Seminar on

New Manufacturing Technologies for Electronics

Miniaturization

Date: 15 March 2003 (Saturday)

Time: 9:30 a.m. — 12:30 p.m.

Venue: Room CF401, Microsoft Enterprise Systems Centre

The Hong Kong Polytechnic University
Hung Hom, Kowloon, Hong Kong

Organised by:
PCB Technology Centre
Advanced Manufacturing Technology Research Centre
Department of Industrial and Systems Engineering
The Hong Kong Polytechnic University

Funded by:
Innovation and Technology Commission (ITC)
The Government of the Hong Kong SAR

Supported by:
Department of Electrical Engineering, Mechatronics,
Information Technology
Georg-Simon-Ohm University of Applied Sciences in
Nuernberg, Germany

The seminar will be conducted in English

Enquiry : (852) 2766-7974
 Introduction Programme
The seminar covers 3 advanced research topics on plating, packaging and interconnection Time Session
technology for microelectronic circuits:
9:30 a.m. Registration
A new PCB plating technology - SelecTin 9:50 a.m. Welcoming Address
Based on standard PCB processes, an alternative to established technologies like Hot Air
Leveling or Immersion Tin was developed. It allows the selective electroplating of tin and 10:00 a.m. Session 1: A new PCB plating technology - SelecTin
Q&A
avoids the necessity of printing solder resist. The process steps, its advantages and
disadvantages over competing technologies will be discussed. 10:35 a.m. Session 2: A 3-D low-cost Packaging Technology for Ceramic Substrates
Q&A
A 3-D low-cost Packaging Technology for Ceramic Substrates 11:10 a.m. Tea Break (light refreshment will be provided)
By applying PCB plating techniques to alumina substrates, double-sided structured ceramic
11:30 a.m. Session 3: Properties and reliability of a Zn-based lead-free solder paste
substrates with feed-through holes are built and assembled to 3-D packages by using reflow Q&A
soldering technology. In comparison to Low Temperature Cofired Ceramics (LTCC), an
almost equivalent packaging density can be achieved at much lower costs.

Properties and reliability of a Zn-based lead-free solder paste

Near eutectic SnZn solder alloys exhibit a melting range which is just 15 0C above the Registration Form
melting point of standard SnPb solder and approx. 20 0C lower than the melting points of
the favoured SnCu and SnAg alloys. In contrary to earlier reports about poor stability and
reliability of eutectic SnZn pastes, investigations on a newer paste of the composition New Manufacturing Technologies for Electronics
SnZn8Bi3 are very promising with respect to printing quality and reliability. This would
reduce the thermal load on PCBs and components during reflow-soldering. However, the
Miniaturization
use of Zn could change the requirements regarding PCB surface finish.
Please complete and return the Registration Form to Miss Carrie Cheung by fax
(no. 2362 9787) before 11 March 2003.

Name #Prof./Dr./Mr./Miss/Mrs./Ms.
Speaker Profile Position Membership No. (if any)

Prof. Dr.-Ing. Werner Jillek Organization

Department of Electrical Engineering, Mechatronics, Information Technology Address
Georg-Simon-Ohm University of Applied Sciences in Nuernberg, Germany

Prof. Dr.-Ing. Werner Jillek studied Materials Science at the University Phone Fax
of Erlangen, Germany where he also earned his PhD degree. He worked
10 years for an international telecommunication company in Signature Date
responsible positions for PCB design and manufacturing. Since 1989 he ☛ Seats are limited to 40. All seats are allocated on first-come-first-served basis.
is a professor at the Georg-Simon-Ohm Fachhochschule in Nuernberg,
Germany and head of the Microelectronics Packaging Laboratory. He is # Please delete as appropriate.
the co-editor of a German PCB Handbook which will be published in
spring 2003. Contact Person:
Should you have any queries, please feel free to contact Miss Carrie Cheung at (852) 2766-7974.
Web-site: http://www.ise.polyu.edu.hk/pctech