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During analysis of creep data, the value of true stress exponent (n)
well-documented creep cases for metals and alloys: (i) n = 3 for creep controlled by
temperature dislocation climb (lattice diffusion), and (iii) n = 8 for lattice diffusion-
SiCp/Al (Pandey et al, 1990, 1992) and TiB2p/Al (Pandey et al, 1994) composites.
The creep data obtained has been explained by using the substructure invariant
during creep in these composites the subgrain boundaries are pinned by reinforced
particles like Al2O3 and TiB2, thereby yielding a stress exponent of 8 and an
remains stable during extended creep exposure and such a structure is insensitive to
stress. This is achieved by the introduction of second phase particles such as oxide
boundaries and the subgrain size becomes equal to interparticle spacing. In such a
situation, particles stabilize the subgrain size. The substructure invariant model
predicts that the creep rate is proportional to the cube of subgrain size and a stress