8 PIN SOIC/SOIN PACKAGE OUTLINE

3 D SEE DETAIL "A"

e
8 H

0.25

3 E1 E GAUGE PLANE

L 0°-8°

1 2 L1
5
INDEX AREA 4 c
8X b 2 4
(D/2 X E1/2)

TOP VIEW END VIEW DETAIL "A" (SCALE: 3/1)

C
A2 A

SEATING PLANE
A1

ccc C

SIDE VIEW 3-D VIEW

Min Nominal Max Remarks

A 1.35 - 1.75 Overall Package Height
A1 0.10 - 0.25 Standoff
A2 1.25 - 1.65 Package Body Thickness
D 4.80 4.90 5.00 "X" Body Size
E 5.80 6.00 6.20 Lead Span
E1 3.80 3.90 4.00 "Y" Body Size
L 0.40 - 0.90 Lead Foot Length
L1 1.05 REF Lead Length
b 0.31 - 0.51 Lead Width
c 0.17 - 0.25 Lead Thickness
e 1.27 BSC Lead Pitch
ccc - - 0.10 Coplanarity

Notes:
1. All dimensions are in millimeters.
2. True position spread tolerance of each lead is ±0.125mm at maximum material condition.
3. Dimension "D" does not include mold flash, protrusions or gate burrs. Maximum mold flash, protrusions or gate
burrs is 0.15mm per end. Dimension "E1" does not include inter-lead flash or protrusion. Maximum inter-lead
flash or protrusion is 0.25mm per side. Dimensions "D" & "E1" are determined at the datum plane "H".
4. Dimensions "b" and "c" apply to the flat section of the lead between 0.10 to 0.25mm from the lead tip.
5. Details of pin 1 identifier are optional, but must be located within the index area indicated.
6. Provided for reference only - contact your SMSC Regional Sales Office for latest information.
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123 Rev. 8/23/05