BUK9Y53-100B

N-channel TrenchMOS logic level FET

Rev. 01 — 30 August 2007 Product data sheet

1. Product profile

1.1 General description

N-channel enhancement mode power Field-Effect Transistor (FET) in a plastic package
using Nexperia High-Performance Automotive (HPA) TrenchMOS technology.

1.2 Features
n Very low on-state resistance n Q101 compliant
n 175 °C rated n Logic level compatible

1.3 Applications
n Automotive systems n General purpose power switching
n Motors, lamps and solenoids n 12 V, 24 V and 42 V loads

1.4 Quick reference data

n EDS(AL)S ≤ 85 mJ n RDSon = 45 mΩ (typ)
n ID ≤ 23 A n Ptot ≤ 75 W

2. Pinning information
Table 1. Pinning
Pin Description Simplified outline Symbol
1, 2, 3 source (S)
mb D
4 gate (G)
mb mounting base; connected to drain (D)
G

1 2 3 4 mbl798 S1 S2 S3
SOT669 (LFPAK)
Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

3. Ordering information
Table 2. Ordering information
Type number Package
Name Description Version
BUK9Y53-100B LFPAK plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669

4. Limiting values
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage - 100 V
VDGR drain-gate voltage (DC) RGS = 20 kΩ - 100 V
VGS gate-source voltage - ±15 V
ID drain current Tmb = 25 °C; VGS = 5 V; see Figure 2 and 3 - 23 A
Tmb = 100 °C; VGS = 5 V; see Figure 2 - 16 A
IDM peak drain current Tmb = 25 °C; pulsed; tp ≤ 10 µs; see Figure 3 - 94 A
Ptot total power dissipation Tmb = 25 °C; see Figure 1 - 75 W
Tstg storage temperature −55 +175 °C
Tj junction temperature −55 +175 °C
Source-drain diode
IDR reverse drain current Tmb = 25 °C - 23 A
IDRM peak reverse drain current Tmb = 25 °C; pulsed; tp ≤ 10 µs - 94 A
Avalanche ruggedness
EDS(AL)S non-repetitive drain-source avalanche unclamped inductive load; ID = 23 A; - 85 mJ
energy VDS ≤ 100 V; VGS = 5 V; RGS = 50 Ω; starting at
Tj = 25 °C
EDS(AL)R repetitive drain-source avalanche - [1] -
energy

[1] Conditions:
a) Maximum value not quoted. Repetitive rating defined in Figure 16.
b) Single-pulse avalanche rating limited by Tj(max) of 175 °C.
c) Repetitive avalanche rating limited by Tj(avg) of 170 °C.
d) Refer to application note AN10273 for further information.

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Product data sheet Rev. 01 — 30 August 2007 2 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

003aab844 003aab225
120 30

Pder ID
(%) (A)

80 20

40 10

0 0
0 50 100 150 200 0 50 100 150 200
Tmb (°C) Tmb (°C)

P tot VGS ≥ 5 V
P der = ------------------------ × 100 %
P tot ( 25°C )

Fig 1. Normalized total power dissipation as a Fig 2. Continuous drain current as a function of
function of mounting base temperature mounting base temperature

003aab226
103

ID
(A)
Limit RDSon = VDS / ID
102

tp = 10 µs

10 100 µs

DC
1
1 ms
10 ms
100 ms
10−1
1 10 102 103
VDS (V)

Tmb = 25 °C; IDM is single pulse.

Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage

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Product data sheet Rev. 01 — 30 August 2007 3 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

5. Thermal characteristics
Table 4: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - - 2 K/W

003aab219
1

Zth(j−mb)
(K/W)

1 δ = 0.5

0.2

0.1
tp
10−1
0.05 P δ=
T
0.02

tp t
single pulse T
10−2
10−6 10−5 10−4 10−3 10−2 10−1 1
tp (s)

Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration

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Product data sheet Rev. 01 — 30 August 2007 4 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

6. Characteristics
Table 5: Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V(BR)DSS drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V
Tj = 25 °C 100 - - V
Tj = −55 °C 89 - - V
VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; see Figure 9 and 10
Tj = 25 °C 1.1 1.5 2 V
Tj = 175 °C 0.5 - - V
Tj = −55 °C - - 2.3 V
IDSS drain leakage current VDS = 100 V; VGS = 0 V
Tj = 25 °C - 0.02 1 µA
Tj = 175 °C - - 500 µA
IGSS gate leakage current VGS = ±15 V; VDS = 0 V - 2 100 nA
RDSon drain-source on-state resistance VGS = 5 V; ID = 10 A; see Figure 6 and 8
Tj = 25 °C - 45 53 mΩ
Tj = 175 °C - - 132 mΩ
VGS = 4.5 V; ID = 10 A - - 59 mΩ
VGS = 10 V; ID = 10 A - 41 49 mΩ
Dynamic characteristics
QG(tot) total gate charge ID = 15 A; VDS = 80 V; VGS = 5 V; - 18 - nC
QGS gate-source charge see Figure 14 - 4.1 - nC
QGD gate-drain charge - 8 - nC
Ciss input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz; - 1600 2130 pF
Coss output capacitance see Figure 12 - 141 170 pF
Crss reverse transfer capacitance - 60 82 pF
td(on) turn-on delay time VDS = 30 V; RL = 2.5 Ω; - 18 - ns
tr rise time VGS = 5 V; RG = 10 Ω - 26 - ns
td(off) turn-off delay time - 52 - ns
tf fall time - 16 - ns
Source-drain diode
VSD source-drain voltage IS = 25 A; VGS = 0 V; see Figure 15 - 0.85 1.2 V
trr reverse recovery time IS = 20 A; dIS/dt = −100 A/µs; - 71 - ns
Qr recovered charge VGS = 0 V; VR = 30 V - 83 - nC

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Product data sheet Rev. 01 — 30 August 2007 5 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

003aab421 003aab423
60 56
VGS (V) = 15
5
4 RDSon
ID (mΩ)
(A) 3.4
52
40 3.2

3 48

20 2.8
44
2.6

2.4
2.2
0 40
0 2 4 6 8 10 3 6 9 12 15
VDS (V) VGS (V)

Tj = 25 °C Tj = 25 °C; ID = 20 A
Fig 5. Output characteristics: drain current as a Fig 6. Drain-source on-state resistance as a function
function of drain-source voltage; typical values of gate-source voltage; typical values

003aab422 03aa29
100 3

RDSon 3.8
(mΩ) 4 a
VGS (V) = 3 3.4 5
80 15
2

60

1
40

20 0
0 10 20 30 40 50 -60 0 60 120 180
ID (A) Tj (°C)

Tj = 25 °C R DSon
a = -----------------------------
-
R DSon ( 25°C )

Fig 7. Drain-source on-state resistance as a function Fig 8. Normalized drain-source on-state resistance
of drain current; typical values factor as a function of junction temperature

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Product data sheet Rev. 01 — 30 August 2007 6 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

003aab986 003aab987
2.5 10−1
VGS(th) ID
(V) (A)
2.0 10−2
max

min typ max

1.5 10−3
typ

1.0 min 10−4

0.5 10−5

0.0 10−6
−60 0 60 120 180 0 1 2 3
Tj (°C) VGS (V)

ID = 1 mA; VDS = VGS Tj = 25 °C; VDS = VGS

Fig 9. Gate-source threshold voltage as a function of Fig 10. Sub-threshold drain current as a function of
junction temperature gate-source voltage

003aab425 003aab418
50 2500
C
gfs (pF)
(S) 2000
Ciss
40
15000

1000
30

Coss
500

Crss

20 0
5 10 15 20 25 30 10−1 1 10 102
ID (A) VDS (V)

Tj = 25 °C; VDS = 25 V VGS = 0 V; f = 1 MHz

Fig 11. Forward transconductance as a function of Fig 12. Input, output and reverse transfer capacitances
drain current; typical values as a function of drain-source voltage; typical
values

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Product data sheet Rev. 01 — 30 August 2007 7 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

003aab424 003aab420
50 5
ID VGS
(A) (V)
40 4
VDS = 14 V

VDS = 80 V
30 3

20 2

10 1
Tj = 175 °C Tj = 25 °C

0 0
0 1 2 3 4 0 5 10 15 20
VGS (V) QG (nC)

VDS = 25 V Tj = 25 °C; ID = 10 A
Fig 13. Transfer characteristics: drain current as a Fig 14. Gate-source voltage as a function of gate
function of gate-source voltage; typical values charge; typical values

003aab419 003aab224
50 102
IS
(A)
40 IAL
(A) (1)

30

10 (2)

20
Tj = 175 °C

Tj = 25 °C
10
(3)

0 1
0.0 0.2 0.4 0.6 0.8 1.0 10−3 10−2 10−1 1 10
VSD (V) tAL (ms)

VGS = 0 V See Table note 1 of Table 3 Limiting values.

(1) Single-pulse; Tj = 25 °C.
(2) Single-pulse; Tj = 150 °C.
(3) Repetitive.
Fig 15. Source (diode forward) current as a function of Fig 16. Single-pulse and repetitive avalanche rating;
source-drain (diode forward) voltage; typical avalanche current as a function of avalanche
values time

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Product data sheet Rev. 01 — 30 August 2007 8 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

7. Package outline

Plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669

A2
E A C
b2 c2 E1

L1 b3
mounting
b4
base

D1

H D

L2
1 2 3 4
X
e b w M A c

1/2 e

A (A 3)
A1 C

L
detail X
y C

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

D1(1) θ
UNIT A A1 A2 A3 b b2 b3 b4 c c2 D (1) E(1) E1(1) e H L L1 L2 w y
max

mm 1.20 0.15 1.10 0.50 4.41 2.2 0.9 0.25 0.30 4.10 5.0 3.3 6.2 0.85 1.3 1.3 8°
0.25 4.20 1.27 0.25 0.1
1.01 0.00 0.95 0.35 3.62 2.0 0.7 0.19 0.24 3.80 4.8 3.1 5.8 0.40 0.8 0.8 0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

04-10-13
SOT669 MO-235
06-03-16

Fig 17. Package outline SOT669 (LFPAK)

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Product data sheet Rev. 01 — 30 August 2007 9 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

8. Revision history
Table 6. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BUK9Y53-100B_01 20070830 Product data sheet - -

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Product data sheet Rev. 01 — 30 August 2007 10 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

9. Legal information

9.1 Data sheet status

Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nexperia.com.

9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Nexperia does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — Nexperia reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — Nexperia products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Nexperia product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
Nexperia accepts no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — Nexperia products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nexperia.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by Nexperia. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.

10. Contact information

For additional information, please visit: http://www.nexperia.com
For sales office addresses, send an email to: salesaddresses@nexperia.com

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Product data sheet Rev. 01 — 30 August 2007 11 of 12

Nexperia BUK9Y53-100B
N-channel TrenchMOS logic level FET

11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
9.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
10 Contact information. . . . . . . . . . . . . . . . . . . . . 11
11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

© Nexperia B.V. 2017. All rights reserved

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 30 August 2007