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VLSI Processors
VLSI Processors
Subject:
Digital Signal Processing
Submitted by:
Submitted to:
Mam Sumayya
At their most basic level, transistors may seem simple. But their development actually required many
years of painstaking research. Before transistors, computers relied on slow, inefficient vacuum tubes
and mechanical switches to process information. In 1958, engineers managed to put two transistors
onto a Silicon crystal and create the first integrated circuit, which subsequently led to the first
microprocessor.
Then, in 1981, IBM introduced its first personal computer. The personal computer was such a
revolutionary concept and was expected to have such an impact on society that in 1982, "Time"
magazine dedicated its annual "Man of the Year Issue" to the computer. The other feature of the
microprocessor is its versatility. Whereas previously the integrated circuit had had to be manufactured
to fit a special purpose, now one microprocessor could be manufactured and then programmed to meet
any number of demands. Soon everyday household items such as microwave ovens, television sets and
automobiles with electronic fuel injection incorporated microprocessors.
The 1980's saw an expansion in computer use in all three arenas as clones of the IBM PC made the
personal computer even more affordable. The number of personal computers in use more than doubled
from 2 million in 1981 to 5.5 million in 1982. Ten years later, 65 million PCs were being used. Computers
continued their trend toward a smaller size, working their way down from desktop to laptop computers
(which could fit inside a briefcase) to palmtop (able to fit inside a breast pocket).
Why VLSI?
Integration improves the design
o Lower parasitic = higher speed
o Lower power consumption
o Physically smaller
Integration reduces manufacturing cost - (almost) no manual assembly
Introduction
Very-large-scale integration:
(VLSI) is the process of creating an IC by combining thousands of transistors into a single chip.
VLSI began in the 1970s when complex semiconductor and communication technologies were
being developed. The microprocessor is a VLSI device. Before the introduction of VLSI
technology most ICs had a limited set of functions they could perform. An electronic circuit
might consist of a CPU, ROM, RAM and other glue logic. VLSI lets IC makers add all of these into
one chip.
By the 1980's, very large scale integration (VLSI) squeezed hundreds of thousands of
components onto a chip. The ability to fit so much onto an area about half the size of a U.S.
dime helped diminish the size and price of computers. It also increased their power, efficiency
and reliability. Marcian. Hoff invented a device which could replace several of the components
of earlier computers, the microprocessor. The microprocessor is the characteristic of fourth
generation computers, capable of performing all of the functions of a computer's central
processing unit. The reduced size, reduced cost, and increased speed of the microprocessor led
to the creation of the first personal computers. Until now computers had been the almost
exclusively the domain of universities, business and government.
IC:
Integrated Circuits, many transistors on one chip
VLSI:
Very Large Scale Integration, a modern technology of IC design flow
MOS:
Metal-Oxide-Silicon transistor (also called device)
CMOS:
Complementary Metal Oxide Semiconductor
Moore’s Law
Gordon Moore: co-founder of Intel Predicted that the number of transistors per chip would
grow exponentially (double every 18 months) Exponential improvement in technology is a
natural trend:
E.g. Steam Engines - Dynamo – Automobile
Technology Background
What is a Silicon Chip?
A pattern of interconnected switches and gates on the surface of a crystal of semiconductor
(typically Si) these switches and gates are made of
Areas of n-type silicon
Areas of p-type silicon
Areas of insulator
Lines of conductor (interconnects) joining areas together
Aluminum, Copper, Titanium, Molybdenum, polysilicon, tungsten
The geometry of these areas is known as the layout of the chip Connections from the chip to the
outside world are made around the edge of the chip to facilitate connections to other devices
Semiconductors and Doping:
•Adding trace amounts of certain materials to semiconductors alters the crystal structure and
can change their electrical properties.
In particular it can change the number of free electrons or holes
•N-Type
semiconductor has free electrons
dopant is (typically) phosphorus, arsenic, antimony
•P-Type
semiconductor has free holes
dopant is (typically) boron, indium, gallium
Dopants are usually implanted into the semiconductor using Implant Technology, followed by
thermal process to diffuse the dopants .
Silicon Lattice
Transistors are built on a silicon substrate
Silicon is a Group IV material
Forms crystal lattice with bonds to four neighbors
Dopants
Silicon is a semiconductor
Pure silicon has no free carriers and conducts poorly
Adding dopants increases the conductivity
Group V: extra electron (n-type)
Group III: missing electron, called hole (p-type)
Integrated Circuits
SSI – Small-Scale Integration (0-10^2 )---1960
MSI – Medium-Scale Integration (10^2 -10^3 )---1967
LSI – Large-Scale Integration (10^3 -10^5 )---1972
VLSI – Very Large-Scale Integration (10^5 -10^7 )---1978
ULSI – Ultra Large-Scale Integration (>=10^7 )---1989
GSI _ Giant Scale Integration (>=10^9 )---2000
Why Make Ic s?
o Integration improves
size
speed
power
o Integration reduce manufacturing costs
(almost) no manual assembly
IC Evolution (1/3)
SSI – Small Scale Integration (early 1970s)
o contained 1 – 10 logic gates
MSI – Medium Scale Integration
o logic functions, counters
LSI – Large Scale Integration
o first microprocessors on the chip
VLSI – Very Large Scale Integration
o now offers 64-bit microprocessors, complete with cache memory (L1 and often L2),
floating-point arithmetic unit(s), etc.
Bipolar technology
o TTL (transistor-transistor logic)
o ECL (emitter-coupled logic)
IC Evolution (2/3)
MOS (Metal-oxide-silicon)
o although invented before bipolar transistor, was initially difficult to manufacture
o nMOS (n-channel MOS) technology developed in 1970s required fewer masking steps,
was denser, and consumed less power than equivalent bipolar ICs => an MOS IC was
cheaper than a bipolar IC and led to investment and growth of the MOS IC MARKET.
o aluminum gates for replaced by polysilicon by early 1980
o CMOS (Complementary MOS): n-channel and p-channel MOS transistors => lower
power consumption, simplified fabrication process
Bi-CMOS - hybrid Bipolar, CMOS (for high speed)
GaAs - Gallium Arsenide (for high speed)
Si-Ge - Silicon Germanium (for RF)
Chips
Integrated circuits consist of:
o A small square or rectangular “die”, < 1mm thick
Small die: 1.5 mm x 1.5 mm => 2.25 mm2
Large die: 15 mm x 15 mm => 225 mm2
o Larger die sizes mean:
More logic, memory
Less volume
Less yield
o Dies are made from silicon (substrate)
Substrate provides mechanical support and electrical common point
Current Processors
References:-
1. AUTHOR STREAM:
http://www.authorstream.com/Presentation/aSGuest43958-383515-vlsi-
spdas1vlsibput-education-ppt-powerpoint/
2. SLIDE SHARE:
http://www.slideshare.net/illpa/introduction-to-vlsi
3. ENGINEERS GARAGE: -
http://www.engineersgarage.com/articles/vlsi-design-future
4. FORCEPERFECT:
http://www.forcedperfect.net/hardware/cards/applepowermacintoshupgradecar
d/images/applepowermacintoshupgradecard-vlsi.jpg
5. Uyemura, John P.
Introduction to VLSI Circuits and Systems
6. http://www.cs.sun.ac.za/museum/gen4.html
7. http://www.youtube.com/watch?v=hO455B9d7zY