FORWARD CONCEPTS ®

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TABLE OF CONTENTS

SMARTPHONE & CHIP MARKET

OPPORTUNITIES
Strategies & Insight into the Advanced Class of Mobile Phones and the ICs that enable them

Authors:

Carter L. Horney

&

Satish Menon

Report No. 9010

February, 2009
 Authors

Carter L. Horney, a recognized authority on microprocessor and DSP implementation in

telecommunications. Mr. Horney is an independent consultant and Forward Concepts Associate
specializing in semiconductor product strategy and market planning. He was formerly Division Planner
for Rockwell International’s Digital Communications Division and earlier Strategic Marketing manager
for Rockwell’s Semiconductor Products Division. Mr. Horney was responsible for the product planning,
which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and high-speed modem
chip market. He was appointed a Rockwell Engineering Fellow and received many commendations for
outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning
and Customer Relations. Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics
from Western Illinois University.

Satish Menon is an independent consultant and Forward Concepts Associate specializing in

communications electronics. Most recently, Satish was Chief Technology Officer for a facilities-based
provider of wholesale and retail voice telecommunication services where he architected a distributed,
high-availability voice network that unified several circuit-based and packet-based protocols into a single
packet-core network based on SIP protocol. Prior to this, he was founder and VP Product Development
for Nuntius Systems, Inc. where he was responsible for all engineering activities that included activities
involving voice codecs, GSM/GPRS/EDGE baseband/MAC, DSP based lower-power Wi-Fi baseband/MAC
and multimedia codecs. Mr. Menon led a multi-disciplinary team of over 120 engineers and was
responsible for building several successful products from concept to completion, over a seven year
period. His background includes product management in areas of wireless technology and platforms,
real-time embedded systems, DSP implementations of wired/wireless technology and communication
protocol stacks along with product positioning and strategic planning expertise. Mr. Menon has also
consulted with several high-tech companies in the areas of communication and multimedia technology.
He earned his Bachelor’s degree in Electronics and Communication Engineering from REC, Trichy, India
and his Master’s degree in Computer Engineering from University of Southern California.

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Forward Concepts Co. ® Reg. U.S. Patent & Trademark Office

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Table of Contents

I. Executive Summary ........................................................................................................ 1

A. Overview ............................................................................................................................... 1
B. Key Findings........................................................................................................................... 3
C. Smartphone Market Overview ............................................................................................... 5
D. Smartphone Chip Market Overview........................................................................................ 9
E. Smartphone Semiconductor Forecast Highlights ....................................................................11

II. Smartphone Market Trends .......................................................................................... 13

A. Device and Usage Trends ......................................................................................................14
1. Macro Trends .............................................................................................................................................14
2. Architectural Trends...................................................................................................................................15
3. Security Trends ...........................................................................................................................................15
4. Input Method Trends .................................................................................................................................16
5. Air Interface Trends....................................................................................................................................17

B. O/S Trends............................................................................................................................17
C. Service & Application Trends................................................................................................. 18
D. Semiconductor Trends ..........................................................................................................19

III. Mobile Internet ......................................................................................................... 21

A. Mobile Web Browsers...........................................................................................................21
1. Apple MobileSafari.....................................................................................................................................22
2. BlackBerry Browser ....................................................................................................................................22
3. Microsoft Internet Explorer Mobile ...........................................................................................................22
4. Nokia Web Browser for S60 (formerly OSS Browser) ................................................................................23
5. Opera Mobile .............................................................................................................................................25
6. Skyfire.........................................................................................................................................................26

B. Web Technologies & Environments .......................................................................................27

1. Java ME (Micro Edition) .............................................................................................................................27
2. Asynchronous JavaScript and XML (AJAX)..................................................................................................30
3. Dynamic HTML (DHTML) ............................................................................................................................31

C. Browser Plug-ins ...................................................................................................................32

1. Adobe Flash................................................................................................................................................32
2. Microsoft Silverlight ...................................................................................................................................34

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IV. 3G Market Drivers & Migration Paths........................................................................ 37

A. Spectral Efficiency.................................................................................................................38
1. Increased Voice Capacity ...........................................................................................................................41
2. Improved Cell Edge Performance...............................................................................................................42

B. Higher Peak & Average Data Rates ........................................................................................ 43

C. All IP-Network Benefits .........................................................................................................44
1. VoIP over Cellular.......................................................................................................................................45
2. Simplified Fixed Mobile Convergence (FMC) Implementation ..................................................................47

D. Reduced End-to-End Network Latencies & Jitter ....................................................................47

E. New and Improved Services ..................................................................................................49
1. IMS Integration ..........................................................................................................................................50
2. Better Suitability for Streaming Media Services ........................................................................................50
a) Support for Broadcast and Multicast Services.......................................................................................51

V. Mobile Multimedia.................................................................................................... 53
A. Multimedia Players...............................................................................................................53
1. Windows Media Player Mobile ..................................................................................................................53
2. RealNetworks RealPlayer ...........................................................................................................................54

B. Multimedia Containers .........................................................................................................56

1. 3GPP 3GP ...................................................................................................................................................56
2. Apple QuickTime ........................................................................................................................................57
3. Microsoft Advanced Systems Format (ASF) ...............................................................................................57
4. Microsoft Audio Video Interleave (AVI) .....................................................................................................58
5. ISO/IEC MPEG-4 Part 14 (MP4) ..................................................................................................................58
6. Ogg .............................................................................................................................................................59
7. RealNetworks RealMedia ...........................................................................................................................60
a) RealNetworks RealMedia Variable BitRate (RMVB) ..............................................................................60

C. Multimedia Communication Protocols...................................................................................61

1. 3GPP 3G-324.M..........................................................................................................................................61
2. IETF Session Initiation Protocol (SIP) ..........................................................................................................62
3. ITU-T H.323 ................................................................................................................................................63

D. Video Coding Algorithms.......................................................................................................63

1. ITU-T H.263 ................................................................................................................................................63
2. ITU-T H.264/MPEG-4 Part 10 .....................................................................................................................63
3. Microsoft Windows Media Video (WMV / WMV9 / VC-1) .........................................................................65
4. RealNetworks RealVideo............................................................................................................................65
5. DivX ............................................................................................................................................................66
6. TrueMotion VP6 .........................................................................................................................................67
7. Xvid.............................................................................................................................................................67

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E. Digital Audio Coding Algorithms ............................................................................................68

1. Audio Interchange File Format (AIFF) ........................................................................................................68
2. MPEG Audio Layer 3 (MP3) ........................................................................................................................68
3. Advanced Audio Codec (AAC) ....................................................................................................................69
4. High Efficiency AAC (HE-AAC)/aacPlus/aacPlus v1/AAC+ ..........................................................................69
5. High Efficiency AAC v2/aacPlus v2/Enhanced AAC+/AAC++ ......................................................................70
6. RealNetworks RealAudio............................................................................................................................71
7. Microsoft Windows Media Audio (WMA)..................................................................................................71

F. Speech Coding & Recording Algorithms .................................................................................73

1. Half Rate (HR /GSM-HR).............................................................................................................................73
2. Full Rate (FR /GSM- FR / GSM 06.10) ..........................................................................................................73
3. Microsoft GSM (MS-GSM)..........................................................................................................................73
4. Enhanced Full Rate (EFR /GSM-EFR) ..........................................................................................................73
5. Adaptive Multi-Rate (AMR/AMR- NB/AMR-HR/AMR-FR) ...........................................................................74
6. Adaptive Multi-Rate - Wide Band (AMR-WB) ............................................................................................75
7. Variable Multi- Rate - Wide Band (VMR-WB) .............................................................................................76
8. Extended Adaptive Multi-Rate-Wide Band (AMR-WB+) ............................................................................76
9. Qualcomm PureVoice (QCELP) ...................................................................................................................77
10. Enhanced Variable Rate Codec (EVRC/IS-127).......................................................................................78
11. Enhanced Variable Rate Codec B (EVRC-B)............................................................................................79

VI. 3GPP 3G Standards Overview .................................................................................... 80

A. 3GPP Packet Network Architecture Evolution ........................................................................82
1. Core Network Architecture Evolution ........................................................................................................82
2. Radio Access Network (RAN) Architecture Evolution ................................................................................84

B. 3GPP Air Interface Technology Evolution ...............................................................................84

1. HSDPA (3GPP Release 5) ............................................................................................................................85
a) Time Domain Link Adaption...................................................................................................................85
b) Hybrid ARQ ............................................................................................................................................86
c) Fast Packet Scheduling ..........................................................................................................................87
2. HSUPA (3GPP Release 6) ............................................................................................................................87
3. HSPA Evolved or HSPA+ (3GPP Release 7) .................................................................................................88
a) Higher-Order Modulation ......................................................................................................................88
b) Multiple Input Multiple Output (MIMO) ...............................................................................................89
c) Continuous Packet Connectivity (CPC) ..................................................................................................89
4. Evolved EDGE (3GPP Release 7) .................................................................................................................90
5. LTE (3GPP Release 8) ..................................................................................................................................92
a) LTE System Architecture ........................................................................................................................92
b) LTE Radio Interface Protocol Architecture.............................................................................................95
c) LTE – WCDMA Handovers......................................................................................................................97
d) Frequency Domain Scheduling ..............................................................................................................98
e) Frequency Domain Link Adaptation ......................................................................................................98
f) Channel Quality Estimation ...................................................................................................................99

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g) Frequency Domain Channel Equalization ............................................................................................100

h) Advantages of OFDM over WCDMA ....................................................................................................100
i) Drawbacks of OFDM ............................................................................................................................101

C. Technical References...........................................................................................................102

VII. Global Smartphone Market ..................................................................................... 103

A. Overall Global Smartphone Market Share (2008) .................................................................103
B. Smartphone Vendor Market Shares by Region (2008) ..........................................................104
1. North America ..........................................................................................................................................104
2. Western Europe .......................................................................................................................................105
3. Japan ........................................................................................................................................................105
4. South Korea..............................................................................................................................................107
5. China ........................................................................................................................................................108
6. India .........................................................................................................................................................111
7. Middle-East and Africa .............................................................................................................................111
8. Central/Latin America ..............................................................................................................................112
9. Eastern Europe .........................................................................................................................................113
10. Asia Pacific ...........................................................................................................................................114

C. Global Smartphone Shipment Forecast ('08-'12) ..................................................................115

1. Global Smartphone Unit Shipment Forecast by Region ('08-'13) ............................................................115
2. Global Smartphone Unit Shipment Forecast by Cellular Technology ('07-'13) ........................................116

VIII. Global Smartphone Suppliers................................................................................... 117

1. Acer/E-Ten ...............................................................................................................................................117
2. Amoi .........................................................................................................................................................119
3. Apple ........................................................................................................................................................122
4. ASUSTeK Computer ..................................................................................................................................127
5. CEC Telecom .............................................................................................................................................130
6. Gigabyte Communications .......................................................................................................................133
7. Hewlett Packard .......................................................................................................................................136
8. HTC Corporation .......................................................................................................................................139
9. Kyocera.....................................................................................................................................................148
10. Lenovo Mobile Communications .........................................................................................................151
11. LG Electronics.......................................................................................................................................152
12. Mitac ....................................................................................................................................................158
13. Motorola..............................................................................................................................................160
14. Nokia ....................................................................................................................................................171
15. Palm .....................................................................................................................................................187
16. Pantech & Curitel.................................................................................................................................194
17. Research In Motion (RIM)....................................................................................................................196
18. Sony Ericsson .......................................................................................................................................203
19. Samsung...............................................................................................................................................207

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IX. Japan Smartphone Market ...................................................................................... 215

A. Overview ............................................................................................................................215
B. Japanese Smartphone Suppliers ..........................................................................................217
1. Fujitsu.......................................................................................................................................................218
2. NEC Mobile...............................................................................................................................................223
3. Panasonic Mobile Communications .........................................................................................................227
4. Sharp ........................................................................................................................................................231
5. Sony Ericsson............................................................................................................................................235
6. Toshiba .....................................................................................................................................................238

X. Smartphone Operating Systems .................................................................................. 241

A. Overview ............................................................................................................................241
B. Smartphone O/S Market Share and Forecast .......................................................................244
C. Global Smartphone O/S Market Share & Forecast................................................................244
D. Regional Smartphone O/S & Air IF Market Shares & Forecast...............................................245
1. North America..........................................................................................................................................245
2. Western Europe .......................................................................................................................................247
3. Japan ........................................................................................................................................................249
4. South Korea..............................................................................................................................................251
5. China ........................................................................................................................................................252
6. India .........................................................................................................................................................256
7. Southeast Asia..........................................................................................................................................259
8. Eastern Europe .........................................................................................................................................260
9. Central and Latin America........................................................................................................................262
10. Middle East & Africa ............................................................................................................................264

E. O/S Vendor Profiles ............................................................................................................266

1. Google Android™.....................................................................................................................................266
2. Microsoft Windows Mobile......................................................................................................................271
3. Symbian ....................................................................................................................................................274

XI. Smartphone Semiconductor Market ........................................................................ 277

A. Communication Processors .................................................................................................277
1. Overview ..................................................................................................................................................277
2. 2.5G Communication Processors .............................................................................................................277
a) Overview..............................................................................................................................................277
b) 2.5G Communication Processor Market Share & Forecast .................................................................277
c) 2.5G Communications Processor Vendor Profiles ...............................................................................279
i. Freescale (EGPRS Platform).............................................................................................................279
ii. Marvell (Single-Die EGPRS Baseband Communications Processor) ................................................281
iii. Texas Instruments (Single-chip EGPRS Baseband Applications Processor) .....................................282
iv. Texas Instruments (Single-die EGPRS Baseband Multimedia Applications Processor) ...................286

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3. 3G Communication Processors/Platforms ...............................................................................................289

a) Overview..............................................................................................................................................289
b) 3G Communication Processor Market Share & Forecast ....................................................................289
c) 3G Communications Processors/Platforms Vendor Profiles ...............................................................291
i. Broadcom (Single-die HSDPA/EDGE Baseband Processor) .............................................................293
ii. Broadcom (Single-die HSPA/EDGE Baseband+RF Processor) ..........................................................294
iii. Ericsson Mobile Platforms (HEDGE Multimedia Platforms) ............................................................297
iv. Freescale Semiconductor (Multimode, Multiband HEDGE Platform) .............................................299
v. Marvell (Single-Die HEDGE Baseband Communications Processor)................................................302
vi. Panasonic (GPRS/HSDPA Baseband High-Def Communication Processors)....................................303
vii. NEC Electronics (Single-chip HEDGE Baseband Communications Processor) .............................304
viii. NXP (WEDGE Multimedia Platform)............................................................................................307
ix. Qualcomm (HEDGE and EV-DO Multimedia Platforms) ..................................................................308
x. Renesas Technology (FOMA and HEDGE Multimedia Platforms) ...................................................311

B. Stand-alone Applications Processors ...................................................................................313

1. Overview ..................................................................................................................................................313
2. Stand-alone Applications Processor Market Share & Forecast ................................................................315
3. Low-Definition Multimedia Applications Processor Vendor Profiles .......................................................317
a) Marvell.................................................................................................................................................317
b) NXP ......................................................................................................................................................319
c) Samsung (Stacked Memory MCP Applications Processor) ..................................................................321
d) STMicroelectronics ..............................................................................................................................323
e) Texas Instruments................................................................................................................................325
4. Standard-Definition Multimedia Applications Processor Vendor Profiles ...............................................328
a) Core Logic ............................................................................................................................................328
b) Freescale..............................................................................................................................................330
c) Marvell.................................................................................................................................................333
d) Nvidia ...................................................................................................................................................335
a) Panasonic .............................................................................................................................................336
e) Renesas Technology.............................................................................................................................338
f) Samsung...............................................................................................................................................342
g) STMicroelectronics ..............................................................................................................................346
h) Zoran (Multimedia Applications Processor) ........................................................................................351

C. Media Co-Processors...........................................................................................................353
1. Overview ..................................................................................................................................................353
2. Supplier Profiles .......................................................................................................................................353
a) AMD/ATI Technologies (Std. Definition Media Co-Processor).............................................................353
b) Broadcom (High-Def Media Co- Processor)..........................................................................................354
c) Marvell (Std.-Definition Media Co-Processor).....................................................................................357
d) MtekVision (Std.-Definition Media Co-Processor) ...............................................................................358
e) Nvidia (Std.- Definition Media Co-Processor) .......................................................................................361
f) Nvidia (Low- Definition Media Co-Processor).......................................................................................365
g) Texas Instruments (Low-Definition & Std.-Definition Media Co-Processors) ......................................368

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h) Toshiba (Std.-Definition Media Co-Processor).....................................................................................371

D. Non-Captive Baseband & RF Transceivers ............................................................................373

1. 3G Stack Market Overview .......................................................................................................................374
a) LTE Software ........................................................................................................................................376
2. Cellular Baseband & RF Transceiver Market Share & Forecast ................................................................377
3. Cellular Baseband and RF Transceiver Supplier Profiles ..........................................................................382
a) AKM (WCDMA RF Xceivers) .................................................................................................................384
b) Broadcom (EDGE DBB, RF Xceiver, DBB+RF Xceiver) ...........................................................................386
c) Ericsson Mobile Platforms (HSPA, HSPA+ and LTE Modems) ..............................................................388
d) Ericsson Mobile Platforms (UMTS/HSPA BB/RF + Multimedia Co-Processors) ...................................389
e) Freescale (WEDGE and EDGE RF Subsystems) .....................................................................................392
f) Icera Semiconductor (Multimode HSPA/EDGE Baseband) ..................................................................396
g) Infineon (CMOS EDGE, WEDGE & LTE Xceivers) ..................................................................................397
h) Infineon (Multimode/Multiband HEDGE BB/RF/PM Platform) ...........................................................399
i) Interdigital (Multimode HSPA/EDGE Baseband) ..................................................................................402
j) NXP (CMOS EDGE Xceivers) .................................................................................................................404
k) Qualcomm (WCDMA/EV-DO Baseband/RF + Multimedia Co-Processors) ..........................................405
l) Renesas (SOI BiCMOS GSM/GPRS/EDGE Xceiver)................................................................................412
m) Renesas Technology (Single-chip Multiband WEDGE/HSPA RF Xceiver).........................................413
n) RF Micro Devices (EDGE Xceiver/SW-PA Module) ...............................................................................414
o) Skyworks Solutions (Multiband, Direct Conversion HEDGE RF Xceivers) ............................................414

E. Bluetooth ...........................................................................................................................416
1. Overview ..................................................................................................................................................416
a) Bluetooth 1.0 and 1.0B ........................................................................................................................417
b) Bluetooth 1.1 .......................................................................................................................................417
c) Bluetooth 1.2 .......................................................................................................................................418
d) Bluetooth 2.0 EDR................................................................................................................................418
e) Bluetooth 2.1 .......................................................................................................................................418
f) Wimedia High-speed Bluetooth .........................................................................................................419
g) Bluetooth Seattle.................................................................................................................................419
h) Ultra Low Power Bluetooth (a.k.a. Wibree).........................................................................................420
i) Advanced Audio Distribution (A2DP) Profile .......................................................................................420
2. Bluetooth Market Share & Forecast ........................................................................................................421
3. Bluetooth Supplier Profiles ......................................................................................................................422
a) Broadcom (130nm CMOS BT 2.1+EDR + FM/RDS + Wi-Fi)...................................................................423
b) CSR (130 nm CMOS BT 2.1+EDR, BT 2.1+EDR + Wibree + FM/RDS + GPS) ..........................................424
c) Infineon Technologies AG (130 nm CMOS BT 2.0 EDR) .......................................................................425
d) NXP (CMOS BT 2.0 EDR, BT 2.0 EDR + Wi-Fi) .......................................................................................426
e) Qualcomm (130 nm CMOS BT 2.0 EDR) ...............................................................................................426
f) Staccato (110 nm CMOS BT 3.0, USB over UWB) ................................................................................427
g) STMicroelectronics (Single-Chip CMOS BT 2.1 EDR, BT 2.1 EDR + FM Xceiver) ...................................428
h) Texas Instruments (Single-Chip 65nm CMOS BT 2.1 EDR + FM Xceiver) .............................................430

F. Mobile Wireless LAN...........................................................................................................431

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1. Overview ..................................................................................................................................................431
2. Mobile Wireless LAN Market Share & Forecast .......................................................................................433
3. Mobile Wireless LAN Supplier Profiles.....................................................................................................435
a) Atheros Communications (Single-Chip Wi-Fi and GPS)........................................................................436
b) Broadcom (Single-Chip Wi-Fi+Bluetooth+FM).....................................................................................437
c) Marvell (Single-Chip Wi-Fi + BT 2.0 EDR, Wi-Fi + BT 2.0 EDR + FM).....................................................438
d) NXP Semiconductors (Wi- Fi/UMA, Wi-Fi+Bluetooth SIP) ....................................................................439
e) Qualcomm ...........................................................................................................................................440
f) STMicroelectronics (SIP-based Wi-Fi)..................................................................................................441
g) Texas Instruments (Single-Chip Wi-Fi + BT 2.1 EDR + FM/RDS)...........................................................442

G. FM Radio ............................................................................................................................444
1. Overview ..................................................................................................................................................444
2. FM Radio Market Share & Forecast .........................................................................................................445
3. FM Radio Supplier Profiles .......................................................................................................................446
a) Airoha Technologies (FM Stereo Receiver + RDS/RBDS) .....................................................................447
b) NXP (Single-Chip FM Stereo Receiver + RDS + AM) .............................................................................448
c) ROHM (Single-Chip FM Stereo Receiver) .............................................................................................449
d) Sanyo (AM/FM Receiver) .....................................................................................................................449
e) Silicon Labs (CMOS FM Stereo RDS/RBDS Xceiver, AM/FM Receiver) .................................................449
f) STMicroelectronics (FM RDS Receiver)................................................................................................451
g) Texas Instruments (FM RDS Transceiver) ............................................................................................451

H. GPS ....................................................................................................................................452
1. Overview ..................................................................................................................................................452
a) Future Satellite Navigation Systems....................................................................................................455
b) Navigation Software for Smartphones ................................................................................................456
2. GPS Market Share & Forecast ..................................................................................................................458
3. GPS Chip Supplier Profiles........................................................................................................................459
a) Atheros/u-Nav (One-Chip SoC) ............................................................................................................461
b) Broadcom/Global Locate (A-GPS) ........................................................................................................462
c) Infineon (Global Locate GPS Chip) .......................................................................................................465
d) Nemerix ...............................................................................................................................................465
e) NXP (GloNav) .......................................................................................................................................466
f) Qualcomm (Embedded A-GPS) ...........................................................................................................467
g) RFMD (Software-assisted GPS Receiver) .............................................................................................467
h) SiRF Technology (Stand-alone 90 nm Single-Die A-GPS) .....................................................................467
i) STMicroelectronics (2-Chip Set)...........................................................................................................469
j) Texas Instruments (Single-Chip A- GPS)................................................................................................470

I. Mobile WiMAX ...................................................................................................................471

1. Overview ..................................................................................................................................................471
2. Mobile WiMAX Supplier Profiles ..............................................................................................................474
a) Beceem Communications (802.16e Wave 2 PHY, MAC & Direct Conversion RF)................................474
b) Intel® (802.16e Wave 2 PHY, MAC & Triple-band RF) .........................................................................475
c) Sequans (802.16e Wave 2 PHY, MAC & CMOS RF) ..............................................................................477

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J. Mobile TV...........................................................................................................................480
1. Mobile TV Standards Overview ................................................................................................................480
2. Mobile TV Semiconductor Market Share & Forecast ...............................................................................483
3. Mobile TV Semiconductor Vendors .........................................................................................................485
a) Broadcom (CMOS DVB-H & DVB-T Monolithic Tuner).........................................................................486
b) DiBcom (DVB-H/T/SH Tuners & Demods)............................................................................................486
c) Imagination Technology (Multi-Standard MTV Demodulator IP Core) ...............................................487
d) Infineon (CMOS DVB- H, DVB-T Tuner & Demod) ................................................................................488
e) Innofidei (CMMB Demod & Receiver) .................................................................................................489
f) Legend Silicon (DMB-TH, TDS-OFDM Demod).....................................................................................489
g) Maxim (ISDB-T 1Seg & 3Seg Tuners)....................................................................................................490
h) MegaChips (ISDB-T Demod) .................................................................................................................490
i) Newport Media (CMOS DVB-H, ISDB-T Tuner & Demod)....................................................................491
j) NXP (Analog TV Output Processor) ......................................................................................................492
k) Qualcomm (MediaFLO™, ISDB-T, DVB-H Tuner & Demod) .................................................................493
l) Samsung (Multi-Mode DVB-T/H, DAB-IP, ISDB-T/T-DMB Tuner & Demod) ........................................494
m) Siano Mobile Silicon (DVB-T/H, T-DMB, ISDB-T, CMMB Tuner & Demod) ......................................495
n) Texas Instruments (DVB- H, ISDB-T Tuner & Demod) ...........................................................................497

K. Digital Camera Image Sensors & Processors .........................................................................498

1. Overview ..................................................................................................................................................498
2. Image Sensor Market Share & Forecast ...................................................................................................500
3. Image Sensor Supplier Profiles .................................................................................................................504
a) Aptina Imaging (CMOS Image Sensors and Processors) ......................................................................507
b) MagnaChip Semiconductor (SXGA, UXGA & 3.2MP Imagers & Processors) ........................................509
c) OmniVision (3.2MP, 5MP and 8MP CMOS Sensors & Processors) ......................................................509
d) Samsung (8.4 MP CMOS Image Sensor) ..............................................................................................511
e) STMicroelectronics (1.3MP, 2MP and 3.15MP Sensors & Processors)................................................511
f) Toshiba Electronic Components (CMOS 3.2 MP & 2MP) ....................................................................513

L. Fingerprint Sensors.............................................................................................................514
1. Overview ..................................................................................................................................................514
a)
Fingerprint Sensor Technologies .........................................................................................................515
2. Fingerprint Sensor Market Share & Forecast ...........................................................................................517
3. Fingerprint Sensor Supplier Profiles.........................................................................................................519
a) Atmel (Fingerprint Recognition Sensor) ..............................................................................................519
b) Atrua Technologies (Fingerprint Authentication & Touch Navigation Chip) .......................................520
c) Authentec (Fingerprint Authentication Sensors).................................................................................521
d) UPEK (Capacitive Fingerprint Sensors).................................................................................................523

M. Touchscreen Panels & Controllers....................................................................................525

1. Overview ..................................................................................................................................................525
a) Resistive Touchscreens ........................................................................................................................529
b) Capacitive Touchscreens......................................................................................................................530
2. Touchscreen Controller Market Share & Forecast ...................................................................................533
3. Touchscreen Controller Supplier Profiles.................................................................................................534

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a) Broadcom (Capacitive Touchscreen Controller) ..................................................................................534

b) Cypress (Capacitive Touchscreen Controllers).....................................................................................534
c) ELANTECH (Capacitive Touchscreen Modules & Controllers)..............................................................536
d) Leadis Technology (Capacitive Touchscreen Controllers With Integrated Haptics Driver) .................539
e) STMicroelectronics (Resistive & Capacitive Touchscreen Controllers)................................................540
f) Synaptics (Capacitive & Resistive Touchscreen Controllers) ..............................................................542
g) Texas Instruments (Resistive Touchscreen Controllers) ......................................................................544

N. Accelerometers ...............................................................................................................545
1. Overview ..................................................................................................................................................545
2. Accelerometer Vendor Market Share & Forecast ....................................................................................546
3. Accelerometer Semiconductor Vendor Profiles.......................................................................................547
a) Analog Devices (3-axis MEMS Accelerometers) ..................................................................................548
b) Bosch Sensortec (3-axis MEMS Accelerometers) ................................................................................549
c) Freescale (3-axis Digital Accelerometers) ............................................................................................550
d) Hitachi Metals (3-axis Digital Accelerometers) ....................................................................................550
e) Kionix (3-axis MEMS Accelerometers) .................................................................................................551
f) STMicroelectronics (3-axis Linear MEMS Accelerometers) .................................................................552

O. Pico Projectors ................................................................................................................554

1. Overview ..................................................................................................................................................554
2. Semiconductor Vendor Profiles ...............................................................................................................555
a) Microvision (Single-Mirror MEMS Pico Projector)...............................................................................555
b) Texas Instruments (DLP Pico Projector)...............................................................................................556

P. Licensed Processor, Graphics & Media Cores .......................................................................557

1. ARM Cortex™A8 (Low-Power Processor IP) ............................................................................................557
2. AMD/ATI Technologies (Low -Power 2D/3D Graphics Cores)...................................................................559
3. Imagination Technologies Group (2D/3D Graphics, Multimedia & Display IP) ........................................560

XII. Semiconductor & Mobile Platform Vendor Profiles................................................... 565

A. Broadcom...........................................................................................................................565
B. Ericsson Mobile Platforms (EMP).........................................................................................568
C. Freescale ............................................................................................................................572
D. Infineon..............................................................................................................................574
E. Marvell...............................................................................................................................575
F. NEC Electronics ...................................................................................................................578
G. NXP Semiconductor ............................................................................................................580
H. Qualcomm..........................................................................................................................582
I. Renesas Technology............................................................................................................592
J. ST Microelectronics.............................................................................................................595

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K. Texas Instruments...............................................................................................................601

XIII. Wireless & Multimedia: Acronyms & Abbreviations ................................................. 609

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List of Figures

Figure 1 Smartphone Shipments by Region - 2008...................................................................................6

Figure 2 Smartphone O/S Vendor Unit Market Share - 2008 ....................................................................7

Figure 3: Smartphone Semiconductor Revenue Forecast – 2008 - 2013 ................................................. 10

Figure 4: Nokia Mobile Browser and Web Runtime Roadmap ................................................................ 24

Figure 5: 3GPP, 3GPP2 and Mobile WiMAX Standards and Migration Paths ........................................... 37

Figure 6: Spectral Efficiency for WCDMA (R99 – R8) and LTE.................................................................. 40

Figure 7: Voice Capacity in Paired 10 MHz Band for GSM, UMTS R99/R6/R7 and LTE............................. 41

Figure 8: HSPA (R6) and LTE Typical Cell Edge User Throughput ............................................................. 42

Figure 9: Peak Data Rates in UL and DL for WCDMA and LTE.................................................................. 43

Figure 10: EDGE, WCDMA (R99 – R7), LTE and DSL Typical Roundtrip Network Latencies....................... 48

Figure 11: Bandwidth and Latency Requirements for Key Services......................................................... 49

Figure 12: 3GPP Packet Network Architecture Evolution........................................................................ 82

Figure 13: 3GPP Core Network Architecture and Interfaces ................................................................... 83

Figure 14: LTE Overall System Architecture ............................................................................................ 93

Figure 15: Functional Split Between E-UTRAN and Evolved Packet Core (EPC)........................................ 94

Figure 16: LTE Radio Interface Protocol Architecture ............................................................................. 95

Figure 17: E-UTRAN Layer 2 Downlink Radio Protocol Architecture and Workload Partitioning.............. 96

Figure 18: Motorola MOTOMAGX Mobile Linux Platform ....................................................................163

Figure 19: Android Software Stack....................................................................................................... 267

Figure 20: Freescale MXC275 EGPRS Platform ..................................................................................... 279

Figure 21: Marvell PXA901 Communications Processor Block Diagram ................................................ 281

Figure 22: OMAP850 Communications Processor Block Diagram .........................................................283

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Figure 23: OMAP850 Based Smartphone Reference Design ................................................................. 285

Figure 24: OMAPV1030 Communications Processor Block Diagram ..................................................... 287

Figure 25: Broadcom HEDGE Applications Processor............................................................................ 293

Figure 26: Broadcom Standard Definition Apps Processor Block Diagram ............................................ 295

Figure 27: Freescale 3G Single-Core Modem Platform .........................................................................299

Figure 28: NEC Electronics Medity2 Chipset.........................................................................................304

Figure 29: NXP 7210 WEDGE Platform................................................................................................. 307

Figure 30: Qualcomm MSM7600 Chipset Solution...............................................................................309

Figure 31: Qualcomm MSM7600 Chipset RF Options ........................................................................... 310

Figure 32: Marvell PXA270 Block Diagram ........................................................................................... 318

Figure 33: NXP PNX4008 Block Diagram............................................................................................... 319

Figure 34: STMicro STn8815 Block Diagram.........................................................................................323

Figure 35: TI OMAP1710 Applications Processor Block Diagram........................................................... 326

Figure 36: Core Logic Multimedia Device Block Diagram ...................................................................... 329

Figure 37: Freescale Standard-Definition Applications Processor Block Diagram .................................. 331

Figure 38: Marvell PXA320 Standard-Definition SoC Block Diagram ..................................................... 333

Figure 39: Samsung Standard-Definition Apps Processor Block Diagram ..............................................343

Figure 40: STMicro Nomadik STn8815 Applications Processor Block Diagram ...................................... 347

Figure 41: Texas Instruments Standard-Definition OMAP Apps Processor Block Diagram..................... 350

Figure 42: Broadcom High-Def Mobile Multimedia Co-Processor Block Diagram.................................. 356

Figure 43: Marvell 2700G Graphics and Multimedia Accelerator.......................................................... 357

Figure 44: MtekVision Multimedia Co-Processor Architecture .............................................................358

Figure 45: TI OMAP-DM500/OMAP-DM299 Media Co-processor .........................................................368

Figure 46: TI OMAP-DM510 Media Co-processor ................................................................................. 370

Figure 47: RF Transceiver Supplier Overview ....................................................................................... 383

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Figure 48: Broadcom BCM21331 Cellular EDGE Processor ................................................................... 387

Figure 49 Freescale's 4-chip WCDMA/EDGE Radio Block Diagram ....................................................... 393

Figure 50: Freescale's RFX300-30: 2-chip WCDMA/EDGE Radio Block Diagram ....................................395

Figure 51: Infineon HSDPA Modem Platform ....................................................................................... 400

Figure 52: MSM6260 Cat. 6 HSDPA Multimedia Platform.....................................................................405

Figure 53: MSM6280 Cat. 8 HSDPA Enhanced Multimedia Platform..................................................... 407

Figure 54: MSM6500 EV-DO Rev 0 + GSM/GPRS Multimedia Platform ................................................. 409

Figure 55: MSM6550 1X Rel 0/Rev A/EV-DO Rev 0 + GSM/GPRS Multimedia Platform.........................411

Figure 56: Texas Instruments WiLink 6.0 Solution ................................................................................ 442

Figure 57: GPS Receiver Block Diagram................................................................................................ 453

Figure 58 Global Locate/Broadcom Hammerhead II A-GPS Chip Block Diagram ................................... 463

Figure 59: Intel WiMAX Connection 2400 Solution...............................................................................476

Figure 60: Sequans SQN1130 802.16e Wave 2 Baseband (MAC+PHY) Chip Architecture...................... 478

Figure 61: Smartphone Image Sensor Usage by Resolution – 2008....................................................... 499

Figure 62: NEC Medity Applications Processor Roadmap .....................................................................579

Figure 63: Renesas SH-Mobile Applications Processor Product Roadmap.............................................592

Figure 64: Renesas SH-Mobile G-series Smartphone Platforms with Integrated Baseband LSI ..............593

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List of Tables
Table 1: Smartphone Vendor Unit Shipments and Market Share - 2008 ...................................................5

Table 2: Smartphone Unit Shipments and Market Share by Primary Cellular Technology - 2008 ..............8

Table 3: Java Technologies Supported by Nokia Series 40 and Series 60 Platforms................................. 28

Table 4: Theoretical Max Achievable Spectral Efficiency for GPRS, EDGE, WCDMA & LTE....................... 39

Table 5: Peak and Average UL/DL Data Rates for GPRS, EDGE, WCDMA (R99 – R7) and LTE ................... 44

Table 6: 3GPP Standards Evolution ........................................................................................................ 81

Table 7: HSDPA Supported User Equipment (UE) Categories.................................................................. 85

Table 8: HSDPA supported Modulation and Channel Coding Schemes (MCS) ......................................... 86

Table 9: HSUPA Supported User Equipment Categories ......................................................................... 87

Table 10: Release 7 HSPA+ Peak Data Rates........................................................................................... 89

Table 11: LTE Radio Interface UL and DL Specifications.......................................................................... 97

Table 12: Smartphone Vendor 2008 Unit Shipments & Market Share - Overall ....................................103

Table 13: Smartphone Vendor 2008 Unit Shipments & Market Share – North America ........................104

Table 14: Smartphone Vendor 2008 Unit Shipments & Market Share – Western Europe ..................... 105

Table 15: Smartphone Vendor 2008 Unit Shipments & Market Share – Japan...................................... 107

Table 16: Smartphone Vendor 2008 Unit Shipments & Market Share – South Korea............................ 108

Table 17: Smartphone Vendor 2008 Unit Shipments & Market Share – China...................................... 110

Table 18: Smartphone Vendor 2008 Unit Shipments & Market Share – India ....................................... 111

Table 19: Smartphone Vendor 2008 Unit Shipments & Market Share – Middle-East/Africa.................. 111

Table 20: Smartphone Vendor 2008 Unit Shipments & Market Share – Central/Latin America.............112

Table 21: Smartphone Vendor 2008 Unit Shipments & Market Share – Eastern Europe....................... 113

Table 22: Smartphone Vendor 2008 Unit Shipments & Market Share – Asia Pacific .............................114

Table 23: Global Smartphone Shipment Forecast by Region ('08-'13)...................................................115

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Table 24: Global Smartphone Unit Shipment Forecast by Cellular Technology (2008-2013) ................. 116

Table 25: Acer/E-Ten Windows Mobile Smartphones - Technical Specifications................................... 118

Table 26: Amoi Windows Mobile Smartphones - Technical Specifications............................................ 120

Table 27: Apple 2.5G and 3G iPhone - Technical Specifications ............................................................ 124

Table 28: ASUSTeK Windows Mobile Smartphones - Technical Specifications...................................... 128

Table 29: CEC Telecom Windows Mobile (Chinese) Smartphones - Technical Specifications................. 131

Table 30: Gigabyte Communications Windows Mobile Smartphones - Technical Specifications ........... 133

Table 31: HP Windows Mobile Smartphones - Technical Specifications................................................ 137

Table 32: HTC Touch Screen Smartphones – Technical Specifications .................................................. 141

Table 33: HTC Non Touch Screen Smartphones – Technical Specifications ........................................... 143

Table 34: HTC PDA Smartphones – Technical Specifications................................................................. 145

Table 35: Kyocera Windows Mobile Smartphone – Technical Specifications ........................................ 149

Table 36: Lenovo Windows Mobile Smartphones – Technical Specifications ........................................ 151

Table 37: LG Symbian and Windows Mobile Smartphones – Technical Specifications .......................... 155

Table 38: Mitac Windows Mobile Smartphones – Technical Specifications .......................................... 158

Table 39: Motorola Q Windows Mobile GSM and CDMA Smartphones - Technical Specifications ........ 165

Table 40: Motorola Symbian/UIQ Smartphones - Technical Specifications........................................... 167

Table 41: Motorola Mobile Linux Smartphones - Technical Specifications ............................................ 169

Table 42: Nokia S60 Smartphones by Edition ....................................................................................... 174

Table 43: Nokia Enterprise Smartphones - Technical Specifications ..................................................... 176

Table 44: Nokia N95 Smartphone Models Comparison ........................................................................ 179

Table 45: Nokia Consumer Smartphones #1 - Technical Specifications ................................................. 180

Table 46: Nokia Consumer Smartphones #2 - Technical Specifications ................................................. 182

Table 47: Palm WCDMA Smartphones - Technical Specifications .........................................................190

Table 48: Palm CDMA2000 Smartphones - Technical Specifications..................................................... 192

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Table 49: Pantech Windows Mobile Smartphones - Technical Specifications ....................................... 194

Table 50: Blackberry EGPRS, WCDMA and CDMA2000 Smartphones - Technical Specifications............ 199

Table 51: Sony-Ericsson Symbian & Windows Mobile Smartphone for RoW – Tech. Specifications ...... 204

Table 52: Samsung Windows Mobile Smartphones - Technical Specifications...................................... 209

Table 53: Samsung Symbian Smartphones - Technical Specifications ...................................................211

Table 54: Samsung Linux Smartphones - Technical Specifications ........................................................213

Table 55: Fujitsu Windows Mobile Smartphones - Technical Specifications.......................................... 218

Table 56: Fujitsu Symbian Smartphones - Technical Specifications....................................................... 221

Table 57: NEC Linux Smartphones - Technical Specifications................................................................ 224

Table 58: Panasonic Linux and Symbian Smartphones - Technical Specifications .................................. 228

Table 59: Sharp Symbian and Windows Mobile Smartphones - Technical Specifications ...................... 232

Table 60: Sony-Ericsson Symbian Smartphones for the Japanese Market – Technical Specifications ....235

Table 61: Toshiba Windows Mobile Smartphones - Technical Specifications........................................ 238

Table 62: Web 2.0 Technologies and Multimedia Feature Comparison by Mobile O/S .........................242

Table 63: Global Smartphone O/S Market Share (2008) & Forecast (‘08-’13) ....................................... 244

Table 64: Smartphone O/S Shipment Market Share (2008) & Forecast ('08-'13) – N. America ..............245

Table 65: Smartphone Air-Interface Shipments & Forecast ('08-'13) – N. America ............................... 247

Table 66: Smartphone O/S Shipment Market Share & Forecast ('08-'13) – W. Europe .........................248

Table 67: Smartphone Air Interface Shipment Market Share & Forecast ('08-'13) – W. Europe ........... 248

Table 68: Smartphone O/S Shipment Market Share & Forecast ('08-'13) – Japan ................................ 250

Table 69: Smartphone Air Interface Shipment Market Share & Forecast ('08-'13) – Japan.................. 250

Table 70: Smartphone O/S Shipment Market Share (2008) & Forecast ('08-'13) – S. Korea.................. 252

Table 71: Smartphone Air-interface Shipment Market Share (2008) & Forecast ('08-'13) – S. Korea ....252

Table 72: Smartphone O/S Shipment Market Share & Forecast ('08-'13) – China ................................ 255

Table 73: Smartphone Air-interface Shipment Market Share & Forecast ('08-'13) – China...................255

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Table 74: Smartphone O/S Shipment Market Share (2008) & Forecast ('08-'13) – India....................... 257

Table 75: Smartphone Air-Interface Shipment Market Share (2008) & Forecast ('08-'13) – India .........258

Table 76: Smartphone O/S Shipment Market Share (2008) & Forecast ('08-'13) – S.E. Asia ................. 259

Table 77: Smartphone Air-Interface Shipment Market Share (2008) & Forecast ('08-'13) – S.E. Asia....260

Table 78: Smartphone O/S Shipment Market Share (2008) & Forecast ('08-'13) – E. Europe ...............261

Table 79: Smartphone Air-Interface Shipment Market Share (2008) & Forecast ('08-'13) – E. Europe.. 261

Table 80: Smartphone O/S Shipment Market Share & Forecast ('08-'13) – Central/Latin America ....... 263

Table 81: Smartphone Air-Interface Unit Market Share & Forecast ('08-'13) – Central/Latin America.. 263

Table 82: Smartphone O/S Shipment Market Share & Forecast ('08-'13) – Middle-East and Africa ...... 264

Table 83: Smartphone Air Interface Market Share & Forecast ('08-'13) – Middle-East & Africa ........... 265

Table 84: 2.5G Communication Processor Vendor Market Share ('07-'09)............................................ 278

Table 85: 2.5G Communication Processor Forecast '08-'13 .................................................................. 278

Table 86: 2.5G Communication Processor Vendor Overview................................................................ 279

Table 87: 3G Communication Processor Vendor Market Shares '07-'09 ...............................................290

Table 88: 3G Communication Processor Forecast '08-'13.....................................................................290

Table 89: 3G Communication Processor/Platform Vendor Overview....................................................292

Table 90: Panasonic UniPhier 4MBB+ Specification..............................................................................303

Table 91: OpenGL and Direct3D Feature Comparison .......................................................................... 314

Table 92: Stand-alone Applications Processor Vendor Market Share 2007-2009 .................................. 316

Table 93: Stand-alone Applications Processor Forecast '08-'13 ............................................................ 317

Table 94: Panasonic UniPhier 4M Specification....................................................................................337

Table 95: Renesas SH-Mobile 3A Specifications ...................................................................................340

Table 96: MtekVision’s current lineup of MMP (Mobile Multimedia Platform) products ...................... 360

Table 97: Nvidia Standard-Definition Media Co-Processor Specifications .............................................362

Table 98: Nvidia Low-Definition Media Co-Processor Specifications..................................................... 366

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Table 99: Toshiba T5G Specifications................................................................................................... 372

Table 100: WCDMA Advanced Receiver Types ..................................................................................... 373

Table 101: 3G Stack Source for Major UMTS Baseband Chip Suppliers ................................................. 376

Table 102: Digital Baseband Overall (Integrated and Non-Integrated) 2008 Vendor Market Share ....... 378

Table 103: RF Transceiver 2008 Vendor Market Shares........................................................................ 379

Table 104: Non-Integrated DBB Forecast - '08-'13................................................................................ 380

Table 105: RF Transceiver Forecast '08-'13 .......................................................................................... 381

Table 106: Smartphone Non-Integrated DBB Supplier Overview.......................................................... 382

Table 107: Bluetooth Penetration Rates in Smartphones by Vendor ....................................................417

Table 108: Bluetooth Vendor Unit Shipments and Market Share - 2008...............................................421

Table 109: Bluetooth Forecast '08-'13 ................................................................................................. 422

Table 110: WLAN Penetration in Smartphones by OEM ....................................................................... 432

Table 111: Mobile WLAN Vendor Unit Shipments and Market Share – 2008 ........................................ 433

Table 112: Stand-alone & Combo Wi-Fi Chipset Forecast '08-'13 .........................................................434

Table 113: WLAN Stand-alone and Combo Chipset Supplier Overview................................................ 436

Table 114: FM Penetration Rates in Smartphones by Vendor............................................................... 445

Table 115: Stand-alone and Combo FM Chipset Vendor Unit Shipments and Market Share - 2008....... 445

Table 116: Stand-alone and Combo FM Chipset Shipment Forecast - '08-'13 ....................................... 446

Table 117: Stand-alone and Combo FM Chipset Supplier Overview...................................................... 447

Table 118: GPS Chipset Vendor 2008 Market Share.............................................................................458

Table 119: GPS Chipset Forecast '08-'13 ..............................................................................................458

Table 120: GPS Penetration in Smartphones by Supplier...................................................................... 460

Table 121: SiRF GPS Chips....................................................................................................................468

Table 122: Mobile WiMAX Profiles ...................................................................................................... 472

Table 123: Popular WiMAX 802.16-2005 Profiles Supporting Mobility ................................................. 473

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Table 124: Intel Mobile WiMAX Specifications..................................................................................... 477

Table 125: Mobile TV Smartphone 2008 Vendor Shipments and Market Share....................................483

Table 126: Mobile TV Chipset 2008 Shipments by Standard................................................................. 484

Table 127: Mobile TV Multicast Chipset and Subscriber Forecast by MTV Standard ('08-'13) ...............484

Table 128: Mobile TV Demodulators & Tuners Product Overview ....................................................... 485

Table 129: Primary and Secondary Image Sensor 2008 Unit Shipments and Market Share ...................501

Table 130: Image Sensor Shipment/Revenue Forecast 2009-2013 ....................................................... 503

Table 131: Image Sensor Supplier Overview ........................................................................................505

Table 132: Fingerprint Sensor Vendor Market Share - 2008 ................................................................. 518

Table 133: Fingerprint Sensor Market Forecast – 2009-2013 ............................................................... 518

Table 134: Touchscreen Technology Comparison................................................................................. 525

Table 135: Touchscreen Technology Used in Popular Smartphones..................................................... 527

Table 136: Capacitive Touchscreen Controller 2008 Market Share....................................................... 533

Table 137: Resistive & Capacitive Touchscreen Controller Forecast – '08-'13 ....................................... 534

Table 138: Cypress TrueTouch Capacitive Controller Characteristics....................................................535

Table 139: ELANTECH Capacitive Full-Screen Multi-Touch Modules..................................................... 538

Table 140: ELANTECH Capacitive Single-Touch Controllers................................................................... 539

Table 141: Accelerometer Market Forecast '08-'13..............................................................................547

Table 142: Accelerometer Supplier Overview ...................................................................................... 548

Table 143: Imagination Technologies Graphics and Video IP Licensees for Smartphones ..................... 563

Table 144: Qualcomm’s MSM WAN Processor Evolution - 2000 to 2008 ..............................................584

Table 145: Qualcomm Platform Segmentation Strategy....................................................................... 585

Table 146: Qualcomm CDMA2000-centric Platform Portfolio ..............................................................586

Table 147: Qualcomm WCDMA-centric Platform Portfolio................................................................... 587

Table 148: ST’s Nomadik Applications Processor Family Specifications ................................................ 597

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Table 149: TI’s Stand-alone Smartphone Applications Processors ........................................................602

Table 150: TI’s Smartphone 2.5G Communications Processor ABB/PMU/RF Pairings ........................... 605

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