JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

The J OURNAL OF M ICROELECTROMECHANICAL S YSTEMS is published by the IEEE Electron Devices Society, the IEEE Industrial Electronics Society, and the IEEE Robotics and Automation
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I NFORMATION F OR AUTHORS
The J OURNAL OF M ICROELECTROMECHANICAL S YSTEMS (JMEMS) is published bimonthly to report on advances in micromechanics and microdynamical systems. A selection of topics suitable
for papers in JMEMS would include descriptions of technologies useful for MEMS, modeling and design issues for MEMS, properties of materials that bear on MEMS designs; phenomena pertinent
to MEMS designs and performance; MEMS characterization and reliability; mechanical, electrical, chemical, and biological factors associated with MEMS, and interface issues such as tribology
in microsystems. Typical MEMS devices have smaller than millimeter dimensions and they are characterized by engineering and control of lengths and movements that most usually range between
nanometers and micrometers. Papers that are sometimes described as being concerned with nanotechnology are welcome in JMEMS, a journal in which the term “micro” is interpreted in its classical
sense as tiny. To prepare a submission to JMEMS, authors should consult the JMEMS home web site https://eds.ieee.org/journal-of-microelectromechanical-systems.html and also take note of
instructions that are posted on the Corresponding Author “dashboard” at the ScholarOne Manuscripts website http://mc.manuscriptcentral.com/jmems through which all submissions for publication
must be made.
Open Access: This publication is a hybrid journal, allowing either Traditional manuscript submission or Open Access (author-pays OA) manuscript submission. Upon submission, if you choose to
have your manuscript be an Open Access article, you commit to pay the discounted $1,950 OA fee if your manuscript is accepted for publication in order to enable unrestricted public access. Any
other application charges (such as overlength page charge and/or charge for the use of color in the print format) will be billed separately once the manuscript formatting is complete but prior to the
publication. If you would like your manuscript to be a Traditional submission, your article will be available to qualified subscribers and purchasers via IEEE Xplore. No OA payment is required for
Traditional submission.
Author Names in Native Languages: IEEE supports the publication of author names in the native language alongside the English versions of the names in the author list of an article. For more
information, please visit the IEEE Author Digital Tool Box at the following URL: http://www.ieee.org/publications standards/publications/authors/auth names native lang.pdf.
ORCID Required: All IEEE journals require an Open Researcher and Contributor ID (ORCID) for all authors. To create an ORCID, please visit: https://orcid.org/register. The author will need a
registered ORCID in order to submit a manuscript or review a proof in this journal.
EDITOR-IN-CHIEF
PROF. C HRISTOFER H IEROLD
ETH Zürich, Micro and Nanosystems
Tannestrasse 3
CH-8092 Zürich, Switzerland
hierold@micro.mavt.ethz.ch
EDITORS
C HONG H. A HN R EZA G HODSSI ROYA MABOUDIAN H ELMUT S EIDEL X IAOHONG WANG
Dept. of ECE & CS Dept. Elect. Comput. Eng. Dept. Chemical Engineering Lehrstuhl für Mikromechanik, Tsinghua University
Microsystems & BioMEMS Lab Univ. of Maryland Univ. of California, Berkeley Mikrofluidik/Mikroaktorik wxh-ime@tsinghua.edu.cn
University of Cincinnati ghodssi@umd.edu maboudia@berkeley.edu Universität des Saarlandes
chong.ahn@uc.edu seidel@lmm.uni-saarland.de MAN W ONG
A NDREW H OLMES C ARLOS H. MASTRANGELO Senior Editor
J ÜRGEN B RUGGER EEE Department Elect. Comput. Eng. Dept. Dept. EEE
Imperial College London A SHWIN S ESHIA
Ecole Polytechnique Federale de The University of Utah Hong Kong Univ. of Science and
a.holmes@imperial.ac.uk Queens’ College
Lausanne (EPFL), Switzerland mastrang@ece.utah.edu Technol.
Univ. of Cambridge
juergen.brugger@epfl.ch aas41@cam.ac.uk eemwong@ee.ust.hk
ROGER T. H OWE S ABINA MERLO
L IONEL B UCHAILLOT Senior Editor Dipartimento di Elettronica J. A NDREW Y EH
Inst. for Elect., Microelectronics Dept. Elect. Eng. Università degli Studi di Pavia A NDREI M. S HKEL Institute of MEMS
and Nanotechnology, EIMN Stanford University merlo@ieee.org Dept. Mech. & Aerospace Eng. National Tsing Hua Univ., Taiwan
lionel.buchaillot@iemn.univ-lille1.fr rthowe@stanford.edu Univ. of California, Irvine jayeh@mx.nthu.edu.tw
J IANMIN MIAO ashkel@uci.edu
D ONG -I L “DAN ” C HO H ONGRUI J IANG Nanyang Technological University
Micro-Nano Sensors & Actuators Lab. J UN -B O YOON
Senior Editor jmiao@pmail.ntu.edu.sg Korea Advanced Institute of Science and
Univ. of Wisconsin O LAV S OLGAARD
Elect. Eng. & Comp. Sci. Ginzton Lab. Technology (KAIST)
Seoul National University hongrui@engr.wisc.edu C LARK N GUYEN
Dept. EECS Stanford Univ. jbyoon@kaist.ac.kr
dicho@asri.snu.ac.kr C HANG -J IN K IM solgaard@stanford.edu
Univ. of California, Berkeley
Senior Editor ctnguyen@eecs.berkeley.edu MINA -R AIS Z ADEH
D ON L. D E VOE University of Michigan
MAE Dept., Univ. of California, L ELAND (C HIP ) S PANGLER
Senior Editor minar@eecs.umich.edu
Los Angeles G IANLUCA P IAZZA Aspen Microsystems
Dept. Mech. Eng. &
cjkim@seas.ucla.edu Carnegie Mellon University chip@aspenmicrosystems.com
Bioeng. Program H ANS Z APPE
piazza@ece.cmu.edu
University of Maryland E UN S OK K IM Senior Editor
ddev@eng.umd.edu Dept. Elect. Eng. & Electrophys. RUDRA P RATAP S. MARK S PEARING Inst. Microsyst. Technol.
Univ. of Southern California, Indian Institute of Science School of Eng. Sci. Univ. Freiburg
DAVID E LATA Los Angeles pratap@cense.iisc.ernet.in University of Southampton zappe@imtek.uni-Freiburg.de
Mech. Eng. Micro-Systems Lab. eskim@usc.edu spearing@soton.ac.uk
Faculty Mech. Eng. C HRISTIAN R EMBE H AIXIA (A LICE ) Z HANG
Technion—Israel Inst. Technol. S ATOSHI KONISHI Technical University of Clausthal Peking University
G ÖRAN S TEMME
elata@tx.technion.ac.il Ritsumeikan University rembe@iei.tu-clausthal.de hxzhang@pku.edu.cn
Senior Editor
konishi@se.ritsumei.ac.jp Dept. Signals, Sens., & Syst.
H IROYUKI F UJITA A NTONIO J. R ICCO J OHN X. J. Z HANG
Senior Editor Royal Inst. of Technol.
L IWEI L IN Senior Editor Thayer School of Engineering at
IIS, Univ. of Tokyo stemme@s3.kth.se
Dept. Mech. Eng. NASA Ames Research Ctr. Dartmouth
fujita@iis.u-tokyo.ac.jp Univ. of California, Berkeley Adjunct Professor, Dublin City Univ. John.Zhang@dartmouth.edu
lwlin@me.berkeley.edu ajricco@alum.mit.edu O SAMU TABATA
S AMI F RANSSILA Dept. Mech. Eng. Y ITSHAK Z OHAR
Dept. Elect. Comput. Eng. A NTONIO L UQUE PASQUALINA S ARRO Grad. School Eng. Dept. of Aerospace and Mech. Eng.
Aalto University University of Seville Delft University of Technology Kyoto Univ. The Univ. of Arizona
sami.franssila@aalto.fi aluque@gte.esi.us.es p.m.sarro@tudelft.nl tabata@mech.kyoto-u.ac.jp zohar@email.arizona.edu
Editors, identified above as Senior Editors, may be chosen to assume the duties of Editor-in-Chief for selected articles submitted to JMEMS.

STEERING COMMITTEE
IEEE Electron Devices Society IEEE Industrial Electronics Society IEEE Robotics and Automation
B IN ZHAO, VP Pub R IDHA B EN M RAD Society
Fairchild Semiconductor University of Toronto FUMIHITO A RAI
Nagoya University
R AJENDRA SINGH STOYAN N IHTIANOV
Clemson University TU Delft B RADLEY J. N ELSON
ETH Zürich
K HALIL NAJAFI
University of Michigan
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Digital Object Identifier 10.1109/JMEMS.2018.2796979