Professional Documents
Culture Documents
Cui 2006
Cui 2006
www.elsevier.com/locate/surfcoat
Abstract
The manufacture of electroless black nickel surfaces had been obtained, through etching electroless nickel deposits by oxidizing acid
solution. The morphology, chemical composition and reflectance of pre-etch and post-etch coatings were compared to examine influence of
phosphorus and sulfur content on preparation of black surfaces. The non-metallic elements content of electroless nickel deposits was greatly
improved after black treatment. It indicated the etching treatment was a selective dissolving process. The nickel atoms can be preferentially
removed during the period. Optimum phosphorus content range to produce low reflectance black surface was proposed, after reflectance
measurement of black surfaces. Additionally, the effect of co-deposited phosphorus and sulfur atoms on corrosion resistance of electroless
nickel deposits was evaluated by electrochemical impedance spectroscopy (EIS). The fitting results indicated that corrosion resistance of high-
phosphorus electroless nickel deposits will be significantly reduced after black treatment. However, that of low-phosphorus deposits will be
improved.
© 2005 Elsevier B.V. All rights reserved.
Keywords: Electroless nickel; Phosphorus content; Black treatment; Electrochemical impedance spectroscopy; Corrosion resistance
influences of chemical composition of deposits on physical P alloy were investigated. Moreover, corrosion resistance of
and corrosion resistant property of electroless Ni–P black the coating was evaluated by electrochemical impedance
coatings. spectroscopy (EIS), which had been extensively used to eval-
In this work, comparison of the chemical composition and uate the corrosion performance of electroless nickel coatings
physical characteristics of the pre-etched and post-etched Ni– [15,16].
Fig. 1. Typical AFM morphologies of pre-etch (left) and post-etch (right) electroless nickel surfaces, with pre-etch phosphorus content at (A) 2.87 wt.%, (B) 8.39 wt.%,
(C) 10.10 wt.% and (D) 12.91 wt.%, respectively.
6810 G. Cui et al. / Surface & Coatings Technology 200 (2006) 6808–6814
decomposition of an entire plating process [24,25]. Thiourea can sulfur content is too low inffi this measurement. All coalescing
pffiffiffi
be used as an effective stabilizer for electroless plating nickel peaks centered around E ¼ 5:982 and the peak amplitudes
bath [26,27]. During electroless nickel deposition process, sulfur corresponding to sulfur content in alloys. The peak
atoms can co-deposit with nickel by secondary reactions [26]. amplitudes and sulfur content of post-etch samples were
Meanwhile, they can greatly affect corrosion resistant property greatly higher than those of pre-etch ones, as illustrated in
of Ni–P alloys, although sulfur content is rather low. Table 4 and Fig. 3. It indicated that the selective nature of the
The chemical composition and reflectance of pre- and etching process, in which the nickel atoms can be preferential,
post-etch electroless nickel alloys were shown in Table 4. The dissolved, but non-metallic atoms will be left in the alloys.
measured samples were obtained in Table 2. The XRF Additionally, the reflectance of black nickel surface de-
patterns of sulfur element for electroless nickel deposits on creased, with sulfur content increasing, although phosphorous
as-plated and blacken states were shown in Fig. 3, because content of three samples were similar.
A B
Post-etch
Sqr (kcps)
Sqr (kcps)
Post-etch
Pre-etch Pre-etch
C
Post-etch
Sqr (kcps)
Pre-etch
SqE- Scale
Fig. 3. The XRF patterns of single sulfur element in electroless nickel and black nickel alloys obtained in bath as described in Table 2.
6812 G. Cui et al. / Surface & Coatings Technology 200 (2006) 6808–6814
A A
3000
P=2.89%
P=8.39% 2400 A
2700
P=9.13% B
2400 P=10.10% 2100 C
P=12.90%
2100 1800
-Zim / (Ω .cm2)
-Zim / (Ω .cm2)
1800
1500
1500
1200
1200
900
900
600 600
300 300
0 0
0 1000 2000 3000 4000 5000 6000 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000
Zre / (Ω .cm2) Zre / (Ω .cm2)
B B
1400 1100
P=2.89%
P=8.39% A
1000
1200 B
P=9.13%
P=10.10%
900 C
1000 P=12.90%
-Zim / (Ω .cm2) 800
-Zim / (Ω .cm2)
700
800 600
500
600
400
400 300
200
200 100
0
0 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200
0 500 1000 1500 2000 2500
Zre / (Ω .cm2)
Zre / (Ω .cm2)
Fig. 6. Nyquist plots of electroless nickel coatings on as-plated (A) and blacken
Fig. 4. Nyquist plots of electroless nickel coatings on as-plated (A) and blacken conditions (B) at various sulfur content on samples obtained in Table 2 in 3.5%
conditions (B) at various phosphorus content on the pre-etch coatings in 3.5% sodium chloride solution.
sodium chloride solution.
3.3. Corrosion resistant property of electroless black nickel various phosphorous contents were compared in Fig. 4.
coatings Those plots were fitted by the equivalent circuit as
illustrated in Fig. 5. The fitting results are shown in
The electrochemical impedance spectra of as-deposited Table 5. Similar corrosion behavior evaluated method for
and blackened electroless plating nickel coatings in 3.5% electroless plating nickel coatings was used in literatures
sodium chloride media were shown in Fig. 4(A) and (B), [15,16].
respectively. The Nyquist plots of pre-etch coatings at
Table 1
Bath compositions and operating conditions of electroless Ni–P depositions
Bath constituents and parameters Quantity (mol·L− 1)
Nickel sulfate (NiSO4·6H2O) 0.10
Sodium hypophosphite 0.08, 0.1, 0.13, 0.15, 0.20,
(NaH2PO2·H2O) 0.25, 0.3, 0.35, 0.40
Sodium acetate (CH3COONa) 0.15
D,L-Malic acid 0.03
Rs- Resistance of solution. Citrate acid 0.02
Rc- Corrosion resistance of the coating. Succinic acid 0.05
Q- Constant phase element. Lauryl sodium sulfate 8 mg·l− 1
Operating conditions
pH 5.8
Fig. 5. Equivalent circuit for electrochemical impedance measurement on
Temperature 85 ± 2 °C
corrosion resistance of electroless nickel deposits.
G. Cui et al. / Surface & Coatings Technology 200 (2006) 6808–6814 6813
Table 5
Fitted results of Nyquist plots for electroless nickel deposits on equivalent circuit described in Fig. 5
Phosphorous 2.87 wt.% 8.39 wt.% 9.13 wt.% 10.1 wt.% 12.9 wt.%
content
As-plated Blacken As-plated Blacken As-plated Blacken As-plated Blacken As-plated Blacken
Rs 14.64 15.99 15.72 15.81 14.2 16.17 14.25 16.03 14.35 15.70
Rc 1356 2122 2954 2139 3648 2095 4200 2674 5772 3012
CPEc
CPEc-T 4.397e − 5 1.165e − 3 7.337e − 5 1.768e − 3 1.077e − 4 2.741e − 3 1.104e − 4 2.749e − 3 1.477e − 4 3.391e − 3
CPEc-P 0.8174 0.9072 0.8463 0.8795 0.8051 0.8533 0.8040 0.9004 0.8244 0.8443
Unit of Rs and Rc is Ω cm2. Unit of CPEc-T is F cm− 2.
Table 6
Fitted results of Nyquist plots for electroless nickel deposits on equivalent circuit described in Fig. 5
Sample A B C
As-plated Blacken As-plated Blacken As-plated Blacken
Rs 16.44 16.36 16.55 16.58 16.48 16.37
Rc 4282 1924 3508 1892 3328 1936
CPEc
CPEc-T 2.124e − 4 1.574e − 3 1.359e − 4 3.299e − 3 5.784e − 4 4.803e − 3
CPEc-P 0.8181 0.8943 0.9084 0.9098 0.9013 0.9058
Unit of Rs and Rc is Ω cm2. Unit of CPEc-T is F cm− 2.
6814 G. Cui et al. / Surface & Coatings Technology 200 (2006) 6808–6814
4. Conclusions References
The purpose of this paper was to report the effect of [1] A. Wurtz, C.R. Hebd, Séances Acad. Sci. 18 (1844) 702.
phosphorus and sulfur content on the physical and electro- [2] A. Brenner, G.E. Riddell, J. Res. Natl. Bur. Stand. (U.S.) 37 (1946) 91.
[3] A. Brenner, G.E. Riddell, J. Res. Natl. Bur. Stand. (U.S.) 39 (1947) 385.
chemical properties of electroless black nickel deposits. The [4] A. Brenner, D.E. Couch, E.K. Williams, J. Res. Natl. Inst. Stand. Technol.
black coatings were prepared in oxidizing acid solution, after 44 (1950) 109.
the electroless plating process. The morphology, chemical [5] S. Kodama, M. Horiuchi, T. Kunii, K. Kuroda, IEEE Trans. Instrum. Meas.
composition and corrosion resistant property of electroless 39 (1990) 230.
plating nickel deposits on as-plated and blacken conditions were [6] C.E. Johnson, Met. Finish. 78 (1980) 21.
[7] J. Hajdu, S. Zabrocky, Met. Finish. 98 (2000) 42.
investigated by AFM, XRF and EIS, respectively. The research [8] E. Wäckelgård, Sol. Energy Mater. Sol. Cells 56 (1998) 35.
results showed that: [9] M.L. Cantú, A.M. Sabio, A. Brustenga, P.G. Romero, Sol. Energy Mater.
Sol. Cells 87 (2005) 685.
(1) The electroless black nickel surfaces with lower [10] S. John, Met. Finish. 95 (1997) 84.
reflectance in the visible region can be prepared by [11] R.J.C. Brown, P.J. Brewer, Martin J.T. Milton, J. Mater. Chem. 12 (2002)
2750.
lower phosphorous content coatings on as-plated [12] S. John, N.V. Shanmugham, B.A. Shenoi, Met. Finish. 80 (1982) 47.
condition. [13] L.M. Abrantes, J.P. Correia, J. Electrochem. Soc. 141 (1994) 2356.
(2) The non-metallic element content greatly improved after [14] K. Parker, Plat. Surf. Finish. 74 (1987) 60.
the black treatment, including phosphorus and sulfur [15] T.S.N. Sankara Narayanan, S.K. Seshadri, J. Alloys Compd. 365 (2004)
elements. It can be attributed to preferential dissolution of 203.
[16] Y.S. Huang, X.T. Zeng, X.F. Hu, F.M. Liu, Electrochim. Acta 49 (2004)
the nickel atoms at the coating surface during the etching 4313.
period. [17] W. Riedel, Electroless Nickel Plating, Finishing Publications Ltd.,
(3) The phosphorous atoms incorporated with nickel atoms Stevenage, UK, 1991.
can effectively increase corrosion resistance of electroless [18] R.C. Agarwala, S. Ray, Z. Met.kd. 79 (1988) 472.
[19] W. Ding, M. Wang, C. Hsiao, Y. Xu, Z. Tian, Scr. Metall. 21 (1987) 1685.
nickel deposits, while sulfur atoms decrease it, on as-
[20] S.W. Court, B.D. Barker, F.C. Walsh, Trans. Inst. Met. Finish. 78 (2000)
plated condition. 157.
(4) The corrosion resistance of high-phosphorus electroless [21] C. Kerr, D. Barker, F.C. Walsh, Trans. Inst. Met. Finish. 74 (1996) 214.
nickel deposits will be significantly reduced after black [22] D. Barker, S. Campbell, F. Walsh, Trans. Inst. Met. Finish. 75 (1997) B110.
treatment. However, that of low-phosphorus deposits will [23] C. Kerr, D. Barker, F.C. Walsh, Trans. Inst. Met. Finish. 75 (1997) 81.
be improved. [24] M. Schlesinger, in: M. Schlesinger, M. Paunovic (Eds.), Modern
Electroplating, 4th ed., John Wiley and Sons, Inc., New York, USA,
2000, Chap. 18.
Acknowledgements [25] I. Petukhov, M. Shcherban, V. Kichigan, Prot. Met. 35 (1999) 85.
[26] H. Xu, J. Brito, O.A. Sadik, J. Electrochem. Soc. 150 (2003) C816.
We greatly thank the Chinese Doctoral Foundation in the [27] W.J. Cheong, B.L. Luan, D.W. Shoesmith, Appl. Surf. Sci. 229 (2004) 282.
form of Grant 20030213007 through the Chinese Education [28] C. Gu, J. Lian, G. Li, L. Niu, Z. Jiang, Surf. Coat. Technol. 197 (2005) 65.
Department for financial support at Harbin Institute of
Technology in PR China.