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Alliance Memory - 4M - AS6C4016A Rev 2.0 May 2016 PDF
Alliance Memory - 4M - AS6C4016A Rev 2.0 May 2016 PDF
Revision History
Alliance Memory Inc. 511 Taylor Way, San Carlos, CA 94070 TEL: (650) 610-6800 FAX: (650) 620-9211
Alliance Memory Inc. reserves the right to change products or specification without notice
PRODUCT FAMILY
Power Dissipation
Operating
Product Family Vcc Range Speed Standby Operating PKG Type
Temperature
(ISB1, Typ.) (ISB1.Max.)
KGD
Industrial
AS6C4016A 2.7 ~ 3.6V 45 ns 0.25 µA2) 3 mA VFBGA-48
(-40 ~ 85°C)
44-TSOP2
2. Typical values are measured at Vcc=3.3V, TA=25°C and not 100% tested.
Pre-charge Circuit
A0
VCC
A1
VSS
Row Select
A2
A3 Memory Array
A4
A5
A6 2048 x 2048
A7
A8
A9
A10
Data
DQ0 ~ DQ7 Cont
I/O Circuit
DQ8 ~ DQ15 Data
Cont
Column Select
WE
OE
UB Control Logic
LB
CS
PIN CONFIGURATIONS
VFBGA-48 : Top view(ball down) 44 - TSOP2 : Top view
1 2 3 4 5 6
A4 1 44 A5
A3 2 43 A6
A LB OE A0 A1 A2 NC A2 3 42 A7
A1 4 41 OE
A0 5 40 UB
B DQ8 UB A3 A4 CS DQ0
CS 6 39 LB
DQ0 7 38 DQ15
DQ1 8 37 DQ14
C DQ9 DQ10 A5 A6 DQ1 DQ2
9
DQ2 36 DQ13
DQ3 10 35 DQ12
D VSS DQ11 A17 A7 DQ3 VCC VCC
VSS
11
12
44 - TSOP2 34
33
VSS
VCC
DQ4 13 32 DQ11
E VCC DQ12 NC A16 DQ4 VSS DQ5 14 31 DQ10
DQ6 15 30 DQ9
DQ7 16 29 DQ8
F DQ14 DQ13 A14 A15 DQ5 DQ6 WE 17 28 NC
A17 18 27 A8
A16 19 26 A9
G DQ15 NC A12 A13 WE DQ7
20
A15 25 A10
A14 21 24 A11
H NC A8 A9 A10 A11 NC A13 22 23 A12
PIN DESCRIPTION
Name Function Name Function
FUNCTIONAL DESCRIPTION
CS OE WE LB UB DQ0~7 DQ8~15 Mode Power
H X X X X High-Z High-Z Deselected Stand by
X X X H H High-Z High-Z Deselected Stand by
L H H L X High-Z High-Z Output Disabled Active
L H H X L High-Z High-Z Output Disabled Active
L L H L H Data Out High-Z Lower Byte Read Active
L L H H L High-Z Data Out Upper Byte Read Active
L L H L L Data Out Data Out Word Read Active
L X L L H Data In High-Z Lower Byte Write Active
L X L H L High-Z Data In Upper Byte Write Active
L X L L L Data In Data In Word Write Active
NOTE : X means don’t care. (Must be low or high state)
1. Typical values are measured at Vcc=3.3V, TA=25oC and not 100% tested.
AC OPERATING CONDITIONS
Test Conditions (Test Load and Test Input/Output Reference)
Input Pulse Level : 0.4 to 2.2V
Input Rise and Fall Time : 5ns VTM3)
Input and Output reference Voltage : 1.5V
Output Load (See right) : CL1) = 100pF+ 1 TTL(70ns), CL1) = 30pF + 1 TTL(45ns/55ns) R12)
TIMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS=OE=VIL, WE=VIH, UB or/and LB=VIL)
tRC
Address
tAA
tOH
tRC
Address
tAA
tOH
CS tCO
tHZ
tBA
UB,LB
tBHZ
tOE
OE
tOLZ tOHZ
Data Out High-Z
Data Valid
tBLZ
tLZ
tWC
Address
tCW(2) tWR(4)
CS
tAW
tBW
UB,LB
tWP(1)
WE
Address
CS
tAW
tBW
UB,LB
tWP(1)
WE
tDW tDH
tWC
Address
tCW(2) tWR(4)
CS
tAW
tBW
UB,LB
tAS(3) tWP(1)
WE
tDW tDH
Vcc
2.7V
2.2V
VDR
CS > Vcc-0.2V
CS
GND
A
A1 CORNER
B
e/2
C
D
E E1
E
7X e F
G
H
48X b 1)
5X e 0.15 M Z X
0.1 Z 0
0.08 M
e/2
D1
DETAIL K 3)
0.1 Z
(A3)
A
(A2) 0.08 Z
M M
A1
Z 2)
Min. NOR. Max.
DETAIL K
SEATING
A --- 1
PLANE
A1 0.22 0.32
NOTES.
A2 0.21 REF
A3 0.45 REF 1). DIMENSION b IS MEASURED AT THE MAXIMUM
b 0.32 5.25 0.42 SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z.
2). DATUM Z (SEATING PLANE) IS DEFINED BY THE SPHERICAL
D 6 BSC CROWNS OF THE SOLDER BALLS.
E 7 BSC 3). PARALLELISM MEASUREMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.
e 0.75 BSC
D1 0.35 BSC
E1 5.25 BSC
Ordering Information
VCC Speed
Alliance Organization Package Operating Temp
Range ns