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While there are some fully-automated BGA reballing systems, the cost is typically justified only
for very high volumes, not a part of this discussion.
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spheres onto the screen and tilt things around until spheres drop into each aperture. It is very
reminiscent of those little games from childhood where you try to get all the BBs to rest in the
proper holes all at the same time.
Preforms. At least two sources are available to provide spheres in their proper array. These use
either water-soluble paper or polymer. A large number of arrays are available, and the cost is low
for small quantities since there is minimal tooling cost. Both methods require additional
component cleaning with water and baking to dry the BGA again before use.
With paper preforms, the preform is placed into a template that matches the outside dimensions
of both the preform and component. The BGA surface is then covered with water-soluble paste
flux and placed down onto the preform. The two are reflowed together. After reflow, the charred
paper is peeled off and the BGA is scrubbed with a brush and DI water to remove remaining paper
remnants and flux. The polymer preform process has the operator put water-soluble flux onto the
component pad side and lay it flux-down on top of the preform. The outside edges of the BGA and
preform are aligned to line up the spheres and pads. The pair then go through reflow and the
polymer is peeled off after cooling. A polymer preform vendor's website states: mentions "It's not
unusual with any reball process to occasionally have one or two balls not adhered to BGA after
processing. That's why we've included our repair stencil. It is used when there is a need to replace
only a few balls." A translation is that if spheres come off as the polymer is peeled back, the
operator would replace the individual spheres and reflow the part again.
Vacuum Pick-Up. The third method uses a vacuum head with the sphere pattern, coupled with a
flux stencil. There is an initial cost for a vacuum and control system. After that, tooling is needed
for each unique BGA pattern. However, the process is extremely fast and typically eliminates the
need for final cleaning and re-baking. A new, patented process for supporting the spheres
reportedly slashes vacuum head cleaning issues and enhances sphere pick-up and release. The
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ready to be used.
Reflow
While reflow is fairly straightforward, reflow of the spheres does need to be addressed. With a
typical profile, the spheres would go liquidus for around 30-45 seconds — the temperature
depending on the solder alloy being used. The ramp rate should be kept to around 0.7°C per
second ideally, but definitely less than 2°C per second. With hot air, be careful to keep flow down.
Although it seems obvious, a lot of spheres have been blown around during reflow. Also, nitrogen
atmospheres are always going to provide a better finished product if such an atmosphere is
feasible. Component preparation and reflow are fairly consistent regardless of the method used to
place the spheres. The three primary methods include tilt and roll systems, solder preforms, and
vacuum pick-up. Preforms offer a good solution where very low volume and high mix are the rule.
Additional cleaning labor and baking time need to be factored in, along with a possible additional
heat cycle if spheres don't adhere. Vacuum pick-up offers value at mid- to high-volume and
provides a finished product quickly with virtually no cleaning needed after bumping. Each method
has a price point and volume where it may be the proper choice.
Contact: HEPCO, Inc., 150 San Lazaro Ave., Sunnyvale, CA 94086 408-738-1880 fax: 408-
732-4456 E-mail: tim@hepcoblue.com Web:http://www.hepcoblue.com
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