“STUDY AND DESIGN OF PORTABLE COOLING SYSTEM

USING PELTIER EFFECT”

A SYNOPSIS
Submitted to
Rajiv Gandhi Proudyogiki Vishwavidhyalaya, Bhopal (M.P.)
In partial fulfillment of the degree of
Bachelor of Engineering
In
Electronics & Instrumentation
Engineering

Submitted By: Guided By:

Ayush Pandya Mrs. Neha Maheshwari
Suraj Sheokand
Vaibhav Gupta

Department of Electronics Engineering

Shri VaishnavSM Institute of Technology and Science, Indore-453111 (M.P.)
India
 RECOMMENDATION
This Major Project entitled “STUDY AND DESIGN OF PORTABLE COLLING SYSTEM USING
PELTIER EFFECT” is submitted by Ayush Pandya, Suraj Sheokand and Vaibhav Gupta for the
partial fulfillment of the requirement for the award of the degree of Bachelor of Engineering in
Electronics & Instrumentation Engineering, is an original record under guidance of Rohit
kanthaliya. The matter embodied in this report has not been submitted anywhere for the award
of any degree.
It is recommended that the above statement made by the students is correct to the best of our
knowledge and belief.

Mr. Rohit kanthaliya Mrs. Neha Maheshwari Dr. Namit Gupta

Project Guide Project Coordinator HOD
Department of Department of Electronics & Instrumentation
Electronics & Instrumentation Electronics & Department
Engineering Instrumentation SVITS, Indore
Engineering

i
 Shri Vaishnav Institute of Technology and Science, Indore
(Rajiv Gandhi ProudyogikiVishwavidyalaya, Bhopal M.P.)

(2018-2019)
CERTIFICATE

This is to certify that Ayush Pandya, Suraj Sheokand and Vaibhav Gupta of
Eighth semester final year B.E. (Electronics & Instrumentation Engineering) have
carried out the minor project entitled “STUDY AND DESIGN OF PORTABLE
COLLING SYSTEM USING PELTIER EFFECT”. It is being submitted for fulfillment of
partial requirement for the award of Bachelor of Engineering degree to the Rajiv
Gandhi Proudyogiki Vishwavidyalaya (RGPV) Bhopal.

ii
 Shri Vaishnav Institute of Technology and Science, Indore
(Rajiv Gandhi ProudyogikiVishwavidyalaya, Bhopal M.P.)

Department of Electronics Engineering

Session - 2018-2019
APPROVAL
This is to certify that the project report entitle “STUDY AND DESIGN OF
PORTABLE COLLING SYSTEM USING PELTIER EFFECT” being submitted Ayush
Pandya, Suraj Sheokand and Vaibhav Gupta is approved for the Bachelor of
Engineering in Electronics & Instrumentation Engineering at Shri Vaishnav Institute
of Technology and Science, Indore

Internal Examiner External Examiner

Name: - Name:-

Signature: - Signature:-

Date: - Date:-

Department of Electronics Engineering Shri Vaishnav Institute of Technology and

Science, Indore (M.P.), Session 2018-19

iii
 ACKNOWLEDGEMENT
With great pleasure and sense of obligation we also express our heartily gratitude to Mrs. Neha
Maheshwari our project guide. We are highly indebted for his invaluable guidance and support
in successfully completing this project in stipulated time. His persisting encouragement,
perpetual motivation, everlasting patience and excellent expertise in discussions, during
progress of project work, has benefited us in extent, which is far beyond expressions.
We are also grateful to Dr. Namit Gupta, Head of Mechanical Engineering Department, Dr. Namit
Gupta, Director, Shri Vaishnav Institute of Technology and Science, Indore for their support in our
project work.

Our sincere appreciation also goes to all our colleagues and friends who have provided
assistance at various occasions.

Ayush pandya (0802EI151006)

Suraj Sheokand (0802EI151107)
Vaibhav Gupta (0802ME151111)
E.I. 8th SEM
(Electronics & Instrumentation Engineering)

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Contents
Contentsi-ii
List of Abbreviations iii
List of Figuresiv
Abstract v

1. INTRODUCTION……………………………………………………………………………………1-7
1.1 Introduction………………………………………………………………………………………….………..1
1.1.1 Refrigeration………………………………………………………………………………………….1
1.1.2 Cyclic Refrigeration………………………………………………………………………………..2
1.2 Problem Discussion……………………………………………………………………………..…………..3
1.2.1 Refrigeration Cycle on Environment…………………………………..………………….3
1.2.2 On Global Warming……………………………………………………………………………….4
1.3 Objective of Research………………………………………………………………………………..……4
1.4 Basic Theory of Peltier Device.………………………………………………………………………….4
1.4.1 Thermo Electric cooling………………………………………………………….………………5
1.4.2 Basic Structure……………………………………………………………………………………….6
1.4.3 Semiconductor……………………………………………………………………………………….6

2. LITERATURE REVIEW………………………………………………………………………...8-10
2.1 Research paper ………………………………………………………………………………………………8
2.2 Proposed Solution……………………………………………………………………………………………9
2.3 Technology Used………………………………………………………………………………………….…10

3. RESEARCH METHODOLOGY………………………………………………………………11-20
3.1 Flowchart…………………………………………………………………………………………..……….11
3.2 Material Review………………………………………………………………………………………....16
3.2.1 Thermoelectric Module……………………………………………………………………..17
3.2.2 Refrigeration Chamber ……………………………………………………………………..18
3.2.3 Battery…………………………………………………………………………………….…….….18
3.2.4 Heat Sink And Fan………………………………………………………………………………19
3.2.5 Thermostat………………………………………………………………………………………..20
3.2.6 Temperature Control Switch.................................................................21

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4. RESULT AND DISCUSSION………………………………………………………………22-24
4.1 Observation……………………………………………………………………………………………….22
4.2 Features of peltier module……………………………………………………………….……….23
4.3 Limitations………………………………………………………………………………………………..24

5. CONCLUSION AND FUTURE SCOPE………………………………………………..25

5.1 Conclusion…………………………………………………………………………………………………25
5.2 Future Scope …………………………………………………………………………………….……...25

REFRENCES………………………………………………………………………………….….26-27

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 LIST OF ABBREVIATIONS

TEM Thermoelectric Module

PE Peltier Effect
CFC Chlorofluoro Carbon
HFC Hydrofluoro Carbon
HCHC Hydro ChlorofluoroCarbon
TEC Thermoelectric Cooling
CCD Charged Coupled Devices
TTPC Two Staged Peltier Couples
COP Coefficient of Performance
EMF Electromotive Force

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 LIST OF FIGURES

Figure no. Title Page no.

1 Thermoelectric Module 5
2 Process of heat flow in Peltier Device 6
3 Working of Semiconductor 7
4 Working of Peltier Device 10
5 Peltier Effect 13
6 Fabrication of peltier module 14
7 Working of peltier effect 18
8 Working 20
9 Refrigeration box 21
10 Adapter 21
11 Heat sink 22
12 Fan 22
13 Thermostat 23
14 Final setup 25

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 ABSTRACT
In present day scenario, when everyone is concerned about melting of glaciers and ozone layer
depletion, it is important to do something which helps in overcoming this problem. Many types
of refrigerator are made using refrigerant which to an extent affect our environment. The
problem occurs about the shape of refrigerators, refrigeration system with absorption system is
heavy and bulky. This leads our project to thermoelectric cooling using concept of Peltier effect.
With reference to various research papers published in various scientific journals it has been
evident that a lot of work is done in field of thermoelectric cooling while some of the research
papers and books depicts that the efficiency of this thermoelectric refrigeration system is not
more. To increase the effect of this thermoelectric cooling refrigeration system a Peltier
junction is used with fin and a forced convection process to increase the heat dissipation from
the outsource of Peltier junction. The total arrangement is studied, fabricated and analyzed.
The result we would obtain will show that this refrigeration system is useful in journey period,
carrying medicines and making the temperature of the food stuff stable at what they were
kept. Without any harm to our environment.

1
 CHAPTER-1
INTRODUCTION

1.1 Introduction
Conventional cooling systems such as those used in refrigerators utilize a compressor and a
working fluid to transfer heat. Thermal energy is absorbed and released as the working Fluid
undergoes expansion and compression and changes phase from liquid to vapour and back,
respectively. Semiconductor thermoelectric coolers (also known as Peltier coolers) offer
several advantages over conventional systems. They are entirely solid-state devices, with no
moving parts; this makes them rugged, reliable, and quiet. They use no ozone depleting
chlorofluorocarbons, potentially offering a more environmentally responsible alternative to
conventional refrigeration. They can be extremely compact, much more so than
compressor-based systems. Precise temperature control (< ± 0.1 °C) can be achieved with
Peltier coolers. However, their efficiency is low compared to conventional refrigerators.
Thus, they are used in niche applications where their unique advantages outweigh their low
efficiency. Although some largescale applications have been considered (on submarines and
surface vessels), Peltier coolers are generally used in applications where small size is needed
and the cooling demands are not too great, such as for cooling electronic components.

1.1.1 Refrigeration
Refrigeration is a process of removing heat from a low-temperature reservoir and
transferring it to a high-temperature reservoir. The work of heat transfer is traditionally
driven by mechanical means, but can also be driven by heat, magnetism, electricity, or
other means.
Refrigeration has many applications, including, but not limited to: household refrigerators,
industrial freezers, and air conditioning. Heat pumps may use the heat output of the
refrigeration process, and also may be designed to be reversible, but are otherwise similar
to air conditioning units.

1.1.2 Cyclic refrigeration

This consists of a refrigeration cycle, where heat is removed from a low-temperature space
or source and rejected to a high-temperature sink with the help of external work, and its
inverse, the thermodynamic power cycle.

2
A refrigeration cycle describes the changes that take place in the refrigerant as it alternately
absorbs and rejects heat as it circulates through a refrigerator.
Heat naturally flows from hot to cold. Work is applied to cool a living space or storage
volume by pumping heat from a lower temperature heat source into a higher temperature
heat sink. Insulation is used to reduce the work and energy required to achieve and maintain
a lower temperature in the cooled space. The operating principle of the refrigeration cycle
was described mathematically by Sadi Carnot in 1824 as a heat engine.

The most common types of refrigeration systems use the reverse-Rankine vapor-
compression refrigeration cycle although absorption heat pumps are used in a minority of
applications.

Cyclic refrigeration can be classified as:

 Vapour cycle
 Gas cycle

Vapour cycle refrigeration can further be classified as:

 Vapour compression refrigeration

 Vapour absorption refrigeration

1.2 Problem Discussion

1.2.1 Refrigeration cycle on environment
On the stratospheric ozone layer More than 90% of refrigeration equipment relies on vapour
compression using refrigerants and this figure will not change in the near future: other
technologies do not generally have enough efficiency. Chlorinated refrigerants
(chlorofluorocarbons – CFCs, and to a lesser extent, hydro chlorofluorocarbons - HCFCs)
contribute to the depletion of stratospheric ozone if released into the atmosphere due to
equipment leaks or if refrigerants are not properly recovered when disposal of the
equipment takes place. CFCs and HCFCs are gradually being phased out thanks to the
Montreal Protocol. Current measurements of the ozone layer show overall stability and
probable recovery to the previous level around 2060. They are often replaced by hydro
fluorocarbons (HFCs) which do not deplete the ozone layer but are potent greenhouse gases,
as are HCFCs, when released into the atmosphere. CFCs were also greenhouse gases and

3
 their global warming potential was much higher. The impact of the Montreal Protocol is thus
also positive regarding global warming. However, it is not enough.

1.2.2 On global warming

Refrigeration and air conditioning have an impact on global warming in three ways:Release
into the atmosphere of CFCs, HCFCs and HFCs. The contribution of these refrigerants
represents between 1-2% of greenhouse gas emissions. It has been reduced considerably
since 1987 (signature of the Montreal Protocol)
The effect of these gases is very harmful hence a new alternative is required to compensate
the process. The refrigeration due to peltier effect can replace the current technique and no
gases at all are used hence no effects are caused on the environment.

1.3 Objective of Research

The overall short-term aim was to develop a small, inexpensive and compact cooler box. This
can be further explained as: -
 To make a portable refrigeration which could be taken from one place to another.
 To make environment friendly refrigeration system.
 To investigate the cost and effectiveness of the design or TEC module.
 To study the results coming out from this project.
 To compare results with theoretical result.
 To look at commercially available 12V DC cooler boxes.
 To construct a test on the behavior and specifications of a TEC heat exchanger
operating in a cooler box environment.

1.4 Basic theory of Peltier device

Early 19th century scientists, Thomas Seebeck and Jean Peltier, first discovered thephenomena
that are the basis for today’s thermoelectric industry. Seebeck found that if you placed a
temperature gradient across the junctions of two dissimilar conductors, electrical current
would flow. Peltier, on the other hand, learned that passing current through two dissimilar
electrical conductors, caused heat to be either emitted or absorbed at the junction of the
materials. It was only after mid-20th Century advancements in semiconductor technology,
however, that practical applications for thermoelectric devices became feasible. With modern
techniques, we can now produce thermoelectric “modules” that deliver efficient solid-state
heat-pumping for both cooling and heating; many of these units can also be used to generate
DC power at reduced efficiency. New and often elegant uses for thermoelectric continue to be
developed each day.
4
A typical thermoelectric module consists of an array of Bismuth Telluride semiconductor pellets
that have been “doped” so that one type of charge carrier– either positive or negative– carries
the majority of current. The pairs of P/N pellets are configured so that they are connected
electrically in series, but thermally in parallel. Metalized ceramic substrates provide the
platform for the pellets and the small conductive tabs that connect them.
When DC voltage is applied to the module, the positive and negative charge carriers in the
pellet array absorb heat energy from one substrate surface and release it to the substrate at
the opposite side. The surface where heat energy is absorbed becomes cold; the opposite
surface where heat energy is released, becomes hot. Reversing the polarity will result in
reversed hot and cold sides.

Fig 1 -Thermoelectric Module

1.4.1 Thermoelectric Cooling

A thermoelectric cooling system typically employs a matrix of semiconductor pellets

sandwiched in between two large electrodes. When a DC voltage source is connected between
the electrodes, the negatively-charged side becomes cooler while the positively-charged side
becomes warmer. The negative electrode is placed in contact with the component, device or
medium to be cooled, while the positive electrode is connected to a heat sink that radiates or
dissipates thermal energy into the external environment Thermoelectric cooling is used in
electronic systems and computers to cool sensitive components such as power amplifiers and
microprocessors. In general, thermoelectric cooling is less efficient than compressor-based
refrigeration. However, in situations where thermal energy must be transferred away from a
solid or liquid on a small scale, a thermoelectric cooling may be more practical and cost-
5
effective than a conventional refrigeration system. Other advantages of the thermoelectric
cooling include the absence of moving mechanical parts, physical ruggedness, portability, long
operating life and minimal maintenance requirements.

1.4.2 Basic Structure

When a p type semiconductor is used instead, the holes move in a direction opposite the
current flow. The heat is also transported in a direction opposite the current flow and in
direction of the holes. Essentially the charge carriers dictate the direction of flow.

Fig 2 - Process of heat flow in Peltier Device

1.4.3 Semiconductor
A semiconductor material has an electrical conductivity value falling between that of
a conductor, like copper, gold, etc. and an insulator, such as glass. Their resistance decreases as
their temperature increases, which is behavior opposite to that of a metal. Their conducting
properties may be altered in useful ways by the deliberate, controlled introduction of
impurities ("doping") into the crystal structure. Where two differently-doped regions exist in
the same crystal, a semiconductor junction is which include electrons, ions and electron
holes at these junctions is the basis of diodes, transistors and all modern electronics.

6
 Fig 3 - Working of Semiconductor

N type semiconductor
An N-Type semiconductor is created by adding pentavalent impurities
like phosphorus (P), arsenic (As), antimony (Sb), or bismuth (Bi). A pentavalent impurity is called
a donor because it is ready to give a free electron to a semiconductor. The impurities are called
dopants. The purpose of doing this is to make more charge carriers, or electron wires available
in the material for conduction. In n-type semiconductors the number of electrons is more than
the holes, so electrons are measured as majority charge carriers and holes are referred to as
minority charge carriers.
N-Type semiconductors are manufactured by doping 'intrinsic' or pure semiconductor material.
The amount of impurity added is very small compared to the amount of semiconductor. The
characteristics and nature of the resultant semiconductor can be controlled by controlling the
quantity of the dopant.

P type Semiconductor
As opposed to a n type semiconductor have a large hole concentration than electron
concentration. The term p type refers to the positive charge of the hole. In p type
semiconductor holes are majority charge carriers and electrons are minority charge carriers. P
type semiconductors are created by doping an intrinsic semiconductor with acceptor
impurities. A common p type do pant for silicon is boron. For p type semiconductor the Fermi
level is below the intrinsic Fermi level and lies closer to the valence bend than the conduction
band.

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 CHAPTER-2
LITERATURE REVIEW
Some research papers published on this project are

 Use of Advanced computational model for Peltier effect based on

refrigeration
Research done on this topic by A. Martinez, D.Astrain, A. Rodriguez and P. Aranguren in
Mechanic , Energy and mineral , Engineering Department Spain which was received on 6 August
2015
Computational models emerge as essential tools in the challenge of developing competitive
thermoelectric refrigerators for the domestic sector.
This paper presents a computational model for thermoelectric refrigerators that simulates the
entire system under transient state, including the thermoelectric modules, heat exchangers,
insulated compartments, and hot and cold reservoirs. Also, temperature-dependent Peltier,
Seebeck, Thomson and Joule effects are implemented. A prototype of a thermoelectric
refrigerator has been built and tested to conduct the verification and validation of the
computational model. The most important outputs are predicted with deviations lower than
±10%. The effect on the outputs of temperature-independent properties has been assessed.
Results indicate that deviations are up to twice as high as those obtained for temperature-
dependent properties, so these simplifications are invalid in the simulation of thermoelectric
refrigerators under real operation.

Benefits
 Outperforms any other simulation of thermoelectric refrigerators.
 Transient state with temperature-dependent Seebeck, Peltier, Joule and
Thomson.

 Construction and testing of a prototype for model validation and verification.

 ±10 % of maximum deviation from experimental values of the main outputs.

8
Optimization of a trapezoid type two stage Peltier couples for thermoelectric cooling
applications.
Research done on the above topic by Shunin Lin Jialin Yu at department of Refrigeration and
Cryogenic Engineering School of Energy and Power Engineering , Xi’an Jiaotang University .
Xi’an 710049 , China which was received on 8-10-2015.

This paper aims to present a trapezoid-type two-stage Peltier couples (TTPC) for applications in
two-stage thermoelectric cooling. By using the TTPC units without intermediate ceramic plates,
the TTPC based thermoelectric module may reduce the interstage thermal resistance that could
provide better performance. For the TTPC, optimum configuration analyses are performed
using developed mathematical model. The simulation result indicates that the Peltier couple leg
length allocation ratio between the cold stage and hot stage as well as the shape ratio of
trapezoid-type Peltier couple leg at hot stage affect the maximum cooling capacity and
coefficient of performance (COP) of TTPC. Moreover, there is an optimum configuration of the
TTPC to achieve the optimal maximum cooling capacity and COP at given geometry parameters
and operating conditions. The results obtained here may provide some guides for the optimal
design and operation of practical the TTPC based thermoelectric module.

Benefits
 A trapezoid type semiconductor two stage peltier couple for thermoelectric cooling is
presented
 Optimum configuration results in maximum capacity and maximum COP
 Comparison of TTPC and STCU reveals the performance advantage of TTPC.

9
2.1 Solution
We know that there have been various problems due to usage of the conventional refrigerator
and the refrigeration system is the pollution and other natural hazard taking place due to these
old form of refrigeration systems.
The solution of this problem is the adaptation of the thermoelectric module for ecofriendly
refrigeration system. The peltier effect is used for refrigeration using thermoelectric module.
The refrigeration should be transformed as per the future aspects and the utilization of the
resources should be minimized and the pollution should be controlled as it will affect the future
generation ahead. Therefore, the only solution that should be adopted is the use of peltier for
refrigeration using thermoelectric module.

2.2 Technology Used

The technology used in this thermoelectric module is the diffusion of the semiconductors
element an junction of p n and n p. DC current flows through tem causing heat to the
transferred from one side of tec to the other, creation a cold and hot side. The p type
semiconductor is doped with certain atoms that have lesser electrons than necessary to
complete the electronic bond within the crystal lattice. Current is flown as per the holes and
electrons at different region of the semiconductor and with the phenomenon of peltier effect
and seebeck effect the ceramic part of the peltier module is heated with a heat exchanger and
refrigeration is with all this phenomenon.

Fig 4 - Working of Peltier Device

10
 CHAPTER-3
RESEARCH METHODOLOGY

3.1 FLOW CHART

• Data of all the components used in terms of quantity , price per

Data piece and total cost .
collection

• Evaluation of the processes involved (Peltier effect and Seebeck

effect)
Data analysis

• Steps involved in the construction of the Refrigerator

Acquiring and
Assembling

• Results obtained through the process of Peltier effect.

Final result

11
3.1.1 Data collection

Serial no. Name of Price per No. of Total cost

component piece components
1 Peltier module 900 1 900
2 Heat sink + fan 3100 1 3100
3 Adapter 1 1000 1 1000
4 Adapter 2 200 1 200
5 Thermo glue 250 1 250
6 Thermocol box 100 1 100
7 Thermostat 100 1 100
8 Aluminium foil 100 1 100

3.1.2 Data Analysis

THERMOELECTRIC COOLING

In Thermo-electrical refrigeration system, the Peltier effect is the phenomenon of to create a

heat flux between the junctions of two different types of materials. A Peltier heater, cooler or
thermoelectric heat pump is a solid-state active heat pump, which convert heat from one side
of the device to the other, with consumption of electrical energy, depending on the direction of
the current. Such an instrument is also called a Peltier device, Peltier heat pump, solid state
refrigerator, or thermoelectric cooler (TEC). Thermoelectric cooling uses the Peltier effect to
create a heat flux between the junctions of two different types of materials. They can be used
either for heating or for cooling (refrigeration), although in practice the main application is
cooling. It can also be used as a temperature controller that either heats or cools. This
technology is far less commonly applied to refrigeration thanvapourcompressionrefrigeration.
The main advantages of a Peltier cooler are its lack of moving parts orcirculatingliquid, near-
infinite life and potential to avoid leaks, and its small size and flexible shape. Its
maindisadvantageis high cost and poor power efficiency. Many researchers and companies are
trying to develop Peltier coolers that are both cheap and efficient
12
PELTIER EFFECT

A Peltier cooler can also be used as a thermoelectric generator. When operated as a cooler, a
voltage is applied across the device, and as a result, a difference in temperature will build up
between the two sides.

Fig. 5 - Peltier effect

When operated as a generator, one side of the device is heated to a temperature greater than
the other side, and as a result, a difference in voltage will build up between the two sides.

SEEBECK EFFECT

When the two junctions of a pair of dissimilar metals are maintained at different temperatures,
there is the generation of emf (electromotive force).He conducted a series of tests by varying
the temperatures of the junctions of various combinations of a set of materials. The emf output
was found to be:ΔE α ΔT……………………………... (1)
Where ΔE and ΔT the emf output and the temperature difference of the junctions. The
phenomenon of generation of emf is called Seebeck effect the proportionality constant ofEq.1is
denoted byαab = ΔE / ΔT………………………. (2)
and is called Seebeck coefficient or the thermo electric power. It is to be noted that αab(αa-αb)
is the coefficient for a pair of different metals (A and B or P and N or p and n).

13
Fabrication of Peltier cooler

As we have seen, for producing thermoelectric effect couples of P and N type semiconductors
are connected in series by metal plates. By doing this it absorbs
the heat from one side and releases the heat to another side.
So, when solid state P-N materials are connected electrically in series and thermally in
parallel it makes one thermoelectric unit as shown in Figure.

Fig 6 - Fabrication of peltier module

A typical TEC module comprises of two highly thermally conductive substrates (A1 2O3,
AlN, BeO) that serve as Hot/Cold plates. An array of p-type and n-type semiconductor
(Bi2Te3, Sb2Te3, Bi2Se3, PbTe, Si-Ge) pellets are connected electrically in series sandwiched
between the substrates. The device is normally attached to the cold side of the TEC module,
and a heat sink which is required for enhanced heat dissipation is attached to the hot side.
Solder is normally used to connect the TEC elements onto the conducting pads of the
substrates. The construction of a single stage thermoelectric module is shown in Figure
14
Considering a typical thermoelectric system designed to cool air in an enclosure (e.g.,
picnic box, equipment enclosure, etc.) as in Figure 11; this is probably the most common type
of TE application. Here the challenge is to “gather” heat from the inside of the box, pump it to
a heat exchanger on the outside of the box, and release the collected heat into the ambient air.
Usually, this is done by employing two heat sink/fan combinations in conjunction with one or
more Peltier devices. One of the heat sinks is used on the inside of the enclosure; cooled to a
temperature below that of the air in the box, the sink picks up heat as the air circulates
between the fins. In the simplest case, the Peltier device is mounted between this “cold side”
actively pumps heat from the cold side sink to the one on the hot side. The fan on the hot side
that the heat dissipated on the hot side not only includes what is pumped from the box, but
also the heat produced within the Peltier device itself (V x I).

Let’s look at this in terms of real numbers. Imagine that we have to pump 25 watts from a
box to bring its temperature to 3 degree Celsius from 20 degree Celsius (ambient). To
accomplish this, we might well have to take the temperature of the cold side sink down to 0° C.
Using a Peltier device which draws 4.1 amps at 10.4 V, the hot side of the system will have to
dissipate the 25 watts from the thermal load plus the 42.6 watts it takes to power the TE
module (for a total of 67.6 watts). Employing a hot side sink and fan with an effective thermal
resistance of 0.148 C°/W. The temperature of the hot side sink will rise approximately 10°C
above ambient.

It should be noted that, to achieve the 17° C drop between the box temperature and ambient,
we had to create a 30° C (54°F) temperature difference across the Peltier device.

3.1.3 Acquiring and assembling

Steps in the construction of Refrigerator
 Firstly, a box of thermocol is made of given dimensions and then the aluminum foil is
insulated and fixed into it.
 The peltier device is positioned on the top of larger heat sink with the help of thermal paste.
 The smaller heat sink is attached on top of the peltier module.
 A medium sized fan is attached to the larger heat sink to take out the heat outside the
system.

15
 The cold side of the peltier module is placed facing towards the evaporator and hot side
towards the atmosphere.
 Now the whole setup is positioned on the evaporator with a properly insulated small hole.
 A 12 V – 15-amp adapter and another 12 V – 2 amp are properly connected to the peltier
module and medium sized fan respectively.

Dimensions of Refrigeration box

1. Outer dimensions
 Length 180 mm
 Breadth 145 mm
 Height 175 mm

2. Inner dimensions
 Length 170 mm
 Breadth 135 mm
 Height 165 mm

3. Volume of the fridge 3,786,750 mm³

4. Dimensions of peltier 40 mm × 40 mm × 2 mm

3.1.4 Results

 The temperature varies from 15 °C to -2.9 °C with temperature variation within the
Thermoelectric cooler for peltier rating 12715 with 12-volt 12 amp . As this was the
proto sample with improvement in prototyping, we can achieve even lower
temperature.

 The temperature varies from 15 °C to 7.8 °C with temperature variation within the
Thermoelectric cooler for peltier rating 12706 with 12-volt 2 amp.

16
3.2 MATERIAL REVIEW
3.2.1 Thermoelectric module
A thermoelectric (TE) module, also called a thermoelectric cooler or Peltier cooler, is a
semiconductor-based electronic component that functions as a small heat pump, moving heat
from one side of the device to the other. Thermoelectric modules are also sometimes used to
generate electricity by using a temperature differential between the two sides of the module.
There exists optimum current and optimum voltage for maximum coefficient of performance
for specific module and fixed hot/cold side temperatures.

Fig 8 - Working of Peltier Effect

3.2.2 Refrigeration Box

The chamber used is same as that of the chambers used in conventional refrigeration. The
chamber can be of any volume, shape and size. For experimentation purposes the volume of
the chambers is kept low Insulation provided to the chamber is done by polystyrene and
aluminum casting is done in the inner side of the insulation to provide better cooling.

17
 Fig 9 – Refrigeration box

3.2.3 Adapter
An adapteris a device that converts attributes of one device or system to those of an otherwise
incompatible device or system. Some modify power or signal attributes, while others merely
adapt the physical form of one connector to another.

Fig 10 - Adapter

3.2.4 Heat sink and Fan

A heat sink is an electronic device that incorporates either a fan or a peltier device to keep a hot
component such as a processor cool . There are two heat sink types active and passive . Active
heat sink utilize the power supply and are usually a fan type or some other peltier cooling
device.

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 Fig 11 - Heat Sink

A fan for active cooling and may refer to fans that drew cooler air into the case from the
outside, expel warm air from inside, or move air across a heat sink to cool a particular
component.

Fig 12 - Fan

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3.2.5 Thermostat
A thermostat is a component that which senses the temperature of the system so that the
systems temperature is maintained near a desired set point.
A thermostat can often be the main control unit for a heating or cooling system, in application
ranging from ambient air control,too such as automotive coolant control, but is also used in
many other applications.

Fig 13 - Thermostat

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 CHAPTER-4
RESULT AND DISCUSSUION

4.1 Observations

SNo. ADAPTER PELTIER TEMPRATURE TIME ADAPTER

(For Peltier) REACHED (in min) (for fan)
(in ˚C)

1 12-volt 2 amp 12706 20.8 15 12-volt 2 amp

2 12-volt 3 amp 12706 18.7 15 12-volt 2 amp

3 12-volt 5 amp 12706 11.4 10 12-volt 2 amp

4 12-volt 5 amp 12706 7.8 30 12-volt 2 amp

5 12-volt 12 amp 12715 -0.4 2 12-volt 2 amp

6 12-volt 12 amp 12715 -2.9 3 12-volt 2 amp

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 Fig. 14 – Final setup

4.2Features of Peltier Module

•Peltier module can convert thermal energy into electricity, or when electricity is provided to
the Peltier module then absorb the heat (cool side) from one side and reject (hot side) heat
from other side.

•Conventional systems can use or generate harmful gases like chlorofluorocarbons (CFCs) and
hydro chlorofluorocarbons (HCFCs). The Peltier module can’t use or generate these harmful
gases.

•Peltier module can operate on DC power source.

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•Light weight and compact for small heat loads.

•No moving parts, so frequent maintenance is required

•Eliminating vibrations, noise and problems of wear.

• Reversing the directions of current transforms the cooling unit into a heater

•Precision temperature control capability

4.3 Limitations

• Limited to very small refrigeration volume.

• Compared to conventional refrigerators cooling achieved is less.

• Heat sinks required conducting heat to and from the thermoelectric modules become very
Heavy and bulky as the refrigeration capacity increases.

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 CHAPTER-5
CONCLUSION AND FUTURE SCOPE

5.1 Conclusion
The TE devices can act as coolers, heat pumps, power generators, or thermal energy sensors
and are used in almost all the fields such as military, aerospace, instrument, biology, medicine,
industrial or commercial products. The major challenge faced in TE cooling is lower COP
especially in large capacity systems. However, as the energy costs are elevating and
environmental regulations regarding the manufacture and release of CFCs have become more
firm with time, the scope of TE effect has revived, especially in the developing countries or the
third world where the energy is not surplus. These devices can achieve negative temperature in
only 3 seconds when insulated properly. These devices weight under 3 kg.

TE chilling of beverage can be done at the farm level to inhibit any enzymatic or microbial
change in quality of the beverage. Research in `the field of thermoelectricity and
experimentation with different materials is required to improve the COP of the TE cooler. In the
coming years thermoelectricity has a lot of potential to create energy saving and effective
solutions for the industry and commercially as well. The minimum temperature achieved was
found to be 15◦c for cooling and the maximum temperature was 65◦c for heating in this
experiment.

5.2 Future Scope

• Consumer products (Portable coolers, cooling electronic components, climate control

Jackets, heat sinks for microprocessors).

• Science field (Thermal cyclers, satellites and spacecraft’s, photon detectors such as
Spectrometers and digital cameras).

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