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Example - Extended Abstract
CONCLUSION
As a conclusion, approximately 60 microns thickness of
Cu-Sn-Zn alloy was successfully deposited on a copper
substrate. An average coating composition of 55 – 60wt%
of copper, 25 – 30wt% of tin and 10 – 12 wt% of zinc was
able to be obtained. Cauliflower appearance was detected
under SEM analysis where the morphology became
rougher with the increment of the current density
ACKNOWLEDGMENTS
Figure 1: Weight of Cu-Sn-Zn vs current density A gratefully acknowledge to Universiti Sains Malaysia and
Malaysian Chamber of Mines for granting the research,
Instead of Cu-Sn-Zn presence, some samples portrayed a and also for the support provided by Kolej Universiti
small percentage existence of carbon. This impurity was Teknologi Tun Hussien Onn
originated from the graphite anodes.
REFERENCES
SEM Analysis Picincu L., Pletcher D. & Smith A., (2001).
Under the SEM investigation in Figure 2(a)-(d), all Electrochemistry of the SUCOPLATE®
electroplated samples portrayed the infamous Electroplating Bath for the Deposition of a Cu-Zn-Sn
‘cauliflower’ morphology. The cauliflower Alloy, Part I: Commercial Bath, J. App.
appearance looks rougher and bigger when Electrochem., , 387-394,
the current density increases. The presence of Helton, R.L., Trobough, D.W. & McPherson, M., (1985).
porosity was also noticed for each current density applied. Bath composition and method for copper-tin-zinc
This was due to the release of hydrogen gas at the cathode alloy electroplating, US Pat. 4496438,
during electroplating even though a continuous stirring He, X., Chen, B., Hu, G., Deng, L., Zhou, N. & Tian, W.,
suppose to prevent such condition. Hence, it will also (2006). Process of electroless plating Cu-Sn-Zn
result in a less homogen and less adorable surface finish. ternary alloy, Trans Nonferrous Met. Soc. China, ,
16(1): 223-228