SCHOOL OF MECHANICAL ENGINEERING

COMPREHENSIVE VIVA VOCE

ENHANCING THE THERMAL PERFORMANCE IN ELECTRONIC DEVICES BY CIRCULATING VARIOUS LIQUID

COOLANTS AIDED WITH PCM FILLED ANNULAR - AN EXPERIMENTAL STUDY

Presented by
1 K. GOPI KANNAN (16PHD0671)
FULL TIME - RESEARCH SCHOLAR

Guided by
Dr. R. KAMATCHI
ASSOCIATE PROFESSOR/SMEC
 2 INTRODUCTION
 The advancement in design and compactness of electronics
generates enormous heat during its operation.

 The continuous overheating leads to system failure and

unreliable operation.

 Thermal management is the only imperative solution for

effective performance and longevity of device.
VARIOUS CAUSES OF ELECTRONIC FAILURE

 Focal point should be customer impressive product.

 3 COOLING METHODS IN ELECTRONIC DEVICES
ELECTRONIC COOLING

ACTIVE COOLING PASSIVE COOLING

1. Spray cooling 1. Natural convective cooling
2. Forced convective cooling 2. Thermoelectric cooling
3. Jet impingement cooling 3. Heat pipes
4. Refrigeration cooling 4. PCM based cooling

ADVANTAGES OF PASSIVE COOLING : 1. No need of additional requirement i.e., fan or blower

2. Decrease the system downtime for maintenance
3. Less power consumption
4. Noiseless operation
4 LITERATURE REVIEW
TITLE OF THE PAPER
Exp. study on closed loop two
phase thermosyphon devices
for cooling MCMs
Heat Transfer Engg (T&F)
Two phase closed loop
thermosyphon for electronic
cooling
Exp. Heat Transfer (T&F)
Exp. Investigation of PCM as
coolant of electronic chipsets
Applied Thermal Engg
(Elsevier)
AUTHOR NAME OBSERVATIONS MADE
kyun • Appropriate size of condenser and adequate amount of
et al charging liquid – crucial factors – performance of
2010 thermosyphon
• Selection of component sizes – important constraints – for
natural convective heat transfer
Chang • Condenser and evaporator thermal resistance decreases with
et al increasing of heat input
2010 • Thermal resistance decreases and heat transfer co-efficient
increases with increasing of heat power input
Mahdieh • Liquid cooling by pump is efficient - chance of leakage -
et al unstable operation of electronic devices
2016 • Closed loop thermosyphon is best way – without use of
electrical power
5 LITERATURE REVIEW
TITLE OF THE PAPER AUTHOR OBSERVATIONS MADE
NAME
Exp. Investigation & Naik • The exp. results indicates acetone - better working fluid - lower
performance evaluation of a et al thermal resistance and higher heat transfer coefficient
closed loop pulsating heat 2012 • At high heat input, superheat will be more which leads to nucleate
pipe. Journal of Applied boiling consequently thermal resistance is low
Fluid Mechanics

A comparative study of the
behavior of working fluids and
their properties on the
performance of pulsating heat
pipes IJTS (Elsevier)
Han • The increase in heat input reduces the viscosity of working fluid.
et al • The specific heat and latent heat of evaporation increases with heat
2014 input which caused for the reduction in thermal resistance.

Application of TCE-PCM
based heat sinks for cooling of
electronic components: A
review
Renewable and Sustainable
Energy Reviews (Elsevier)
Sahoo • The TCE filled metallic PCM is desirable for various thermal
et al performance parameters. Nevertheless, the high density of metallic
2016 PCM is unsuited for less weight design of heat sink.
• Organic PCM is desirable for medium temperature application such as
electronic cooling
6 OBJECTIVES
 Development of a passive hybrid test facility to extract the heat from electronic gadgets.

 To Identify of suitable circulating liquid coolants for removing high-heat flux by

thermosyphon method.

 To find the suitable PCM to cool the circulating fluid during solidify and supplies the heat
to cold water during resoldify.

 To analysis the thermal performance of electronic component in both steady and unsteady
conditions.

 To Measure the outlet water temperature and storing heat capacity of PCM for various
coolants using the experimental facility.
7 RESEARCH GAP
 Many of the recent papers are encountered with PCM based fin pin and its performance
stability towards the electronic cooling. Moreover, the heat pipe based PCM cooling also
very widely used method in electronic system to extract the heat.
 Among this plenty of literature survey, the circulation of liquid coolant by evaporative
closed thermosyphon method is entirely different in electronic cooling.
 A very limited research work is reported in the literature with liquid coolant and PCM
based heat sink together. Hence, this work will be a disparate hybrid electronic cooling for
smart industries.
 METHODOLOGY
8
9 IMPORTANCE OF THIS WORK

 In this work, the widely used method called evaporative cooling is employed for
dissipating the heat from electronic gadgets.

 The thermosyphon mechanism is employed for circulating the coolants throughout the test
facility. Hence, there is no need of electric power for operating the system.

 Instead of fins, the PCM cooling removes the large amount of heat from vaporized coolants
and to get condensate by virtue of its high storing heat capacity.

 It is a kind of passive cooling techniques. Also, there is no chance for leakage owing to
absence of prime mover which leads to stable operation to electronic devices.
10 CRITERIA FOR SELECTION OF WORKING COOLANT
LESS EFFECT ON SUB COOLING
RATE OF HEAT
REMOVAL
(Parameter 1) LOW BOILING POINT

HIGH SPECIFIC HEAT

HEAT INPUT HEAT TRANSFER
CO-EFFICIENT
(Major variable (Parameter 2)
parameter) LOW VISCOSITY/RATE OF FLUID
FLOW

COOLING CAPACITY
THERMAL
RESISTANCE
(Parameter 3)
HIGH SUPER HEAT NUCLEATE
BOILING
 PCM CLASSIFICATION
11

NON- METALLIC HYDRATED

PARAFFIN
PARAFFIN SALTS

ORGANIC INORGANIC
PCM PCM PCM
(Phase
Change
Material)

ORGANIC- INORGANIC
ORGANIC
EUTECTIC
-ORGANIC

INORGANIC-
INORGANIC
12
PCM SELECTION

ORGANIC PCM SELECTED PCM FOR THIS

 No corrosives
 Low or none undercooling
 Chemical and thermal stability
 Suitable for medium temperature
applications
 Safe and Non-reactive
 Recyclable
 No segregation
 High heat of fusion
EXPERIMENT
1. Lauric acid
 Melting point - 44.20C
 Heat of fusion - 211.6 KJ/Kg
 Specific heat - 1.76 KJ/Kg.K
2. Paraffin (RT 55)
 Melting point – 550C
 Heat of fusion - 170 KJ/Kg
 Specific heat – 2.001 KJ/Kg.K
13
LAURIC ACID CHARACTERIZATION
SEM&EDAX TGA
14 PARAFFIN CHARACTERIZATION
SEM&EDAX TGA
15 PROPOSED EXPERIMENTAL SETUP
 PHOTOGRAPHIC VIEW
16
1. Coolant tank
2. Conical manifold
3. PCM stored annular
4. Cylindrical manifold
5. Secondary PCM storage
6. NRV
7. Cold water tank (in)
8. Hot water tank (out)
9. U-tube manometer
10.Drainage
 WORKING METHODOLOGY
17
CIRCUIT I
 The working principle is based on phase change liquid evaporation method. The coolant
storage tank is filled with different coolants such as acetone, methanol, ethanol and
benzene.
 The heat input to the setup varies from 30 to 80 W. After absorbing the heat, the liquid
coolant becomes vapour and rises to top of the conical manifold which helps to increase
the velocity of vapour flow. When the vapour passes through the PCM filled annular, it
rejects the heat and becomes liquid due to the increase of density.
 Then, the working fluid comes back into the coolant storage tank due to capillary effect
and remains constantly in the tubes. Thus, the process occurs in a cyclic manner without
the use of electricity. NRV & secondary PCM tank are used to avoid the back flow of
coolant and its their heat respectively.
 The heat flux and convective heat transfer coefficient can be calculated by following
equation respectively,
𝑞 = 𝑉𝐼 / 𝐴
ℎ𝑒 = 𝑞 / (𝑇𝑤 − 𝑇𝛼)
18 WORKING METHODOLOGY
CIRCUIT II
 The circulating coolant conducts the heat to the PCM which is stored in the annular.
During the operating conditions of electronic gadgets, the PCM absorbs the heat from the
liquid coolant and stores as latent heat in it.
 During switch off condition, the cold water is supplied to the PCM filled annular through
the inside copper tube. The temperature of cold water (inlet) and hot water (outlet) are
used to determine the heat storing capacity of PCM.
 The total heat energy absorbed by PCM is given by
QS = m Cp (Tf − Ti)
Where Tf and Ti are the final and initial temperatures of the PCM respectively
19 EFFECT OF HEAT INPUT ON HEAT REMOVAL
 Heat input Heat removal rate for all the
coolants used in this study.
 The acetone has the maximum heat carrying
capacity of about 65.4% at 60 W, while the
percentage heat removal with alcohol and
petrol are 53.9% and 51.4% respectively.
REASON BEHIND
 The amount of vapour enters into the
condenser is high which leads to less effect
on subcooing of acetone.
 The acetone has low boiling point which
induced to high evaportaion rate.
20 EFFECT OF HEAT INPUT ON HEAT TRANSFER COEFFICIENT
 Heat input Convective heat transfer
coefficient for all the coolants used in this
study.
 The maximum of 374.59 W/m2K is found for
acetone whereas the alcohol and petrol has
309.07 and 294.5 W/m2K respectively.
REASON BEHIND
 The high heat transfer coefficient for acetone
is mainly because of the high specific heat
and low viscosity.
 In general, the heat transfer coefficient
depends on geometric shape of the device and
rate of fluid flow.
21 EFFECT OF HEAT INPUT ON THERMAL RESISTANCE
 Heat input thermal resistance for all the
coolants used in this study.
 The maximum reduction in thermal resistance
of about 0.523 0C/W is found for acetone at
60 W. Overall thermal resistance can be
calculated by

REASON BEHIND
 At high flow rate due to increase of heat
input, the vapour is compressed, thus the
pressure and velocity of working fluid in the
copper tube increases, which further causes
decrease in thermal resistance.
 At high heat input, superheat will be more
which leads to nucleate boiling consequently
thermal resistance is low
22 PLAN OF ACTIVITIES THROUGH BAR DIAGRAM
JAN 2017 JULY JAN 2018 JULY JAN 2019 JULY
DURATION / – JUN 2017 – – JUN 2018 – – JUN 2019 –
ACTIVITY 2017 DEC 2017 2018 DEC 2018 2019 DEC 2019

Literature review
Course work
Defining the research problem
Defining the objectives
Material purchasing and installation
Experimentation
Validation of results
Optimization of the parameters
Research paper publication
Thesis writing

Completed On going Future work

 PROPOSED COURSEWORK RESULT
23
24
KEY PUBLICATIONS
[1] Gopi Kannan, K., Kamatchi, R., Venkatajalapathi, T., & Krishnan, A. S. (2018).
Enhanced heat transfer by thermosyphon method in electronic devices, International
Journal of Heat and Technology, 36(1), 339-343.
25 REFERENCE
[1] Alimohammadi, Mahdieh et al. "Experimental Investigation Of The Effects Of Using Nano/Phase Change Materials
(NPCM) As Coolant Of Electronic Chipsets, Under Free And Forced Convection". Applied Thermal Engineering 111
(2017): 271-279.
[2] Krishna, Jogi, P.S. Kishore, and A. Brusly Solomon. "Heat Pipe With Nano Enhanced-PCM For Electronic Cooling
Application". Experimental Thermal and Fluid Science 81 (2017): 84-92.
[3] Chang, C.-C. et al. "Two-Phase Closed-Loop Thermosyphon For Electronic Cooling". Experimental Heat Transfer 23.2
(2010): 144-156.
[4] Krishnan, S., S.V. Garimella, and S.S. Kang. "A Novel Hybrid Heat Sink Using Phase Change Materials For Transient
Thermal Management Of Electronics". IEEE Transactions on Components and Packaging Technologies 28.2 (2005): 281-
289.
[5] Min-Kyun Na, Jin-Seok Jeon, Ho-Youn. "Experimental Study On Closed-Loop Two-Phase Thermosyphon Devices For
Cooling MCMs". Heat Transfer Engineering 22.2 (2001): 29-39.
[6] Babu, N. Narendra, and Rudra Naik. "Experimental Investigation And Performance Evaluation Of A Multi Turn Closed
Loop Pulsating Heat Pipe". Applied Mechanics and Materials 592-594 (2014): 1554-1558.
[7] Baby, R., and C. Balaji. "A Neural Network-Based Optimization Of Thermal Performance Of Phase Change Material-
Based Finned Heat Sinks—An Experimental Study". Experimental Heat Transfer 26.5 (2013): 431-452.
[8] Kandasamy, Ravi, Xiang-Qi Wang, and Arun S. Mujumdar. "Transient Cooling Of Electronics Using Phase Change
Material (PCM)-Based Heat Sinks". Applied Thermal Engineering 28.8-9 (2008): 1047-1057.
26

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