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PlasticBGA SMTAssembly Issues From Freescale
PlasticBGA SMTAssembly Issues From Freescale
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Presentation
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Introduction and Package Description
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
WB PBGA Construction (Cont.)
Thermal Balls
Perimeter Balls
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Introduction and Package Description
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Introduction and Package Description
200
1991 1992
! Source: IBM and COMPAQ; “Workshop on Ball Grid Arrays & Advanced
Packaging”; 30 August 1993, Sunnyvale, CA.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Introduction and Package Description
b b b
160 Pin 304 Pin
240 Pin
28 mm Body 40 mm Body
32 mm Body
0.65 mm Pitch 0.50 mm Pitch
0.50 mm Pitch
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Introduction and Package Description
Vdd plane
Vss plane
capacitor
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Introduction and Package Description
62Sn/36Pb/2Ag
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Introduction and Package Description
Stand-Off (Varies
with Pad Size and 1.27 mm Routing Vias
Solder Paste Vol.) Pitch
Solder Pads (SMD Pads
62Sn/36Pb/2Ag on PBGA-Either on PCB)
Solder Ball
Motherboard
(Typically FR4/Glass)
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
Overall Summary
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Presentation
! PBGA Assembly
! PBGA Solder Joint Voids
! Rework
! Reliability
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
! Solder mask
! May be used to define contact pads
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
Disadvantages Disadvantages
1. Potential Stress point
2. Foreign matter entrapment on pad 1. Reduced pad to board adhesion
3. Generally poor dimensional tolerance on actual strength
solderable opening 2. May be weak link in other mechanical
testing, i.e. board bending, mechanical shock
and vibration
3. Non symmetrical joint fails at the package
interface first
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
solder pad
Copper pad
0.635-0.8 mm (25-31 mil)
Photoimageable Solder Mask
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
solder pad
Copper pad
0.7-0.85 mm (28-33 mil)
Photoimageable Solder Mask
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
Soldermask Clearance
Soldermask Overlap
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
Signal via
Power or Ground via
0.152 mm line (6 mil)
Subsurface Vias
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Presentation
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
Pre-assembly Handling
PBGA Moisture Sensitivity
! Many PBGAs are moisture sensitive, just as Plastic QFP
packages
! Follow Moisture Sensitivity guidelines printed on the
package labels
JEDEC MOISTURE LEVEL TABLE Time allowed out of Drypack
before a rebake is required
Level Condition Time
1 30°C/85% RH Unlimited
2 30°C/60% RH 1 year
2a 30°C/60% RH 4 weeks
3 30°C/60% RH 168 hours
4 30°C/60% RH 72 hours
5 30°C/60% RH 48 hours
5a 30°C/60% RH 24 hours
6 30°C/60% RH Time on Label
J-STD-020C
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
PBGA
Wire Bond
PQFP
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PC Board Design for PBGA
Solder Paste
!Stencil thickness can be anything from 5 to 10 mils thick.
!Openings, same as pad sizes
!Large round holes print easily
!Print accuracy
"± 5 mils print registration, with no paste touching other exposed
metalization.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
Placement
! Most newer vision systems can use solder balls
for alignment.
!Most vendors of older equipment are working on
retrofits.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
Reflow
! Recommended profile: 210-215° C peak, 75 seconds above 183° C. (any
standard surface mount reflow profile)
! Follow guidelines recommended by Solder paste vendor
! Flux requirements must be met for best solderability
! Temperature profile should be carefully characterized to insure uniform
temperature across the board and package.
! Solder ball voiding may be affected by ramp rates and dwell time below and
above liquidus.
! Nitrogen not required, but will make the process even more robust, and can
make big difference in the case of marginal solderability of PC board pads.
! Full convection forced air furnaces work best, but IR, convection/IR or vapor
phase can be used.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
Secondary Reflow
! A Wave Solder operation is often required after Surface Mount devices have been
soldered on the board.
! Reflow of BGA solder joints in this secondary operation must be avoided.
! The result can be open BGA solder joints
" PBGAs are low thermal mass packages (get hot fast)
" The large number of plated through holes transmit heat
rapidly
" When heated from bottom only, PBGAs may warp
# Bow up on outside edge due to expansionTend to
flatten in surface mount reflow with uniform heat (Mold temp
180° C)
# Coplanarity may be so great, solder joints separate
PBGA Through-Hole
Vias
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
Cleaning
! The industry is moving to no clean flux, but due to large pitch and high
standoff, any conventional cleaning process can be used.
! Insure spray nozzles direct flow at an angle to clean under the part.
Inspection
! External solder joints can be visually inspected. If uniform reflow
temperature is maintained, and outer joints look good, the internal joints
will be good.
! Internal solder joints can be inspected by X-ray.
! The entire assembly process should be carefully characterized;
then, due to the very high yielding nature of the product, solder
joint inspection can be eliminated.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Assembly
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Presentation
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
Flux Residue
on Void Wall
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
Void Count
Void Count
Mean Voids per Joint = 7.90 40 Minimum Void Diameter = 0.68 mils
15 Minimum Void Diameter = 0.71 mils Maximum Void Diameter = 8.54 mils
Maximum Void Diameter = 6.39 mils Mean Void Diameter = 1.70 mils
Mean Void Diameter = 1.92 mils
30
Standard Deviation = 1.41 mils
Standard Deviation = 1.14 mils
10
20
5 10
0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10
Void Diameter (mils) Void Diameter (mils)
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or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
Second Void Study - Reflow Profile Experiments
! Three-cell matrix to study low voids (flux only) vs. paste with
two reflow profiles; used same solder volume for all cases
! Paste: standard profile: slow ramp to 160°C @ 60°C/min,
dwell @ 150-175°C, spike to 215° (65 seconds in liquidus)
! Paste: modified profile: quick ramp to peak 215°C @
75°C/minute (60 seconds in liquidus)
! Flux profile same as paste standard profile
! X-ray imaging for void size and count, cross-section for
standoff height determination
! Twenty solder joints/cell analyzed for voids size and count
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
80
60 Paste
40 Attach
Void Count 20
0 Flux Attach
0 to 1
3 to 4
6 to 7
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
! Dye penetrant analysis revealed that a few voids DO NOT appear to
have an effect on attachment reliability.
! Same Fracture Lengths at Both Voided and Void-Free Joint Interfaces.
! Fractures Observed to Grow Through Bulk Solder Between Voids and Pad
Usually Bisecting Void Well away from Its Maximum Diameter:
Line Added
Along Fracture
Fractures Propagate Front for
Clarity
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Solder Joint Voids
! Conclusions
! “Standard” and “Modified” reflow profiles resulted in similar
void density for the given solder paste (~10 voids/joint on
average)
! Solder paste samples had percent voided area from 0.47% to
23.7%, with a mean of 7.1%. Flux (only) sample had a mean
voided area of 0.15%
! Solder joint voiding up to 24% of pad area causes no
degradation on solder joint reliability
! Reliability improvement in voided parts (by 16% over parts
without voids) partially explained by greater standoff height
! Voids, while not altering crack propagation path, slowed crack
propagation by forcing re-initiation of crack
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Presentation
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Rework
Key Points for Special Effort in
Characterization to avoid rework
! Bare board quality
! Solderable pads
! Mask not encroaching on pads areas
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Rework
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Rework
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or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Rework
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or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Rework
Solder Application
! No additional solder needed. Apply flux only. (For High Reliability
assemblies, see below *.)
! Flux should be compatible with production cleaning strategy and applied
uniformly but sparingly
* For assemblies requiring high reliability, use a mini-stencil for solder paste
application, resulting in more solder volume and a taller component
standoff. Use of solder paste or flux only must be made on an assembly
by assembly use basis.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Rework
Reflow
! Preheating of entire board may be advisable, especially with large
multilayer boards, to prevent board warpage
! Characterize temperatures to provide uniform heat and ramp rates
similar to reflow furnace
! Non uniform heat and fast ramp rates can cause PBGA to warp or
cause non uniform collapse of solder balls.
Cleaning
! If cleaning is required use standard production cleaning method.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Rework
Rework Summary
! The rework process goal is joint structure and quality at
least as good as the initial assembly.
! Robust initial assembly process reduces the need for
reworking Ball Grid Array packages.
! Removing and replacing a PBGA is easier than for a QFP,
but individual solder joints cannot be repaired.
! BGA package rework can be accomplished with off-the-shelf
equipment.
! The entire rework process must be carefully characterized.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Presentation
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
FR4/Glass PCB
(15-21 ppm/°C) Copper Planes, Solder Pads, Traces
and Die Flag (17 ppm/°C)
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
80 Board 60 125°C
100°C
60 40 -40°C
0°C
20
40
0
20 -20
-40
0
-60
-20 -80
0 5 10 15 20 25 0 10 20 30 40 50 60
Time (minutes)
Time (minutes)
Typical Profile for 0 to 100°C Testing Typical Profile for -40 to 125°C Testing
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
Devices
for Interim
Score Line for Break- Analysis
Continuously Monitored Devices away Removal
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or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
Outer 1 2 3 4 5 6 7 8 9 10 12 14 16 18 20
A
Common B
C
D
E
F
G
H
J
K
L 27 mm
M Body
N
P
R
T
U
V
W
Y
1.27 mm Pitch
PBGA Traces
Test Board Traces
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
%
Packages 225 PBGA Row
Failed Group Breakdown
Thermal Cycles
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
Note Downward
Curvature in Data
Indicating Potential
% Better Fit to a 3P
Packages Weibull Distribution
Failed
Thermal Cycles
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
0 to 100°C Board-Level Testing Results for Both SMD
and NSMD 361 PBGA Packages Versus 144 TQFP
SMD Pkgs NSMD Pkgs
}
}
Pkg Pad Type/Test Brd
Pad Type/Diameter (mm)
SMD/NSMD/0.55
NSMD Improve-
SMD/NSMD/0.60
ment in Range NSMD/ SMD/0.52
of from 3.0 to 5.5X NSMD/ SMD/0.58
SMD/ SMD/0.52
SMD/ SMD/0.58
NSMD/NSMD/0.55
NSMD/NSMD/0.60
144 TQFP
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or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
%
Packages
Failed
Thermal Cycles
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or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
Conclusions from PBGA Package and
Board Solder Pad Configuration Study
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
1.27 mm Pitch Plastic Ball Grid Array Versus
Leaded Package Comparison in -40 to 125°C
PBGA Pkgs Leaded Pkgs
}
} Note: All PBGA
packages shown
are SMD and have a
0.56 mm thick BT
substrate except
361 which is 0.36
mm.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Joint Failure Analysis
Using Cross-Sectioning
Fracture Propagating
Through Eutectic Solder
Near the Solder Pad
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or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
Failure Analysis Using Dye Penetrant
• Dye Penetrant Analysis to Observe and Quantify Fractures Faster than
X-Sectioning.
• Yields More Information about Fracture Propagation Lengths and
Location.
• Procedure:
» Clean Assembly after Removal from Cycling for Improved Penetration.
» Flush with Dye Penetrant (Red Layout Dye Used with Excellent Results).
» Place in Vacuum (Optional).
» Bake Assembly at 100°C for -10 Minutes or Until Dye is Dry.
» Mechanically Remove Device to Reveal Dyed Fracture Surfaces.
• Worst-Case Fracture Lengths Observed Are Indication of Time Until
Expected Failure.
• Distribution of Fracture Lengths Around Device Indication of Joints
Stress/Strain Distribution.
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or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
PBGA Reliability
PBGA Dye Penetrant Analysis (Cont.)
• Examples of 361 Pin PBGA Fracture Progression in 2 Cycle Conditions:
Secondary Crack Primary Crack
• 0 to 100°C,30 Minute Cycle:
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
Summary and Conclusions
• BGA Is Possibly the Ideal Packaging Technology.
• PBGA, CBGA and CCGA Shown to Provide a Reliable Package and
Interconnect Through Field Experience and Lifetime Prediction in a Wide
Variety of Applications.
– Computers (PC Cards, Laptops, Desktops, Workstations and Mainframes).
– Communications (Pagers, Two Way Radios, Cellular Phones, Large Outdoor and Office-
Based Switching Systems).
– Other (Camcorders, Satellites, Automotive, Set-Top Boxes).
• Suitability to Other Applications (Military, Automotive-Under-the-Hood).
• When Possible, the Use of Thicker Substrates, Perimeter or “Enhanced”
PBGA May Make Solder Joint Lifetimes Independent of Silicon Mismatch
and Increase Solder Joint Reliability.
• For PBGA, Pad Configuration (Type and Diameter) Can Greatly Affect
Reliability.
• NSMD Pads Appear to Offer Reliability Advantages Over Traditional SMD
Pads and Motorola Has Implemented Them on Select Wire-Bonded and
Flip-Chip PBGA Designs.
• Voiding Present in PBGA Solder Joints Assembled with Solder Paste
Appears to Result in Slightly Increased Reliability.
TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product
or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.