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Laser Soldering Process

Enrique Duarte
Thecnical Sesions / Mexitronica
Guadalajara, October 2007
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Enrique Duarte Introduction

• Electronic Engineer
• 14 years of experience
• Last 11 years working for Electronic Industry in Process Engineering Area.
• Companies:
Process Development Engineer

Black Belt (DMAIC), DFSS (New
thecnologies)
2
Purpose:
All information presented in this conference is focused in “Solving Process
Problems” that we have day to day in Flextronics. Using Six Max
Methodologies for existing processes (DMAIC).
Scope:
Based on Laser Soldering Process for SMT connectors that can not be
processed in Reflow Oven because of the plastic properties, they can not
support high temperatures beyond 150°C. Also, the q uantity of connector pins
(200, 300, 400) does not guarantee an acceptable quality soldering by hand.
This project was developed on Flextronics Campus South in Building Five.
Team Members for this project:

Ricardo Pérez, Javier Cervantes, Efrain Amaral, Eduardo Camarena,
Guillermo Barajas, Roberto Reyes, Ruben López, Arturo Nuñes, Leopoldo
Zuñiga, Machine Supplier, Customer.
3
4

Six
SixSigma
SigmaProject
Project Project
ProjectDescription:
Description:
Department:
Department:D&ED&EGuadalajara
GuadalajaraSite
Site –The top detractor (Solder Empty Defect in J1
–The top detractor (Solder Empty Defect inGDL,
J1 is
Connector)
Connector) for
forthe
theCustomer
Customer ininFlextronics
Flextronics GDL, is
Review # R0
Review # R0 generating
generatingananunstable
unstableprocess
process with
withaaCPK
CPK ofof 0.7
0.7
(Laser
(LaserSoldering
SolderingProcess).
Project
ProjectTitle:
Title:Laser
LaserSoldering
SolderingProcess
Process Process).
Project
ProjectLeader:
Leader:Enrique
EnriqueDuarte
Duarte
Customer Issue:
Defects Distribution (by issue)
Solder Issues 7.7%

3.2%
2.6%
2.5% 17.0%
55.6%
Laser Soldering process defects 13.9%
Project
ProjectGoal:
Goal:Reduce
ReduceDefects
Defectsfrom
from2.5%
2.5%to
to Project
ProjectResults:
Results:Defects
Defectsreduced
reducedto
toless
less
0.5%.
0.5%.To
Toprobe
probeififthe
themachine
machineisiscapable
capablewith
with than
than0.5%.
0.5%.The
Themachine
machineisisnot
notcapable
capableto
to
customer requirements
customer requirements . . work with customer requirements
work with customer requirements ..
5
What is the High Level Problem? and Why Is It Important? , Who Are Customers
and Stakeholders?
:
ol s
To
r o ces
s M ap
H
.
elp
. VOC
•P l
n ic a s.
e c h hart
•T C .
r e tos D iag
•P a
on
e
m ent
B ve
sh pr o
•F i I m
ic k
• Qu
Escapes
Escapesto
toChina
China, ,ItItcauses
causesproblems
problemsfunctions
functionsin
inCustomer
Customerproducts
products&&
Operations
Operationslineslinesin
inFlextronics
FlextronicsGuadalajara.
Guadalajara.
6
How many connector families will be involved?, What are the projected business
benefits of this project?, What happen if we dont do anything?

We studied two families Total of Defects
Total Units=
159
30
Total of Defects
Total Units=
9
30
of connectors, each one Oportunities per Unit=
DPU =
300
5.300
Oportunities per Unit=
DPU =
200
0.300
has 50 models, then in DPMO=

Process Capability (Zst)=
17667
2.10
DPMO=
Process Capability (Zst)=
1500
2.97
Process Capability (CP)= 0.70 Process Capability (CP)= 0.99
total they are around 100
In these images, there are only examples of solder empty and solder bridge defects.
models that have to be
under control in laser J1 J1
FAMILY “A” FAMILY “B”
soldering process.
Solder Empty Solder Empty
Project Definition. Projected Business Solder bridge
Misaligned
Solder bridge
Misaligned
Benefits: Tombstone
Burn
Tombstone
Burn
TOUCH-UP Vis ual Inspection
(SECOND TIME= (Se cond tim e=
120se c) 120se c)
NO
CONTINUE WITH
SODF TBE AM TOUCH-UP VISUAL IINSPECTION DEFECT FOUND
NORMAL PROCESS
YES
$$$
Frecuency= 100% (Families UN's, TN's and KBN's)
Solder Wire Consumption per board= 0.30 grs (Kester Solder Wire P/N 00500098)
Description Sec Opr-Hour-cost (Dlls) Opr-sec-cost (Dlls) Total cost (Dlls) Facilities (10%) Total (Dlls)
Flextronics is loosing
Touch-Up time(Second time)=
Inspector time (Second time)=
120
120
3.66
6.42
0.001016667
0.001783333
0.122
0.214
0.0122
0.0214
0.1342
0.2354
0.3696
200k usd per year
Description
Solder Wire=
Cost per gr. (Dlls)
0.48
Consumption per board (grs)
0.3
Total (Dlls)
0.144
because of the problems
Production per Year (include all families)= 180000
GRAND TOTAL PER BOARD (DLLS)= 0.5136
generated in laser
PCB's burned per year =
PCBA Cost per Unit (USDollar) =
104
1200
Amountof Loss per
soldering process.
Year(Dlls)= $217,248.00
7
Can the Problem Be Broken into Smaller Pieces? Multi-Generational Plan?

More than 20
variables were
identified
Basic Understanding LSP, Mode: “Continuos Pad” Basic Understanding LSP, Mode: “Continuos Pad”
ed PARAMETERS TO
(Models: “A) (Models: “B”) Spe PostHeat
Beam Power A rm CONTROL:
off PARAMETERS TO
PARAMETERS TO 15.-Arm Speed(mm/sec)
CONTROL:
CONTROL:
1.- D1
1.- D1 2.- φ RevF
d
2.- φ Softbeam 3.- Pwr0(watts) Pre-heat Softbeam
3.- Beam Power(watts) Laser Light 4.-Beam Diam (mm) Laser Light
s
in
4.-Beam Diam (mm) (x2,y2,z2) 5.-Tpre (sec)

n) p
(x2,y2,z2)
ig th e
5.-Wait Time. (sec) Pre-heat Pre-heat

Soldering 6.- Pwr1(watts) Feed Pre-heat
Feed
D d to
6.- (x,y,z) Beam Diam Beam Diam PCB

PCB
or e
es
c t ch
RevLn
n e tta
NOISE: NOISE:
How the machine works?

on s a
PARAMETERS TO 16.- Pwr2(watts) Postheat

(C ar i
Beam
.-Clamps .-Clamps CONTROL: 17.- Tpst(sec)

B
er
.- PCB Color .- PCB Color 18.- RevFd (mm/sec)

ld
So
.- PCB Thickness .- PCB Thickness 19.- RevLn(mm)

.- Bent Pins or misaligment .- Bent Pins or misaligment 20.- Tdly(sec)
Power
D1 .- Residuos softbeam manual

D1 .- Residuos
)
CP
d(
Suspipe
ee
Sp
Φ φ
t
bo
r e
Origin r Wi α
Ro
Origin Connector Spec e

300 Sold Diam
w
Feed
Wire Adjust 7.- (x,y,z) 11.-Feed (mm/sec)
(x1,y1,z1) (x1,y1,z1)
PARAMETERS TO 8.- D2 12.-Solder Wire Diam
9.- α
connector specs
PARAMETERS TO 7.-Robot Speed CP (mm/sec) 200 CONTROL: 13.-Wire Adjust (mm)
CONTROL: D2 10.- w 14.-Tmov (sec)
Y=
Y=Solder
Solderempty,
empty,X’s
X’s==Connectors
ConnectorsAssembly,
Assembly,Machine
MachineParameters,
Parameters,Quality
Qualityinspection.
inspection.AAplanning
planning
was established to attack the problem: 2 phases (Machine validation & Process Control).
was established to attack the problem: 2 phases (Machine validation & Process Control).
8
Can we Understand better how the Laser Machine works? Lets see some videos…
Laser characteristics….
Approximate beam diameter: 0.7mm a 3.0mm
Wavelength: 920nm a 960nm
Max Power or Energy: 4w to 60w
9
Model: “A” Beam Power
off
PARAMETERS TO
CONTROL:
1.- D1
2.- φ
3.- Beam Power(watts) Laser Light
s
in
4.-Beam Diam (mm)
n) p
(x2,y2,z2)
ig th e
5.-Wait Time. (sec) Pre-heat Pre-heat
Soldering
D d to
6.- (x,y,z) Beam Diam PCB
or e
es
ct ch
n e tta
NOISE:
on s a
(C ar i
Beam
.-Clamps
B
er
.- PCB Color
ld
So
.- PCB Thickness
.- Bent Pins or misaligment
Power
D1 .- Residuos
P)
(C
ed
pe
tS
Φ
bo
Ro
Origin
(x1,y1,z1)
PARAMETERS TO 7.-Robot Speed CP (mm/sec)
CONTROL:
10
Laser Soldering Processeed Model: “B” PostHeat PARAMETERS TO
p
Ar mS CONTROL:
PARAMETERS TO
CONTROL: 15.-Arm Speed(mm/sec)
1.- D1
2.- φ RevF
d
3.- Pwr0(watts) Pre-heat
4.-Beam Diam (mm) Laser Light
5.-Tpre (sec)
6.- Pwr1(watts) Feed Feed
Pre-heat (x2,y2,z2)
Beam Diam PCB
RevLn
NOISE: PARAMETERS TO 16.- Pwr2(watts) Postheat
.-Clamps CONTROL: 17.- Tpst(sec)
.- PCB Color 18.- RevFd (mm/sec)
.- PCB Thickness 19.- RevLn(mm)
.- Bent Pins or misaligment 20.- Tdly(sec)
D1 .- Residuos
Suspipe
Origin φ r Wir
e
α
ld e
So Diam
w
Feed
Wire Adjust 7.- (x,y,z) 11.-Feed (mm/sec)
(x1,y1,z1)
PARAMETERS TO 8.- D2 12.-Solder Wire Diam
CONTROL: 9.- α 13.-Wire Adjust (mm)
D2 10.- w 14.-Tmov (sec)
11
Can we list all the variables involved in this problem?
X1 = Solder Wire
X2 = Parameters (pw0-watts, pw1-watts, pw2-watts, Tpre-sec, Tmov-sec,Tdly-sec,
Tpst-sec, Arm Speed-mm/sec, Feed-mm/sec, Diameter, RevFn-mm/sec, RevLn-mm,
Y= Solder Empty
beam power, cp).

X3 = Maintenance
X4 = Machine Programs
X5 = Connectors
X6 = PCBA
X7 = Programming Method
X8 =Visual Inspection Criterion
X9 = Training
Y = Discrete Data
(Atributes)
12
13

What is Important and How Can I Measure It? How Good Is the Measurement System?
ls :
Too
.
R. s Z st
R & is y
a ge A nal
• G ty
p a b ili
•Ca
Gage R&R Study (This study was made only for operators R&R Study. Results
because of LSP machine doesn’t have automatic inspection)
Attribute Agre e me n t Wo rk S he e t
A preliminary Gage R&R study was done to identify quickly all the Parameter SOLDER EMPTY
Performed By G Barajas & E Duarte
improvements to guarantee the acceptable inspection criteria.
Known Population RAMON MAURA FELIPE Y/N Y/N
Sample # Expert Tri al 1 Trial 2 Tri al 3 Trial 1 Trial 2 Trial 3 Trial 1 Tri al 2 Trial 3 Agree Agree
In this case 10 pieces were utilized of model A and only the top 10TR
9TR
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
0
1
N
Y
N
Y
sides were inspected. Current microscope which is available in 8TR
7TR
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Y
Y
Y
Y
Results were very low!

line was used. 3TR
10TL
1
1
1
0
1
1
1
1
0
0
0
1
1
0
0
0
0
1
1
1
N
N
N
N
9TL 1 1 1 1 0 1 1 0 0 0 N N
8TL 1 1 1 1 1 1 1 1 1 1 Y Y
7TL 1 1 1 1 1 1 1 1 1 1 Y Y
3 differents oprs in 3TL 1
(1)
1 1 1 1 0 1 1 1 1 N N
% APPRAISER SCORE -> 90% 60% 70%
differents shifts were % SCORE VS. EXPERT(2) -> 90% 60% 60%
taken for this study. SCREEN % EFFECTIVE SCORE
(3)
-> 50%
(4)
SCREEN % EFFECTIVE SCORE vs. EXPERT -> 50%
Note:
Y = Discrete Data Operators
Operatorsneed
needtotobe
bere-trained
(1) If % Appraiser Score is low training needs to occur, focus on specific areas (within inspector error)
re-trained
(2)
(3)
% Score vs. Expert is an error against known population as deemed by experts
>90% is the target for Screen % Effectiveness Score
(Atributes) The overall efficiency of all the included inspectors with respect to each other
(4) Screen % Effective vs. Expert is an error against a known population as deemed by the experts
The overall efficiency of all the included inspectors with respect to external standard
14
Where are we located in terms of Zst capability scale?
2.5
Poor Control Poor Control

& &
2.0
Poor Technology Good Technology
Zshift (Control)
DPMO’s = 1500
DPMO’s = 17667
1.5 A B
CP = 0.70 CP = 0.99
Good Control
1.0 Category of
&
Worldwide Class!
Poor Technology
0.5
1 2 3 4 5 6
Zst (Thecnology)
15
Profiling...
Connector top side
Connector
PCB
side view
Connector Bottom side
297°C
274°C
250°C
THIS PROFILE SHOWS THAT THE

BEHAVIOR OF THE TEMPERATURE IS
NOT THE SAME FOR EACH ZONE
DURING SOLDERING PROCESS.
16
Thermocouple Attachment...
Laser Light Laser Light

Acceptable Not Acceptable
Thermocouple
Thermocouple
pin pin
pad pad
pcb pcb
Laser Light Laser Light

Acceptable
Not Acceptable
Thermocouple pin pin
Avoid the
pad shadow pad
pcb pcb
Thermocouple
17
A good recomendation to use the proper
Soldering By Hand...
equipment for profiling Laser soldering
process....
Soldering By Laser...
18
19

ls:
Too Chi
t est (
si s
p o the
•Hy are).
Squ ts.
x plo
• Bo ms
t o gra
s
• Hi
Ho is rejected, while Ha is
accepted
Shift
ShiftA2
A2detect
detectthe
themajor
majorquantity
quantityof
ofdefects.
defects.Laser’s
Laser’smachines
machineshave
havebetter
better
performance
performancethan
thanXenon
Xenonmachine.
machine.
20
Pins dimensional study.
Top and Bottom have all

pins with different length.
21
100
90 0.7mm Beam Diam
80
70
60
50
40
30 TOP BOTTOM
20
Not all the pins are covered with the same temperature
10 by beam diameter.
0
1
16
31
46
61
76
91
106
121
136
151
166
181
196
211
226
241
256
271
286
Every point means distance of each pin to the reference line.
22
23

How Do I Close the Gap Between Current and Desired Performance? (Critical Xs)
n
Softbeam Parameters (X’s) r
iz atio cp Arm po
we
im chi
m Sp e
O pt
pw
-m ed-m am
– agu nate
d Ln F eed-mm/sec m/se be
2-
E T io Di Re v c
w
O t c,
rac
c
D am e
at
s
e
t -
– EF Tes
v
ts
/s
et
ts
o
pw
O er Tm
Tdl
m
D it y
-wat
l
mal
m
e
0-
– on i r
Nor
w
ecti
n-
y-s
rW ec
re-s
at
vF
S e
pw 1
– ss d $5000 usd
ts
l p
ec
o T
Cro Tpst-sec
Re
S
– was the
IMC investment
DOE
–
for these
DOE’s
According with the quantity of

variables the study will be a
Fractional DOE for 2 levels & 8-4
variables (Resolution IV). This
means to make 16 runs. r
we
According with the quantity of

po
cp
variables the study to be chose is a
am
TAGUCHI DOE for 3 levels & 5

be
variables.This means to make 27

runs. Critical X’s:
Two
TwoVariables
Variablesare
areCritical
CriticalX’s
X’s(Beam
(BeamPower
Power&&CP).
CP).Temperatures
Temperaturespeaks
peakswere
werereduced
reducedtotoavoid
avoidburnings.
burnings.
24
Can We Confirm the Solution on a Small Test?
Tranfer Funtion:
No Of Defects = 10.000 + 3.500 Y -2.625 Z -5.250 Arm Speep PTP -4.000 Arm
Speed CP + 3.500 Beam power + 1.375 PCB Solvent -2.375 Y*Z -4.000 Y*Arm Speed
PTP -6.000 Y*Arm Speed CP + 4.250 Y*Beam Power + 2.625 Y*PCB Solvent + ei
"OLD" PARAMETERS "NEW" PARAMETERS

Variable VALUE Units Variable VALUE Units
Y Y11=148, Y12=227, Y21=249.70, Y22=239,30 mm Y Y11=148.15, Y12=228, Y21=249.70, Y22=239,30 mm

Z 65.5 mm Z 64.5 mm
Arm Speed PTP 75 mm/sec Arm Speed PTP 80 mm/sec
Arm Speed CP 2.7 mm/sec Arm Speed CP 4 mm/sec
Wait time 0 sec Wait time 0.15 sec
Beam Power 18 watts Beam Power 18 watts
Reducing variation
Run Confirmation:
Master Program
159
Defects Before Vs After DOE
100
87
Defects
90
decreased
Quantity of Defects
80 75
70
UN’s 60 63%
50 42
40
30
17
20
TN’s
10
0
Solder Bridge Solder Bridge Solder Empty Solder Empty
62
(Before Doe) (After DOE) (Before DOE) (After DOE)
Type of Defect
Small
Smalltest
testafter
afterimprovements
improvementsconfirmed
confirmedthat
thatfor
forUN’s
UN’swewehave
havedefects
defectsreduction
reduction
inin93%
93%(Zst
(Zst==2.10
2.10toto3.03.
3.03.For
ForTN’s
TN’swe
wehave
havedefects
defectsreduction
reductioninin77%.
77%.(Zst
(Zst==
2.97
2.97toto3.40.
3.40.
Based
Basedon
onthe
thenew
newparameters
parameterswe
wegenerated
generatedaaMaster
MasterProgram
Programon
onthe
theMachine.
Machine.
25
Eliminating “burnings”
Connector top side
This is an example when
some plastic residuos are
Connector left over the pins and the
PCB laser burns them. The
side view
Connector Bottom side reaction is very high, then
the pcb catches a high
temperature (783°C) to be
burned.
297°C
274°C
250°C
THIS PROFILE SHOWS THAT THE

BEHAVIOR OF THE TEMPERATURE
IS NOT THE SAME FOR EACH ZONE
DURING SOLDERING PROCESS.
–Theorically reflow process (tin-lead) window for SMT assembly describes: 60 secs
must be sufficient over 183°C to get peaks of temper ature between 217°C – 230°C.
–Wave Soldering Process has a work window of: 1.5 – 3 secs with peaks of 255°C.
PROCESS
WINDOW
Then we can conclude that PCB is designed to resist at least the 246°C (0.8 sec)
same work window than Wave Soldering Process and 225°C (0.8 sec)
temperatures above this process window could damage the pcb
(FR4) generating “burnings”.
In the previous slide we obtained temperatures peaks like 274°C

(1 sec) and 297°C (1.5 sec) This means that there is a high risk to
burn the PCB.
Making small changes in the master program obtained of last IMC study
DOE study, we have reduced these temperature peaks in order to
work with values less 255°C (0.8sec). See the next slides to note Intermetalic joint study and
the differences with the results. cross section were performed to
asure that acceptables ranges
are achieved.
26
Preheat...... It is better to avoid thermal choke.
27
28

out of
Points
•SP
control!!!
•Gr
C
• Hi
ap
st
h
o
s
g
Too
“P”
ram
ls:
Improvements.
process
performance.
overtime data
We registered
using SPC the
Collection data is needed by Machine, yield, shift, type of defects, type of material, in order to identify
Improvements.
% of Pieces with Defects Qty of Defects Reported

08 08
/0 /0
1
1 /2 /2
0
5
10
15
20
25
15 00
0.0%
0.5%
1.0%
1.5%
2.0%
2.5%
15 00
to work. /0 7 /0 7
1 /2 1 /2
22 00 22 00
/0 7
softbeam
/0 7 1 /2
1 /2
29 00 29 00
/0 7 /0 7
1 /2 1 /2
05 00 05 00
/0 7 /0 7
2 /2 2/
12 00 12 2 00
/0 7 /0 7
specified low
2 /2 2/
19 00 19 2 00
/0 7 /0 7
2 /2 2/
and high limits
machines were
26 00 26 2 00
/0 7 /0 7
2 /2 2/
master program
Critical X’s have

Old programs in
05 2 00
will be available.
05 00
/0 7 /0 7
deleted. Only the
3 /2 3/
20
12 00 12 07
/0 7 /0
3 /2 3/
20
19 00 19 07
/0 7 /0
3
3 /2 /2
26 00 26 00
/0 7 /0 7
3 /2 3 /2
02 00 02 00
/0 7 /0 7
4 /2 4 /2
09 00 09 00
/0 7 /0 7
4/ 4 /2
20
Date
16 00
D ate
16
/0
07 /0 7
4/ 4 /2
20 23 00
23
/0
07 /0 7
4/ 4 /2
30 2 00 30 00
/0 7 /0 7
4/ 4 /2
07 2 00 07 00
/0 7 /0 7
5/ 5 /2
2 14 00
How Will Critical Xs be Controlled?
14 00
/0 7 /0 7
5/ 5 /2
21 2 00 21 00
/0 7 /0 7
5/ 5 /2
De fe cts Reported from China (J1 Conne ctor)
2 0
Defects Reported from China (J1 Connector)
28 00 28 07
/0 7 /0
5/ 5 /2
04 2 00 04 00
/0 7 /0 7
6/ 6 /2
11 2 00 11 00
/0 7 /0 7
6/ 6 /2
18 2 00 18 00
/0 7 /0 7
6/ 6 /2
25 2 00 25 00
/0 7 /0 7
6/ 6/
20 20
07 07
29
machines)
Softbeam process must be measured daily to identify significant

variations and take actions. It will be better if types of defects are We implemented some formats in
separated.
Daily Report
QUANTITY OF DEFECTS DETECTED
order to collect as may information
Total of
SHIFT Date MACHINE
LASER 1
Connector Inspection Final Inspection QA Pieces
Produced
YIELD
as needed.
A1 LASER 2
XENON
LASER 1
B1 LASER 2
XENON
LASER 1
A2 LASER 2
XENON
LASER 1
B2 LASER 2
XENON
( 1- (Connector Inspection + Final inpection + QA) ) X 100

Yield = = _____%
Total of pieces produced
Softbeam process must be measured daily to identify significant

variations and take actions. It will be better if types of defects are
separated.
Formato de llenado de parámetros de la Softbeam
Beam ó PW1
FECHA
MAQUINA
TURNO
Tmov
Ing
Feed
Tdly
Proc. X1 Y1 Y2 Z W X2 Y3 Y4
HORA Modelo
.- Daily Yields Softbeam

parameter collection data
.- Daily Machine Parameters

.- Set-up Procedure
.- Validation Machine Procedure. Set-up procedure
30
Tpst (20)/100: Es el tiempo en seg que el Pwr2 (100)/10: Es la potencia

robot permanece con el beam abierto
Pwr 2
en watts aplicada al
Beam Power
off Softbeam 1
en último pin. último pin para poder
Tdly (10-30)/100: Es el tiempo en seg que el retirar la soldadura.
Based on suspipe permanece dispensando

soldadura una vez que el robot se ha
detenido en el último pin.
Re vF
d Softbeam
Laser Light
Softbeam
d
three months Laser Light
ee
Beam On
,F
Pwr 0 RevFd (300)/10: Es la
d
ee
velocidad the
Sp
retracción en
Z + (64.50)
of data Pw
1,
r
RevLn
RevLn (20)/10: Es la
distancia en mm
mm/seg con la
que la
soldadura es
retirada del Beam Power (14-16):
con la que la último pin. Es la potencia en
collected, we soldadura es watts aplicada a
Z + (68.25)
retirada del último lo largo de todos
pin. los pines.
calculate e
Suspipe CP(2.6 – 3.0): Es la velocidad en
mm/seg con la que el
robot se desplaza a lo W
Wir largo de todos los pines.
lder
confidence So
w (60.26)
(75.00) Wait Time (0.15): Es el tiempo
intervals for Pwr0 (140)/10: Es la potencia en

watts aplicada al primer pin
(precalentamiento).
en seg que el robot
espera en el primer pin
antes de moverse a lo
largo de todo el conector.
Tpst (20)/100: Es el tiempo en seg que el
each machine robot permanece con el beam abierto
en el primer pin.
Tmov (10-30)/100: Es el tiempo en seg que
parameter in el suspipe permanece dispensando

soldadura en el primer pin antes de
que el robot se mueva.
order to Pwr1 (140-170)/10: Es la

potencia en watts
aplicada a lo largo de
todos los pines.
Speed (26-30)/10: Es la velocidad en
specify the mm/seg con la que el robot se
desplaza a lo largo de todos
los pines.
Feed (80-100)/10: Es la velocidad en
maximum mm/seg con la que la
soldadura es dispensada por
el suspipe.
PTP: Point to Point, es la velocidad con la
and PTP: (Point to Point), es la velocidad con
la que se desplaza el robot
entre dos puntos. Se mide en
% de la velocodad máxima del
que se desplaza el robot entre
dos puntos. Se mide en % de
la velocodad máxima del
mismo. 75% - 80% son
mismo. 75% - 80% son valores típicos.
minimum valores típicos.
values of Modelos con más variación: TN13, TN113, TN1987,

TN395, TN1893, TN1873, TN1371C, TN220B.
Modelos con más variación:UN398, UN395, UN395B,

tolerance. UN595B, UN553
Solectron Confidential 125
31
We spent 10 months to close this project....However continuos improvement never

ends, then always there will be something more to improve.
Thank you !
32

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Laser Soldering Process

Enrique Duarte Introduction

Process Development Engineer

Team Members for this project:

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Defects Distribution (by issue)

Solder Issues 7.7%

Laser Soldering process defects 13.9%

benefits of this project?, What happen if we dont do anything?

has 50 models, then in DPMO=

Can the Problem Be Broken into Smaller Pieces? Multi-Generational Plan?

4.-Beam Diam (mm) (x2,y2,z2) 5.-Tpre (sec)

5.-Wait Time. (sec) Pre-heat Pre-heat

6.- (x,y,z) Beam Diam Beam Diam PCB

How the machine works?

PARAMETERS TO 16.- Pwr2(watts) Postheat

.-Clamps .-Clamps CONTROL: 17.- Tpst(sec)

.- PCB Color .- PCB Color 18.- RevFd (mm/sec)

.- PCB Thickness .- PCB Thickness 19.- RevLn(mm)

D1 .- Residuos softbeam manual

Origin Connector Spec e

Can we list all the variables involved in this problem?

beam power, cp).

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Results were very low!

Where are we located in terms of Zst capability scale?

Poor Control Poor Control

Connector top side

THIS PROFILE SHOWS THAT THE

Laser Light Laser Light

Laser Light Laser Light

Thermocouple pin pin

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Pins dimensional study.

Top and Bottom have all

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According with the quantity of

According with the quantity of

TAGUCHI DOE for 3 levels & 5

variables.This means to make 27

"OLD" PARAMETERS "NEW" PARAMETERS

Y Y11=148, Y12=227, Y21=249.70, Y22=239,30 mm Y Y11=148.15, Y12=228, Y21=249.70, Y22=239,30 mm

THIS PROFILE SHOWS THAT THE

In the previous slide we obtained temperatures peaks like 274°C

Preheat...... It is better to avoid thermal choke.

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using SPC the

% of Pieces with Defects Qty of Defects Reported

Critical X’s have

Softbeam process must be measured daily to identify significant

( 1- (Connector Inspection + Final inpection + QA) ) X 100

Softbeam process must be measured daily to identify significant

.- Daily Yields Softbeam

.- Daily Machine Parameters

Tpst (20)/100: Es el tiempo en seg que el Pwr2 (100)/10: Es la potencia

Based on suspipe permanece dispensando

collected, we soldadura es watts aplicada a

(75.00) Wait Time (0.15): Es el tiempo

intervals for Pwr0 (140)/10: Es la potencia en

Tmov (10-30)/100: Es el tiempo en seg que

parameter in el suspipe permanece dispensando