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Matchline Controller For Content Addressable Memory
Matchline Controller For Content Addressable Memory
Matchline Controller For Content Addressable Memory
6, JUNE 2017
I. I NTRODUCTION
Fig. 2. Low-level architecture of the LAAM [N (E): test node signal of the erstwhile CAM cell].
Fig. 6. Area, ML delay, and energy dissipation comparison of the proposed LAAM with referred designs at various TCAM macros at 27 ◦ C and a VDD of 1 V.
TABLE II
F REQUENCY A SSESSMENT OF THE P ROPOSED LAAM C ONSIDERING THE
ML L OW-L OGIC V OLTAGE (V OLTAGES ARE M EASURED IN V OLTS )
Fig. 8. Peak current, ML delay, and energy dissipation comparison at various supply voltages.
TABLE III
F EATURE S UMMARY AND C OMPARISON
R EFERENCES [9] Y. J. Chang, “Using the dynamic power source technique to reduce TCAM
[1] N. Onizawa, S. Matsunaga, V. C. Gaudet, and T. Hanyu, “High-throughput leakage power,” IEEE Trans. Circuits Syst. II, Exp. Briefs, vol. 57, no. 11,
low-energy content-addressable memory based on self-timed overlapped pp. 888–892, Nov. 2010.
search mechanism,” in Proc. IEEE 18th Int. Symp. ASYNC, 2012, [10] P. T. Huang et al., “0.339 fJ/bit/search energy-efficient TCAM macro
pp. 41–48. design in 40nm LP CMOS,” in Proc. IEEE A-SSCC, 2014, pp. 129–132.
[2] B. Wang, T. Q. Nguyen, A. T. Do, J. Zhou, M. Je, and T. T. H. Kim, [11] S. Baeg, “Low-power ternary content-addressable memory design using a
“Design of an ultra-low voltage 9T SRAM with equalized bitline leakage segmented match line,” IEEE Trans. Circuits Syst. I, Reg. Papers, vol. 55,
and CAM-assisted energy efficiency improvement,” IEEE Trans. Circuits no. 6, pp. 1485–1494, Jul. 2008.
Syst. I, Reg. Papers, vol. 62, no. 2, pp. 441–448, Feb. 2015. [12] S. J. Ruan, C. Y. Wu, and J. Y. Hsieh, “Low power design of
[3] Y.-J. Chang, “A high-performance and energy-efficient TCAM design for precomputation-based content-addressable memory,” IEEE Trans. Very
IP-address lookup,” IEEE Trans. Circuits Syst. II, Exp. Briefs, vol. 56, Large Scale Integr. (VLSI) Syst., vol. 16, no. 3, pp. 331–335, Mar. 2008.
no. 6, pp. 479–483, Jun. 2009. [13] I. Hayashi et al., “A 250-MHz 18-Mb full ternary CAM with low-voltage
[4] K. Pagiamtzis and A. Sheikholeslami, “Content-addressable memory matchline sensing scheme in 65-nm CMOS,” IEEE J. Solid-State Circuits,
(CAM) circuits and architectures: A tutorial and survey,” IEEE J. Solid- vol. 48, no. 11, pp. 2671–2680, Nov. 2013.
State Circuits, vol. 41, no. 3, pp. 712–727, Mar. 2006. [14] A. T. Do, S. Chen, Z. H. Kong, and K. S. Yeo, “A high speed low power
[5] S. H. Yang, Y. J. Huang, and J. F. Li, “A low-power ternary con- CAM with a parity bit and power-gated ML sensing,” IEEE Trans. Very
tent addressable memory with pai-sigma matchlines,” IEEE Trans. Very Large Scale Integr. (VLSI) Syst., vol. 21, no. 1, pp. 151–156, Jul. 2013.
Large Scale Integr. (VLSI) Syst., vol. 20, no. 10, pp. 1909–1913, [15] D. Kayal, A. Dandapat, and C. Sarkar, “Design of a high performance
Oct. 2012. memory using a novel architecture of double bit CAM and SRAM,” Int.
[6] C. Wang, C. Hsu, C. Huang, and J. Wu, “A self-disabled sensing technique J. Electron., vol. 99, no. 12, pp. 1691–1702, Jun. 2012.
for content-addressable memories,” IEEE Trans. Circuits Syst. II, Exp. [16] S. Mishra and A. Dandapat, “EMDBAM: A low-power dual bit associa-
Briefs, vol. 57, no. 1, pp. 31–35, Jan. 2010. tive memory with match error and mask control,” IEEE Trans. Very Large
[7] A. Agarwal et al., “A 128 × 128 b high-speed wide-and ML con- Scale Integr. (VLSI) Syst., vol. 24, no. 6, pp. 2142–2151, Jun. 2016.
tent addressable memory in 32nm CMOS,” in Proc. ESSCIRC, 2011, [17] M. Chae, J. W. Lee, and S. H. Hong, “Decoupled 4T dynamic CAM
pp. 83–86. suitable for high density storage,” Electron. Lett., vol. 47, no. 7,
[8] J. W. Zhang, Y. Z. Ye, and B. D. Liu, “A current-recycling technique pp. 434–436, Mar. 2011.
for shadow-ML sensing in content-addressable memories,” IEEE Trans. [18] V. Vinogradov, J. Ha, C. Lee, A. Molnar, and S. H. Hong, “Dynamic
Very Large Scale Integr. (VLSI) Syst., vol. 16, no. 6, pp. 677–682, ternary CAM for hardware search engine,” Electron. Lett., vol. 50,
Jun. 2008. no. 4, pp. 256–258, Feb. 2014.