Workshop 2 Circuit Board and Chips Using Conduction and Heating

WORKSHOP 2
CIRCUIT BOARD AND CHIPS USING

CONDUCTION AND HEATING
NAS104, Workshop 2, March 2004

Copyright 2004 MSC.Software Corporation WS2-1
 Problem Description
 Create model of a PCB and five chips connected to it with

epoxy. Only 3D hexahedral conduction elements are used. The
boundary conditions consist of heat flux applied to the free
faces of the chips, and fixed temperature for the sides of the
model. A steady-state thermal analysis is to be performed.

 Suggested Exercise Steps
1. Create a new database
2. Specify the tolerance
3. Create surfaces and curves for modeling
4. Create chain curves for trimmed surfaces
5. Trim trimmed surfaces
6. Mesh the surface for the circuit board
7. Create a Group for Base Component
8. Mesh the surfaces for the components
9. Create a group for epoxy material
10. Create elements for the epoxy
11. Create a Group for Chips
12. Create elements for the Chips
13. Create a group for circuit board
14. Create elements for the circuit board
15. Connect elements using equivalence
 Suggested Exercise Steps (continued)
16. Find element free edges using verify boundaries
17. Define material
18. Define property for PCB
19. Define property for chips
20. Define property for epoxy
21. Post all groups
22. Select picking preference
23. Apply heat flux
24. Apply boundary temperature
25. Create the analysis file
26. Run MSC.Nastran thermal
27. Access the results file
28. Display the results
29. Quit MSC.Patran

Step 1: Create New Database
Create new database

a. File: New
b. Enter pcb for File name.
c. Click OK.
b c

Step 2: Specify the Tolerance
b
Specify the tolerance
a. File: New…
b. Select Default for Tolerance.
c. Select MSC.Nastran for
Analysis Code.
d. Select Thermal for Analysis
Type. c
e. Click OK.
d

Step 3: Create Surfaces and Curves for Modeling
Create the surface representing the

printed circuit board.
a. Geometry:
Create/Surface/XYZ
b. Enter <6.5 5.4 0> for Vector a
Coordinates List.
c. Enter [0 0 0] for Origin
Coordinates List.
d. Click Apply.
e. Enter <0.75 0.875 0> for Vector
Coordinates List.
f. Enter [5 3.5 0] for Origin
Coordinates List. b e
g. Click Apply.
c f
d g

Step 3: Create Surfaces and Curves for Modeling (Cont.)
Create the surface representing the

printed circuit board
a. Geometry: e
Create/Surface/XYZ a
b. Enter <1 1 0> for Vector
Coordinates List.
c. Enter [1 1.5 0] for Origin
Coordinates List. f
d. Click Apply.
e. Geometry: Create/Curve/2D
Circle. g
f. Click Input Radius
g. Enter 0.75 for Circle Radius
b
h. Enter [3.5 3 0] for Center Point
List.
i. Click Apply
c
h
d

Step 3: Create Surfaces and Curves for Modeling (Cont.)
Create two circular components

a. Geometry: Create/Curve/ 2D
Circle a
b. Click Input Radius for Circle
Radius.
c. Enter [4.5 1.5 0] for Center
Point List.
d. Click Apply.
e. Enter [1.5 4 0] for Center Point b
List.
f. Click Apply.
c e
d
f
Step 4: Create Chain Curves for Trimmed Surfaces
Create curve chain

a. Geometry:
Create/Curve/Chain. a
b. Enter Surface 1.4 1.3 1.2 1.1
for Curve List.
c. Click Apply.
d. Enter Surface 2.4 2.3 2.2 2.1
for Curve List.
e. Click Apply.
f. Enter Surface 3.4 3.3 3.2 3.1
for Curve List. b d f
g. Click Apply.
c e g

Step 5: Create Trimmed Surfaces
Create trimmed surfaces that will

represent the components and
the circuit board.
a
a. Geometry:
Create/Surface/Trimmed.
b. Select Planar for Option.
c. Enter Curve 4 for Outer Loop
List.
b
d. Enter Curve 2 1 6 3 5 for Inner
Loop List.
e. Click Apply.
f. Click NO for Do you wish to
delete the original curves?
e
Step 5: Create Trimmed Surfaces (Cont.)

the circuit board. a
a. Geometry:
Create/Surface/Trimmed
b. Select Planar for Option. e
c. Select Curve 2 for Outer Loop
List. b
d. Click Apply.
e. Click NO for Do you wish to
d

a. Geometry:
b. Select Curve 1 for Outer Loop
List.
c. Click Apply.
d. Click NO for Do you wish to


a. Geometry:
b. Select Curve 3 for Outer Loop
List.
c. Click Apply.
d. Click NO for Do you wish to
c
Step 6: Mesh the Surface for the Circuit board
Mesh the surface for the circuit

board.
a
a. Elements:
Create/Mesh/Surface
b. Select Quad for Elem Shape.
c. Select Paver for Mesher.
d. Select Quad4 for Topology.
e. Select Surface 4 for Surface
List. b
f. Enter 0.1 for Value of Global c
Edge Length. d
g. Click Apply.
g
Step7: Create a Group for Base Component
Create group for base

component
a. Group/Create…
b. Enter base_component.
c. Click Apply.

Step 8: Mesh the Surfaces for the Components
Mesh the surfaces for the components. a

a. Elements: Create/Mesh/Surface
b. Select Quad for Elem Shape.
c. Select Paver for Mesher.
d. Select Quad4 for Topology.
e. Enter Surface 7 6 5 3 2 for Surface
List. b
f. Enter 0.1 for Value of Global Edge c
Length. d
g. Click Apply.

Step 9: Create a Group for Epoxy Material
Create a group for epoxy material.

a. Group/Create…
b. Enter epoxy for New Group
Name.
c. Click Apply.
c
Step 10: Create Elements for the Epoxy
a
Mesh the epoxy
a. Elements:
Sweep/Element/Extrude.
b. Click Mesh Control…
c. Enter 2 for Number.
d. Click OK.
e. Enter <0 0 1> for Direction
Vector.
b
f. Enter 0.01 for Extrude Distance.
g. Enter 0.0 for Offset.
h. Enter Surface 7 2 6 3 5 for c
Base Entity List.
e
i. Click Apply.
f
d
g
h
i
Step 11: Create a Group for Chips
Create a group for chips.

a. Group/Create…
b. Enter Chip for New Group
Name.
c. Click Apply.

Step 12: Create Elements for the Chips
a
Create elements for the chips.
a. Elements:
b. Enter <0 0 1> for Direction
Vector.
c. Enter 0.4 for Extrude Distance.
d. Enter 0.01 for Offset.
e. Enter Surface 7 3 6 2 5 for
Base Entity List.
f. Click Apply.
e
f
Step 13: Create a Group for Circuit Board
Create a group for circuit board

a. Group/Create…
b. Enter circuit_board for New
Group Name.
c. Click Apply.
c
Step 14: Create Elements for the Circuit Board
a
Create elements for the circuit board.
a. Elements:
b. Enter <0 0 –1> for Direction Vector
c. Enter 0.2 for Extrude Distance.
d. Enter Surface 2:7 for Base Entity
List.
e. Click Apply.
d
e
Step 15: Connect Elements
a. Elements:
Equivalence/All/Tolerance
Cube.
b. Enter 0.005 for Equivalencing
Tolerance. a
c. Click Apply.
b
c

Step 16: Find Element Free Edges
Verify boundaries
a. Elements:
Verify/Element/Boundaries.
a
b. Select Free Edges for Display
Type.
c. Click Apply.

Step 17: Define Material
Define material of glue.

a. Materials: Create/ Isotropic/
Manual Input.
a
b. Enter glue for material name.
c. Click Input Properties. d
d. Enter 0.2 for Thermal
Conductivity.
e. Click OK.
f. Click Apply.
c
e
f
Step 17: Define Material (Cont.)
Define material of components.

a. Materials: a
Create/isotropic/manual
Input. d
b. Enter component for Material
Name.
c. Click Input Properties..
Conductivity.
e. Click OK.
f. Click Apply.
e
c
f
Step 17: Define Material (Cont.)
Define material of circuit board.

a. Materials: a
Create/Isotropic/Manual
Input. d
b. Enter circuit_board for Material
Name.
c. Click Input Properties…
Conductivity.
e. Click OK.
f. Click Apply.
c e
f
Step 18: Define Property for PCB
Post circuit board group.

a. Group/Post…
b. Select circuit_board
c. Click Apply.
b
c
Step 18: Define Property for PCB (Cont.)
Define property for pcb. d

a. Properties: Create/3D/Solid a
b. Enter pcb for Property Set
name.
c. Click Input properties…
d. Click in the material Name box
and select circuit_board under
Material Property Sets.
e. Click OK. b
f. Select the entire of the screen
for Select Members. e
g. Click Add.
h. Click Apply. c
f
g
h
Step 19: Define Property for Chips
Define property for chips

a. Group/Post…
b. Select chip for Select
Groups to Post. b
c. Click Apply.
c
Step 19: Define Property for Chips (Cont.)
Define property for chips

a. Properties/Create/3D/Solid
a
b. Enter chip for Property Set
name.
c. Click Input Properties… d
d. Click in the Material Name box
and select component under
material Property Sets.
e. Click OK.
b
f. Select the entire of the screen
for Select members.
g. Click Add.
h. Click Apply
c
f
g
h e
Step 20: Define Property for Epoxy
Define property for epoxy

a. Group/Post…
b. Select epoxy for Select
Groups to Post.
c. Click Apply.
b
c
Step 20: Define Property for Epoxy (Cont.)
Define property for epoxy

a. Properties: Create/3D/Solid
b. Enter epoxy for Property Set a
Name d
c. Click Input properties…
d. Click in the Material Name box
and select glue under Material
Property Sets.
e. Click OK.
b
f. Select the entire screen for
select Members.
g. Click Add.
h. Click Apply. c
f
g
e
h
Step 21:Post All Groups
Post all
a. Group/Post…
b. Select all for Select Groups
to Post. b
c. Click Apply.
c
Step 22: Select Picking Preference
Select picking
a. Preferences: Picking.
b. Select Enclose entire entity for
Rectangle/Polygon Picking.
c. Click Close. b

Step 23: Apply Heat Flux
Apply heat flux

a. Loads/BCs: Create/Applied
a
heat/Element Uniform f
b. Select normal Fluxes for
Option. b
c. Enter heatflux for New Set
name. i
d. Select 3D for Target Element j
Type.
e. Click Input Data…
f. Enter 3 for Heat Flux.
g. Click OK.
h. Click Select Application
Region…
g
c k
i. See figure for Select 3D
Element Faces. d
j. Click Add.
k. Click OK.
e
l. Click Apply.
h
l
Step 24: Apply Boundary Temperature
Apply boundary temperature

a. Loads/BCs: a d
Create/Temp/Nodal.
b. Enter temp_edge for New Set
name.
c. Click Input Data…
d. Enter 40 for Boundary g
Temperature.
e. Click OK. e h
f. Click Select Application
Region…
g. See Figure for Select Nodes.
h. Click Add.
i. Click OK. b
i
c
f g

Step 25: Create the Analysis File
Perform the analysis

a. Analysis:Analyze/Entire b
Model/Analysis Deck.
d
b. Click Translation
parameters… h
c. Select XDB and Print for Data
Output.
d. Click OK.
i
e. Click Solution Type.
f. Select STEADY STATE
ANALYSIS for Solution Type. g
g. Click Solution Parameters.
h. Enter 70 for Default Inlt
Temperature.
i. Click OK.
j
j. Click OK. c
k. Click Apply. f
e
k
Step 26: Run MSC.Nastran Thermal
Run MSC Patran

a. Run MSC Natran.
b. Select pcb.bdf.
c. Click Open
d. Click Run
b c
d
Step 27: Access the Results File
Attach the XDB file

a. Analysis: Attach XDB/Result
Entities/Local
b. Click Select Results File…
c. Select pcb.xdb for File name.
d. Click OK.
e. Click Apply.
c d

Step 28: Display the Results
Display the result. a

a. Results: Create/Quick Plot.
b. Select SC1:DEFAULT, At.. For
Select Result Cases.
c. Select Temperatures for Select b
Fringe Result.
d. Click Apply.
d
Step 29: Quit MSC.Patran
Quit MSC.Patran
a. Select File on the Menu
Bar and select Quit from
the drop down menu


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WORKSHOP 2

CIRCUIT BOARD AND CHIPS USING

NAS104, Workshop 2, March 2004

 Create model of a PCB and five chips connected to it with

NAS104, Workshop 2, March 2004

NAS104, Workshop 2, March 2004

Create new database

NAS104, Workshop 2, March 2004

NAS104, Workshop 2, March 2004

Create the surface representing the

NAS104, Workshop 2, March 2004

Create the surface representing the

NAS104, Workshop 2, March 2004

Create two circular components

Create curve chain

NAS104, Workshop 2, March 2004

Create trimmed surfaces that will

Create trimmed surfaces that will

Create trimmed surfaces that will

NAS104, Workshop 2, March 2004

Create trimmed surfaces that will

Mesh the surface for the circuit

Create group for base

NAS104, Workshop 2, March 2004

Mesh the surfaces for the components. a

NAS104, Workshop 2, March 2004

Create a group for epoxy material.

Create a group for chips.

NAS104, Workshop 2, March 2004

Create a group for circuit board

NAS104, Workshop 2, March 2004

NAS104, Workshop 2, March 2004

Define material of glue.

Define material of components.

Define material of circuit board.

Post circuit board group.

Define property for pcb. d

Define property for chips

Define property for chips

Define property for epoxy

Define property for epoxy

NAS104, Workshop 2, March 2004

Apply heat flux

Apply boundary temperature

NAS104, Workshop 2, March 2004

Perform the analysis

Run MSC Patran

Attach the XDB file

NAS104, Workshop 2, March 2004

Display the result. a

NAS104, Workshop 2, March 2004

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