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Microscale and Nanoscale Systems
Microscale and Nanoscale Systems
Nanoscale Systems
INTRODUCTION
Origins of Nanotechnology
New
Nanotechnology aims at
making materials and
processes better by re-
engineering the
fundamental building
blocks of matter.
Diamond
The central theme of
nanotechnology is
improvements or
adaptation of materials by
reconfiguring the atoms.
Protein
Molecular Gears
Size effects
10
Sources: http://www.cambridge.edu.au/education/PracticeITBook2/Microscope.jpg
http://news.bbc.co.uk/olmedia/760000/images/_764022_red_blood_cells300.jpg
Size:
1m,10 cm,1 cm,100m,10m
1m, 100nm, 10nm,1nm
Microscale and Nanoscale
Energy Transport
The modern trends in micro-electronics have introduced the
quest for miniaturization of all electro-mechanical systems
Spatial Microscales:
Physical dimension
The space and Mean Free Path
timescales for analysis Wavelength
have to be chosen Timescales:
based on the domain Laser pulse duration
size and the fastness of Relaxation time (time for
the process equilibrium from
excitation)
Thermalization time (time
for electron-phonon
energy transfer)
Physical Properties
Incapability of Conventional Definitions
Example:
Fourier’s law, which we believe
Fourier’s Law to be an authentic law has
q = - k ΔT/Δx these handicaps:
Does not talk about changing
heat fluxes
Does not talk about the
Newton’s law of viscosity propagation speed of energy
Hook’s law carriers
Does not talk about size effect
Ohm’s Law of thermal conductivity at all.
All these relate between the Still we use the law along with
gradient of a potential to an the transient conservation
effect, based on macroscopic equation to obtain
observation. temperature distributions.
Other models such as
hyperbolic heat conduction
equations has been proposed
Heat Conduction
Size-effect on Thermal Conductivity
Thermal conductivity is
defined by Fourier’s
Law, and is taken as a
directional material
property, dependent on
the temperature.
In small dimensions
(such as thin films) this
assumption is found to
fail. The measured
values are found to be
size dependent.
Nath and Chopra (1974)
Thin Films in IC applications
Silicon On Insulator Devices
Modern semi-conductor
devices are fabricated using
thin films of silicon
(substrate), silicon dioxide
(insulation or passivation)
and copper interconnects.
Size affected values of
thermal conductivity are
required to perform
calculations for appropriate
design of these
components, to avoid Ju and Goodson (1998)
operational failure due to
differential heating.
Fabrication and Operation of
SOI Devices
Thermal control during
the fabrication
processes of SOI
devices involving laser
induced heating.
Perfect temperature
control is required
Design of the
constituent films such
that there is no thermal Construction of a SOI device
failure during operation
Fluid Flow and Heat Convection
Modified Continuum and Discrete
Analysis
Fabrication Methods
• Atom-by-atom assembly (Bottom Up)
– Like bricklaying, move atoms into
place one at a time using tools like
the AFM and STM IBM logo assembled
• Chisel away atoms (Top down) from individual xenon
atoms
– Like a sculptor, chisel out material
from a surface until the desired
structure emerges
• Self assembly
– Set up an environment so atoms
assemble automatically. Nature uses Polystyrene
self assembly (e.g., cell membranes) spheres self-
assembling
Source: http://www.phys.uri.edu/~sps/STM/stm10.jpg; http://www.nanoptek.com/digitalptm.html
What We Need
solar Storage
Environment