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Team C Vardhman Kothari (200701034) Manit Kant (200701088)
Team C Vardhman Kothari (200701034) Manit Kant (200701088)
Team C Vardhman Kothari (200701034) Manit Kant (200701088)
Vardhman Kothari(200701034)
Manit Kant(200701088)
MEMS technology is based on number of tools and
methodologies, which are used to form small structures with
dimensions in the micrometer scale.
Polymers
Metals
Bulk micromachining
oldest paradigm of silicon based MEMS.
whole thickness of a silicon wafer is used for
building the micro-mechanical structures.
Surface micromachining
uses layers deposited on the surface of a
substrate as the structural materials.
to render micromachining of silicon more
compatible with planar integrated circuit
technology, with the goal of combining
MEMS and integrated circuits on the same
silicon wafer.
High aspect ratio (HAR) silicon
micromachining
A new etching technology, deep reactive-ion
etching, has made it possible to combine
good performance typical of bulk
micromachining with comb structures and in-
plane operation typical of surface
micromachining.
MEMS are used in general as:-
Sensor
Actuator
Structure
MEMS used in:-
Accelerometers Inkjet printers
Gyroscopes Displays
pressure sensors etc.
Sound Sensors(microphones)
Chemosensor
Biosensor
blood pressure sensors
• Smaller
• Lighter
• More functional
• Cheaper
• Power
• Easy to integrate into systems or modify
• Small thermal constant
• Can be highly resistant to vibration, shock and radiation
• MEMS sensors, like almost all electronic devices, do not
exhibit ideal behavior. While most designers have learned
how to handle the non-ideal behavior of op-amps and
transistors, few have learned the design techniques used to
compensate for non-ideal MEMS behavior.
The types of MEMS devices that are the most reliable, and the easiest to
qualify are devices that can be packaged in such a way as to protect them
from the environment. An excellent example of this is the case of optical
MEMS devices. These devices can be packaged in a traditional ceramic
package, with a glass lid. The glass lid, hermetically attached to the
ceramic package creates a "safe" environment for the sensitive MEMS
chip, while still allowing photons to interact with the MEMS device.
The medical , wireless technology, biotechnology , computer
, automotive , aerospace and defense industry etc. will
greatly benefit from MEMS
“Small is great”
PDF Files http://www.scribd.com/mems/
Introduction to Microengineering
http://www.dbanks.demon.co.uk/ueng/
http://www.memsnet.org/
http://www.mems-exchange.org/
http://www.slideshare.net/vinayak.nandi/memsintro-
presentation-1115551
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