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Manual Do Usuario - Mult-K - (REV 6.3)
Manual Do Usuario - Mult-K - (REV 6.3)
Manual Do Usuario - Mult-K - (REV 6.3)
PN 11-01-00140 V1.8
We intend to provide you with the highest level of support and service in order to assure your
continued satisfaction. Our corporate philosophy in this regard is expressed best by our Mission
Statement:
Through the skills and dedication of our team, working in an environment where
we can all grow and prosper, we shall maintain the highest level of product
performance and customer satisfaction.
We encourage you to contact our highly qualified staff if you have questions regarding operation or
service. Call us at 845-795-2020 or e-mail us at info@sono-tek.com. In addition, extensive technical
information about our products is available on our website at www.sono-tek.com.
1.2.1 FLUX CONSUMPTION 4 5.3 SONOFLUX SYSTEM VARIABLES & THEIR EFFECTS 23
The control and display module is the user interface for controlling system functions. It contains a keypad, a wheel encoder, a 4-line
by 40-character display and an interface port, as well as housing the system's several microcontrollers.
Refer to Figure 2.1 which shows how the major SonoFlux System components are connected to each other.
The flux reservoir consists of a polypropylene (or stainless steel) tank with an input line to the pump inlet, a return line from the 3-way
valve, and a low level sensor cable to alert the operator if the flux level is low in the tank.
The SonoFlux System can be adjusted to apply precise, repeatable amounts of flux with virtually no top-side overspray to circuit boards.
Adjusting the conveyor speed, jet air flow, liquid flow rate and nozzle power level all affect the amount and uniformity of the deposition.
Because these variables interact, a number of different settings will satisfy a given deposition requirement. The SonoFlux 2000F
System greatly simplifies the procedure for obtaining the correct settings by incorporating a spray mode that sets deposition density
(referred to as "Deposition Mode"), which allows the SonoFlux 2000F system to automatically adjust the flow rate to compensate for
changes in conveyor speed, spray width and flux specific parameters. If desired, the user will still have the ability to select "Flow Rate"
spray mode which allows a specific flow rate to be maintained regardless of all other parameter settings.
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1. 06-03-00463-### Display (-005 Single head, -004 Dual Head) 1. 05-01-00006 Belt for Rotary Valve
2. 02-04-00942-001 M8 Nozzle Cable, 8 ft (New Style) 2. 01-00-00229 1/4” Bulkhead Fitting
**06-01-0007M SMA Nozzle Cable, 8 ft (Old Style) (Liquid)
3. 02-10-00015/16 PCB Sensor & Cover 3. 10-00-00001 1/4” Nylon Ferrules
4. 06-03-00374 Air Regulator/Filter (Pack of 10)
5. 05-03-00045 5/16” Tubing Blue Stripe (Air) 4. 10-00-00024 Flux Tank Filters
6. 05-03-00041 3/8” Tubing Blue (Air) (Pack of 12)
7. 05-03-00047 1/4” Tubing Blue Stripe (Liquid)
8. 05-03-00040 5/16” Tubing Blue (Air)
3.0 INSTALLATION
NOTE - Package of parts (air regulator/filter/gauge assembly,
clamps, Teflon PTFE tubing (1/4" OD with blue or
THERE IS CONSIDERABLE VARIATION AMONG red stripe; 5/16" OD blue, red, blue-stripe and red-
WAVE SOLDERING MACHINES WITH RESPECT stripe; 3/8" OD blue. Tubing supplied may vary
TO THE SPACE AND FACILITIES AVAILABLE FOR depending on the type of SonoFlux system),
INSTALLING THE SONOFLUX SYSTEM. THE pressure hose, hardware)
INSTALLATION HARDWARE PROVIDED HAS - Flux reservoir
BEEN FURNISHED BASED ON THE (c) The following additional items are necessary to install
QUESTIONNAIRE YOU SUBMITTED TO the SonoFlux System. These are to be supplied by the
SONO-TEK WITH YOUR ORDER. customer.
- Flexible ducting for the exhaust hood. The most
3.1. REMOVAL OF SHIPPING MATERIALS common hood supplied has a 4" diameter exhaust
(RETROFIT SYSTEMS) port. Ports of 6" and 8" diameter are also available.
(a) Remove the SonoFlux Fluxing System from its packing. - 100/240 VAC single phase, 50/60 Hz, 10 A service,
properly grounded (dedicated 15A service
(b) Verify that the following parts are present: recommended). The service must be from a non-
- Electronics enclosure and enclosure mounting rail switchable source. Switching AC power on/off while
the system is energized can damage the control
- Spray assembly
electronics.
- Ultrasonic nozzle and coaxial cable
- Compressed dry air (90 - 150 psi, 3 cfm), supplied
- Control and display module to the filter assembly (1/4 NPT female thread).
- Exhaust hood, stand, brackets, and hardware - Exhaust air. IMPORTANT: Maintain a minimum of
- Board detection sensor 140 liters/sec ( 300 cfm) of exhaust. Too much or
too little exhaust volume may affect fluxer
performance.
NOTE: Actual positions of each SonoFlux module may vary depending on type of wave solder machine.
(r) Connect the power cord from the electronic enclosure pressing the ON/OFF button located on the control and
to 100 - 240 VAC, 1φ, 50/60/Hz service. display module.
IMPORTANT (v) Observe that the inlet flux line from the reservoir to the
pump begins to fill and that after this line is filled the
BE CERTAIN THAT THE SUPPLY VOLTAGE flux fills the return line to the reservoir. Bubbles
CORRESPONDS TO THE VOLTAGE STAMPED ON forming after any fitting indicate that a fitting is not
THE LABEL LOCATED ADJACENT TO THE tight enough.
POWER ENTRY MODULE. NOTE
DO NOT OPERATE THE PUMP
NOTE FOR LONG PERIODS IN A DRY CONDITION AS
THIS WILL CAUSE DAMAGE TO THE PUMP. IF
THE SYSTEM MUST BE FUSED WITH A 6.3 A
YOU EXPERIENCE DIFFICULTY IN PRIMING THE
SLOW BLOW FUSE. BE CERTAIN THAT THE
PUMP WITHIN TWO TO THREE MINUTES, RAISE
CORRECT FUSE IS INSTALLED. THE FUSE IS
THE FLUX RESERVOIR ABOVE THE PUMP TO
LOCATED IN THE POWER ENTRY MODULE JUST
FORCE LIQUID INTO THE PUMP.
ABOVE THE POWER SWITCH AND LINE CORD
THEN RETURN THE RESERVOIR
RECEPTACLE. TO ACCESS THE FUSE, SQUEEZE
TO ITS NORMAL POSITION.
THE TWO SMALL CLIPS, LOCATED ON EITHER
SIDE OF THE FUSE HOLDER, TOWARD EACH
OTHER TO RELEASE THE HOLDER, AND PRECAUTION
PULL IT STRAIGHT OUT.
NEVER OPERATE THE SYSTEM WITHOUT THE
(s) Fill the flux container. Make sure the foreign particles
do not find their way into the reservoir, as they may FILTER REGULATOR/OIL MIST SEPARATOR.
clog the filter and/or damage the pump.
(t) Attach the flux level sensor connection from the cable PRECAUTION
on the reservoir to the cable coming from the
electronics enclosure. The connector is polarized. AVOID LOCATING THE ELECTRONICS
(u) Power up the system by flipping the main power switch ENCLOSURE IN AN ENVIRONMENT THAT IS
located on the power entry module, followed by WARMER THAN 100°F (38°C).
PRECAUTION
NEVER OPERATE THE SYSTEM WITHOUT
THIS FILTER OR WITHOUT THE FILTER
REGULATOR/OIL MIST SEPARATOR.
4.0 CONTROL OF THE SONOFLUX Pressing the POWER ON button will load the Active Process
screen. The LED will turn green indicating that the system is
SYSTEM functioning properly. The Active Process screen displays the
process that is currently running, followed by the name of the
4.1 SYSTEM CONTROL flux being used. The Spray mode is also shown, which can either
be “Flow Rate” or “Deposition”. These will be explained in more
detail later. To access the MAIN MENU from this screen, simply
4.1.1 Overview
hit the MENU key.
The SonoFlux control and display module permits adjustment
and calibration of system variables such as nozzle power, flux
flow rate/deposition density, air jet force, conveyor speed, spray
on, spray off, spray width and spray offset. Up to 1500 recipes
consisting of various combinations of these parameters can be
created and stored for later use.
On 330M models, one nozzle provides a spray width range of
50mm (2") to 330mm (13"). On 610M models, two nozzles are
employed for a spray width range of 50mm (2") to 610mm (24"). The MAIN MENU consists of 11 functions which can be viewed
by using the UP/DOWN scroll keys. These are shown below and
In addition, various aspects of the system can be password
will now be explained in more detail.
protected. Two levels of password protection are available. The
lower level password permits limited user access. The upper
level password enables access to ALL system functions. The
lower level password might be used by a line operator, and the
upper level password by process or maintenance engineers.
The user can set these passwords or deactivate them as
required.
A sketch of the system controller showing the location of the
functional keypad and backlit liquid crystal display (LCD) is
shown in Figure 2.5. The keypad consists of the POWER
ON/OFF key, 10 number keys (0 through 9) for data entry, 4
cursor keys for UP, DOWN, LEFT and RIGHT, an ENTER key for
initiating commands, a MENU key for bringing up the Main Menu,
and an ESCAPE key to return to the previous screen. An
encoder wheel is used for selecting alphanumeric characters in
the name field.
The following functions can be performed with this system:
(a) Monitor alarms.
(b) Adjust current process.
(c) Select Spray mode (flow rate or deposition).
(d) Set up system calibration.
(e) Edit existing processes.
(f) Create and store new processes.
(g) Set jet burst delay.
(h) Monitor system temperature and alarms.
4.1.4 Alarms
When the system is functioning normally, the Alarms screen will
display NO ALARMS. Otherwise, it will indicate which
subsystem(s) of the machine is experiencing a problem.
(a) Place an opaque object four (4) inches above the The SonoFlux allows the user to select 2 different spray modes,
infrared PCB sensor located on input side of the Flow Rate and Deposition. The deposition mode requires the
SonoFlux System. The sensor diode will change state. user to specify the flux density and percent solids in the EDIT
FLUX menu. Once this is done, the system will automatically
(b) After several seconds the nozzle will begin to spray flux. calculate the flow rate based on conveyor speed and spray width.
The delay is keyed to the conveyor speed setting. If The flow rate is displayed when in ADJUST CURRENT PROCESS,
this is the first time the unit has been run, there may but cannot be modified in this mode of operation.
be some initial sputtering as air is cleared from the
liquid delivery tubing. Increasing the flow rate will The Flow Rate mode allows the user to manually adjust the flow
speed the process of clearing the air. rate for different applications, and basically override the settings
that Deposition mode would provide.
Remove the opaque object from above the sensor
when the atomized stream is stable and free of In this mode, the Deposition value is calculated for reference
interruptions. when on the ADJUST CURRENT PROCESS screen but cannot be
edited. When using this mode, the flow rate calculated in
Occasionally, black-colored board carriers (palettes) will Deposition mode could be used as a starting point (assuming
not reflect light to the sensor. In that case a through- the flux parameters have been entered). Then the rate could
beam sensor is required. Consult Sono-Tek. then be adjusted up or down from there based on the results
the user is trying to achieve.
The Nozzle Power Width and Jet Force are the only parameters
5.2 CALIBRATING SPRAY ON/OFF that need to be set up for either of these modes. In general,
(a) The conveyor speed must be set on the control and 5W is the recommended initial power setting for low solids flux
display module in order to set the timing delay for the and VOC-free flux. For high-solids content fluxes, the initial
spray sequence. This is true for both retrofit and recommended power level should be 12W. The power level can
stand-alone installations. For the optional conveyors be adjusted for optimum performance as will be discussed in
provided by Sono-Tek for stand-alone models , this section 5.3.1. The Jet Force is a less critical parameter and can
setting is also used to control conveyor speed. Any be set initially to 65 l/min for most applications. Problems
conveyor speed change must be reflected in the generally occur with too little Jet Force rather than too much.
Greater force enhances top-side fill. Higher settings may be
SonoFlux conveyor speed setting.
necessary to achieve optimal results.
Check the sensitivity of the infrared sensor located on
the input side of the system. This is done by placing an 5.3.1 Nozzle Power Level
opaque object at circuit board height over the sensor.
For ultrasonic atomization to occur, the power supplied to the
If the diode on the sensor does not change state, nozzle must be above a certain critical threshold level. The
increase the sensitivity of the sensor by turning the critical power level may be different for different fluids, and can
potentiometer, located next to diode, clockwise. vary based upon the solids content, composition of the flux
(b) The spray trigger timing can be set on the second frame being used, and flow rate.
of the System Setup menu. Set the Spray Off to a (a) For all low-solids, no-clean fluxes or VOC-free fluxes set
value x equal to the horizontal distance (in inches) from the initial nozzle power level to 5 watts. For all other
the infrared sensor to the plane formed by the vertical fluxes set the power level to 12 watts.
air sheet plus 1 inch, and Spray On to the value x
minus 1 inch. Use the center of the enclosure as the (b) Set the Flow Rate or Deposition Density to a value you
reference point. expect will be in the range that will ultimately be
required.
(c) Using the wave solder machine calibration glass, (or a
blank circuit board, or a piece of plexiglass cut to the (c) Place an opaque object over the PCB sensor.
pallet or circuit board dimensions) make a test run (d) Stand in a position where it is possible to both observe
through the SonoFlux System. the spray and adjust the nozzle power on the control
Place the calibration glass on the conveyor and let it and display module.
travel through the machine. Check the leading and (e) Gradually decrease power level until the atomization
trailing edge of the pallet or circuit board for flux stops and the nozzle tip becomes flooded with flux.
coverage. This is the critical power level for the flux being tested
Width coverage will be addressed in Section 5.3.4. at this flow rate. Increase the power level by one (1)
Adjust the spray on/off values up or down to ensure watt. This will be the operating power level.
adequate edge coverage and minimal overspray. If
there is a problem with leading edge or trailing edge
coverage, verify that the conveyor speed is correct.
1 6 65 6.5
Flow rate will vary based on the types and sizes of PCBs to be
processed, solids content of the flux, conveyor speed and 7 70 7.0
variables associated with the wave solder machine, such as 8 75 7.8
preheat temperatures.
5 60 6.5
For conveyor speeds in the range of 5-6 ft/min (1.5-1.8 m/min),
the following flow rates may be used as guidelines for most low 2 6 65 7.5
solids fluxes. 7 70 8.0
PCB WIDTH* TYPICAL FLOW 8 75 8.3
(inches) RATE (ML/MIN)** 5 60 7.8
2-6 10 - 25 6 65 8.8
3
7 - 10 20 - 40 7 70 9.5
11 - 13 30 - 50 8 75 10.3
* Excluding pallet 5 60 9.0
** These recommended flows will vary significantly for different 6 65 10.0
4
fluxes. For example, highly active water soluble fluxes may
7 70 10.5
require only 60% of the recommended flow rate. For best
performance, economy, and minimum residues, the flow rate 8 75 11.0
should be set at the lowest possible value that will still result in 5 60 10.0
acceptable solderability.
5 6 65 11.0
6 6 65 12.5
5.3.4.1 SPRAY WIDTH PARAMETERS
7 70 13.0
Achieving the optimal spray width is a function of three parts of
the system. Once a good pattern is established, nothing needs 8 75 13.5
to be set again for a given board size. 5 60 12.5
The three variables are: jet force, jet position, and jet block 6 65 14.0
7
height all contribute to the width of a pattern.
7 70 15.5
Jet Force: This is a setting on the display and control module
8 75 17.0
that controls how much air passes through the jets. The air is
responsible for entraining the spray and transferring it to the
PCB. Increasing the jet force generally enhances top-side solder
fill. Adjust the jet force for best top-side fill using the table
below as a guide for initial settings.
Jet Position: This is the angular position of the jets on the jet
block. Six (6) positions are available. The position, coupled with
the correct jet block height relative to the PCB, will achieve the
desired result. It is always preferable to have the jet angle as
narrow as possible. (Use the table below as a guide.)
Jet Block Height: This is the distance from the nozzle tip to
the bottom of the PCB. The greater this distance, the wider the
pattern will be. Smaller distances are generally more desirable,
but the jet position (described above) is more critical in reducing
defects on the outer edges of a PCB. (Use the table below as a
guide.) In order to adjust the height of the jet block assembly,
it is mounted on a pair of uprights that move up and down.
Each upright is notched at 1/4" intervals so that when installing
On the other hand, if the work cycle is such that the system is p) Set the Spray Width to the width of the board being sprayed
and verify the jet block height and jet position.
idle for long periods during a shift, a delay setting of 10 minutes
may be more appropriate. If a buildup of flux is noticed that q) Run populated boards through the wave soldering machine
starts to affect performance, you may want to shorten the delay and check for defects.
time setting. r) If consistent defects are found on the leading or trailing edges
of the boards, adjust the Spray On and/or Spray Off settings.
5.3.6 Conveyor Speed s) If consistent failures occur on the two sides of the boards, try
increasing the jet force and/or raising the Deposition Density
The speed at which a printed circuit board passes through the
value in the CALIBRATION menu. This will have the effect of
spray chamber is directly related to the quantity of flux increasing the flow rate. Alternatively, if there are no defects,
deposited on it when each of the other variables is fixed. When the Deposition Density value can be lowered by small
in Flow Rate mode, if the conveyor speed is doubled, then the increments until defects occur, and then raised slightly.
flux deposition density will be cut in half. In Deposition mode, Lowering the value has the effect of decreasing the flow rate,
the flow rate will be adjusted automatically as a function of so this procedure will result in the optimal flow rate for
conveyor speed. achieving satisfactory results with the least amount of flux and
waste.
a. Turn ON the SonoFlux system. Go to the Calibration 1200 105 236 419
Menu and select conveyor from the menu. Refer to 1400 122 275 489
Section 4.1.10.2, System Calibration Functions, for
information on the procedures associated with accessing 1600 140 314 559
and using the Calibration Menu. 1800 157 353 628
b. Set the voltage to 5 volts using the UP or DOWN keys. 2000 175 393 698
c. Measure the actual conveyor speed by passing a board of
2200 192 432 768
measured length on the conveyor over the SonoFlux
System infrared board sensor and precisely measuring the 2500 218 491 873
length of time the sensor detects the board (visually
3000 262 589 1047
observable by the status of the sensing LED located on
the sensor housing). 3500 306 687 1222
d. Compute the conveyor speed by dividing the time (in 4000 349 785 1396
minutes) into the board length (in feet or centimeters
4500 393 883 1571
depending on the units shown on the control and display
module panel). 5000 437 982 1746
e. If required, change the conveyor speed value shown on 5500 480 1080 1920
the screen such that it is the same as the measured value.
6000 524 1178 2095
f. Next, set the voltage to 1 volt. Repeat steps c,d, and e
for 1.5 - 5 volt calibration points. Suggested Inadequate
Missing or light flux Dirty spray assembly components Check for excessive residue on the jet block assembly. Verify that the jets are not
deposition one side of a plugged.
PCB
Flux filter Replace filter.
Improper reassembly after cleaning Make sure that the jet block assembly and all tubing are properly installed.
Nozzle not positioned properly in jet block The nozzle must be positioned such that the front of the nozzle housing is in contact with
the front wall of the jet block's nozzle well.
External air currents Make certain that there are no external air currents in the vicinity of the spray fluxer, such
as produced by fans, openings in the wave-soldering machine, etc.
Missing or light flux Jet force setting See Section 5.3.4.
deposition both sides of a
Flux filter Replace.
PCB
Flux obstructing jet block Clean.
Input air pressure Set to 80 psi.
Nozzle power setting See Section 5.3.1.
Jet block assembly position Lower jet assembly; reposition jets.
Fire (used on INTLK_1 or Fire has been detected Turn off system.
INTLK_2, depends on
which used) (option) Flame detector disconnected Reconnect.
Flame detector aimed at high intensity light Redirect detector.
* P/N 02-10016/17, a “break beam” PCB sensor is also available. Please specify if this option is required.
* P/N 02-10016/17, a “break beam” PCB sensor is also available. Please specify if this option is required.
LIMITED WARRANTY
Sono–Tek warranties SonoFlux PCB Fluxing Systems (“Product”) against defects in material and workmanship for a period of 12
months from the date of shipment. The following items are not covered by this warranty:
– conveyor fingers (for models supplied with finger conveyor)
– conveyor drive motor(s) and transport chains (for models supplied with chain/pin or finger conveyor)
– conveyor drive pulleys, sprockets, gearboxes, etc (for models supplied with chain/pin or finger conveyor)