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SPP11N60C3, SPB11N60C3 SPI11N60C3, SPA11N60C3 Cool MOS™ Power Transistor
SPP11N60C3, SPB11N60C3 SPI11N60C3, SPA11N60C3 Cool MOS™ Power Transistor
SPI11N60C3, SPA11N60C3
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope dv/dt 50 V/ns
VDS = 480 V, ID = 11 A, Tj = 125 °C
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case RthJC - - 1 K/W
Thermal resistance, junction - case, FullPAK RthJC_FP - - 3.8
Thermal resistance, junction - ambient, leaded RthJA - - 62
Thermal resistance, junction - ambient, FullPAK RthJA_FP - - 80
SMD version, device on PCB: RthJA
@ min. footprint - - 62
@ 6 cm 2 cooling area 3) - 35 -
Soldering temperature, Tsold - - 260 °C
1.6 mm (0.063 in.) from case for 10s 4)
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Transconductance gfs VDS≥2*ID*R DS(on)max, - 8.3 - S
ID=7A
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Inverse diode continuous IS TC=25°C - - 11 A
forward current
Inverse diode direct current, I SM - - 33
pulsed
Inverse diode forward voltage VSD VGS =0V, IF=IS - 1 1.2 V
Reverse recovery time t rr VR =480V, IF =IS , - 400 600 ns
Reverse recovery charge Q rr diF/dt=100A/µs - 6 - µC
Peak reverse recovery current I rrm - 41 - A
Peak rate of fall of reverse dirr /dt Tj=25°C - 1200 - A/µs
recovery current
Tj E xternal H eatsink
R th1 R th,n T case
P tot (t)
T am b
SPP11N60C3
140 35
W
W
120
110
100 25
Ptot
Ptot
90
80 20
70
60 15
50
40 10
30
20 5
10
0 0
0 20 40 60 80 100 120 °C 160 0 20 40 60 80 100 120 °C 160
TC TC
A A
10 1 10 1
ID
ID
10 0 10 0
tp = 0.001 ms
tp = 0.001 ms tp = 0.01 ms
tp = 0.01 ms tp = 0.1 ms
10 -1 tp = 0.1 ms 10 -1 tp = 1 ms
tp = 1 ms tp = 10 ms
DC DC
10 -2 0 1 2 3
10 -2 0 1 2 3
10 10 10 V 10 10 10 10 V 10
VDS VDS
10 0 10 0
ZthJC
ZthJC
10 -1 10 -1
D = 0.5
D = 0.2
D = 0.5 D = 0.1
10 -2 D = 0.2 10 -2 D = 0.05
D = 0.1 D = 0.02
D = 0.05 D = 0.01
D = 0.02 single pulse
10 -3 D = 0.01 10 -3
single pulse
10 -4 -7 -6 -5 -4 -3 -1
10 -4 -7 -6 -5 -4 -3 -2 -1 1
10 10 10 10 10 s 10 10 10 10 10 10 10 10 s 10
tp tp
14
ID
6,5V
ID
24
5.5V
12
20
6V 10
16 5V
8
12 5,5V
6
4.5V
8
5V 4
4V
4 4,5V 2
0 0
0 3 6 9 12 15 18 21 V 27 0 5 10 15 V 25
VDS VDS
1.6 1.6
RDS(on)
RDS(on)
1.4
1.4
1.2
1.2
1
1 0.8
0.6
0.8 98%
0.4 typ
6.5V
0.6 8V
20V 0.2
0.4 0
0 2 4 6 8 10 12 14 16 A 20 -60 -20 20 60 100 °C 180
ID Tj
32
12
28
0,2 VDS max
VGS
ID
20 8
16
6
12
4
8
2
4
0 0
0 2 4 6 8 10 12 V 15 0 10 20 30 40 50 nC 70
VGS QGate
55 td(off)
50
10 1
45
IF
t
40
35
30
10 0 25
Tj = 25 °C typ 20 tf
Tj = 150 °C typ 15 td(on)
Tj = 25 °C (98%)
10
Tj = 150 °C (98%)
5 tr
-1
10 0
0 0.4 0.8 1.2 1.6 2 2.4 V 3 0 2 4 6 8 A 12
VSD ID
ns
A/µs
250
2000
di/dt
t
200
td(off) 1500
td(on)
150 tr
tf
1000
100
di/dt(off)
500
50 di/dt(on)
0 0
0 10 20 30 40 50 Ω 70 0 20 40 60 80 Ω 120
RG RG
110
0.03
100
dv/dt
90 0.025
E
80
0.02
70
60 0.015
50
Eon*
0.01
40 dv/dt(on)
30
0.005
20 Eoff
10 0
0 10 20 30 40 50 Ω 70 0 2 4 6 8 A 12
RG ID
8
0.16 Eoff
IAR
7
E
6
0.12
5 T j(START)=25°C
4
0.08
3 T j(START)=125°C
Eon*
0.04 2
0 0 -3 -2 -1 0 1 2 4
0 10 20 30 40 50 Ω 70 10 10 10 10 10 10 µs 10
RG tAR
V
mJ
680
V(BR)DSS
250
660
EAS
200
640
150 620
600
100
580
50
560
0 540
20 40 60 80 100 120 °C 160 -60 -20 20 60 100 °C 180
Tj Tj
pF
W Ciss
10 3
P AR
200
C
150 10 2
Coss
100
10 1 Crss
50
0 4 5 6
10 0
10 10 Hz 10 0 100 200 300 400 V 600
f VDS
7.5
µJ
6
5.5
Eoss
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0 100 200 300 400 V 600
VDS
P-TO-220-3-1
B
10 ±0.4 4.44
A
3.7 ±0.2 2.8 ±0.2 1.27±0.13
15.38 ±0.6
0.05
9.98 ±0.48
13.5 ±0.5
5.23 ±0.9
0.5 ±0.1
3x
0.75 ±0.1 2.51±0.2
1.17 ±0.22
2x 2.54
0.25 M A B C
P-TO-263-3-2 (D2-PAK)
P-TO-262-3-1 (I2-PAK)
10 ±0.2
A B
0...0.3 4.4
1)
8.5 1 ±0.3 1.27
0.05
1)
9.25 ±0.2
11.6 ±0.3
7.55
2.4
13.5 ±0.5
4.55 ±0.2
1)
Typical
Metal surface min. X = 7.25, Y = 6.9
All metal surfaces tin plated, except area of cut.
P-TO-220-3-31 (FullPAK)
P-TO220-3-31 dimensions
symbol [mm] [inch]
min max min max
A 10.37 10.63 0.4084 0.4184
B 15.86 16.12 0.6245 0.6345
C 0.65 0.78 0.0256 0.0306
D 2.95 typ. 0.1160 typ.
E 3.15 3.25 0.124 0.128
F 6.05 6.56 0.2384 0.2584
G 13.47 13.73 0.5304 0.5404
H 3.18 3.43 0.125 0.135
K 0.45 0.63 0.0177 0.0247
L 1.23 1.36 0.0484 0.0534
M 2.54 typ. 0.100 typ.
N 4.57 4.83 0.1800 0.1900
P 2.57 2.83 0.1013 0.1113
T 2.51 2.62 0.0990 0.1030
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Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
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