KEC SEMICONDUCTOR KIA7805AP/API~ See remanent TECHNICAL DATA KIA7824AP/API RIPOLAR LINEAR INTEGRATED CIRCUIT THREE TERMINAL POSITIVE VOLTAGE REGULATORS: 8V, BV, 8V, 9V, 1OV, 12V, IBV, 18V, 20V, 24V. £ Suitable for C-MOS, TTL, the Other *E | == Digital 1C’s Power Suppl. ! ani + Internal Thermal Overload Protection | [a Tntemal Short Circuit Current Limiting. | tsa Output Current in Excess of 1A + ae + Satisfies IEC-€5 Specification. T 4 ee ae {International Eletronical Commission) SFL | ime of ar MAXIMUM RATINGS (Ta=250) ube! —Z CHARACTERISTIC SYMBOL | RATING | UNIT : we i coos IATROGAP/API~ = Sion CE Teput Votage [BIATBISAP/APL | _ rer Volage TRraTagar/ari=] Vf as IATEOAAP/APL TO-220AB Power Dissipation (Te-25%0) wm | 23 | w Power Dissipation | KIATSREAPI~ ; Without Heatsink) | Kiaveeaapr | PP [| 20 |W i Operating Jumetion Temperanne | 7% | -s0~150 | 0 : Storage Temperature Toe c . TO-22018, 198, 2.4 Revision No 1 KEC visKIA7805AP/API ~ KIA7824AP/API EQUIVALENT CIRCUIT (@ common (ann) 3) ovreur ea oa \8, Bed 3 a ee aesaal | evaneeaas S| eS al TY ar" ree O64 Pe zg KEC Revision No! 1 1908. 12. 4KIA7805AP/API ~ KIA7824AP/API KIATS06AP/APL ELECTRICAL CHARACTERISTICS (Vin=10V, Ioor=500mA, 00 ST)S1250) ; TEST, pa ‘ CHARACTERISTIC, SYMBOL | Heuer "TEST CONDITION MIN. | Typ, | Max, | UNIT Output Voltage Voor 1 | 125%, Torr=100mA 48 | so | 52] v OVE Van <250 ale See in Input Regulation Reg tine | 1 | 125 nV 80VEVis 12 - fa | x smAslursi4a | - | 15 | 100 Lead Regulation Reg od | 1 mv - | 6 | Output Vottaze Voor 1 475 | - | 525) v Quiescent Curent Ib 1 - | 42 | 80 | ma Quiescent Current Change ls 1 - | = | 13 | ma Output Noise Voltage Vo 1 ~ fo] - |e Ripple Rejection Ratio RR 1 el} m| - | a Dropout Voltage Vo 1 | toor=L.0a, 1-25 - ja]- |v Short Cireuit Current Limit Ise 1 | nea - fis] - ja Average Temperature Coefficient of TC 1 | toor-Sma, OC ET} EIT - |-06 | - favre Output Vottaze 198, 124 Revision No: 1 KEC angKIA7805AP/API ~ KIA7824AP/API KIATSIGAP/APL ELECTRICAL CHARACTERISTICS (Vor-11V,_kur-SmA,_ 00ST, S 5 E TEST ‘ CHARACTERISTIC syMBoL | orci] TEST CONDITION in. | TyP, | Max. | UNIT Output Voltaze Your 1 TC, Tove HOOms s75 | 60 | a5 | v sovevwsev | - | 4 | 1 Toput Regulstion Rea line | 1 mv Vs Vavs13V -|2| smAskersi4a | - | 15 | 120 Load Regulation Rey load | mv ons skursisona] - | 8 | @ 8VsVns21V le Output Voltage Your ee ay or sa |v Quiescent Curent b 1 ToS - | 43 | a0 | ma Quiescent Carrent Change as 1 - | = | a | ma Output Noise Voltage Vo 1 ~ |B] | ev F122, WW SVnnss 19, eee tee a Ripple Rejection Ratio RR eee a Dropout Vattage Yo 1 | Teor .04, - |] - |v Short Circuit Current Limit ke 1 - fas] - fa “Average Temperature Coeticent of Tov 1 |toorsSma, owsTs1e | - |-o7 | - |mvre Output Voltage 1908, 12.4 Revision No = 1 KEC a9KIA7805AP/API ~ KIA7824AP/API KIA7SI8AP/API ELECTRICAL CHARACTERISTICS (Vne=1MV, lov : TEST aa 7 CHARACTERISTIC SYMBOL | Route TEST CONDITION MIN, | ‘Typ, | MAX. | UNIT Output Vottage Vour 1 | 125%, tave-200imA at | 0 | a3 | v 105V SVs 50 - | 6 | 160 Input Regulation Reg tine | 1 | Te25C mV VS Vas 17V - | 2 | @ SmA Vise dode. (3) When the inpat voltage is too high, the power dissipation of three terminal regulator increase because of series segulator, so that the junction temperature rises, Jn such a case, it is recommended to reduce the power dissipation by insesting the power limiting resistor Rep in the input terminal, and to reduce the junction temperature as a result 1968.12, 4 Revision No : 1 KEC 1519KIA7805AP/API ~ KIA7824AP/API Your 0.83uF Ie ‘Tho power dissipation Pp of IC 3s expressed in the following equation, Pp = (Vav'-Voon) + Jour + Vay’ + Io 1f Va’ is reduced below the lowest voltage necessary for the I oscillation will be caused according to circumstances Jn determining the resistance value of Reo, design with margin should be made by making reference (0 the following equation, the parasitic Vou ~ Vas" Teor * ip (4) Connect the input terminal and GND, and dhe output terminal and GND, by capacitor respectively. The capacitances should be determined experimentally because they depend on printed pattems, In particular, adequate investigation should be ‘made so that there is no problem even at time of high or low temperature Reo < (6) Installation of IC for power supply For obtaining high veliability on the heat sink design of the regulator TC, it is ‘generally required to derate move than 20% of maximum junction temperature CT) MAX.) Further, full consideration should be given to the installation of IC to the heat sink, (a) Heat sink design ‘The thermal resistance of IC itself is required from the viewpoint of the design of elements, but the thermal resistance from the IC package to the ‘open air varies with the contact thermal zesistance. ‘Table 1 shows how much the value of the contact thermal resistance (Bc +3) is changed by insulating sheet (mica) and heat sink grease. TABLE 1. UNIT: C/W PACKAGE | MODEL NO. [TORQUE | MICA are ‘TO-208B KIATExxAP ‘Skgeem BL Beatiad eee Provided 202514080) ‘The figures given in parentheses denote the values at time of no grease. ‘The package of regulator IC serves as GND, therefore, usually use the value at time cof "no mica” 198,124 Revision No #1 KEC 119KIA7805AP/API ~ KIA7824AP/API 4b) Silicon grease ‘When a circuit not exceeding maximum sating is desivned, it is to be desired that the grease should be used if possible. Tf it is required that the contact thermal resistance is reduced from the view-point of the circuit design, It is recommended that the folowing metheds be adopted At Use Thercon (Fuji High Polymer Kogyo K.K) B: Use SCIOL (Torei Silicon) or G-640 (GE, if grease is used. {fe} Torque ‘When installing 1C on a heat sink or the like, tighten the IC with the torque of Jess than the rated value, If i¢3s Gghtened with the torque in excess of the rated value, sometimes the interual elements of the IC are adversely affected. ‘Thecefore, great care should be given to the installing operation. Fucther, if polvearbonate screws are used, the torque causes a change with the passage of time, which may Jessen the effect of radiation, (6) TEC Cntemational Blectronical Commission)-G5 Specification (a) IBC (ntemational Electronical Commission)-65 is the standard, parts testing method, machinery and tolls (used in connecting main power directly and indirectly) Which are used at home and general building ‘The purpose of the above standard is uot to breaking out the risk which is related to an electsic shock, a heating, a fire and the damage of swrounding parts in the ease of normal ar abnormal operating 4b) Incase temperature is limited by temperature overheating. prevention device, fase or the operation of fuse resister One must calculate the temperature of PCB substrate ia 2 minute ATSUOC regulated AT=Tetbe ROB sibarste tenpersiee in 2 minite) ~Talnten tomers) fe} Graph 2 IsefA) 120 tme(second) As the territory of the deviant line appear by the heat, as the area is wider, ‘Tire PCB subseste tempersnze in 2 mise) 8 becoming. high. 1908. 12, 4 Revision No #1 KEC 19KIA7805AP/API ~ KIA7824AP/API g BIAS CURRENT RIPPLE REJECTION RATIO. RR (aX) 1908, 12, 4 Ip - 7 Voor 5 cs El pera aa z ae fou & Tour =8.0mA, eee oo 80 00D oo 6o ao JUNCTION TEMPERATURE Tj (°C) JUNCTION TEMPERATURE Tj (“C) RR — Tour Vn — Isc = 1a / a 5 ake a i iw =10V (BAPN) = eet (104 5 (eta 3 ° 10 80 80 190300 500 L000 eee ag ae eget OUTPUT CURRENT tour (ma) Revision No! 1 KEC INPUT VOLTAGE vin. (W) 19/19KIA7805AP/API ~ KIA7824AP/API E Pp - Ta ae fa cee ae : THERMAL RESISTANCE = Z 2 e: Tepes s 5 | Leo Tees |" g2 — BR. C7] (KIATBOOAP Series) 2 || tou g : ; = ed 8 toms | 1 2 a g ~~ é g 54 mignon fe Bec = 0 cole eedon aoa E08 ao tp seo ae JUNCTION TEMPERATURE 1) (C) a AMBIENT TEMPERATURE Ta (°C) Zour - t z Pp - Ta S osm om Sana maa : THERA, RESISTANCE Bos fo & 2 a ett g E eo) on | 8 = ie TKIATCODAP Series) a 5 ow & OL a a Boe 5 0s 4 fentiou ar E 3 sive 2 008 Fe oe a a coe eon an eerien dtnentetiena, FREQUENCY f(a) 3 AMBIENT TEMPERATURE Te (°C) 18.124 Tevson No: | KEC rao