PROBLEM 3.

134
KNOWN: Geometry and cooling arrangement for a chip-circuit board arrangement.
Maximum chip temperature.
FIND: (a) Equivalent thermal circuit, (b) Maximum chip heat rate.
SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions, (2) One-dimensional heat transfer in chip-

board assembly, (3) Negligible pin-chip contact resistance, (4) Constant properties, (5)
Negligible chip thermal resistance, (6) Uniform chip temperature.

PROPERTIES: Table A.1, Copper (300 K): k ≈ 400 W/m⋅K.

ANALYSIS: (a) The thermal circuit is

θb cosh mL+ ( h o / mk ) sinh mL

Rf = =
( o c,f ) 
16q f 16 h PkA 1/ 2 sinh mL+ h / mk cosh mL 
( o ) 
(b) The maximum chip heat rate is
q c = 16q f + q b + qi .
Evaluate these parameters
1/ 2 1/ 2 1/ 2
 h P   4h   4 × 1000 W/m 2 ⋅ K 
m= o  = o  =  = 81.7 m-1
 kAc,f  kDp   400 W/m ⋅ K × 0.0015 m 
     

(
mL = 81.7 m-1 × 0.015 m = 1.23, ) sinh mL = 1.57, cosh mL = 1.86

1000 W/m 2 ⋅ K
( h/mk ) = = 0.0306
81.7 m-1 × 400 W/m ⋅ K

( )
1/ 2
M = h oπ D p kπ Dp2 / 4 θb

( ) (55 C) = 3.17 W.
1/ 2
M = 1000 W/m 2 ⋅ K π 2 / 4 ( 0.0015 m ) 400 W/m ⋅ K  $
3
 
Continued …..
 PROBLEM 3.134 (Cont.)
The fin heat rate is
sinh mL+ ( h/mk ) cosh mL 1.57+0.0306 × 1.86
qf = M = 3.17 W
cosh mL+ ( h/mk ) sinh mL 1.86+0.0306 × 1.57
q f = 2.703 W.
The heat rate from the board by convection is

q b = h o A bθ b = 1000 W/m 2 ⋅ K ( 0.0127 m ) − (16π / 4 )( 0.0015 m )  55$ C

2 2
 
q b = 7.32 W.
The convection heat rate is

qi =
Tc − T∞,i
=
(0.0127 m )2 (55 C)$

(1/hi + R ′′t,c + Lb / k b ) (1/ Ac ) (1/40+10-4 + 0.005 /1) m2 ⋅ K/W

qi = 0.29 W.
Hence, the maximum chip heat rate is
q c = 16 ( 2.703) + 7.32 + 0.29  W = [43.25 + 7.32 + 0.29] W

q c = 50.9 W. <
COMMENTS: (1) The fins are extremely effective in enhancing heat transfer from the chip

( )
(assuming negligible contact resistance). Their effectiveness is ε = q f / π Dp2 / 4 h oθ b = 2.703

W/0.097 W = 27.8
2 2
(2) Without the fins, qc = 1000 W/m ⋅K(0.0127 m) 55°C + 0.29 W = 9.16 W. Hence the fins
provide for a (50.9 W/9.16 W) × 100% = 555% enhancement of heat transfer.
2
(3) With the fins, the chip heat flux is 50.9 W/(0.0127 m) or q′′c = 3.16 × 105 W/m 2 = 31.6
2
W/cm .
(4) If the infinite fin approximation is made, qf = M = 3.17 W, and the actual fin heat transfer
is overestimated by 17%.