long-Term Stability:
Each reference voltage is available in both high grade
45 ppm/1000 hr (Typ) after 1000 Hours (REF50xxIDGK and REF50xxID) and standard grade
High-Output Current: 10 mA (REF50xxAIDGK and REF50xxAID). The reference
Temperature Range: 40C to 125C voltages are offered in 8-pin VSSOP and SOIC
packages, and are specified from 40C to 125C.
2 Applications
Device Information(1)
Precision Data Acquisition Systems PART NUMBER PACKAGE BODY SIZE (NOM)
ATE Equipment SOIC (8) 4.90 mm 3.91 mm
REF50xx
Industrial Process Controls VSSOP (8) 3.00 mm 3.00 mm
Medical Instrumentation (1) For all available packages, see the orderable addendum at
Pressure and Temperature Transmitters the end of the data sheet.
R1
Input Signal, 124
0 V to 4 V
OPA365 IN VDD
ADS8326
C1
IN
1 nF REF GND
REF5040
+5V VIN VOUT
CBYPASS
1 F C2
22 F
GND
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
SBOS410H JUNE 2007 REVISED JUNE 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 9.3 Feature Description................................................. 16
2 Applications ........................................................... 1 9.4 Device Functional Modes........................................ 18
3 Description ............................................................. 1 10 Applications and Implementation...................... 19
4 Revision History..................................................... 2 10.1 Application Information.......................................... 19
10.2 Typical Applications .............................................. 19
5 Device Comparison Table..................................... 4
6 Pin Configuration and Functions ......................... 4 11 Power Supply Recommendations ..................... 21
7 Specifications......................................................... 5 12 Layout................................................................... 21
12.1 Layout Guidelines ................................................. 21
7.1 Absolute Maximum Ratings ...................................... 5
12.2 Layout Example .................................................... 21
7.2 ESD Ratings.............................................................. 5
12.3 Power Dissipation ................................................. 21
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5 13 Device and Documentation Support ................. 22
7.5 Electrical Characteristics........................................... 6 13.1 Documentation Support ........................................ 22
7.6 Typical Characteristics .............................................. 8 13.2 Related Links ........................................................ 22
13.3 Community Resources.......................................... 22
8 Parameter Measurement Information ................ 13
13.4 Trademarks ........................................................... 22
8.1 Solder Heat Shift..................................................... 13
13.5 Electrostatic Discharge Caution ............................ 22
9 Detailed Description ............................................ 15
13.6 Glossary ................................................................ 22
9.1 Overview ................................................................. 15
9.2 Functional Block Diagram ....................................... 15 14 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
Removed all notes regarding MSOP-8 package status. MSOP-8 package released at time of document revision.............. 1
Changed Storage Temperature Range absolute minimum value from 55C to 65C........................................................ 5
Added Load Regulation test condition and Over Temperature specifications ....................................................................... 6
Added typical characteristic graph, Quiescent Current vs Input Voltage (Figure 10) ............................................................ 8
D, DGK Packages
8-Pin SOIC, VSSOP
Top View
DNC(1) 1 8 DNC(1)
VIN 2 7 NC(2)
REF50xx
TEMP 3 6 VOUT
GND 4
5 TRIM/NR
Pin Functions
PIN
DESCRIPTION
NAME NO.
DNC 1 Do not connect
VIN 2 Input supply voltage
TEMP 3 Temperature monitoring pin. Provides a temperature-dependent output voltage
GND 4 Ground
TRIM/NR 5 Output adjustment and noise reduction pin
VOUT 6 Reference voltage output
NC 7 No internal connection
DNC 8 Do not connect
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage 0.2 18 V
Output short circuit 30 30 mA
Operating temperature 55 125 C
Junction temperature (TJ max) 150 C
Storage temperature, Tstg 65 150 C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
Population (%)
0
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
4.50
5.00
5.50
6.00
6.50
7.00
7.50
8.00
0.25
0.75
1.25
1.75
2.25
2.75
3.25
3.75
4.25
4.75
0
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
4.50
0.015
Output Voltage Accuracy (%)
0.01
Population (%)
0.005
-0.005
-0.01
-0.015
-0.01
0.01
-0.03
-0.02
0.02
0.03
-0.05
0.05
-0.04
0.04
0
-0.02
50 25 0 25 50 75 100 125
Output Initial Accuracy (%) Temperature (C) C001
Figure 3. Output Voltage Initial Accuracy Figure 4. Output Voltage Accuracy vs Temperature
160 0.8
+125C
140 0.7
120 0.6
Dropout Voltage (V)
+25C
100 0.5
PSRR (dB)
-40C
80 0.4
60 0.3
40 0.2
20 0.1
0 0
10 100 1k 10k 100k -15 -10 -5 0 5 10 15
Frequency (Hz) Load Current (mA)
Figure 5. Power-Supply Rejection Ratio vs Frequency Figure 6. Dropout Voltage vs Load Current
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
2.50050
0.7
2.50025
+25C
2.50000 0.6
2.49975
0.5
2.49950
-40C
2.49925
0.4
+125C
2.49900
2.49875 0.3
-10 -5 0 5 10 -50 -25 0 25 50 75 100 125
Load Current (mA) Temperature (C)
Figure 7. REF5025 Output Voltage vs Load Current Figure 8. Temp Pin Output Voltage vs Temperature
1050 1000
+125?C
1000 950
950
Quiescent Current (mA)
900
900
850
+25?C
IQ (mA)
850
800
800
750
750 -40?C
700
700
650 650
600 600
-50 -25 0 25 50 75 100 125 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Temperature (C) VIN (V)
Figure 9. Quiescent Current vs Temperature Figure 10. Quiescent Current vs Input Voltage
0.5 35
0.4 Sourcing
30
Short-Circuit Current (mA)
0.3
Line Regulation (ppm/V)
0.2 25
0.1
20
0 Sinking
15
-0.1
-0.2 10
-0.3
5
-0.4
-0.5 0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (C) Temperature (C)
Figure 11. Line Regulation vs Temperature Figure 12. Short Circuit Current vs Temperature
VIN
1mV/div
2V/div
VOUT
1V/div
40ms/div
1s/div
(REF5025, CL = 1 F)
+1mA
VIN ILOAD
5V/div
-1mA -1mA
1mA/div
VOUT
VOUT 5mV/div
1V/div
400ms/div 20ms/div
(REF5025, CL = 10F) (CL = 1 F, IOUT = 1 mA)
ILOAD +1mA
+10mA +10mA
10mA/div ILOAD
-1mA -1mA
1mA/div
-10mA
VOUT VOUT
2mV/div 5mV/div
20ms/div 100ms/div
(CL = 1 F, IOUT = 10 mA) (CL = 10 F, IOUT = 1 mA)
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
-10mA -10mA
10mA/div
VIN
500mV/div
VOUT
2mV/div
VOUT
5mV/div
100ms/div 20ms/div
(CL = 10 F, IOUT = 10 mA) (CL = 1 F)
-50
VOUT
5mV/div
-100
-150
-200
100ms/div 0 100 200 300 400 500 600 700 800 900 1000
(CL = 10 F) Hours C001
VSSOP-8
Figure 21. Line Transient Figure 22. REF50xx Long-Term Stability (First 1000 Hours)
100 100
50
Output Voltage Stability (ppm)
50
0
-50
0
-100
-150
-50
-200
-100 -250
1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 0 200 400 600 800 1000 1200 1400 1600 1800 2000
Hours C001 Hours C001
VSSOP-8 VSSOP-8
Figure 23. REF50xx Long-Term Stability Figure 24. REF50xx Long-Term Stability (2000 Hours)
(Second 1000 Hours)
SOIC-8 SOIC-8
Figure 25. REF50xx Long-Term Stability (First 1000 Hours) Figure 26. REF50xx Long-Term Stability
(Second 1000 Hours)
300
250
Output Voltage Stability (ppm)
200
150
100
50
0
-50
-100
-150
-200
-250
-300
0 200 400 600 800 1000 1200 1400 1600 1800 2000
Hours C001
SOIC-8
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
250
Temperature (C)
200
150
100
50
0
0 50 100 150 200 250 300 350 400
Time (seconds) C01
80 80
Population (%)
Population (%)
60 60
40 40
20 20
0 0
-0.02 -0.01 0 0.01 0.02 -0.02 -0.01 0 0.01 0.02
Solder Heat Shift Distribution (%) - SOIC Solder Heat Shift Distribution (%) - MSOP
C005 C004
Figure 29. Solder Heat Shift Distribution (%), Figure 30. Solder Heat Shift Distribution (%),
SOIC Package VSSOP Package
60 60
50 50
40 40
Population (%)
30 Population (%) 30
20 20
10 10
0 0
0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 8
Drift Pre-Soldering (ppm/C) - SOIC Package Drift Post Soldering (ppm/C) - SOIC package
C006 C007
Figure 31. Drift Pre-Soldering Distribution, Figure 32. Drift Post Soldering Distribution,
SOIC Package SOIC Package
50 50
40 40
Population (%)
Population (%)
30 30
20 20
10 10
0 0
0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 8
Drift Distribution Pre-Soldering (ppm/C) - MSOP Package Drift Distribution Post-Soldering (ppm/C) - MSOP Package
C002 C003
Figure 33. Drift Distribution Pre-Soldering, Figure 34. Drift Distribution Post-Soldering,
VSSOP Package VSSOP Package
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
60 60
50 50
Population (%)
Population (%)
40 40
30 30
20 20
10 10
0 0
-3 -2 -1 0 1 2 3 -3 -2 -1 0 1 2 3
Drift Shift Distribution (ppm/C) - SOIC Package Drift Shift Distribution due to Soldering (ppm/C) - MSOP Package
C008 C001
Figure 35. Drift Shift Distribution, Figure 36. Drift Shift Distribution,
SOIC Package VSSOP Package
9 Detailed Description
9.1 Overview
The REF50xx is family of low-noise, precision bandgap voltage references that are specifically designed for
excellent initial voltage accuracy and drift. See the Functional Block Diagram for a simplified block diagram of the
REF50xx.
REF50xx
R2 R1
aT
(10mA
at +25C)
TEMP R4 VOUT
aT
10kW
R3
TRIM/NR
1.2V 1kW
R5
60kW
GND
REF50xx
DNC DNC
VTEMP VIN NC
OPA(1)
2.6mV/C
TEMP VOUT
GND TRIM/NR
NOTE: (1) Low drift op amp, such as the OPA333, OPA335, or OPA376.
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
REF50xx
DNC DNC
VIN NC
TEMP VOUT
GND TRIM/NR C1
1mF
REF50xx
DNC DNC
VIN NC
TEMP VOUT
1kW
The REF50xx allows access to the bandgap through the TRIM/NR pin. Placing a capacitor from the TRIM/NR pin
to GND (Figure 38) in combination with the internal R3 and R4 resistors creates a low-pass filter. A capacitance
of 1F creates a low-pass filter with the corner frequency from 10 Hz to 20 Hz. Such a filter decreases the overall
noise measured on the VOUT pin by half. Higher capacitance results in a lower filter cutoff frequency, further
reducing output noise. Using this capacitor increases start-up time.
REF50xx
DNC DNC
VIN NC
CBYPASS
TEMP VOUT VOUT
1mF to 10mF
GND TRIM/NR CL
1mF to 50mF
REF5025
DNC DNC
VIN NC
TEMP VOUT +2.5V
GND TRIM/NR 1mF
R1
10kW R2
10kW
+5V
OPA735 -2.5V
-5V
NOTE: Bypass capacitors not shown.
Figure 41. The REF5025 and OPA735 Create Positive and Negative Reference Voltages
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
REF5040
ESR
10F
47F
REFIN
CS
124
CLK
ADS8326
0-4V SDO
1nF
OPA365
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
12 Layout
DNC
REF50xx
DNC
VIN NC
R
C TEMP VOUT
GND TRIM/NR
C C
13.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050
REF5010, REF5020, REF5025, REF5030
REF5040, REF5045, REF5050
www.ti.com SBOS410H JUNE 2007 REVISED JUNE 2016
www.ti.com 22-Aug-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
REF5010AID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5010
A
REF5010AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50G
& no Sb/Br)
REF5010AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50G
& no Sb/Br)
REF5010AIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5010
A
REF5010ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5010
REF5010IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50G
& no Sb/Br)
REF5010IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50G
& no Sb/Br)
REF5020AID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5020
A
REF5020AIDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5020
A
REF5020AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50A
& no Sb/Br)
REF5020AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50A
& no Sb/Br)
REF5020AIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5020
A
REF5020AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5020
A
REF5020ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5020
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 22-Aug-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
REF5020IDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5020
REF5020IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50A
& no Sb/Br)
REF5020IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50A
& no Sb/Br)
REF5020IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5020
REF5020IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5020
REF5025AID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5025
A
REF5025AIDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5025
A
REF5025AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50B
& no Sb/Br)
REF5025AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50B
& no Sb/Br)
REF5025AIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5025
A
REF5025AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5025
A
REF5025ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5025
REF5025IDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5025
REF5025IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50B
& no Sb/Br)
REF5025IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50B
& no Sb/Br)
REF5025IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5025
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 22-Aug-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
REF5025IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5025
REF5030AID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5030
A
REF5030AIDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5030
A
REF5030AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50C
& no Sb/Br)
REF5030AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50C
& no Sb/Br)
REF5030AIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5030
A
REF5030AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5030
A
REF5030ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5030
REF5030IDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5030
REF5030IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50C
& no Sb/Br)
REF5030IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50C
& no Sb/Br)
REF5030IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5030
REF5040AID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5040
A
REF5040AIDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5040
A
REF5040AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50D
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 22-Aug-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
REF5040AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50D
& no Sb/Br)
REF5040AIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5040
A
REF5040ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5040
REF5040IDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5040
REF5040IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50D
& no Sb/Br)
REF5040IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50D
& no Sb/Br)
REF5040IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5040
REF5040IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5040
REF5045AID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5045
A
REF5045AIDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5045
A
REF5045AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50E
& no Sb/Br)
REF5045AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50E
& no Sb/Br)
REF5045AIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5045
A
REF5045AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5045
A
REF5045ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5045
REF5045IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50E
& no Sb/Br)
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 22-Aug-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
REF5045IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50E
& no Sb/Br)
REF5045IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5045
REF5050AID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5050
A
REF5050AIDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5050
A
REF5050AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50F
& no Sb/Br)
REF5050AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50F
& no Sb/Br)
REF5050AIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5050
A
REF5050ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5050
REF5050IDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5050
REF5050IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50F
& no Sb/Br)
REF5050IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 R50F
& no Sb/Br)
REF5050IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5050
REF5050IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 REF
& no Sb/Br) 5050
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com 22-Aug-2017
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Aug-2017
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Aug-2017
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Aug-2017
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Aug-2017
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
REF5030IDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
REF5030IDGKT VSSOP DGK 8 250 210.0 185.0 35.0
REF5030IDR SOIC D 8 2500 367.0 367.0 35.0
REF5040AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
REF5040AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0
REF5040AIDR SOIC D 8 2500 367.0 367.0 35.0
REF5040IDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
REF5040IDGKT VSSOP DGK 8 250 210.0 185.0 35.0
REF5040IDR SOIC D 8 2500 367.0 367.0 35.0
REF5045AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
REF5045AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0
REF5045AIDR SOIC D 8 2500 367.0 367.0 35.0
REF5045IDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
REF5045IDGKT VSSOP DGK 8 250 210.0 185.0 35.0
REF5045IDR SOIC D 8 2500 367.0 367.0 35.0
REF5050AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
REF5050AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0
REF5050AIDR SOIC D 8 2500 367.0 367.0 35.0
REF5050IDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
REF5050IDGKT VSSOP DGK 8 250 210.0 185.0 35.0
REF5050IDR SOIC D 8 2500 367.0 367.0 35.0
Pack Materials-Page 4
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