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J. Ain. Ceramin.

Soc., 86 [1] 149-51 (2003)


journal
Two-Layer Crystallization of Amorphous YMnO 3 Thin Films on
Si (100) Substrates
Dong Chul Yoo and Jeong Yong Lee
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology,
Daejeon 305-701, Korea

Ik Soo Kim and Yong Tae Kim


Semiconductor Materials Laboratory, Korea Institute of Science and Technology, Seoul 136-791. Korea

During a rapid thermal annealing process at 850°C in a N2 evaluated using high-resolution X-ray diffraction (HRXRD). The
ambient, an as-deposited amorphous YMInO3 thin film on Si relationship between stress and crystallization in the YMnO 3 thin
(100) substrates was crystallized with two distinct layers. films is discussed.
High-resolution transmission electron microscopy showed a
top layer of c-axis-oriented YMnO3 and a bottom layer of
polycrystalline YMnO_ in the 100-nm-thick YMnO3 thin film. H. Experimental Procedures
The abrupt change of the crystalline orientation from the
c-axis-preferred orientation to the random orientation is YMnO 3 thin films were deposited on p-Si (100) substrates with
caused primarily by high stress induced by the c-axis-oriented radio frequency (rf) sputtering at room temperature using a
YMnOQ, layer. High-resolution X-ray diffraction showed that YMnO_ single target (purity 99.9%) made by mixing Y2 03 and
the c-axis-oriented YMnO 3 /polycrystaliine YMnO3 structure Mn2 03 powders at a ratio of 1:1. During the deposition in Ar + 02
effectively relieved the stress. ambient, the rf-power density and chamber pressure were fixed at
1.85 W/cm2 and 5 X l0-3 torr, respectively. The as-deposited
100-nm-thick YMnO_ films were crystallized by rapid thermal
I. Introduction processing (RTP) in N2 atmosphere at 850°C for 3 min. The

R EcENTLY, ferroelectric thin films have attracted much attention


Rfor use in nondestructive read out (NDRO) ferroelectric
microstructure of the YMnO 3 thin films was characterized by
HRTEM (Model JEM-2000EX, JEOL, Tokyo, Japan) operating at
200 kV. To examine a stress in the YMnO3 /Si, Si (004) rocking
random access memories (FRAM).1- 4 In metal-ferroelectric- curves were measured using HRXRD (Model RINT2000, Rigaku
semiconductor field effect transistor (MFSFET) for FRAM, a high Co., Tokyo, Japan).
dielectric constant in ferroelectric materials decreases an applied
voltage in ferroelectric materials, whereas an applied voltage in a
low dielectric interfacial layer is increased. This causes device mH. Results and Discussion
degradations such as charge injection and a high leakage current.
To resolve these problems, ferroelectric materials with a low Figure I shows a cross-sectional dark-field (DF) TEM micro-
dielectric constant and new buffer layers at the ferroelectric/Si graph of the YMnO 3 /Si, which was observed using a YMnO3
interface have been extensively investigated. 5 6 (0004) diffracted spot. This figure shows that the 100-nm-thick
Among the ferroelectric thin films, YMnO 3 has been proposed YMnO3 thin film is composed of two distinct layers: a top layer of
as a promising ferroelectric material for metal-ferroelectric- a c-axis-oriented YMnO 3 -40 nm thick, which looks bright in the
semiconductor (MFS) structures.7'-' 0 The YMnO3 has a hexagonal (0004) DF image, and a bottom polycrystalline YMnO3 layer -60
structure and a unipolarization direction along [0001]. The YMnO3 nm thick. Figure 1 demonstrates that the YMnO3 thin film has
thin film has low dielectric permittivity (e = 30 at RT), which is been crystallized with the two layers, which have different
a great advantage for a device directly on silicon.' So far, crystallographic orientations.
considerable effort has been focused on the electrical properties, Figure 2 shows an HRTEM micrograph of an interface between
such as memory window and leakage current.'-" However, the c-axis-oriented YMnO3 layer and the polycrystalline YMnO 3
although the crystallization behavior and the crystallized atomic layer. In Fig. 2, the top region shows YMnO, {0002} lattice
structure of the YMnO 3 thin films are important to evaluate and to images with a distance of 0.57 nm. However, the bottom region
improve the electrical properties of, they have not been sufficiently does not show YMnO 3 {000h} lattice images. The YMnO3 {12121
studied. Moreover, there are no studies concerning a relationship plane in the polycrystalline layer is parallel to a {00021 plane in
between stress and crystallization in the YMnO_ thin films. In this the c-axis-oriented layer. This abrupt change of the crystalline
study, the atomic structure of the YMnO_ thin films has been orientation in the YMnO 3 thin film during an RTP annealing is
characterized with high-resolution transmission electron micros- expected to relate to a composition difference or a stress effect
copy (HRTEM), and the stress in the YMnO3 thin films has been between the two layers in the YMnO 3 thin film. To examine the
composition difference between the two layers, energy-dispersive
spectroscopy and auger electron spectroscopy have been used.
However, no composition difference between the two layers was
H. U. Anderson-contributing editor detected. Accordingly, it is expected that this two-layer crystalli-
zation in the YMnO 3 thin film is caused primarily by the stress
effect.
To investigate the stress effect on crystallization of the YMnO 3
Manuscript No. 187305. Received November26, 2001; approved August 23,2002. thin films on silicon, we prepared three YMnO 3 thin films on a Si
This study was supported by the Ministry of Science and Technology through a
Project for National Research Laboratory in Korea and a Collaborative Project for substrate, i.e., as-deposited amorphous YMnO3 , c-axis/amorphous
Excellence in Basic System IC Technology (SYSTEM IC 2010). YMnO3 , and c-axis/polycrystalline YMnO 3 thin films. The c-axis/

149
150 Journalof the American Ceramic Sociery-Yoo and Lee Vol. 86, No. I

Fig. 1. Dark-field TEM micrograph observed using the YMnO3 (0004)


diffracted spot showing the two distinct layers in the YMnO 3 thin film on
Si substrate.

I 0 200
Steps, arcsec
Fig. 3. High-resolution XRD showing the Si (004) rocking curves of
as-deposited, c-axis/amorphous and c-axis/polycrystalline YMnO 3 thin
films on Si (100) substrates.

plane and has low energy. Therefore, at free surface of the film, a
(0001) plane has been preferably crystallized.
Our previous report' 3 demonstrated that purely c-axis-oriented
YMnO3 thin films on silicon substrate were cracked. For a crack
formation, thin film has to have a tensile stress. The thermal
expansion coefficients along the a-axis and c-axis of YMnO3 thin
film and silicon are-18.5 X 10- 6 /SC,3.5 x 10-6/0C,and2.33 X
10-6/IC, respectively.14 Because the thermal expansion coeffi-
cient along the a-axis of YMnO 3 thin film has a negative value,
when the temperature is increased, the c-axis-oriented YMnO 3
layer has high-tensile stress. Therefore, to relieve high-tensile
stress, the crystallization with a c-axis-preferred orientation is
suppressed. and the crystallization with a random orientation is
favorable in the YMnO3 film. Accordingly, the polycrystalline
Fig. 2. High-resolution TEM micrograph showing the interfacial micro- YMnO3 layer is formed under the c-axis-oriented YMnO3 layer, as
structure between the c-axis-oriented YMnO 3 layer and the polycrystalline shown in Fig. 4. With falling temperature, the c-axis-oriented
YMnO3 layer. YMnO3 layer has compressive stress, but it is relieved by the
polycrystalline YMnO 3 layer.

amorphous YMnO 3 thin film is made by a rapid annealing process


at 850°C for -30 s. The stress of polycrystalline thin films on a IV. Conclusion
single-crystal substrate can be evaluated by HRXRD using a
rocking curve of the substrate.' 2 Therefore, Si (004) rocking During the crystallization of an as-deposited amorphous
curves were measured using HRXRD to investigate the stress of YMnO3 thin film on Si (100) substrate at 850°C in N2 ambient, the
the three YMnO 3 thin films. Figure 3 shows Si (004) rocking YMnO3 thin film crystallized with two distinct layers. Transmis-
curves taken from the as-deposited amorphous YMnO3 sample. the sion electron microscopy revealed that the two layers were a
c-axis/amorphous YMnO 3 sample, and the c-axis/polycrystalline c-axis-oriented YMnO3 layer and a polycrystalline YMnO 3 layer.
YMnO 3 sample. The full width at half maximums (FWHMs) of the Moreover, this c-axis/poly-YMnO 3 structure effectively relieved
rocking curve from the as-deposited amorphous YMnO3 sample, the stress, which was confirmed by high-resolution X-ray diffrac-
the c-axis/amorphous YMnO 3 sample, and the c-axis/polycrystal- tion. In this two-layer YMnO 3 structure, the improvement of a
line YMnO3 sample were 17.24, 38.64, and 17.33 arcsec, respec- ferroelectric property, because of the c-axis-oriented layer and the
tively. The FWHM of the c-axis/amorphous YMnO 3 sample was
considerably broader; however, the FWHM of the c-axis/polycrys-
talline YMnO3 sample was nearly the same as that of the
as-deposited sample. This result implies that the c-axis-oriented
YMnO 3 layer induces a high stress, and the c-axis/polycrystalline
YMnO 3 structure effectively reduces the stress. In our previous
work,' 3 stress was more effectively relieved in polycrystalline
YMnO 3 thin films than c-axis-oriented YMnO 3 thin films. Ac-
cordingly, to relieve the high stress of the c-axis-oriented YMnO 3
layer, the polycrystalline YMnO 3 layer was crystallized under the
c-axis-oriented YMnO 3 layer.
Figure 4 shows a schematic diagram of the crystallization
mechanism in the YMnO3 /Si structure. The as-deposited amor-
phous YMnO3 (a-YMnO 3 ) thin film has started to be crystallized
from the surface with a (0001) orientation. Because YMnO 3 has a Fig. 4. Schematic diagram showing the crystallization mechanism of the
hexagonal structure, a (0001) plane of YMnO 3 is a closest packing YMnO 3 thin films on silicon substrates.
January 2003 Two-Layer Crystallization of Amorphous YMnO_ Thin Films on Si (100) Suibstrates 151

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COPYRIGHT INFORMATION

TITLE: Two-Layer Crystallization of Amorphous YMnO3 Thin


Films on Si (100) Substrates
SOURCE: Journal of the American Ceramic Society 86 no1 Ja
2003
PAGE(S): 149-51
WN: 0300102109024

(C) Copyright by the American Ceramic Society. All rights reserved

Copyright 1982-2003 The H.W. Wilson Company. All rights reserved.

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