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Data Sheet
Data Sheet
Data Sheet
04
PRODUCT DATA SHEET – May 15, 2017
ALS2
ALS3
ALS0
GNDD
LEDA
GNDL
LEDB
TMODE
MOSI
MISO
ATB
CSB
SCK
WS
SPI to uC
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Functional Diagram
VDDA GNDA VDDD GNDD ATB TMODE
Diagnosis signals
SPI CSB
Shift
ALI Digital Control Command SCLK
Register
Ambient Light Interface
State Control MOSI
ALS0 Machine Send & Receive
Registers
Register
ALS1 MISO
ALS
ALS2 MUX ADC
ALS Converter LP HP
MUX WS
AMP
ALS3 Filter Filter
ADC
Digital Signal Processing
Demo- LEDA
RS Inte-
RS BP dulator
AMP grator
& Sign LEDB
RSI E527.04
Rain Sensor Interface LED Driver GNDL
GNDL 19
LEDA 18
TMODE 17
1 MOSI 21 EDP RS 15
2 MISO ALS3 14
3 SCLK ALS2 13
4 WS ALS1 12
5 CSB ALS0 11
7 GNDD
9 GNDA
6 VDDD
8 VDDA
10 ATB
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
1 Functional Safety
The development of this product is based on a process according to an ISO/TS
16949 certified quality management system.
Functional safety requirements according to ISO 26262 have not been submitted to ELMOS and therefore have not
been considered for the development of this product.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
3 ESD
Table 3-1: ESD Ratings Table
Description Condition Symbol Min Max Unit
ESD HBM protection at pins LEDA, AEC-Q100-002 VESD(HBM) -2 2 kV
LEDB (HBM), C=100pF,
R=1.5kΩ chip level
ESD HBM protection at all other pins AEC-Q100-002 VESD(HBM) -2 2 kV
(HBM), C=100pF,
R=1.5kΩ chip level
ESD CDM protection at all pins AEC-Q100-011 VESD(CDM) -500 500 V
(CDM), R= 1Ω chip level
ESD CDM protection at edge pins AEC-Q100-011 VESD(CDM),C -750 750 V
(CDM), R= 1Ω chip level
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
5 Electrical Characteristics
(VVDDx = 3.1V to 3.5V, Tamb=-40°C to + 105°C, unless otherwise noted. Typical values are at VVDDx=3.3V and
Tamb=+25°C. Positive currents flow into the device pins.)
5.1 Overview
Table 5.1-1: Electrical Parameters Supply
No. Description Condition Symbol Min Typ Max Unit
1 Current consumption of pin VDDA MODE[7:0] = 0x60, IVDD,LOOP 4.0 4.7 5.4 mA
and VDDD at typical mode (rain AUTOM_CFG[7:0] = 0x0F,
and automatic ambient light RSI_CFG1[7:0] = 0x00
measurement mode)1) RSI_CFG2[7:0] = 0x88,
VDDA = VDDD = 3.3V,
no photo diode current,
LEDs are connected and
supplied,
no communication
2 Current consumption at pin VDDA VDDA = VDDD = 3.3V IVDD,SM 5 8 11 µA
and VDDD in sleep mode
1)
The photo current of photo diodes increases the current consumption of IVDD,LOOP. Additional current consumption of pins LEDA and LEDB must
be considered.
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5.3 References
Table 5.3-1: Electrical Parameters of References
No. Description Condition Symbol Min Typ Max Unit
1 Internally generated reference voltage at VREF 1.288 1.388 1.488 V
pin VREF
2 Guaranteed current range supplied by pin IVREF -3 - 0.2 mA
VREF*)
3 Current into pin VREF in case of VREF IVREF,SC,GND -25 -16.3 - mA
shorted to GND
4 Current into pin VREF in case of VREF IVREF,SC,VDD - 0.8 2 mA
shorted to VDDx
5 Internally generated reference voltage for VREF,ADC 2.300 2.420 2.500 V
ADC
*)
Not tested in production
5.5 Oscillator
Table 5.5-1: Electrical Parameters of Oscillator
No. Description Condition Symbol Min Typ Max Unit
1 Trimmed clk frequency FCLK,TRIM 7.2 8 8.8 MHz
2 Number of trimming positions for FCLK*) NOSC,PROG - 32 -
3 Default untrimmed clk frequency during FCLK,DEF - 6.2 8 MHz
start up or an uncorrectable ECC error of
trim section
*)
Not tested in production
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
6 Functional Description
6.1 Overview
VREF
Voltage LEDA
References
Clk GNDL
Gen.
LEDB
Signal
processing WS
RS TIA ∫dt
-1/+1
MISO
ALS0
MUX
The purpose of the Rain Sensor Module is to control an optical sensor unit for rain detection and ambient light
measurement. The signal flow is displayed in a simplified functional diagram (6.1-1).
Clock
LEDA
Photo Diode
LEDB
Comparator
glass
Integrator
Vref
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Rain drops will disturb the balance due to the reflection change of the surface. The reflected light of one channel
will decrease and new equilibrium has to be found.
Clock
LEDA
Photo Diode
LEDB
Comparator
glass
Integrator
Vref
The input amplifier amplifies the photo current and eliminates the DC current part of the photo current, thus the
ambient light.
The demodulator blanks out one half of the mirrored input signal. The sign block determines the sign of the current
input signal which has to be added in the integrator module. The comparator compares the integrated input signal
with the reference voltage and delivers at his output the bit stream. The bit stream is averaged with a digital low
pass filter.
The averaged bit stream value is a function of LEDA and LEDB damping. If the photo diode receive the light from
both LEDs with the same strength the averaged bit stream value is 0.5. If the light from LEDB is damped by a water
drop and the light from LEDA not, the averaged bit stream value goes below 0.5. If the light from LEDA is damped
by water drop and the light from LEDB not, the averaged bit stream value goes above 0.5.
Am more detailed description of the rain sensor interface can be found in chapter 6.7 and 6.10.1.
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Supply Monitor
POR_VDDD
NPOR NPOR
VBG
POK_VDDA SLEEP_MODE
+
+ OK
POK_VDDA
-
POK_VDDD
+
+ OK
POK_VDDD
-
OV_VDDA
+
OV
-
OV_VDDA
VDIAG,VDDD
VDIAG,VDDA
The supply monitor supervises the external supply voltages VDDA and VDDD:
• In case any supply voltage is lower than expected, reset will be generated
• If VDDA is higher than expected over voltage will be detected
Reset generation
Both supply voltages are compared with a reference voltage.
Comparators POR_VDDD use a reference voltage related to the threshold voltage of the implemented MOS tran-
sistors. Thus this reference varies over temperature and process parameters.
Comparators POK_VDDx use a constant reference voltage derived from the bandgap reference.
In order to avoid toggling of the reset signal all comparators contain a hysteresis.
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During start-up it is possible, that POK_VDDD is released early, when VDDA < VDDD so that the bandgap voltage
is not ready yet. Since POK_VDDA and POK_VDDD are combined reset sources and POK_VDDA is not released
in this condition, this poses no problem.
In sleep mode the clock of the digital part is switched off. Thus the requirements concerning the supply voltage
decrease as there are no timing constrains. Supply voltage has to be sufficiently high to ensure that all registers
keep their value. This can be guaranteed with the comparator POR_VDDD. So in sleep mode the output signals of
comparators POK_VDDx are not taken into account for reset generation. Thus these comparators are switched off
in sleep mode in order to reduce current consumption.
Diagnosis
For diagnosis purpose, the supply voltages can be measured by VDIAG,VDDA (measurement channel 10) and VDIAG,VDDD
(measurement channel 11) via internal ADC. These diagnosis voltages are not available in sleep mode.
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VDDA
VDDD
VBG
NPOR
POK_VDDA
POK_VDDD
BG_OK
CLK
1 23 4 56 7
During power-ramp up, several cells ensure a clean start-up of the circuitry. First the POR_VDDD comparator holds
the whole system in reset until a VDDD crosses the combined threshold voltage of the used MOSFETs (1). At this
point, the bandgap-reference is working well enough to generate a stable BG_OK signal. When VBG is stable,
BG_OK rises (2) which is ANDed with the supply monitor comparators POK_VDDx, since their thresholds are refer-
enced from VBG. BG_OK also enables the oscillator. Only when POK_VDDD and POK_VDDA are also high, the
system is released from its reset-state (3).
When the power falls below the power comparator threshold VPOK,VDDA,FALL (4) or VPOK,VDDD,FALL (5) respectively, the
system is reset until power rises again. If power falls further the bandgap reference cell signals insufficient power
by setting BG_OK to 0 (6), which also stops the oscillator. Finally (7) the NPOR signal ensures the reset when all
other analog circuitry cannot work due to low power supply voltage.
During sleep mode the bandgap reference and the oscillator are switched off. Since their reference is missing, the
POK_VDDx comparators are also powered-down. The only power monitor remaining is the POR_VDDD compar-
ator to ensure information stored in registers is kept. If the device exits the sleep mode due to SPI activity and
VDDD or VDDA are below their thresholds, the device is reset as soon BG_OK signal rises.
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6.3 References
VDDA VDDA
vbg
Bandgap iptat Current
Reference Reference iconst
bg_ok
VDDA
vbg +
VREF
-
CVREF
VDDA
vbg +
vref_adc
-
VREF
The internally generated voltage VREF is the output at pin VREF. VREF is intended as reference for external photo
diodes and the corresponding interface, Rain Sensor Interface and the Ambient Light Interface.
The guaranteed output current range of pin VREF is defined by parameter IVREF.
In case of an external short circuit of pin VREF to VDDx or GNDx the current is limited to IVREF,SC,VDD and IVREF,SC,GND
respectively.
The external decoupling capacitor CVREF should be placed as close as possible to the IC pins VREF and AGND.
For diagnosis purpose VREF can be measured by the internal ADC with measurement channel 7.
At idle and sleep mode VREF generation is switched off.
VREF,ADC
VREF,ADC is the internal upper reference voltage for the internal ADC. At idle and sleep mode VREF,ADC generation is
switched off.
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IREF,VTEMP
ON / OFF
VTEMP
GND
Functionality of the temperature sensor is to output the temperature dependent voltage VTEMP. VTEMP is realised by
supplying two NPN transistor diodes with the current IREF,VTEMP .
At room temperature (25°C) VTEMP is in the range defined by VTEMP,25. The slope of VTEMP over temperature is given
by SLOPEVTEMP.
VTEMP can be passed to the ADC via the ADC multiplexer (measurement channel 6). VTEMP is automatically meas-
ured during an automatic ALI measurement, a burst measurement, RSI measurement, overtemperature mode and
when the LED drivers are switched on for coupling factor measurement.
The Temperature sensor is switched on and off according to the actual IC operating mode in order to reduce cur-
rent consumption in modes, where a temperature measurement is not needed.
6.5 Oscillator
OSCILLATOR
ICONST
FOSC[4:0] CLK
programmable
ON / OFF
The oscillator generates the system clock CLK for the Digital Control block. The frequency FCLK,TRIM is defined by:
• internal reference current ICONST
• TRIM Register bits FOSC
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During start up of the IC or an uncorrectable ECC error of the trim section, the register bits FOSC contain default
data, the corresponding CLK frequency is according to parameter FCLK,DEF.
After start up the calibrated OSC value is readout from OTP and written to register bits FOSC. The corresponding
CLK frequency is than according to parameter FCLK,TRIM.
The oscillator is switched off only during sleep mode in order to reduce current consumption where CLK is not
needed. During start up the oscillator is switched on.
ICAL IREF
To ADC
VIREF
ALS3 RDIAG
PD3
VCONV VALI,OS
+ VALI,OUT
VOP1,OS
IPHOTO
- To ADC
ALS0 -
PD0 +
VINC VCOMP
VREF
PDRS
The ambient light interface (ALI) is intended to convert the current of an external photo diode into a voltage.
This functionality is realized by three functional units:
• input multiplexer
• logarithmic current to voltage converter
• amplifier stage
Input Multiplexer
The input multiplexer of the ALI block is controlled by the internal state machine. According to the chosen channel
setting, the current of the external photo diodes, connected to any ALSx or RS pin, is passed via the multiplexer to
the input of the logarithmic converter. Any not selected ALSx or RS pins are shorted to VREF. If a RSI measure-
ment is selected, the current into pin RS is passed to the rain sensor interface.
In Idle Mode and Sleep Mode all ALS ans RS pins are shorted to VREF and VREF is not regulated (high ohmic). In
Idle Mode VREF is pulled to supply VDDA by a weak current.
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Logarithmic Converter
The input current IPHOTO is logarithmically converted into a voltage VCONV. Valid input current range of IPHOTO depend-
ing on IREF and amplifier gain is given by parameter IPHOTO,ILO,GLO.
VINC
For diagnosis purpose an additional systematic offset VINC can be added to the positive input of the logarithmic OP
by setting INC bit via DEV_CFG register. This function is described in subchapter 6.6.3.1.
VCOMP
To avoid an amplification of VINC by the amplifier, the compensating voltage source VCOMP is
implemented. VCOMP is activated and deactivated together with VINC. Thus activating VINC increases
VALI,OUT by VINC only and not by VINC multiplied by the amplifier gain GALI,LO. Obviously a mismatch between VINC and
VCOMP is amplified.
VALI,OS
6.6-1 shows a voltage source VALI,OS. This voltage represents the output related offset voltages of
both OPs (including VOP1,OS) and in case VINC is activated, additionally the mismatch between VINC and VCOMP.
Current Diagnosis
For diagnosis the reference and calibration current can be passed to an internal resistor RDIAG and can be meas-
ured via ADC. This function is described in subchapter 6.6.3.2.
Amplifier Stage
In order to use the full input range of the connected ADC, VCONV is amplified by the second OP to an appropriate
range.
The ALI output voltage VALI,OUT dependent on photo diode current IPHOTO can be calculated as follows:
The parameter VREF is specified in 5.3-1. VINC, VALI,OS and GALI (as GALI,LO) are specified in 5.6-1. If the systematic off-
set VINC is deactivated, the parameter VINC is zero and can be omitted.
The term k T/q is the thermal voltage and consists of the Boltzmann constant k = 1.381 10-23 Ws/K, the absolute
temperature T in Kelvin and the elementary charge q = 1.602 10-19 As.
The ALI reference current IREF is specified in 5.6-1 as parameter IREF,ALI,LO.
As the input current IPHOTO has to charge several parasitic capacities, a valid measurement can take up to a time of
tALI,VAL.
Calibration
The equation for the ALI output voltage VALI,OUT contains several not precisely specified parameters and depends on
the temperature. For accurate light measurement the system should be calibrated during an end of line test and fre-
quently during operation in order to cancel temperature effects. For that reason it is possible to measure the
internal calibration current ICAL instead of the photo current IPHOTO via a multiplexer. The calibration procedure is
described in subchapter 6.6.2.
• For low input currents: ESD protection and Input Multiplexer circuitry cause leakage currents. These leakage
currents are added to photo diode current IPHOTO of the photo diode selected for measurement. Thus the meas-
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ured current is the sum of both. Positive leakage currents are defined as currents flowing into the pad which
increases the measured value of IPHOTO , negative leakage currents decrease the measured value as depicted in
6.6.1-1.
Leakage currents are strongly dependent on temperature, thus the leakage currents are rising almost exponentially
at high temperatures. The leakage current is specified over the full temperature range by parameters ILEAK,ALSX and
ILEAK,RS.
Measured current
[log scale]
IMEAS,LEAK_POS
IMEAS,NOLEAK Transfer Characteristic with positive leakage current
• For high input currents: The current to voltage characteristic of the Log-converter diodes is not ideal logarithmic
(e.g. due to intrinsic line resistance). Therefore the measured current value is greater than the real input current
IPHOTO. This deviation increase with increasing input current IPHOTO and increasing temperature. So the impact of
this deviation can be seen for example on the parameter IMEAS,300u. For currents below 30µA there is no relevant
effect on measured value.
Measured current
[log scale]
Current Deviation
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6.6.2 Calibration
For accurate light measurement the system should be calibrated. The calibration procedure for ALI measurements
has to be divided into two categories:
• cyclic calibration during operation of the device
• calibration during end of line test of module
In chapter 6.6 the following relations between the photo current IPHOTO and the ALI output voltage VALI,OUT are given:
But the application is intended to measure the ambient light and not IPHOTO. So two other characteristics of the ambi-
ent light sensor must be considered in order to get the relation between ambient light and the measured value:
A) the optical path from ambient light to the illuminance of the photo diode and
B) the transfer characteristic of the connected photo diode (illuminance to photo current)
Simplifying both, A and B, to a linear relation, the influence can be described by adding a constant of proportional-
ity. Describing the ambient light by an illuminance ILAL and adding a constant of proportionality CO,PD for the optical
path and the photo diode, the above given equations result in:
These equations show, that IREF and CO,PD can be merged to CO,PD,IREF. Additionally this has the advantage that the
internal ALI reference current IREF, which varies slightly from chip to chip, is also calibrated. This results in:
The voltages VREF, VINC, VALI,OS and the gain coefficient can be extracted by calibration measurements
during operation and of course also during the modules end of line test.
The constant of proportionality CO,PD,IREF has to be extracted by a calibration during end of line test of the module at
a defined illuminance.
Remark: Instead of converting the measured ALI ADC integer values into voltages it is also possible to directly use
the measured ADC integer values for all voltages in calibration formulas.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
70
10
-10
-20
-30
1E-10 1E-9 1E-8 1E-7 1E-6 1E-5 1E-4 1E-3
Figure 6.6.2-1: Example for ALI measurement error with and without calibration
In 6.6.2-1 the effect of calibration is depicted. A random sample was measured at room temperature. The ALI cur-
rent was injected into an ALS pin with a SMU with about 2000 current steps. About 1000 measurements per current
step were done in burst mode and then averaged. For the ALI measurement value calculation without calibration
the diagnosis ADC measurement value of VREF (measurement channel 7) and the internal temperature ADC meas-
urement value were used. The relative ALI measurement error is the percentage error of the calculated ALI meas-
urement value to the injected ALI current value.
For the calibration measurement CMA the photo current IPHOTO as ALI input current will be replaced by internal calib-
ration current ICAL (like the gain coefficient calibration measurement described in chapter 6.6.2.2). This is done with
a multiplexer.
For the complementary calibration measurement CMB the ALI reference current IREF and the internal calibration
current ICAL are interchanged in comparison to CMA. This is also realized with a multiplexer. The corresponding ALI
output voltages are VALI,OUT,CMA and VALI,OUT,CMB:
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For the CMB measurement the CALI bit in the CALIBRATION register must be set and the channel 5 (ICAL) has to
be measured.
It should be noted that for activated and deactivated systematic offset VINC a separate calibration is necessary
because VINC is zero when systematic offset is deactivated and VALI,OS may differ for the two VINC settings.
The gain coefficient is proportional to absolute temperature. The actual value can be determined by a
calibration measurement during operation.
Selecting a calibration measurement will replace the photo current IPHOTO as ALI input current with an internal calib-
ration current through a multiplexer (like the calibration measurement CMA described in chapter 6.6.2.1). For such
measurement the channel 5 (ICAL) has to be measured. The ALI input current during the calibration measurement
will be called ICAL and the related ALI output voltage VALI,OUT(ICAL). Thus the equations given above can be written as:
The ALI reference current IREF is specified in 5.6-1 as parameter IREF,ALI,LO. The calibration current ICAL is specified in
5.6-1 as parameter IREF,ALI,HI. The current ratio IREF/ICAL has less variance from chip to chip as IREF or ICAL as individual
currents. Therefore, the current ratio IREF/ICAL should be used for the calibration calculation, which is specified recip-
rocal (ICAL/IREF) in the 5.6-1 as parameter RatioREF.
The determination of the term VREF+VINC+VALI,OS is described in chapter 6.6.2.1. The VINC setting has no direct impact
on the gain coefficient. But it should be noted, that the gain coefficient calibration must have the same VINC setting
as the VREF+VINC+VALI,OS calibration.
With the known illuminance ILAL and the calibration measurements described in chapter 6.6.2.1 and 6.6.2.2 all data
is available to calculate the constant of proportionality.
It should be noted that the VINC setting for this calibration measurement must be the same as for the
VREF+VINC+VALI,OS calibration measurement.
6.6.3 Diagnosis
6.6.3.1 Short Circuit Diagnosis
For inputs ALSx and RS an additional systematic offset VINC can be added to the positive input of the logarithmic
OP by setting the bit INC via register DEV_CFG. This functionality is implemented in order to increase the predict-
ability of ALI's output voltage VALI,OUT in case of an external short circuit between any ALSx or RS pin, selected for
ambient light measurement and any other ALSy, RS or VREF pin.
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To examine the effects of a short circuit on the output voltage VALI,OUT, the voltage VALSX of the selected input pin
ALSx or RS must be known. From 6.6-1, the voltage at the negative input of OP1 VOP1,IN,NEG can be derived as fol-
lows:
VOP1,OS is the offset voltage of the first ALI OP specified in 5.6-1. Therefore the voltage VALSX at pin ALSx or RS is:
RSW,PASS is the multiplexer switch resistance from selected ASLx or RS pin to the negative input of OP1. IPHOTOX is
the photo current of the selected input pin ALSx or RS.
The offset voltage VOS,OP1 can be negative as well as a positive. Therefore, the following statement can be made for
the voltage VALSX of the selected input pin ALSx or RS:
• If VINC is deactivated (VINC=0V) VALSX can be less or greater than VREF, depending on VOS,OP1 and IPHOTOX.
• When VINC is activated VALSX is always greater than VREF, because VINC is at least twice as large than as VOS,OP1
(specified in 5.6-1).
• An activation of VINC leads to an increase of VALSX.
For a short circuit to pin VREF which provides the voltage VREF can be concluded:
• If VALSX is less than VREF, the current into pin ALSx or RS will increase and thus VALI,OUT will decrease.
• For VALSX greater than VREF, a part of the photo current IPHOTOX will be drained into pin VREF. The current into pin
ALSx or RS will decrease and thus VALI,OUT will increase.
• An increase of VALSX leads to a decrease of the current into pin ASLx or RS and thus to an increase of VALI,OUT.
Hence a short circuit to pin VREF with activated VINC leads always to an increased VALI,OUT voltage. In contrast to
deactivated VINC where the VALI,OUT voltage can be decreased or increased. More importantly, an activation of the
voltage VINC leads to an increase of VALI,OUT.
For a short circuit to pin ALSy or RS which is not selected for light measurement the voltage VALSY of that pin must
be known:
RSW,SHORT is the multiplexer switch resistance from not selected ASLy or RS pin to the internal VREF voltage. IPHOTOY is
the photo current of the photo diode connected to the not selected ALSy or RS pin.
For a short circuit to pin ALSy or RS which is not selected for light measurement can be concluded:
• If VALSX is less than VALSY, the current into pin ALSx or RS will increase and thus VALI,OUT will decrease:
• For VALSX greater than VALSY, the current into pin ALSx or RS will decrease and thus VALI,OUT will increase:
• An increase of VALSX leads to a decrease of the current into pin ASLx or RS which is selected for light measure-
ment and thus to an increase of VALI,OUT.
By comparison to short circuit to pin VREF with a short circuit to pin ALSy or RS which is not selected for light
measurement leads not always to an increased VALI,OUT voltage when VINC is activated. But the probability is quite
high, because the resistance RSW,PASS is at least 3 times higher than the resistance RSW,SHORT. As with the short cir-
cuit to pin VREF, an activation of the voltage VINC leads to an increase of VALI,OUT.
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1. Measure the ALI ADC result value of the selected ALI channel with deactivated VINC voltage.
2. Measure the ALI ADC result value of the selected ALI channel with activated VINC voltage.
3. Calculate the difference of ALI ADC values between activated and deactivated VINC voltages.
If no short circuit to an ALSy, RS or VREF pin is present, the measured ALI ADC value difference should (accord-
ing to the VALI,OUT equation from chapter 6.6) match the specified value VINC,OS,ADC in 5.6-1. To reduce the specified
range of VINC,OS,ADC it is a good idea to measure the ALI ADC value difference of the internal ICAL current (ICAL chan-
nel 5) at the same time.
If a short circuit to an ALSy, RS or VREF pin is present, a decreased current flows into pin ALSx or RS when VINC is
activated. Therefore the measured ALI ADC value difference must (according to the VALI,OUT equation) be higher
than VINC,OS,ADC.
In practice, there is a limitation. The ALI ADC value range has a lower and upper limit, 0 and 1023 LSB. When the
measured ALI ADC value with deactivated VINC is in the range between (1023 LSB - VINC,OS,ADC) and 1023 LSB, no
firm conclusion can be drawn about a short circuit. The measured ALI ADC value difference can than not rise
above VINC,OS,ADC. This restricted detection range is not in the specified ALI measurement range IPHOTO,ILO,GLO. But it
can be that the photo current in absolute darkness is measured in this restricted detection range without short cir-
cuit.
If the measured ALI ADC value with deactivated VINC is in the restricted detection range from (1023 LSB - VINC,OS,ADC)
to 1023, the following cases may be the reason:
• Short circuit to an ALSy, RS or VREF pin and a positive voltage of the first ALI OP VOP1,OS. The ALI ADC value
than often is 1023.
• Normal ALI ADC measurement value of the selected photo diode in absolute darkness or almost absolute dark-
ness.
• An open circuit of the selected ALSx or RS pin when the ALI ADC value is 1023.
To rule out the case for the absolute darkness, it could be reviewed if more ALI channels measure similar values.
But the used input pin of the comparing channel should not be adjacent to the originally pin, because it can be
affected by the same short circuit.
Another possibility is to switch on the RSI LEDs (e.g. via register CALIBRATION) to generate some light for the RS
photo diode. If the decoupling between RSI LEDs and ALS photo diodes is not perfect, it is possible that the ALS
photo diodes get also some light from the RSI LEDs.
ALI ADC values of the lower limit are not a practical problem. Since the ALI output voltage VALI,OUT is logarithmic, the
ALI input currents in the lower limit range of the ALI ADC are very high. These input currents are far outside the
defined measurement range IPHOTO,ILO,GLO and usually do not occur in reality.
Remark: As explained above selecting VINC increases the voltage at the corresponding ALS input. Thus the connec-
ted photo diode is biased in forward direction which causes a forward current inside the diode. The photo current
will be decreased by this forward current. The forward current will increase at higher temperatures.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
The measured diagnosis voltages depend on absolute process parameters (due to RDIAG) but show only small vari-
ation over temperature. Thus a change of reference or calibration current can be easily detected by comparing the
actual diagnosis voltage ADC value to the corresponding value VDIAG,ALI,X,CAL stored during calibration at room tem-
perature. Tolerances are given by parameters TOLVDIAG,ALI,LO (IREF) and TOLVDIAG,ALI,HI (ICAL) in 5.6-1. The tolerances
are calculated as follows:
rsi_on
RRSI,IU
IRS
RS RRSI,G2
- VCONV,RS RRSI,G1
SW PASS
IRS,AC - SD-stream
of ALS MUX Band Demo- Integra- Com- Flip-
PDRS + Pass dulator Sign tor parator flop
+
VREF
IRS,DC
DC-cancellation
VREF
The Rain Sensor Interface (RSI) is intended to convert the AC current of the external photo diode connected to pin
RS into a voltage. The photo current is passed via ALS-MUX to the RSI.
This functionality is realized by following functional units:
• Current to voltage converter
• DC current cancellation
• Adjustable amplifier stage
• Bandpass filter
• Demodulator
• Sign block
• Integrator
• Comparator
• Flip-flop
DC current cancellation
Function of this block is to cancel the DC component IRS,DC of the input photo current IRS. Thus VCONV,RS is fed back
via an integrator and a voltage controlled current source.
Bandpass filter
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Demodulator
The demodulator passes the converted input current only during the LED light pulses. The length (integration time)
and the phase delay of this conduction period to the LED current pulse is configurable by the register RSI_CFG3.
Sign block
The demodulated input signal is inverted when the LEDB is active.
Integrator
The light pulses from LEDA are integrated positive and the light pulses from LEDB are integrated negative.
Comparator
The comparator works as an 1 Bit-ADC in a SD-loop.
Flip-flop
The flip-flop synchronizes the comparator output with the Halios clock, thereby generating the Sigma-Delta stream
(SD-stream) output. The SD-stream output determines which LED is active and is also the measurement output
signal (after digital filtering).
For optimum measurement results, it is recommended that the RSI is modulated symmetrically. Symmetrically
means that the RSI result value (with bypasses highpass filter) is about the half (1024LSB) of the RSI result range
when no rain drops are present. Therefore the received pulses from LEDA and LEDB are equal. This happens
automatically if the attenuation of both optical paths and both LED currents are equal. In practice it is possible that
the attenuation of on optical path is different from the other path, e.g. caused by a scratch on the windshield. For
that situation it is possible to compensate the different attenuations with different selected LED currents.
In the ideal case, a water drop on the windshield weakens the light pulse received in the photo diode by decoupling
light from the windshield. However, a water drop can also lead to a coupling-in of light into the windshield by reflec-
tion at the water-air boundary layer. Then the received light pulse is amplified rather than decreased.
If it is known to which optical path the water drop has fallen, the RSI result value can be used to determine whether
the light is decoupled or coupled in. There is the following relationship:
• When the water drop on the optical path LEDA has fallen:
• RSI result value increases decoupling
• RSI result value decreases coupling in
• When the water drop on the optical path LEDB has fallen:
• RSI result value increases coupling in
• RSI result value decreases decoupling
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Therefore in this mode the sensitivity of rain drop recognition is independent from the RSI gain and LED current
settings. The sensitivity is almost dependent only on the optical system. For example, a 20% lower received LEDA
to LEDB pulse generates always the same measurement result regardless of the received pulse strength.
If the RSI amplifier does not saturate, the RSI0 result range always reaches from 100% damped LEDB to LEDA
pulse (=-100% LEDA to LEDB) to 100% damped LEDA to LEDB pulse. In 6.7.1.1-1 the characteristic curve for the
RSI0 mode is shown.
At the RSI0 mode a saturation of the amplifier is not reliably recognizable by the RSI0 result values. An overdriven
signal does not necessarily generate the minimum or maximum RSI0 result value, but can produce any result
value. Hence it is important to keep the RSI amplifier out of saturation. However to get a good signal-to-noise ratio
the amplification and LED current should be as high as possible.
To get the optimal RSI gain and LED current setting it is necessary to calculate the maximum amplitude after the
RSI amplification. The calculation of the maximum amplitude is based on the following assumptions:
• Without raindrops the optical system with the two optical coupling channels LEDA and LEDB is symmetrical.
Therefore the two received photo diodes pulse currents from LEDA and LEDB are equal. The RSI0 result value
with bypassed highpass filter (RSI_CFG1.BYPASS_HP=b1) should then be the half (1024LSB) of the RSI result
range (0LSB to 2047LSB).
• If a rain drop decouples the LED light, one optical coupling channel (LEDA or LEDB) can be damped by 100% at
most. Thus the measured photo diode pulse current of this channel is also damped by the same factor. The
other optical coupling channel remains undamped. A damping of 100% of one channel leads to a RSI0 result
value of 0LSB or 2047LSB (with bypassed high-pass filter).
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• If a rain drop couples in LED light (no total reflection), one optical coupling channel (LEDA or LEDB) can be
increased by 58% at most. Therefore the measured photo diode current of this channel is also increased by the
same factor. The other optical coupling channel remains undamped. An increase of 58% of one channel leads to
a RSI0 result value of about 600LSB or 1444LSB (with bypassed highpass filter).
With the following formula the max. amplitude after the RSI amplifier URSI0,MAX at RSI0 mode is calculated. ILED is the
selected LED current, GRSI is the selected RSI gain and KCOUPLING is the coupling factor of the optical system
(described in chapter 6.7.2).
To prevent a saturation of the RSI amplifier the allowed amplitude maximum after the amplifier URSI0,MAX,allowed at
RSI0 mode is 1,08V. Solve the equation to KCOUPLING and plug in URSI0,MAX,allowed results in:
With that formula it is possible to calculate the maximum allowed coupling factor at a given RSI gain and LED cur-
rent. The tables below helps to estimate the right RSI gain and LED current to keep the RSI amplifier out of satura-
tion. However, it should be noted that the height of the coupling-in effect is not always exactly known. This effect
depends on the optical system and can sometimes lead to high amplitudes and thus to saturation. If the possible
height of the coupling-in is not known, a two step smaller RSI gain should be selected for safety. The signal-to-
noise ratio is usually hardly affected by this.
Table 6.7.1.1-1: Max. coupling factor in dependence on RSI gain at constant LED current and RSI0 mode to get not
into saturation
W_LEDx ILED pulse [mA] RSIGAIN GRSI [dBOhm] GRSI [U/I] max. KCOUPLING max. IPHD
[LSB] [LSB] [A/A] pulse [A]
0x7 20 0x0 99.0 89125 6.06E-04 1.21E-05
0x7 20 0x1 101.8 123027 4.39E-04 8.78E-06
0x7 20 0x2 104.6 169824 3.18E-04 6.36E-06
0x7 20 0x3 107.4 234423 2.30E-04 4.61E-06
0x7 20 0x4 110.2 323594 1.67E-04 3.34E-06
0x7 20 0x5 113.0 446684 1.21E-04 2.42E-06
0x7 20 0x6 115.8 616595 8.76E-05 1.75E-06
0x7 20 0x7 118.6 851138 6.34E-05 1.27E-06
0x7 20 0x8 121.4 1174898 4.60E-05 9.19E-07
0x7 20 0x9 124.2 1621810 3.33E-05 6.66E-07
0x7 20 0xA 127.0 2238721 2.41E-05 4.82E-07
0x7 20 0xB 129.8 3090295 1.75E-05 3.49E-07
0x7 20 0xC 132.6 4265795 1.27E-05 2.53E-07
0x7 20 0xD 135.4 5888437 9.17E-06 1.83E-07
0x7 20 0xE 138.2 8128305 6.64E-06 1.33E-07
0x7 20 0xF 141.0 11220185 4.81E-06 9.63E-08
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Table 6.7.1.1-2: Max. coupling factor in dependence on LED current at constant RSI gain and RSI0 mode to get not
into saturation
W_LEDx ILED pulse [mA] RSIGAIN GRSI [dBOhm] GRSI [U/I] max. KCOUPLING max. IPHD
[LSB] [LSB] [A/A] pulse [A]
0x0 2.5 0x7 118.6 851138 5.08E-04 1.27E-06
0x1 5 0x7 118.6 851138 2.54E-04 1.27E-06
0x2 7.5 0x7 118.6 851138 1.69E-04 1.27E-06
0x3 10 0x7 118.6 851138 1.27E-04 1.27E-06
0x4 12.5 0x7 118.6 851138 1.02E-04 1.27E-06
0x5 15 0x7 118.6 851138 8.46E-05 1.27E-06
0x6 17.5 0x7 118.6 851138 7.25E-05 1.27E-06
0x7 20 0x7 118.6 851138 6.34E-05 1.27E-06
0x8 22.5 0x7 118.6 851138 5.64E-05 1.27E-06
0x9 25 0x7 118.6 851138 5.08E-05 1.27E-06
0xA 27.5 0x7 118.6 851138 4.61E-05 1.27E-06
0xB 30 0x7 118.6 851138 4.23E-05 1.27E-06
0xC 32.5 0x7 118.6 851138 3.90E-05 1.27E-06
0xD 35 0x7 118.6 851138 3.63E-05 1.27E-06
0xE 37.5 0x7 118.6 851138 3.38E-05 1.27E-06
0xF 40 0x7 118.6 851138 3.17E-05 1.27E-06
With the following formula the RSI1 result value VALRSI1 can be calculated in dependence from selected RSI gain
GRSI, when the digital highpass filter is deactivated. IPHD,LEDA and IPHD,LEDB are the received LEDA and LEDB current
pulse heights.
It should be considered that typical parameter values are assumed for the formula. In 6.7.1.2-1 the characteristic
curve of RSI1 mode is shown for all RSI gain settings. It is visible that the RSI1 input range is dependent from the
RSI gain. The RSI1 curves are linear in comparison to RSI0 or RSI2 curves.
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In comparison to the RSI0 mode the saturation behavior of the RSI1 mode is like a normal ADC, when the high-
pass filter is bypassed (RSI_CFG1.BYPASS_HP=b1). With values between min. (0LSB) and max. (2047LSB) RSI1
result value the amplifier is not saturated. If the RSI1 result value is 0LSB or 2047LSB a saturation of the digital
RSI1 measurement range and a saturation of the RSI amplifier is possible.
It should be noted that in this mode, the current consumption of the LEDs is twice as high as in the relative RSI0
mode with the same LED current setting.
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The simplest way to measure the coupling factor is to force into the LED group LEDA or LEDB a constant DC cur-
rent ILED, e.g. with a source measure unit. The emitted light from the LEDs is going through the optical system and
at the photo diode the generated current IPHD is measured. Therefore, a good ammeter is required to measure the
small photo diode current IPHD (e.g. 100nA). This measurement must be done at absolute darkness or at constant
ambient light. At constant ambient light the difference of the photo diode current must be measured between LED
current switched-on and switched-off, to cancel out unwanted photo diode current, which is generated by ambient
light.
This measurement method has several practical drawbacks. It is not easily possible to inject external current into
the LEDs and to measure the small photo diode current externally when the module is fully assembled and
attached to the optical system. Additionally a constant current source and a good ammeter are necessary. There-
fore a special mode was implemented to measure the coupling factor at fully installed state without additional
meters. In this coupling factor measurement mode it is possible to draw a constant DC current from pins LEDA and
LEDB and to measure the DC current of the RS photo diode using the ambient light interface.
The LEDA und LEDB current setting (register RSI_CFG2) for the coupling factor measurement should be the same
like in the desired RSI mode. The following example shows a possible sequence of coupling factor measurement of
the optical path LEDA with ILED = 20mA. This measurement must be made at constant ambient light:
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1. Switch on the idle LED current ILEDx,LOW of pins LEDA and LEDB with setting bit LED_DRV of register CALIBRA-
TION to b1. The RSI must be inactive (MODE.RUNRSI=b0).
2. Measure with the ambient light interface the ADC value of the RS photo diode (channel 4: RS/ALS4). Make a
calibration during operation measurement (described in chapter 6.6.2) and calculate the RS photo diode current
IPHD,OFF at LED idle current and constant ambient light.
3. Set bits IW_LEDA of register RSI_CFG2 to 0x7 (20mA).
4. Switch on LEDA on-current ILEDx of pin LEDA with setting bit LEDA_ON of register CALIBRATION to b1.
5. Measure with the ambient light interface the ADC value of the RS photo diode. Make a calibration during opera-
tion measurement and calculate the RS photo diode current IPHD,ON at the sum of LED idle current and LEDA on-
current and at constant ambient light.
6. Switch off LEDA on-current ILEDx of pin LEDA with setting bit LEDA_ON of register CALIBRATION to b0.
7. Switch off the idle LED current ILEDx,LOW of pins LEDA and LEDB with setting bit LED_DRV of register CALIBRA-
TION to b0.
8. Calculate the difference of RS photo diode current between LEDA on-current and LED idle current:
The coupling factor measurement for the optical path LEDB is equivalent to LEDA. Instead of bit LEDA_ON the bit
LEDB_ON of register CALIBRATION must be set and bits IW_LEDB of register RSI_CFG2 must configured to 0x7
(20mA).
Remark 1: In reality the characteristic curves of photo diodes and LEDs are not always linear. Therefore the coup-
ling factor can be different for different LED currents. Additionally the selected LED on-current has a variation, spe-
cified in 5.8-1.
Remark 2: The LED drivers are not designed to generate a permanent high DC current. Thus the coupling factor
measurement mode should not run continuously with DC current over 20mA per LEDx pin. Note also the increase
of junction temperature when LED drivers are switched on.
In order to cover also such cases, the absolute value of the pulse current of one channel must be measured. The
coupling factor measurement, described in chapter 6.7.2, does this with the help of the ambient light interface. In
this method, however, the ambient light must remain constant during the measurement procedure.
An alternative method of absolute value measurement or coupling factor measurement is possible with RSI Mode 1
and deactivated highpass filter (RSI_CFG1.BYPASS_HP=b1). For this purpose, the equation for the coupling factor
KCOUPLING from chapter 6.7.2 is combined with the equation for the RSI1 result value VALRSI1 from chapter 6.7.1.2:
With two measurements with different LED current settings for one LED channel, a term can be reduced after set
up a system of equations. For example, with two different LEDA currents ILEDA1, ILEDA2 and a constant LEDB current
ILEDB:
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With the equation converted to KCOUPLING,LEDA, the coupling factor for the optical path LEDA and the absolute values
for the received pulse currents IPHD,LEDA can be calculated therefrom:
For the determination it is used that, in RSI mode 1, the phase shift with asymmetrical regulation has a traceable
behavior on the RSI result value. This means that with optimal phase delay setting the RSI result value has the
highest deflection. The behavior is visible in 6.7.4-1.
The optimal phase delay configuration is for all three RSI modes equal when the same RSI gain and approximately
the same LED current setting is used. The following example shows a possible measurement sequence to determ-
ine the optimal phase delay. The RSI measurement value must remain constant during the measurement. There-
fore, the measurement must be performed at a dry windshield.
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Averaged RSI1 value vs. phase delay Averaged RSI1 value vs. phase delay
1590 650
av eraged RSI v alue @ 3us
1570 integration time [LSB]
600
av eraged RSI v alue @ 2us
1550 integration time [LSB]
550
1530
1510 500
The LED drivers are designed to drive up to 4 LEDs per driver, but the maximum number of LEDs is dependent
from the LED supply voltage and the characteristics of the LEDs. It is important that the voltage at the pins LEDA
and LEDB is kept above the minimum value of VLEDx when the driver is operating. Also the power dissipation of the
LED drivers should not be neglected. It increases linear with the LEDx pin voltage and can result to a high temper-
ature rise of the device when the LED drivers are activated. A fast temperature change has also an impact on
ambient light measurement results. Counter-measures can be a good thermal coupling to the PCB and a reduction
of the LEDx pin voltage with an optional LED series resistor.
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The state-machine consist of temporary and permanent states. A temporary state is automatically left after a
desired action is finished while a permanent state is kept until an external event enforces a state change.
State Diagram
SLEEP RESET
CSB=0
(tWAKEUP)
Cmd SLEEP
IDLE
Measurement started
ALI/RSI or
Coupling Factor
STATUS.OVER_TEMP cleared
Measurements (allowed when TFTM < TTHR,OVERTEMP)
finished/stopped
The device features a digital overtemperature protection that uses the internal temperature sensor and the ALS
ADC to monitor the device temperature and watch overtemperature conditions.
The automatic temperature monitoring (FTM = Forced Temperature Measurement) is started automatically when
the RSI or ALI measurement loops are started or when the CALIBRATION.LED_DRV bit is set. When the FTM is
running a new temperature measurement is requested every 16ms, the result is stored in the VTEMP register.
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When a request is pending, the ALS unit executes the temperature measurement at the next available time slot. If a
burst measurement is running, it is interrupted for the FTM measurement without discharging the log amplifier of
the selected ALS channel. Hence the settle time of the log amplifier is not extended by the FTM measurement.
6.9.1 Reset
After a Reset Event (Power-Up/Power-Watch/SPI Reset Command) the device reads the trim values from the OTP
and enters the IDLE state.
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When a measurement is requested by the user the measurement is queued as the first measurement into the ALS
measurement queue. Hence it will become the next ALS measurement to execute. If an automatic temperature
measurement (every 16ms) is pending, it will be handled before the requested measurement anyway.
The BUSY bit in the STATUS register is set when the measurement is queued and cleared when the measurement
is finished.
When the BURSTMODE bit is set in the MODE register, the measurement is repeatedly executed on the selected
channel without any delay between two consecutive measurements. Averaging, as defined with the MEASAVG
bits, still applies. The measurements can be stopped with the STOPMEAS command via SPI or resetting the
BURSTMODE bit. Automatic temperature measurements are interspersed every 16ms.
The ALS automeasure loop makes repeated measures of all selected channels in the AUTOM_CFG register and
updates the corresponding data value registers. Each measurement might be the average value according to the
value of the AUTOAVG bits in the AVG_CFG register.
The RSI measurement loop performs a rain sensor measurement and provides the demodulated result to the
RSIVAL register. The loop can be stopped or continued with setting or resetting the HOLDRSI bit in the MODE
register. See RSI_CFG registers for RSI measurement configuration.
To prevent overheating an automatic temperature measurement and validation is interspersed every 16 ms and the
result is stored in the VTEMP register.
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Blocks/Function Description
ALS-ADC ON
ALI ON
RSI-Loop ON when the MODE.RUNRSI bit is set.
LEDs ON when the MODE.RUNRSI bit is set.
Digital control Read access to all result registers.
Read and write access to all configuration registers.
Following states -Idle mode (triggered by setting the RUNRSI and AUTOMODE bits in the Mode register to '0')
-Burst measurement mode (triggered by the SPI measure command )
-OVER_TEMP when a overtemp condition is recognised
To prevent overheating the automatic temperature measurement and validation is interspersed every 16 ms and
the result is stored in the VTEMP register.
The automatic temperature measurement is executed as long as the OVER_TEMP bit in the STATUS register is
set. The related hardware modules are kept active.
The OVER_TEMP bit in the STATUS register can be cleared if the temperature has recovered under the overtem-
perature threshold value. No further measurement requests are accepted until the the OVER_TEMP bit in the
STATUS register is cleared.
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A low phase of the CSB input not less than tWAKEUP is required for wake-up.
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ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Table 6.9.8-6: Register RSI_CFG1 (4) RSI mode and configuration settings.
MSB LSB
Content RSIGAIN[7:4] Reserved[ BYPASS_ RSI_MODE[1:0]
3] HP
Reset value 0 0 0 0
Access R/W R R/W R/W
Bit Description RSIGAIN[7:4] : Gain of the RSI input amplifier in 2.8 dB steps.
Reserved[3] : Reserved. Read as zero.
BYPASS_HP : Bypass the highpass filter within the RSI filter chain
b0: no bypass (lowpass + highpass filter)
b1: bypass (lowpass filter)
RSI_MODE[1:0] : RSI timing mode.
b00: relative mode
b01: differential mode
b10: alternative relative mode
b11: do not use; mapped to differential mode
Note that RSI_MODE can not be changed if MODE.RUNRSI is set.
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Table 6.9.8-9: Register RSI_OUT_THR (7) Threshold value of the RSI threshold comparator.
MSB LSB
Content THR_LVL[7:0]
Reset value 0
Access R/W
Bit Description THR_LVL[7:0] : Threshold value of the RSI threshold comparator.
The 8-bit value is extended to a 12 bit unsigned value by left padding b0000. It is compared to
the output of the RSI filter chain (RSIVAL).
If the absolute value of RSIVAL is greater than the extended THR_LVL the comparator outputs a
logic '1', otherwise a logic '0'.
The output is visible at WS (MODE.WSFCT: 011b)
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Table 6.9.8-11: Register LOG_EPS (9) Acceptable difference of ADC values while settling the ALI-LOG amp.
MSB LSB
Content LOG_EPS[7:0]
Reset value 00000011
Access R/W
Bit Description LOG_EPS[7:0] : ALI Automatic Settling Control.
While the ALI-LOG amplifier is settling the end of the settling phase is assumed when two con-
secutive ADC measurements have a difference smaller than or equal LOG_EPS. If settling can
not be detected within tALI,TIMEOUT the error flag CHN_INVALID will be set in the corresponding
channel result register.
The settling control is disabled in burst mode.
Note 1: LOG_EPS is an unsigned 8-bit value; the absolute value of the difference is taken for the
comparison: if abs(diff) <= LOG_EPS then the channel is assumed to be settled (stable).
Note 2: At very low currents it is possible that the automatic settling control settles to early due to
the very small settling slope of ALI output.
Note 3: With oscillating currents the automatic settling control settles to a current value between
min. and max. current or it does not settle.
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Table 6.9.8-12: Register AVG_CFG (10) Average exponents for ADC measurements.
MSB LSB
Content TEMPAVG[7:6] MEASAVG[5:3] AUTOAVG[2:0]
Reset value 0 0 0
Access R/W R/W R/W
Bit Description TEMPAVG[7:6] : Exponent of the number of ADC values averaged when an auto. temperature
measurement is executed.
The number of ADC values averaged is given by .
The maximum number for TEMPAVG is 3 (binary "11"). This results in an averaging of 8 ADC
values.
MEASAVG[5:3] : Exponent of the number of ADC values averaged when a MEASURE (SPI)
command is executed.
The number of ADC values averaged is given by .
The maximum number for MEASAVG is 4 (binary "100"). This results in an averaging of 16 ADC
values.
When a value greater than 4 is written to MEASAVG it will be clipped down to 4.
AUTOAVG[2:0] : Exponent of the number of ADC values averaged in the "automatic measure-
ment mode"
The number of ADC values averaged is given by .
The maximum number for AUTOAVG is 4 (binary "100"). This results in an averaging of 16 ADC
values.
When a value greater than 4 is written to AUTOAVG it will be clipped down to 4.
Table 6.9.8-13: Register RSIVALH (14) Most significant bits of the RSI value.
MSB LSB
Content ERROR INVALID NEW_VAL LED_WRN RSIVAL[11:8]
Reset value 1 0 0 0 0
Access R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
INVALID : The RSI value is out of range. This bit is set when the internal filter logic detects a
clamping of the RSI bit stream to zero or to one. This can happen when the damping of one LED
group (LEDA/LEDB) becomes too high or one or more LEDs are damaged.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_WRN : LED Warning Flag:
0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
RSIVAL[11:8] : Most significant bits of the RSI value.
Note: RSIVAL[11:0] is a signed number in two's complement format.
Note: the RSIVAL range depends on the RSI_CFG1.BYPASS_HP bit:
if 0: range between -2048..2047 (HP)
if 1: range between 0..2047 (LP)
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Table 6.9.8-14: Register RSIVALL (15) Least significant bits of the RSI value.
MSB LSB
Content RSIVAL[7:0]
Reset value 0
Access R
Bit Description RSIVAL[7:0] : Least significant bits of the RSI value.
Note: RSIVAL[11:0] is a signed number in two's complement format.
Table 6.9.8-15: Register ADCVALH (16) Most significant bits of the ADC value register from the last manual meas-
urement.
MSB LSB
Content ERROR CHN_INVA NEW_VAL LED_DRV Reserved[3:2] ADCVAL[9:8]
LID
Reset value 1 0 0 0 0 0
Access R R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
CHN_INVALID : Bit is set if the measured Channel is not stable with respect of the selected
LOG_EPS value.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_DRV : LED Warning Flag:
0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
Reserved[3:2] : Reserved. Read as 0.
ADCVAL[9:8] : Most significant bits of the ADC value
Table 6.9.8-16: Register ADCVALL (17) Least significant bits of the ADC value register from the last manual meas-
urement.
MSB LSB
Content ADCVAL[7:0]
Reset value 0
Access R
Bit Description ADCVAL[7:0] : Least significant bits of the ADC value
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Table 6.9.8-17: Register VTEMPH (18) When "automatic measurement mode", "rain sensor measurement mode",
"manual temperature measurement mode" or an over-temperature condition is active, the most significant bits of
the temperature measurement.
MSB LSB
Content ERROR Reserved NEW_VAL LED_WRN Reserved[3:2] VTEMP[9:8]
Reset value 1 0 0 0 0 11
Access R R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
Reserved : Reserved. Read as 0.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_WRN : LED Warning Flag:
0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
Reserved[3:2] : Reserved. Read as 0.
VTEMP[9:8] : Most significant bits of the VTEMP value
Table 6.9.8-18: Register VTEMPL (19) When "automatic measurement mode", "rain sensor measurement mode",
"manual temperature measurement mode" or an over-temperature condition is active, the least significant bits of
the temperature measurement.
MSB LSB
Content VTEMP[7:0]
Reset value 11111111
Access R
Bit Description VTEMP[7:0] : Least significant bits of the VTEMP value
Table 6.9.8-19: Register ALS0H (20) In "automatic measurement mode" the most significant bits of the ambient
light sensor 0 value.
MSB LSB
Content ERROR CHN_INVA NEW_VAL LED_WRN Reserved[1:0] ALS0[9:8]
LID
Reset value 1 0 0 0 0 0
Access R R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
CHN_INVALID : Bit is set if the Channel is not stable with respect to the selected LOG_EPS
value.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_WRN : LED Warning Flag:
0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
Reserved[1:0] : Reserved. Read as 0.
ALS0[9:8] : Most significant bits of ambient light sensor 0
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Table 6.9.8-20: Register ALS0L (21) In "automatic measurement mode" the least significant bits of the ambient
light sensor 0 value.
MSB LSB
Content ALS1[7:0]
Reset value 0
Access R
Bit Description ALS1[7:0] : Least significant bits of ambient light sensor 0
Table 6.9.8-21: Register ALS1H (22) In "automatic measurement mode" the most significant bits of the ambient
light sensor 1 value.
MSB LSB
Content ERROR CHN_INVA NEW_VAL LED_WRN Reserved[1:0] ALS1[9:8]
LID
Reset value 1 0 0 0 0 0
Access R R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
CHN_INVALID : Bit is set if the Channel is not stable with respect to the selected LOG_EPS
value.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_WRN : 0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
Reserved[1:0] : Reserved. Read as 0.
ALS1[9:8] : Most significant bits of ambient light sensor 1
Table 6.9.8-22: Register ALS1L (23) In "automatic measurement mode" the least significant bits of the ambient
light sensor 1 value.
MSB LSB
Content ALS2[7:0]
Reset value 0
Access R
Bit Description ALS2[7:0] : Least significant bits of ambient light sensor 1
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Table 6.9.8-23: Register ALS2H (24) In "automatic measurement mode" the most significant bits of the ambient
light sensor 2 value.
MSB LSB
Content ERROR CHN_INVA NEW_VAL LED_WRN Reserved[1:0] ALS2[9:8]
LID
Reset value 1 0 0 0 0 0
Access R R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
CHN_INVALID : Bit is set if the Channel is not stable with respect to the selected LOG_EPS
value.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_WRN : 0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
Reserved[1:0] : Reserved. Read as 0.
ALS2[9:8] : Most significant bits of ambient light sensor 2
Table 6.9.8-24: Register ALS2L (25) In "automatic measurement mode" the least significant bits of the ambient
light sensor 2 value.
MSB LSB
Content ALS2[7:0]
Reset value 0
Access R
Bit Description ALS2[7:0] : Least significant bits of ambient light sensor 2
Table 6.9.8-25: Register ALS3H (26) In "automatic measurement mode" the most significant bits of the ambient
light sensor 3 value.
MSB LSB
Content ERROR CHN_INVA NEW_VAL LED_WRN Reserved[1:0] ALS3[9:8]
LD
Reset value 1 0 0 0 0 0
Access R R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
CHN_INVALD : Bit is set if the Channel is not stable with respect to the selected LOG_EPS
value.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_WRN : 0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
Reserved[1:0] : Reserved. Read as 0.
ALS3[9:8] : Most significant bits of ambient light sensor 3
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Table 6.9.8-26: Register ALS3L (27) In "automatic measurement mode" the least significant bits of the ambient
light sensor 3 value.
MSB LSB
Content ALS3[7:0]
Reset value 0
Access R
Bit Description ALS3[7:0] : Least significant bits of ambient light sensor 3
Table 6.9.8-27: Register RS/ALS4H (28) In "automatic measurement mode" the most significant bits of the rain
sensor output value.(Intended for use as fifth ALI channel only)
MSB LSB
Content ERROR CHN_INVA NEW_VAL LED_WRN Reserved[1:0] ALS4[9:8]
LID
Reset value 1 0 0 0 0 0
Access R R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
CHN_INVALID : Bit is set if the Channel is not stable with respect to the selected LOG_EPS
value.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_WRN : 0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
Reserved[1:0] : Reserved. Read as 0.
ALS4[9:8] : Most significant bits of ambient light sensor 4
Table 6.9.8-28: Register RS/ALS4L (29) In "automatic measurement mode" the least significant bits of the rain
sensor output value.(Intended for use as fifth ALI channel only)
MSB LSB
Content ALS4[7:0]
Reset value 0
Access R
Bit Description ALS4[7:0] : Least significant bits of ambient light sensor 4
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Table 6.9.8-29: Register ICALH (30) In "automatic measurement mode" the most significant bits of the ALI calibra-
tion current value.
MSB LSB
Content ERROR CHN_INVA NEW_VAL LED_WRN Reserved[1:0] ICAL[9:8]
LID
Reset value 1 0 0 0 0 0
Access R R R R R R
Bit Description ERROR : This bit is always set after a system reset (also after power up), if over
temperature/voltage occurs or if an ECC error occurs. Read STATUS register for details.
CHN_INVALID : Bit is set if the Channel is not stable with respect to the selected LOG_EPS
value.
NEW_VAL : The New Value Flag (NEW_VAL) is set to '1' when a new value is written to the
register, it is cleared to '0' when the value is read via the SPI.
LED_WRN : 0: no warning
1: LEDs controlled by CALIBRATION.LED_DRV bit
Reserved[1:0] : Reserved. Read as 0.
ICAL[9:8] : Most significant bits of the ICAL value
Table 6.9.8-30: Register ICALL (31) In "automatic measurement mode" the least significant bits of the ALI calibra-
tion current value.
MSB LSB
Content ICAL[7:0]
Reset value 0
Access R
Bit Description ICAL[7:0] : Least significant bits of the ICAL value
Both subsystems can be enabled independently and run almost independently of each other. The RSI subsystem
makes measurements (LED pulses) with a frequency of fRSI,MOD while the ALS subsystem in AUTOMODE measures
the selected channels in a tALI,AUTOM timing intervals. Note that a channel measurement can consist of more than one
ADC measurement due to averaging.
Since the ALS input stage needs to settle, the time needed for an ALS measurement with AUTOMODE or MEAS-
URE command is not constant. In extreme situations (i.e. very low currents, oscillating current or large noise) it is
possible that the settling time becomes longer than tALI,AUTOM (refer tALI,VALID). Then the next ALI channel measure-
ment is delayed to the next tALI,AUTOM interval time.
The ALI control machine contains an automatic digital settling control. The difference of two consecutive ALI ADC
measurement values is compared against a threshold value (LOG_EPS) and the ADC value is assumed to be not
settled until the difference of two measurements is smaller than or equal the threshold value. The measurement of
the channel will be repeated within an interval of tALI,TIMEOUT. If the channel does not settle within this time the error
flag CHN_INVALID will be raised in the corresponding channel result register and the ALI control continuous with
the next channel. See control register LOG_EPS for details.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
When RSI measurement (or coupling factor measurement) is not selected at all, then no LED stimuli signals are
generated. Nevertheless the ADC measurements keep the same timing intervals as when RSI measurements are
taken.
An overview picture of the RSI subsystem (without SPI interface) is shown in 6.10.1-1.
0 000
001
BYPASS_HP
THRLVL
Bitstream
LEDA LED Current WSFCT
LED Driver
State
Machine
Digital control
BSAV (Bitstream data available)
001
Internal MISO else MISO
The output of the HALIOS loop is a bit stream that corresponds to the amount of received light reflection of the two
LEDs. The bit stream is used to select which of the two LEDs is fired next.
To roughly compensate differences in the common reflection received from the two LEDs, the sink current of the
LEDs can be adjusted in 16 steps for each LED using the RSI_CFG2 register.
The bit stream from the HALIOS loop is filtered to reconstruct a measure of the received light strength of the LED
pulses. The implemented filter chain consists of a decimation, a low-pass and a high-pass filter:
• The decimation filter is realized as a Cascaded-Integrator-Comb-Filter (CIC Filter) and is used to average and
decimate the incoming bitstream signal.
• The low-pass filter is realized as a 2nd order Butterworth filter with a corner frequency of fRSI,LP. It is used in com-
bination with the CIC filter to reconstruct a measure of the received light energy of the LED pulses.
• The high-pass filter is realized as a 1st-order filter with a corner frequency of fRSI,HP. It is used to roughly detect
changes of the received light energy which can be used in combination with the following threshold comparator
to estimate the occurrence of rain drops. Both filters run at a sampling frequency of fRSI_DAV which also represents
the update frequency of the RSI data. Note: The high-pass filter can be bypassed using the configuration bit
RSI_CFG1.BYPASS_HP.
The output of the filter chain is stored in the RSIVAL register for further processing. It is also fed into a threshold
comparator. The threshold level of the comparator can be programmed using the 8-bit THR_LVL value in the
RSI_OUT_THR register.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Since the filter chain output is a 12 bit signed value, its absolute value is compared to the threshold value. The 8-bit
THR_LVL value is extended by left-padding four binary zeros.
If the absolute of the filter chain output is greater than the extended THR_LVL value, the comparator outputs a logic
'1', otherwise a logic '0' The result of the comparison can be routed to the WS pin using the MODE register for fur-
ther processing.
An overview picture of the ALS subsystem (without SPI interface) is shown in 6.10.2-1.
Analog Control
Temperature
VREF References
Sensor
Diagnosis signals
State
ALS0 Maschine
ALS1
ADC ADC Control
ALS ALS
MUX
Converter
ALS2 MUX AMP Averaging Registers
ADC
ALS3 Digital control
RS
Ambient Light Interface
In the automatic measurement mode the device measures a predefined set of ADC channels periodically. The
channels that should be measured are set in the AUTOM_CFG register.
To reduce noise there is the possibility to automatically average a number of measures before providing the result
to the user. The number of averages can be set using the AVGEXP[1:0] bits in the AVG_CFG register.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
The RSI/ALI4 channel is the device input of the rain sensor, measured using the ALI ADC. This channel is useful
when a fifth ALI sensor is required and no rain sensor interface is needed.
Selecting this channel for automatic or manual measurement is not possible, when the rain sensor interface is
switched on.
Accordingly the RUNRSI bit can not be set when this channel is used for automatic or manual measurement.
In the manual measurement mode the user can initialize a one-time measurement with the command MEASURE.
MEASURE takes the channel number as parameter. The applied average is set using the MEASAVG bits in the
AVG_CFG register. Note that the number of averages is independent from the value set using the AUTOAVG bits
in the same register to allow flexible "single shot" measurements.
With the MEASURE command there are more channels available as in the AUTOMEASURE mode. Refer to
6.11.2-2 for a complete list of available channels.
In both modes averaging is done by repeated measurement of a particular channel, before the next channel is pro-
cessed. The averaged value for each channel is calculated by:
with
The expreg is either TEMPAVG, MEASAVG or AUTOAVG, depending of the executed measurement. These three
average exponents can be set in the AVG_CFG register.
Note that this is not a moving average since the intention of this operation is not low pass filtering, but noise reduc-
tion.
Since manual measurements are synchronized with running auto-measurements they may not execute immedi-
ately. A running manual measure is indicated by the BUSY flag in the status register. When doing a measure in the
"manual measurement mode" this flag should be checked to determine if the requested measure was finished.
When the manual measurement is finished the result is available in the ADCVALH/ADCVALL register pair.
A special case of the MEASURE command can be invoked using the BURSTMODE bit in the MODE register.
When this bit is set and a MEASURE command is send to the device, a running AUTOMEASURE is
interrupted and the MEASURE command is executed repeatedly without any delay between consecutive meas-
ures.
The result is available in the ADCVALH/ADCVALL register pair.
This repeated measure can be stopped by either clearing the BURSTMODE bit in the MODE register or by sending
a STOPMEAS command to the device. An interrupted AUTOMEASURE will be resumed.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Output DAV pulse if a new measurement value from ALI or RSI is available
In this mode the DAV pulses of RSI and ALI are logically OR combined and routed to the WS Pin
Note: If a pulse will be output at WS or MISO (DAV or BSAV pulse) the pulse width will be tDAV_PULSE
CSB
tC(SCLK) tW(CSBH)
SCLK
tSU(MOSIV)
The SPI (Serial Peripheral Interface) provides access to the complete control of the device.
The device supports 3-wire and 4-wire SPI communication. When using 3-wire SPI the CSB signal must be tied to
digital ground. No further precaution is needed.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Since CSB is also used for wake-up the device from sleep mode there is no usable sleep mode available with 3-
wire SPI. Moreover, since the device can't detect if the CSB pin is used, there is no way to protect the device from
executing a SLEEP command accidently send by the SPI master.
Hence 3-wire SPI is not recommended and should be seen as last resort solution when pin count at the SPI master
becomes a serious issue.
All communication is made in form of transactions. The SPI works as a slave only. It never initiates a communica-
tion cycle. Hence all transactions start by the SPI master, sending a sequence of bytes to the device.
As first byte of a transaction a command is expected by the device. A list of available commands is given in chapter
6.11.2. Depending on the command a data byte is expected as second byte.
Finally the device expects a byte containing a parity bit as MSB. All other bits in this byte are ignored.
The device verifies the received command and data against the parity bit. If the total number of logical ones is not
odd, the command is assumed to be corrupted. In this case the device will set the ECS bit in the status byte and
does not execute the command.
The parity mechanism can be disabled by setting the NOPARITY bit in the DEV_CFG register (see chapter 6.9.8).
When NOPARITY is set the whole last byte is ignored and the command is always executed (assuming no further
errors occur).
In addition, the ECS bit is set in the status byte to indicate that no successful parity check has been performed.
• NOTE: For reading data from the device the master doesn't need to provide the parity byte at all. This is due to
the fact that reading data can't provide any harm to the device state. Hence the device handle all read com-
mands in the same way as when the NOPARITY bit was set. Note that this also means that the ECS bit is set in
the status bit of every read command.
Besides to the transmitted parity bit, the device provides a further mechanism which allows the SPI master to check
whether the data has been transferred correctly.When the device receives a bit from the master (MOSI) then the bit
is registered in the SPI input register. The inverted bit is send back to the master (MISO). Because the bit is
registered first, the bit returned is delayed by one SCLK cycle.
After CSB has become active (CSB=0) the data provided by the master is registered at every rising edge of SCLK.
The most significant bit of the command (C7) is registered with the first rising edge of SLCK and the inverted value
of C7 is provided on MISO at the falling edge of SCLK. In 6.11.1-1 this is marked with a small arrow.
When the complete command byte (C7-C0) is sent, the device sends a status byte including a parity bit (PRX) and
four error flags. The PRX bit is generated over all mirrored bits sent to the master and the status byte itself to
provide an odd parity.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
CSB
SCLK
Bit No. 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
Command Parity
P
MOSI C7 C6 C5 C4 C3 C2 C1 C0
TX
X
P E E E E
MISO X C7 C6 C5 C4 C3 C2 C1 C0 0
RX UC AD RO CS X
Four error flags indicate problems with the command sent. If one of these bits is '1' the appropriate error has
occurred. The following bits are defined:
• EUC (Unknown command error): The given command is not known by the device.
• EAD (Address error): The given address coded in the command is invalid. This might occur in read & write oper-
ations only.
• ERO (Read Only error): An attempt to write to a read only address was made. This might occur in write opera-
tions only.
• ECS (Parity error): The command or data doesn't match the (odd) parity bit.
Note that ECS is also set when a read command is processed or the NOPARITY bit in the MODE register is set.
This is because in this situations no parity check is made at all and hence it can't be successful. However, in this
situations the command is still executed.
A further error is signalised when the device received a valid command but is unable to execute it.
• ENE (Not Executable error): The command can not be executed yet.
This error is signalised by raising the EUC and EAD bits at the same time. (This normally can't happen because an
unknown command does not provide an address at all and hence that address can not be wrong.)
An ENE error occurs when a user command tries to execute a command that is not executable in the actual device
state, i.e. sending a MEASURE command while another MEASURE command is running. Another popular example
is sending a SLEEP command while the device is still running RSI or AUTOMODE measurements. When an ENE
error occurs the device does not execute the command but raises the EUC and EAD bits in the status, returned to
the SPI-master.
6.11.1-2 shows an example of a read command. No parity bit is added to the command byte (hence no additional
byte) because the whole transaction, including the command itself can be verified using the mirrored bits sent back
to the master.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
After the command is transferred the device starts sending the requested data (D7-D0) followed by the status byte.
The position of the parity and error bits is the same as in the command shown above. The three MSBs are con-
stantly set to '0' because, in the case of read commands, the command bit C0 is not used and therefore the inver-
ted command bit C0 is not sent. (Note: In the case of commands other than read commands, the LSB of the inver-
ted command or data byte was assigned to bit 7 of the status byte.)
The ERO bit is always '0' because no write access was made at all. The ECS bit is always '1' as described above.
The only possible error situations that can occur are when an unknown command was received or an invalid
address is given by the read command. This is signalled by setting the EUC bit and/or the EAD bit to '1' (marked
red for reference).
CSB
SCLK
RD_BYTE Cmd
MOSI 1 1 A4 A3 A2 A1 A0 X X
P E E
MISO X 0 0 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 0
RX UC AD
0 1 X
The SPI features a timeout monitor to prevent communication errors due to missing SCLK edges.
During a running transaction the maximum allowed time between two SCLK edges must be less than tTO(SPI).
After this time the transaction is aborted and the SPI is reset to its initial state.
After the falling edge of CSB the MISO Signal becomes active. The initial value of the MISO signal is undefined
because the device has not received any data to echo yet.
The eight bits of the command are provided by the master at the MOSI signal and registered by the slave on the
rising edge of SCLK.
On the falling edge of SCLK the received bits are inverted and mirrored at the MISO signal for verification as
described in chapter 6.11.1.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
CSB
SCLK
Bit No. 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
RESET cmd Parity
P
MOSI 0 0 0 0 1 1 0 1
TX
X
P E E E
MISO X 1 1 1 1 0 0 1 0 0
RX UC AD
0
CS
X
When the command byte is transferred (after eight SCLK pulses) the device provides a status byte at the MISO line
for the next eight SCLK pulses while receiving the parity bit as MSB on the MOSI line. Further data on MOSI is
ignored for these SCLK pulses.
When the second byte is transferred, the device verifies the command against the parity bit. When this check is
successful (the parity over command byte and parity bit is odd) the command is executed.
Otherwise either the command is not known by the device or the checksum test has failed. In the first case the
EUC bit is set, in the second case the ECS bit is set and the command is abandoned.
When the NOPARITY-bit is set in the DEV_CFG register the command is executed after the eight SCLK pulse
unless the command is not recognised. In this case the EUC bit is set in the status byte.
An example is given in 6.11.1.1-2.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
CSB
SCLK
Bit No. 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
RESET cmd
MOSI 0 0 0 0 1 1 0 1 X
P E E
MISO X 1 1 1 1 0 0 1 0 0
RX UC AD
0 1 X
After the falling edge of CSB the MISO Signal becomes active. The initial value of the MISO signal is undefined
because the device has not received any data to echo yet.
On the falling edge of SCLK the received bits are inverted and mirrored at the MISO signal for verification.
The write-byte command and data are provided by the master at the MOSI signal and registered by the slave on
the rising edge of SCLK.
Note that the address of the destination register is embedded into the write-byte command, shown as bits A4 .. A0.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
CSB
SCLK
P E E E E
MISO X 1 0 A4 A3 A2 A1 A0 1 D7 D6 D5 D4 D3 D2 D1 D0 0
RX UC AD RO CS X
After transmission of this byte the device verifies the transmitted command & data against the parity bit. When this
verification is successful the data byte is assigned to the addressed register and a status byte is sent back to the
master.
Finally, with the rising edge of CSB the MISO signal becomes Hi-Z and the SPI is set to the initial state.
Parity handling can be disabled globally by setting the NOPARITY bit in the DEV_CFG register. 6.11.1.2-2 shows
the same transaction as 6.11.1.2-1 but with NOPARITY set. Note that the ECS bit is always set as described in
chapter 6.11.1.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
CSB
SCLK
MOSI 0 1 A4 A3 A2 A1 A0 0 D7 D6 D5 D4 D3 D2 D1 D0 X
P E E E
MISO X 1 0 A4 A3 A2 A1 A0 1 D7 D6 D5 D4 D3 D2 D1 D0 0
RX UC AD RO
1 X
6.11.1.3-1 shows the read operation for a single byte from a register.
After the falling edge of CSB the MISO Signal becomes active. The initial value of the MISO signal is undefined
because the device has not received any data to echo yet.
On the falling edge of SCLK the received bits are inverted and mirrored at the MISO signal for verification. The last
data bit is not mirrored.
The RD_BYTE command is provided by the master at the MOSI signal and registered by the slave on the rising
edge of SCLK. Note that the address of the source register is embedded into the RD_BYTE command, shown as
bits A4 .. A0.
When the command is transferred (after eight SCLK pulses) the device provides the content of the addressed
register at the MISO line for the next eight SCLK pulses.
Finally a status byte is transferred. The status byte has the same content as described in section 6.11.1.2.
To keep byte-aligning of the data transmission the LSB of the command is not transferred as MSB in the second
byte and hence not observable (this is in contrast to 8-bit and write commands).
To get rid of this problem the LSB of the RD_BYTE & RD_WORD commands can be either '0' or '1'. That means it
doesn't care.
All data on MOSI is ignored while the device sends data or status bytes.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
CSB
SCLK
RD_BYTE Cmd
MOSI 1 1 A4 A3 A2 A1 A0 X X
P E E
MISO X 0 0 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 0
RX UC AD
0 1 X
Note: All read commands do not require sending a parity bit from the SPI master as described in chapter 6.11.1.
Note: The new value flag (NEW_VAL) of an accessed result register will be cleared either when accessing an even
address (high byte) with the RD_BYTE command or when accessing the register with a RD_WORD command.
Note: Result registers (addresses 0x0E to 0x1E) are required to be read using the RD_WORD command since only
the RD_WORD command allows a consistent access to the 16 bit value of the register.
The RD_WORD command can be used to read a 16 Bit word from two consecutive registers. An example is given
in 6.11.1.3-2.
RD_WORD behaves similar to RD_BYTE but generates only one status byte for the two bytes read. This is useful
for reading the register pairs that contains 16- bit values spread over two consecutive registers.
Note that the address bit A0 must be set to '0' for word reads. Otherwise the device will reject the command with an
EAD error.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
CSB
SCLK
RD_WORD Cmd
MOSI 1 0 A4 A3 A2 A1 0 X X
D D D D D D D D D D D D D D D D P E E
MISO X 0 1 A4 A3 A2 A1 1
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
0
RX UC AD
0 1 X
The commands can be divided in 8 bit commands which are executed after reading the command byte (and parity
bit, if applicable), and read/write commands where the length is variable and the execution is performed during the
transmission.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
A special kind of command is the MEASURE command. While other commands execute when the commands (and
parity, if applicable) are correct, the MEASURE command only initiates a measurement to be processed at the next
possible time slot. This ensures that running AUTOMEASURE measurements are not aborted.
The MEASUREMENT command immediately sets the BUSY bit in the status register. As long as this bit is set the
measurement is processing. When the requested measurement has finished the BUSY bit is cleared and the result
is transferred to the ADCVAL register.
Note that the rain sensor input may be used as ALS4 input channel. Therefore a MEASUREMENT command for
the RS/ALS4 channel is skipped without further notice (i.e. no error is raised) when the rain sensor interface is run-
ning (RUNRSI bit is set).
Note that the RSI unit and the ALS4 measurement share the same physical register (accessible via different phys-
ical addresses).
The channels that can be measured with the MEASUREMENT command are given in 6.11.2-2 below.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
To test all basic functions of the 527.04, five operating modes are defined:
• ALS burst mode
• ALS auto mode
• RSI mode 0
• RSI mode 1
• RSI mode 2
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
VBAT
VRF 50Ω
E520.34 E527.04 VREF
CVREF
1nF PDALS3
LIN TEMD6200FX
ALS3 PDALS2
Measuring ALS2 PDALS1
equipment GND
ALS1 PDALS0
DIV_ON
RES_N
WDIN
MOSI ALS0
MISO
RXD
SCK
TXD
WS
EN
CS
PV
SPI
GPIO
GPIO
GPIO
SPI
SPI
SPI
ADC_IN
RESET_N
LIN
LIN
µC
GND
External microcontroller
D1 L1 L2
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
300kHz
70
150kHz
60
10MHz
Emission [dBµV]
750kHz
50
40
30
76MHz
20
Frequency [MHz]
For the EMS test the 527.04 must be configured and the sensor data must be read out via SPI. This can be done,
for example, by an external microcontroller.
The ALS interface is temperature sensitive. It could be that the ASSP heats up during the EMS test and thus the
ALS result value drifts away. In order to prevent this, an optional cyclic ALI calibration as described in chapter 6.6.2
can be made.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
VBAT
ALS2 PDALS1
GND
ALS1 PDALS0
DIV_ON
RES_N
WDIN
ALS0
MOSI
MISO
RXD
SCK
TXD
WS
EN
CS
PV
SPI
GPIO
GPIO
GPIO
SPI
SPI
SPI
RESET_N
LIN
LIN
ADC_IN
µC
GND
External microcontroller
The conducted EMS limit line is shown in 7.2.1-2. The start level for this test is 36dBm.
36
33
Forward power [dBm]
30
27
24
21
18
15
12
Frequency [MHz]
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
8 Package Reference
The E527.04 is available in a Pb free, RoHs compliant, QFN20L4 plastic package according to JEDEC MO-220
VGGD-5. The package is classified to Moisture Sensitivity Level 2 (MSL 3) according to JEDEC J-STD-MO-220-K.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
9 Marking
9.1 Top Side
Table 9.1-1: Top Side
52704A
XXXXU
YWW*#
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
10 Typical Applications
Typical automotive application example as rain and light sensor module with LIN interface. For that example a LIN
SBC and a microcontroller are necessary. However, other applications are possible without LIN SBC.
VBAT
CVLED1 CVLED2
DVLED
CVSUP ZVSUP
CVS1 CVS2
DVS
RWAKE_N
RS
PDRS/LEDRS
RES_N
WDIN
ALS0
MOSI
MISO
RXD
SCK
TXD
WS
EN
CS
PV
CVDDuC
GPIO
ADC_IN
RESET_N
LIN
LIN
GPIO
GPIO
GPIO
SPI
SPI
SPI
SPI
VDD
µC
GND
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
11 General
11.1 WARNING - Life Support Applications Policy
ELMOS Semiconductor AG is continually working to improve the quality and reliability of its products. Nevertheless,
semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability
to physical stress. It is the responsibility of the buyer, when utilizing ELMOS Semiconductor AG products, to
observe standards of safety, and to avoid situations in which malfunction or failure of an ELMOS Semiconductor
AG Product could cause loss of human life, body injury or damage to property. In development your designs,
please ensure that ELMOS Semiconductor AG products are used within specified operating ranges as set forth in
the most recent product specifications.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
12 Contact Info
Table 12-1: Contact Information
Headquarters +492317549100 sales@elmos.de www.elmos.de
ELMOS Semiconductor AG
Heinrich-Hertz-Str. 1,
44227 Dortmund (Germany)
Sales and Application Support Office North +12488653200 sales-usa@elmos.com
America
Elmos NA. Inc.
32255 Northwestern Highway, Suite 220
Farmington Hills, MI 48334 (United States)
Sales and Application Support Office Korea +82317141131 sales-korea@elmos.com
Elmos Korea Co, Ltd.
B-1006, U-Space 2, 670 Daewangpangyo-ro,
Sampyoung-dong, Bundang-gu, Seongnam-si,
Gyeonggi-do, 13494 Korea
Sales and Application Support Office Japan +81334517101 sales-japan@elmos.com
Elmos Japan K.K.
BR Shibaura N Bldg. 7F
3-20-9 Shibaura, Minato-ku,
Tokyo 108-0023 Japan
Sales and Application Support Office China +862162197502 sales-china@elmos.com
Elmos Semiconductor Technology (Shanghai)
Co., Ltd.
Unit 16B, 16F Zhao Feng World Trade Building,
No. 369 Jiang Su Road,
Chang Ning District,
Shanghai, PR China, 200050
Sales and Application Support Office +6569081261 sales-singapore@elmos.com
Singapore
Elmos Semiconductor Singapore Pte Ltd.
3A International Business Park,
1. 09-13 ICON@IBP, Singapore 609935
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
13 Contents
Table of Content
Features.........................................................................................................................................................................1
Applications...................................................................................................................................................................1
General Description.......................................................................................................................................................1
Ordering Information......................................................................................................................................................1
Typical Operating Circuit...............................................................................................................................................1
Functional Diagram........................................................................................................................................................2
Pin Configuration QFN20L4..........................................................................................................................................2
Pin Description QFN20L4..............................................................................................................................................3
1 Functional Safety........................................................................................................................................................4
2 Absolute Maximum Ratings........................................................................................................................................5
3 ESD.............................................................................................................................................................................6
4 Recommended Operating Conditions........................................................................................................................7
5 Electrical Characteristics............................................................................................................................................8
5.1 Overview.............................................................................................................................................................8
5.2 Supply Monitor....................................................................................................................................................8
5.3 References.........................................................................................................................................................9
5.4 Temperature Sensor .........................................................................................................................................9
5.5 Oscillator.............................................................................................................................................................9
5.6 Ambient Light Interface (ALI)............................................................................................................................10
5.7 Rain Sensor Interface (RSI).............................................................................................................................11
5.8 LED Driver........................................................................................................................................................11
5.9 Digital Control...................................................................................................................................................12
5.10 Digital Signal Processing................................................................................................................................12
5.10.1 Rain sensor data processing..................................................................................................................12
5.11 Serial Peripheral Interface (SPI)....................................................................................................................13
6 Functional Description .............................................................................................................................................14
6.1 Overview...........................................................................................................................................................14
6.1.1 Rain Sensor Interface..............................................................................................................................14
6.1.2 Ambient Light Interface............................................................................................................................15
6.2 Supply Monitor..................................................................................................................................................16
6.2.1 Power-up and -down Timing Diagram.....................................................................................................18
6.3 References.......................................................................................................................................................19
6.4 Temperature Sensor .......................................................................................................................................20
6.5 Oscillator...........................................................................................................................................................20
6.6 Ambient Light Interface (ALI)............................................................................................................................21
6.6.1 Deviations from logarithmic transfer characteristic..................................................................................22
6.6.2 Calibration................................................................................................................................................24
6.6.2.1 Calibration during operation: VREF, VINC, VALI,OS......................................................................25
6.6.2.2 Calibration during operation: gain coefficient...................................................................................26
6.6.2.3 Calibration during End of Line Test.................................................................................................26
6.6.3 Diagnosis..................................................................................................................................................26
6.6.3.1 Short Circuit Diagnosis....................................................................................................................26
6.6.3.2 Current Diagnosis............................................................................................................................28
6.7 Rain Sensor Interface (RSI).............................................................................................................................29
6.7.1 RSI Modes................................................................................................................................................30
6.7.1.1 RSI0 - Relative Mode.......................................................................................................................31
6.7.1.2 RSI1 - Differential Mode...................................................................................................................33
6.7.1.3 RSI2 - Alternative Relative Mode.....................................................................................................34
6.7.2 Coupling Factor Measurement.................................................................................................................35
6.7.3 Indirect Absolute Value Measurement.....................................................................................................36
6.7.4 Phase Delay Configuration......................................................................................................................37
6.8 LED Driver........................................................................................................................................................38
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
ELMOS Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.