X505 Service Guide Chapter 02-V1.0

You might also like

Download as pdf or txt
Download as pdf or txt
You are on page 1of 33

Disassembly Procedure

2
Chapter

Rev. Change History Change Date Originator


V1.0 First Release 2018/5/23 Yue_zhuo

Disassembly Procedure
Please follow the information provided in this section to perform the
complete disassembly procedure of the notebook. Be sure to use proper
tools described before.

A
SUS X505 Series Notebook consists of various modules. This chapter describes the
procedure for the complete notebook disassembly. In addition, in between procedures, the
detailed disassembly procedure of individual modules will be provided for your service needs.

The disassembly procedure consists of the following steps:


 Service overview
 Appropriate Tools
 Block Diagram
 Bottom Case Module
 Touchpad Module
 Battery Module
 HDD Module
 WLAN Module
 Motherboard Module
 SSD Module
 Thermal Tunnel & Fan
 Speaker Module
 IO Board
 LCD Module
 GAP STEP

2-1 V1.0
Disassembly Procedure

Service Overview
Please pay special attention to the cautions below to prevent any damages to the notebook and also
please be sure to select the appropriate tools described in this section to perform any services desired.

Precautions
Before you perform any service and or repair on the notebook, please follow the steps below first.

1. Be sure that the notebook is powered down.

2. Disconnect the AC plug from the notebook.

3. Remove all rings, watches and any other metal objects from your hands.

4. Always wear a ground strap on your hand to protect the notebook from static discharge.
5. Please refer to “ANSI ESD S20.20” about ESD protection measure.
6. Put disassemble the parts in the functional PE BAG for avoid any damages of the A/B/C/D part.

7. Environment temperature is 20-30 ℃ and humidity is 40% - 70%.


8. Avoid scratching the surface of the machine, please use anti-static and soft materials to put on desk
in repair environment as below photo.

2-2 V1.0
Disassembly Procedure

9. Screw Appearance Criteria.


If the screws have the following damaged appearance, please do not use.
a. Shape deformed
b. Paint scratched off
c. Rusty

d. Damaged head – unable to drive in

e. Damaged unable to securely tighten


BACK

Appropriate Tools
The illustrations below show the appropriate tools that should be used for the notebook’s service and
repair.

2-3 V1.0
Disassembly Procedure

Cross Screwdriver
Please according to different screw specification choose different screwdriver and head.
Below photos are for reference only.

Use a cross screwdriver to fasten/remove screws.

Plastic Blade (PN: 20LT0-0005O000)

Tweezers
Use a pair of tweezers to remove/insert flexible cables.

2-4 V1.0
Disassembly Procedure

Thickness gauge (PN: 20LT0-0002J000)


Thickness compass specification 0.05mm-1.5mm
Use it to measure the gap.

BACK

2-5 V1.0
Disassembly Procedure

Block Diagram

BACK

B O T T O M C A S E Bottom Case Module


M O D U L E The illustrations below show how to remove and disassemble the bottom Case Module.

Remove the Bottom Case Module


1. Remove 11 screws (11 SCREWS M2*8L (K) B-ZN,NY) on the bottom case.
Assembly Notice: follow the reverse numbers to lock screws
Screw tightening torque (Kg F-cm): 2.0kg

2-6 V1.0
Disassembly Procedure

1 2 3 4

6 7

8 9 10
11

2. Use disassembly tool to pry up the sides of the top case .

Please pry open Top case


from this location

2-7 V1.0
Disassembly Procedure

3. Disconnect the keyboard FFC and TP FFC.


Insert FFC and FPC to the bottom until just accord with the line when lock the latch.

Parts
 Total screw *11
(Actual part name depends on different SKU.)
BACK

T O U C H P A D
Touchpad Module
The illustrations below show how to disassemble and remove the touchpad Module.
M O D U L E

Remove the touchpad Module


1. Tear off 1 TP tape.
Assembly Notice: follow the reverse numbers to lock screws.

2-8 V1.0
Disassembly Procedure

Insert FFC and FPC to the bottom until just accord with the line when lock the latch.
Screw tightening torque : 2.0kgf-cm

2.Disconnect the TP FFC on the touchpad and remove 3 screws (SCREW M2*2L D7.0 (K)
B-ZN #1) on the touchpad.

2-9 V1.0
Disassembly Procedure

Parts
 X505BP-1A TOP CASE (US)//*1
 90NB0G13-R90010 X505BA-1A TOUCHPAD MODULE*1
 X505UA TP FFC 8P 0.5MM L180*1
 X505UA TP AL MYLAR*1
 Total screw *3
(Actual part name depends on different SKU.)

BACK

2 - 10 V1.0
Disassembly Procedure

Battery Module
The illustrations below show how to remove the battery from the notebook.
1. Remove 1 screw (SCREW M2*4L D4.5(K) B-ZN,NY #1) on the battery and take the battery away.
Notice: Before disassembly, please be sure to pull out adapter and disconnect the battery more than ten
seconds in order to avoid IC damage.
Screw tightening torque: 2.0kgf-cm

Parts
 X505BP BATT 3CELL 42WH*1
 Total screw *1
(Actual part name depends on different SKU.)

BACK

2 - 11 V1.0
Disassembly Procedure

HDD Module
The illustration shows how to remove the HDD Module.

Remove HDD Module


1. Remove 3 screws (SCREW M2*4L D4.5(K) B-ZN,NY #1) on the HDD module. Remove the
HDD module toward the arrow direction.
Screw tightening torque: 2.0kgf-cm

Parts
 X505BP HDD SATA3 2.5' 1TB5*1
 Total screw *3
(Actual part name depends on different SKU.)

BACK

2 - 12 V1.0
Disassembly Procedure

W L A N M O D U L E WLAN Module
The illustrations below show how to remove the WLAN Module from the notebook.
Remove WLAN Module
1. Disconnect the antenna cable of the WLAN card and Remove 1 screw (SCREW
M2*1.8L+0.7(5,0.8) (K)#1) on the WLAN card.
Assembly Notice: black cable is connect to the ‘Main’ input port.
White cable is connect to the ‘Aux’ port.
Screw tightening torque: 2kgf-cm

2 - 13 V1.0
Disassembly Procedure

Parts
 802.11A/B/G/N/AC+BT4.2(2*2)M.2*1
 Total screw *1
(Actual part name depends on different SKU.)

BACK

Motherboard Module
The illustrations below show how to separate the Motherboard module

Separate motherboard Module


1. Disconnect LVDS Cable, Speaker Cable from MB.
Assembly notice: insert audio cable to the bottom.
Insert FFC and FPC to the bottom until just accord with the line when lock the latch.

2 - 14 V1.0
Disassembly Procedure

2. Remove 3 screws (SCREW M2*4L D4.5(K) B-ZN,NY #1) on the motherboard and take it away.
Screw tightening torque: 2.0kgf-cm

2 - 15 V1.0
Disassembly Procedure

Parts
 90NB0G10-R00010 X505BA MB._4G/E2-9000/AS*1
 Total screw *3
(Actual part name depends on different SKU.)

BACK

SSD
The illustrations below show how to remove and disassemble the SSD of the notebook.

Removing the SSD


1. Remove 1 screw (SCREW M2*2.5L D4.5(K)B-ZN,NY#1) on the SSD and take it away.
Screw tightening torque: 2.0kgf-cm

2 - 16 V1.0
Disassembly Procedure

Parts
 X505BP SSD M2 2280 S3 128G*1
 Total screw *1
(Actual part name depends on different SKU.)

BACK

Thermal Module Assy & Fan


The illustrations below show how to separate the Thermal module assy & Fan

Separate Thermal module assy & Fan


1. Disconnect the FAN cable and follow the numbers to remove 7 screws (SCREW M2*2.5L
D4.5(K)B-ZN,NY#1,SCREW M2*4L D4.5(K) B-ZN,NY #1)on the thermal module and take it away.
Assembly Notice: follow the reverse numbers to lock screws.
Screw tightening torque: 2.0kgf-cm,2.0kgf-cm

2 - 17 V1.0
Disassembly Procedure

3 6

5 4

2. Disconnect the fan cable toward the arrow direction.

2 - 18 V1.0
Disassembly Procedure

Notice: please replace a new CPU PAD(13GNWU10T010-1 UL50A TH CPU PAD//APUS) & GPU
PAD (13GNVP10L060-1 K51IO THERMAL MXM GPU PAD//APUS)

Parts
 X505BP THERMAL MODULE*1
 Total screw *7
(Actual part name depends on different SKU.)

BACK

2 - 19 V1.0
Disassembly Procedure

2 - 20 V1.0
Disassembly Procedure

Speaker Module
The illustrations below show how to remove and disassemble the Speaker Module of the notebook.
1. Tear off 2 Tapes and take speaker away.

2 - 21 V1.0
Disassembly Procedure

Please well arrange the cables and put it in the hook slot as below.

Parts
 X505U_HONGLIN_SPK_WIFI_ANTENNA*1
(Actual part name depends on different SKU.)

BACK

2 - 22 V1.0
Disassembly Procedure

I O B O A R D IO Board
The illustrations below show how to remove and disassemble the IO Board of the notebook.

Removing the IO Board


2. Remove 7 screws (SCREW M2.5*4L (K) W-NI,NY) on the LCD hinge and take IO Board away.
Screw tightening torque: 2.5kgf-cm
Assembly Notice: follow the reverse numbers to lock screws.

2 3

1
4

2 - 23 V1.0
Disassembly Procedure

Parts
 90NB0G10-R10010 X505BA IO_BD./AS*1
 Total screw *7
(Actual part name depends on different SKU.)

BACK

L C D M O D U L E LCD Module
The illustrations below show how to remove and disassemble the LCD Module of the notebook.

Removing the LCD Module


1. Remove 2 rubber pads and 2 screws (SCREW M2.5*3.5L (4.5,0.5)(K)#1) on LCD front bezel.
Screw tightening torque: 2.5kgf-cm

2 - 24 V1.0
Disassembly Procedure

2. Use disassembly tool to pry up the edge of the bezel. And take the LCD front bezel away.

Please pry open LCD


Bezel from this location

3. Remove 8 screws (SCREW M2.5*3.5L (4.5,0.5)(K)#1, SCREW M2*2.5L D4.5(K)B-ZN,NY#1) on


the LCD panel.
Screw tightening torque: 2.0-2.5kgf-cm, 2.0kgf-cm
Assembly Notice: follow the reverse numbers to lock screws.

2 - 25 V1.0
Disassembly Procedure

1 2
3

2 3

4. Tear off 1 tape and disconnect the LVDS cable.

2 - 26 V1.0
Disassembly Procedure

Assembly notice: There have a LVDS cable connected with back of the LCD, insert it to the bottom and put
cable in the hook slot as below.

7. Disconnect the CAMERA cable and take it away.

2 - 27 V1.0
Disassembly Procedure

Release the EDP cable from the LCD cover.


Assembly Notice: Please well arrange the cables and put it in the hook slot as below.

2 - 28 V1.0
Disassembly Procedure

Notice: Don’t paste the adhesive, it doesn’t affect the function.

Parts
 X505UA-1B BOTTOM CASE*1
 X505UA EDP CABLE*1
 CAMERA VGA FIX 3.3V AMIC CL*1
 LCD 15.6' FHD VWV US EDP*1
 X505UA-1B LCD BEZEL*1
 X505UA HINGE R*1
 X505UA HINGE L*1
 X505BP COVER HINGE GASKET R*1
 X505BP COVER HINGE GASKET L*1
 Total screw *10 2 - 29 V1.0
(Actual part name depends on different SKU.)
Disassembly Procedure

BACK

Gap Step

2 - 30 V1.0
Disassembly Procedure

2 - 31 V1.0
Disassembly Procedure

2 - 32 V1.0
Disassembly Procedure

BACK

2 - 33 V1.0

You might also like