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Led Street Light
Led Street Light
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2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
temperature distribution is more uniform for the module
with the heat pipe. It is implied that the heat transfer
Solder Fin 1 Fin 2
rate is enhanced by the heat pipes. There is no hotspot
observed near the joint positions between the metal fins
and the heat pipes indicated the welding does not created
a substantial thermal resistance. It is also indicated that
the embedding of the heat pipes does not have significant
effect on the air flow path for natural convection.
Fin 1 Fin 2
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2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
Table 3. The convective heat transfer coefficient of each Table 4. Simulated temperatures (°C) in the LED
heat sink streetlight module
h Module without
Type Region Position Module with HP
W/(m2·°C) HP
Module without Fin center 10 FEM Measured FEM Measured
heat pipe Fin – two sides 15 Solder point 48.1 49.3 58.6 58.4
Fin - center 3 HP-middle 47.2 45.6 - -
Module with heat
pipe HP-end 41.0 40.5 - -
Fin – two sides 8
Fin1 41.8 45.7 50.1 48.1
Fin2 39.2 40.4 41.0 40.0
Fin
(a) (b)
Figure 7. 3D model of LED streetlight module without Figure 9. Simulated temperature distribution of LED
heat pipe (left) and with heat pipes (right). streetlight module without heat pipe.
Side
Center
Side
Center
Side
Figure 8. Meshing of the 3D model of LED streetlight
module without heat pipe (left) and with heat pipes (right).
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2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
pipes having the lowest Tsolder than the module without
heat pipe. The Tsolder difference is up to over 20 oC at
the input power of 70W. In order to improve the thermal
performance, heat sink made of high thermal conductivity
material is usually considered. A module that with the
structure identical to the one without heat pipe but made
of copper was simulated as a comparison. Although the
thermal performance can be improved by using copper
module, the module with heat pipe still has lowest Tsolder.
With 80W of input power, the Tsolder difference between
the two is about 12 oC. The module with heat pipes is
capable to handle higher energy density light source
compared to module without heat pipe.
5. Conclusions
The thermal performance of streetlight modules with
and without heat pipe was investigated. The
improvement of the heat dissipation with the heat pipe is
significant. The thermal resistance of the module with
the heat pipes is reduced by over 50% compared with the
module without heat pipe. Temperature distribution is
more uniform with the heat pipe module. The heat
dissipation capability of different module design was
analyzed using finite element model. The module with
heat pipe is capable for light source of about 90W. The
Figure 11. The solder point temperature of LED heat dissipation capability of the heat pipe module is even
streetlight module under different input power. is the better than a module made of copper. The solder joint
measurement result of module with heat pipe; is the temperature can be more than 20 oC lower under 70W of
measurement result of module without heat pipe. power input with the heat pipe module compared to the
module without heat pipe. The lowering of the
The lumen maintenance of the streetlight module is temperature is expected to improve the lumen
dependent on the junction temperature of the LED die. maintenance and extend the useful life of the streetlight
A L70 lifetime of a commercial LED light source was module by over 30%. The proposed streetlight module
taken as an example (Figure 12). A decrease of 20 oC with heat pipe is a promising solution for the demanding
from 80 oC to 60 oC, the product life is increased from of the high power LED light source.
105000 hours to 140000 hours (T air=45 oC). It is
corresponding to 8 years extension of useful life. While
Acknowledgments
the cost of the module with heat pipes is expected to be
increase, the added cost could be amortized through the This work is supported by the Sino-German cooperation
extended life time and achieve a competitive total cost of project, LED beyond conventional lighting: Off grid
ownership. application. Authors would like to thank Huaiyu Ye and
Bo Sun from Delft University of Technology for the
technical advises. The first author would also like to
thanks to Lei Zhong for the assistance on thermal
measurement.
References
[1] Ji Li, Feng Lin, Daming Wang, Wenkai Tian, “A
loop-heat-pipe heat sink with parallel condensers for
high-power integrated LED chips,” Applied Thermal
Engineering, 56 (2013) 18-26.
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2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
[2] Xiang-you Lu, Tse-Chao Hua, Mei-jing Liu, Yuan-
xia Cheng, “Thermal analysis of loop HP used for
high-power LED,” Thermochimica Acta, 493 (2009)
25-29
[3] HP reliability documentation, November 10, 1999.
Thermacore,Inc.
[4] Lijiang Bai. “The FEM Analysis of a Heat Pipe,”
Master thesis: Beijing University of Technology,
2004.
[5] Hui Huang Cheng, De-Shau Huang Ming-Tzer Lin,
“Heat dissipation design and analysis of high power
LED array using the finite element method,”
Microelectronics Reliability, 52 (2012) 905-911.
[6] Jifi Jakovenko, Robert Werkhoven, et al. “Thermal
simulation and validation of 8W LED Luminaire,”
Proc 12th EuroSimE, Linz, April. 2011
[7] J. P. Holman (2009). Heat Transfer. Singapore:
McGraw Hill.
[8] Huaiyu Ye, Bo Li, Hongyu Tang, Jia Zhao, Cadmus
Yuan, Guoqi Zhang, “Design of vertical fin arrays
with heat pipes used for high-power light-emitting
diodes,” Microelectronics Reliability, submitted.
[9] “XLamp X-RE Lighting-Class Lumen Maintenance,”
2009, Cree Inc.
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2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014