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Charlies PhimphilaResume09
Charlies PhimphilaResume09
Education:
Work experience
Work well. Then put lebel on the phone wrap up then put in the box
Ship to customer
Align, fit, assemble, connect, and install system components, using jigs, fixtures, measuring instruments,
hand tools, and power tools. Assemble, install, and connect parts, fittings, and assemblies on aircraft, using
layout tools, hand tools, power tools, and fasteners such as bolts, screws, rivets, and clamps. Install and
connect control cables to electronically controlled units, using hand tools, ring locks, cotter keys, threaded
connectors, turnbuckles, and related devices.
Honeywell 02/07-07/08
Machine Operator
Richardson, Texas
Hand-form, cut, or finish workpieces, using tools such as table saws, hand sledges, and anvils. Place
workpieces on cutting tables, manually or using hoists, cranes, or sledges. Position, align, and secure
workpieces against fixtures or stops on machine beds or on dies. Read work orders and production
schedules to determine specifications, such as materials to be used, locations of cutting lines, and
dimensions and tolerances. Read work order, instructions, formulas, or processing charts. Use hand or
power tools.
Calculate etching time based on thickness of material to be removed from wafers or crystals. Clean and
maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work
area. Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer
cleaners, or blow-off wands. Load and unload equipment chambers and transport finished product to
storage or to area for further processing. Maintain processing, production, and inspection information and
reports. Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials
into container, and monitor processing procedures to help identify crystal growing problems. Monitor
operation and adjust controls of processing machines and equipment to produce compositions with specific
electronic properties, using computer terminals. Operate saw to cut remelt into sections of specified size or
to cut ingots into wafers. Place semiconductor wafers in processing containers or equipment holders, using
vacuum wand or tweezers.