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01 Cyclical Surface Chipping P1 PDF
01 Cyclical Surface Chipping P1 PDF
kezuru
DISCO CORPORATION
PS Company
Precision Diamond Planning Dept.
migaku
Cyclical Surface Chipping _ Part 1
The range of devices and materials processed Based on calculations with spindle rpm and feed rate, the
with diamond blades has broadened chipping interval in Photo 2 is consistent with the hypothesis
considerably in recent years, and many of you that the chipping was caused by a single problem area on the
periphery of the blade (Fig. 3).
are seeking to increase processing quality as
you strive for further miniaturization and better Blade Progress
cost performance. DISCO continues to work
on ways to reduce chipping but eliminating the
problem completely with brittle materials like
silicon won't be easy. Blade
Revolution
In this newsletter, we will address some of the
known causes of chipping in the hopes that
understanding our blades a little better will Problem
Area
assist you in identifying and solving problems
Chipping
at their early stages.
Fig.3: Cyclical Chipping Model
Surface chipping can be divided into three types (Fig. 1). This Regular Interval
issue will focus on cyclical surface chipping.
Initial Chipping
Calculation of chipping interval (µm)
Surface
Cyclical Chipping feed rate (mm/sec) x 60
Chipping x1000
spindle rotation (rpm)
Other Chipping
Fig.1: Types of Surface Chipping
"Problem areas on the periphery of the blade" have generally
been thought to result from external influences such as
Three factors are known to cause cyclical chipping (Fig. 2).
foreign matter or impact. Recently, however, abnormally large
This issue addresses grit, a factor whose relationship to
grit has also been shown to exert a similar influence (Fig. 4).
chipping has only recently been confirmed. The relationship
of foreign matter and impact to cyclical chipping will be
addressed in future issues of this newsletter, as will the other
Impact
types of surface chipping.
Impact
Photo 3 Photo 4
Cyclical
Grit
Chipping
Photo 6 Photo 7
Cuts made in DISCO test mirror wafer Fig.5: Diagram of Photographed Locations
Since separating the grit one grain at a time is impractical, the elutriation* process Elutriation is perhaps the most common
is generally used (Fig. 7). * way to separate very small grit. Crushed
diamond grit is mixed in a fluid and
separated by the difference in the speed at
which they precipitate
Frequency(%) Accumulation(%)
25 100
20 80
15 60
10 40
5 20
Coarse Intermediate Fine
0 0
Fig.7: Outline of Elutriation 0.1 1 10 100 1000
Grit size(µm)