PWM Controlled Step-Up DC-DC Converter

AN010699
XC6371 Series PWM controlled step-up DC/DC converter

XC6372 Series PWM / PFM Switching step-up DC/DC converter
XC6373 Series Low Frequency PWM controlled step-up DC/DC converter
Application Notes
=============== Index ===============
Introduction P-2
Peripheral Selection P-2
Notes on Use P-6
Application Circuits P-7
1.Pager power supplies (3.0V, 3mA)
2.PDA power supplies (3.3V, 300mA)
3.LCD power supplies (12V, 2mA)
Characteristics P-11
Appendix P-21
Step-up switching regulator operational explanation
Step-up switching regulator functional explanation
1. The products and product specifications contained herein are subject to change
without notice to improve performance characteristics. Consult us, or our
representatives before use, to confirm that the information in these notes is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in these notes.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in these notes.
4. The products in these notes are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in these notes within the specified ranges. Should you
wish to use the products under conditions exceeding the specifications, please consult
us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this document may be copied or reproduced without
the prior permission of Torex Semiconductor Ltd.
Torex Semiconductor Ltd.

WARNING
When selecting peripherals for use with this series, do not limit your reference to only
the specifications and characteristics for the DC/DC converters, but thoroughly check
the specifications for each component.
(Please also refer to “ peripheral’s selection ” below )
In actual operation we suggest that you allow ample margins above the recommended
specifications and take the IC’s and the peripheral’s absolute maximum ratings into
consideration.
❍ Introduction
The XC6371, XC6372 and XC6373 series are PWM, PWM/PFM switching step-up
DC/DC converters.
Low power consumption and high accuracy are achieved through CMOS process and
laser trimming technologies. Output voltage is selectable in 0.1V steps within a
range of 2.0V∼7.0V and oscillation frequencies are selectable from 30kHz (XC6373
series), 50kHz, 100kHz and 180kHz (XC6371, XC6372 series).
Both internal (Step-up transistor switch built-in) transistor types (A, C, E) and
external transistor types (B, D, F) are available. With only 3 external components
(a coil, a diode and a capacitor) a step-up circuit can be configured using the internal
transistor types.
By adding a transistor to the above 3 peripherals, large output currents can be
achieved with the external transistor types.
Versions with stand-by functions (C, D types) or with the power supply VDD pin
separated (E, F types) are also available.
❍ Peripheral’s Selection
It is essential that ample care be taken when selecting peripherals as they greatly
influence the switching regulator’s characteristics. How they influence those
characteristics is explained in the table below.
Table 1. Peripheral Selection
Coil’s Coil’s DC Load Step-up External
Inductance Resistance Capacitance Transistor Transistor
Value Value Value Switch RB CB
Wish to increase External
Output Current? Small Small Large (Low on Small Large
Resistance)
Light
Wish to Load Large Small Large Small
Achieve
High Heavy External
Efficiency? Load Large Small (Low on Small Large
Resistance)
Wish to reduce output

ripple? Large Large Large
Wish to improve
transient response? Small Large
5
Note :
If using a power MOSFET as an external transistor, RB and CB are unnecessary.
For more detailed information on the various peripherals, please refer to the following
notes.
1. Coil
When selecting an inductance value, make your selection so that both oscillator
frequency and output current (load) are taken into account. (Please refer to table 2
below).
Since the higher the oscillation frequency the smaller the inductance value that can be
selected, the coil’s actual size can be reduced. With large load currents, please use a
coil with a small DC resistance. If a coil with a small inductance value is used, the
stability of the switching regulator’s circuit will be improved (i.e. The occurrence of
abnormal oscillation will be difficult).
Table 2. Inductance Value Selection

Oscillation Frequency
50kHz 100kHz 180kHz
Light Loads 330µΗ 220µH 100µH
Medium Loads 220µH 100µH 47µH
Heavy Loads 100µH 47µH 22µH
In intermittent mode, the coil’s peak current value (IL peak) can be calculated as
follows:
IL peak2 = 2 (VOUT-VIN) x IOUT ÷ (L x FOSC)
Ex.) If VIN = 3V, VOUT = 5V, IOUT = 50mA, FOSC = 100kHz and L=100µH,
then IL peak = SQRT (2 x (5-3) x 0.05 ÷ (100000 x 0.0001) ) = 140mA
Please use a coil where the regular current is higher than the coil’s peak current value.
Please also note that the above formula is based conditions in which no losses occur
and that in reality, the actual value will be larger than the one calculated.
2. Diode
Please use a diode with a small VF (Forward Voltage) value. Depending on drops in
VF, loss and efficiency can be improved. Operating start voltage will also be reduced.
To ensure stability we recommend that you use with VF < 0.6V at the coil’s peak
current value.
Please ensure that the capacitance between the pins is small. If the capacitance is
large, switching speed will be slowed and ‘ spike noise ’ which occurs during the
diode’s turn ON and OFF operations may increase. Should switching speed be slowed,
loss will increase and efficiency will be reduced.
6
Please ensure that each respective current is more than 1.5 times the coil’s peak
current value and that respective voltages are more than 1.5 times the output voltage.
We further recommend that you select a diode with a small IR (reverse leak current)
value. Should IR be large, efficiency will be reduced during light loads and the
increased spike noise will have negative effects on performance.
3. Load Capacitance
Please use a capacitor with a load capacitance value of at least 10 µF (Tantalum).
With applications using output currents of more than 100mA, ensure that the load
capacitance is 2 ∼ 3 times more than the values given in the standard circuit diagram.
Be aware of the capacitor’s approved ripple current. Should excessive ripple
currents flow, the life of the capacitor may be shortened as a result of heat produced at
such times.
By using the following formula, stable values for ESR (Electrical Series Resistance)
can be selected. Usually, the OS-CON series cannot be used.
1 ÷ (2π CL • ESR) ≤ 25kHz

Ex.) If CL=47µF, ESR=50mΩ then 1 ÷ (2π CL • ESR) = 68kHz
Therefore not recommended.
4. External Transistor
If using with applications where input voltage is less than 1.2V, we recommend that
a Bipolar transistor be used since there may be cases in which gate voltage cannot
be obtained with the Power MOSFET ‘ON’. With applications where the output
current is large, we recommend that a power MOSFET with a small On-state
resistance be used.
4-1. N-Channel Power MOSFET

Please use N-Channel Power MOSFETs with a small input capacitance (Ciss) or a
small output capacitance (Coss). The ICs in this series can be driven by MOSFETs
with a maximum capacitance of 1000 pF.
We also recommend that N-channel Power MOSFETs with fast switching speeds be
used (where turn on delay time [ td (on)], rise time [tr] and turn off delay time
[td (off) ] are all short.)
Ensure that the Gate / Source cut off voltage (Vgs (off)) of the N-channel Power
MOSFET is adequately lower than the input voltage and note that with this series,
a voltage higher than Vgs (off) must be applied at the IC’s power supply pin during
switching regulator start-up times.
Further, ensure that the Drain / Source On-state resistance (Rds(on)) of the N
-channel Power MOSFET is small, but be aware that an extremely small value for
Rds (on) will generally result in large capacitance values for Ciss and Coss.
7
Finally, do not exceed the values stated for the respective currents and power
dissipation.
4-2. Bipolar Transistor

Please use a Bipolar transistor where the current amplification (hFE) is within the
100 ∼ 500 range.
Please note that transistors with extremely large hFE values generally result in small
base currents and that caution over OFF leak current needs to be taken.
As much as possible, we recommend that you use a transistor with fast switching
speeds (where turn on time [ ton ] , fall time [ tf ] and accumulation time [ tstg] are
short) as efficiency will be improved.
We also recommend that transistors with small collector output capacitance (Cob)
values be used (Several 10’s pF).
4-3. Bipolar Transistor’s RB, CB values
4-3-1. Base Resistance (RB)

Please ensure that the base resistance (RB) of the transistor to be used is within the
250Ω∼ 2kΩ range.
Although output current will increase, should the value of RB be reduced, efficiency
during light loads will drop.
The value for RB can be calculated by using the collector current value (IC*) when
the transistor is ON. When calculating, please take into account hFE variance etc.,
and use a value for IC* that is more than 3 times the actual value.
RB ≤ (VOUT – 0.7) x hFE ÷ IC* - REXTH
Ex.) If IIN = 100 mA, VOUT = 5.0V, hFE = 200
then 250Ω ≤ RB ≤ 1.4kΩ
4-3-2. Speed–up Capacitor (CB)

Please use the following formula to select values for CB. Efficiency will improve
as switching speed increases.
1 ÷ (2π RB • CB) = FOSC x 0.75
Ex.) If RB = 1kΩ, FOSC = 100kHz then CB = 3300pF
Please contact our sales department for all inquiries relating to the specifications of
the external components listed.
8
❍ Notes on Use
Please locate peripherals (coil, diode, capacitor) close to the IC and use thick, short
wires in order to reduce wiring impedance. In particular, we recommend that the
load capacitor (CL) be located as close to the IC as possible and that ground wiring
be suitably strengthened.
Because the IC’s operations may become unstable due to changes in ground voltage
level (as a result of ground current during step-up switch ON/OFF functions),we
suggest that the area around the VSS pin be strengthened.
With regards to the VOUT power supply voltage monitor pin’s wiring, please wire
so that the Schottky Diode’s (SD) voltage can be smoothly pulled from behind by
the load capacitor (CL).
If using an external transistor, please wire in such a way that the transistor’s ground
side is separated from the IC’s VSS pin in order to avoid changes in the ground
voltage level (brought about by ground current during the transistor’s ON/OFF
functions) affecting the IC’s performance.
To reduce the influence of input impedance, we recommend that a capacitor (CIN)
be added to the input side. Please be aware that voltage changes brought about as a
result of input impedance will have the affect of reducing output current level.
If using an electrolytic capacitor for CIN, please give careful consideration to the
drops in capacitance that occur in low temperatures.
If using a manganese battery with a large internal impedance for the switching
regulator’s power supply, please note that output current will be reduced due to the
impedance. We therefore recommend that an alkali battery with a small internal
impedance be used.
XC6371A, XC6372A, XC6373A Series

VOUT
SD CL
L
V IN
LX VOUT VSS
3 2 1
C IN
GND
XC6371B, XC6372B Series

VOUT
SD CL
L
V IN
EXT VOUT VSS

3 2 1
C IN
Tr
CB RB
GND
Diagram 1. PCB layout example

9
❍ Application Circuits
1. Pager use power supply (Input : single cell, Output : 3.0V, 3mA)
SD
3.0V/3mA
OUTPUT
L
LX V OUT CL
Single +
Cell XC6373A300
C IN +
V SS
XC6373A300 (3.0V, 30kHz, PWM)
Peripherals :
L : 220µH (Coil, Sumida CD54)
SD : MA729 (Schottky Diode, Matsushita)
CL : 22µF / 6.3V (Tantalum Capacitor, Nichicon F93)
CIN : 15µF / 6.3V (Electrolytic Capacitor, low ESR value)
Ex.) Sanyo OS-CON SM Series
Notes :
With pagers, several mA are required when drawing 2.5V∼ 3.0V
from a single cell battery.
The low noise XC6373 series, when used in conjunction with high
inductance values, provides high efficiencies and minimizes the
existence of high frequency noise.
An effective method for reducing the noise factor is to connect a π
type filter to the input/output.
:
2. PDA use power supply (Input : two cells, Output : 3.3V, 300mA)
SD
3.3V/300m A
L OUTPUT
EXT VOUT
CL +
2 Cells Tr XC6372D332 C1
C
+ C IN CE E
GND
XC6372D332 (3.3V, 180kHz, PWM/PFM switching, CE function)
Peripherals :
CL : 150µF / 6.3V (Tantalum Capacitor, Nichicon F93)
Tr : XP161A1355PR (N-channel Power MOSFET, Torex)
CIN : 150µF / 6.3V (Electrolytic Capacitor, low ESR value)
Ex.) Sanyo OS-CON SN Series
C1 : 0.1µF (Ceramic capacitor)
Notes :
With PDA applications, supplying several 100mA of large current
from 2 cells, we recommend using a Power MOSFET with a small
ON resistance value as the external transistor.
;
3. LCD use power supply (Input : 2 ∼ 3 cells, Output : 12V, 2mA)
VDD
+ C DD
SD
12V/2mA
L OUTPUT
VDD R FB1
EXT C FB
2~3 Tr CL +
XC6371F501
Cells
+ C IN VOUT
GND
R FB2
XC6371F501 (5.0V, 100kHz, PWM, VDD separate)
Peripherals :
CL : 22µF / 20V (Tantalum Capacitor, Nichicon F93)
Tr : XP151A12A2MR (N-channel Power MOSFET, Torex)
CIN : 22µF / 10V (Electrolytic Capacitor, low ESR value)
Ex.) Sanyo OS-CON SM Series
CDD : 10µF/16V (Tantalum Capacitor, Nichicon F93)
RFB1 : 66kΩ
RFB2 : 47kΩ
CFB : 3300pF
Conditions of use :
VDD : 2.2V ∼ 7.0V (12V standard)
Notes on use :
Please be aware of the breakdown voltages for the IC, load
capacitor, transistor and diode. As much as possible, ensure a
stable power supply to the VDD pin.
<
Points to note when establishing values for RFB1, RFB2, CFB :
1. Output voltage (RFB1, RFB2) set-up :

Output voltage can be established using the formula below.
However, please take the effects of the internally divided resistance
values between the IC’s VOUT and VSS pins into consideration
when calculating output voltage. The value for internally divided
resistance is between 6MΩ ∼ 16.8MΩ.
RFB1 ÷ (RFB1 + RFB2) = (Output Voltage) ÷ (IC’s set-up Voltage)

Ex.) If RFB1=150kW, RFB2=50kW, IC’s set-up Voltage = 5.0V
then Output Voltage = 20V
2. Speed–up capacitor (CFB) set-up :

Values can be calculated using the formula below.
1 ÷ (2π RFB1 • CFB) ≤ 1kHz
Notes :
High voltages can be generated if using the series with VDD
separated (F type). Output voltage can be set-up via RFB and the IC
will stably operate up to about 30V.
43
n Characteristics
1-1 : Output Voltage vs. Output Current
XC6371A301PR XC6371A501PR
L=100µH(CD54),CL=47µF(Tantalum) L=100µH(CD54),CL=47µF(Tantalum)
3.10 5.2
1.2V 1.5V 2.0V
Output Voltage VOUT (V)

1.2V 1.5V
3.05 VIN=1.0V 1.8V 5.1 VIN=0.9V 3.0V
3.00 2.7V 5.0 4.0V
2.95 4.9
2.90 4.8
0.1 1 10 100 1000 0.1 1 10 100 1000
Output Current IOUT (mA) Output Current IOUT (mA)
L L=100µH(CD54),CL=47µF(Tantalum)
H(CD ) CL F( ) L=100µH(CD54),CL=47µF(Tantalum)
3.10 5.2
1.2V 1.5V
1.2V 1.5V
2.0V
3.05 1.8V 5.1 VIN=0.9V
VIN=0.9V 3.0V
3.00 2.7V 5.0

4.0V
2.95 4.9
2.90 4.8
0.1 1 10 100 1000 0.1 1 10 100 1000
XC6373A300PR
L=100µH(CD54),CL=47µF(Tantalum)
3.10
1.5V
3.05 1.2V 1.8V
VIN=0.9V
3.00
2.7V
2.95
2.90
0.1 1 10 100 1000
Output Current IOUT (mA)
11
2-1 : Efficiency vs. Output Current
100 100
2.7V 4.0
80 80
Efficiency EFFI (%)
Efficiency EFFI (%)

3.0V
60 60 VIN=0.9
VIN=0.9V
1.8V 2.0V
40 1.2V 1.5V 40 1.2V 1.5V
20 20
0 0
0.1 1 10 100 1000 0.1 1 10 100 1000
100 100
2.7V 4.0V
80 80
Efficiency EFFI (%)
Efficiency EFFI (%)
3.0V
60 VIN=0.9V 60 VIN=0.9V
1.8V 2.0V
1.2V 1.5V 1.2V
1.5V
40 40
20 20
0 0
0.1 1 10 100 1000 0.1 1 10 100 1000
XC6373A300PR
100 L=100µH(CD54),CL=47µF(Tantalum)
2.7V
80
Efficiency EFFI (%)
60 1.8V
VIN=0.9V 1.5V
40 1.2V
20
0
0.1 1 10 100 1000
12
3-1 : Ripple Voltage vs. Output Current
100 100
Ripple Voltage Vr (mVp-p)

80 80 3.0
2.0
60 1.8V 60
1.5V 1.5
1.2
40 1.2V 40
2.7
VIN=0.9V 4.0
VIN=0.9
20 20
0 0
0.1 1 10 100 1000 0.1 1 10 100 1000
100 100
80 80 3.0V
1.8V
2.0V
60 1.5V 60
1.5V
1.2V
40 2.7V 40 1.2V
VIN=0.9V
VIN=0.9V 4.0V
20 20
0 0
0.1 1 10 100 1000 0.1 1 10 100 1000
XC6373A300PR
100
80
1.8V
60 1.5V
1.2V
40 2.7V
VIN=0.9V
20
0
0.1 1 10 100 1000
13
4-1 : Input Current (at times of no load) vs. Input Voltage
500 1000
400 800
Input Current IIN (µA)

300 600
200 400
100 200
0 0
0 1 2 3 0 1 2 3 4 5
Input Voltage VIN (V) Input Voltage VIN (V)
100 200
80
150
60
100
40
50
20
0 0
0 1 2 3 0 1 2 3 4 5
Input Voltage VIN (V) Input Voltage VIN (V)
XC6373A300PR
200
150
100
50
0
0 1 2 3
Input Voltage VIN (V)
14
1-2 : Output Voltage vs. Output Current
XC6371B301 XC6371B50
L=47µH,CL=94µF(Tantalum),SD:MA735 L=47µH,CL=94µF(Tantalum),SD:MA735
Tr:2SD1628G,RB=500Ω,CB=0.01µF Tr:2SD1628G,RB=500Ω,CB=0.01µF
3.2 5.2

3.1 5.1
VIN=2.4V VIN=3.0V
3.0 5.0
1.8V
2.9 1.5V 4.9
1.2V 2.5V
0.9V 2.0V
1.5V
2.8 4.8
2.7 4.7
0 100 200 300 400 500 600 0 100 200 300 400 500 600
XC6371B301 XC6372B331
L=22µH,CL=94µF(Tantalum) L=47µH,CL=94µF(Tantalum)
SD:U2FWJ44N,Tr:XP161A0390P,RB=0Ω SD:U2FWJ44N,Tr:XP161A02A1PR,RB=0Ω
3.2 3.4
VIN=0.9V 2.7V
2.0V
3.1 1.2V 3.3

VIN=2.7V
3.0 3.2 1.2V,1.5V,1.8V,2.4V
2.9 1.5V 3.1

1.0V
2.8 3.0
2.7 2.9
0.1 1 10 100 1000 0.1 1 10 100 1000
Note : CIN = 220µF (Electrolytic)
15
2-2 : Efficiency vs. Output Current
XC6371B301 XC6371B501
100 100
VIN=3.0V
VIN=2.4V
80 80
Efficiency EFFI (%)
Efficiency EFFI (%)

60 1.8V 60 2.0V 2.5V
40 1.5V 40
1.2V 1.5V
20 0.9V 20
0 0
0 100 200 300 400 500 600 0 100 200 300 400 500 600
XC6371B301 XC6372B331
100 100
VIN=2.7V VIN=2.7V
2.4V
80 2.0V 80
Efficiency EFFI (%)
Efficiency EFFI (%)
60 60 1.8V
1.5V
1.2V 1.2V 1.5V
40 1.0V 40 0.9V
20 20
0 0
0.1 1 10 100 1000 0.1 1 10 100 1000
16
3-2 : Ripple Voltage vs. Output Current
XC6371B301 XC6371B501
200 200
1.5V

0.9
2.5V
150 150
1.2V 2.0V
100 1.8V 100
VIN=3.0
50 50
VIN=2.4
1.5V
0 0
0 100 200 300 400 500 600 0 100 200 300 400 500 600
XC6371B301 XC6372B331
200 200
1.8V 2.4V
150 150
1.8V
1.5V
1.5V
100 1.2V 100 1.2V
VIN=1.0V
VIN=0.9V
50 50
2.7V 2.7V
0 0
0.1 1 10 100 1000 0.1 1 10 100 1000
17
5 : Operating Start/Retain Voltage vs. Output Current 6 : Output Voltage vs. Ambient Temp.
XC6371A501 XC6371A501
1.4 5.2
VST,VHLD (V)
1.2

VIN=3V, IOUT=10mA
5.1
1.0 VST
0.8
Start/Retain Voltage
5.0
VHLD
0.6
0.4
4.9
0.2
0.0 4.8
0 10 20 30 -40 -20 0 20 40 60 80
Output Current IOUT (mA) Ambient Temp. Topr (OC)
7 : Operating Start Voltage vs. Ambient Temp. 8 : Operating Retain Voltage

vs. Ambient Temp.
XC6371A501 XC6371A501
1.2 1.0
Operating Retain Voltage VHLD (V)
Operating Start Voltage VST (V)
1.0
0.8
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0.0 0.0
-40 -20 0 20 40 60 80 -40 -20 0 20 40 60 80
Ambient Temp. Topr (OC) Ambient Temp. Topr ( C)

O
18
9 : Supply Current 1 vs. Ambient Temp. 10 : Supply Current 2 vs. Ambient Temp.
XC6371A501 XC6371A501
120 10
Supply Current 1 IDD1 (µA)
Supply Current 2 IDD2 (µA)

100
8
80
6
60
4
40
2
20
0 0
-40 -20 0 20 40 60 80 -40 -20 0 20 40 60 80
Ambient Temp. Topr ( C) O Ambient Temp. Topr (OC)
11 : Lx Switch ON Resistance vs. Ambient Temp. 12 : Lx Leak Current vs. Ambient Temp.
XC6371A501 XC6371A501
3 3
Lx Switch ON Resistance RSWON (Ω)
Lx Leak Current ILXL (µA)
2 2
1 1
0 0
-40 -20 0 20 40 60 80 -40 -20 0 20 40 60 80
Ambient Temp. Ta ( C)O
Ambient Temp. Ta ( C)O
19
13 : Oscillation Frequency vs. Ambient Temp. 14 : Maximum Duty Ratio
vs. Ambient Temp.
XC6371A501 XC6371A501
L=100µH,CL=47µF(Tantalum)
140
Oscillation Frequency FOSC (kHz)
100
Maximum Duty Ratio MAXDTY (%)

120
80
100
60
80
40
60
40 20
-40 -20 0 20 40 60 80 -40 -20 0 20 40 60 80
Ambient Temp. Ta ( C) O
Ambient Temp. Topr ( C)
O
15 : VLX Limiter Voltage vs. Ambient Temp.
XC6371A501
1.2
Lx Limiter Voltage VLXLMT (V)
1.0
0.8
0.6
0.4
0.2
0.0
-40 -20 0 20 40 60 80
Ambient Temp. Topr ( C) O
16 : Load Transient Response
XC6371A501
L=100µH,CL=47µF(Tantalum)
7 240
IOUT=1mA-30mA,VIN=3V 210
6 180
Output Voltage 150

5 120
90
4 Output Current 60
30
3 0
-20 0 20 40 60 80
Time (msec)
20
❍ Appendix
A1. Step-up switching regulator operational explanation
1. XC6371/XC6372 Series
The XC6371 series is a Pulse Width Modulation (PWM) controlled
series. The XC6372 Series switches to Pulse Frequency Modulation
(PFM) control during light loads, oscillation frequency drops and the
switching regulator’s consumption current is reduced.
2. Step-up Principles
Diagram A-1 indicates the operating principles of a step-up switching
regulator. With SW ‘ON’, energy accumulates at the coil ; with SW
‘OFF’, the coil’s energy is released. When the coil releases energy,
voltage direction is reversed from what it was when SW was ‘ON’ in
order to maintain a constant current flowing through the coil. By
accumulating this current at VIN, a voltage higher than the input
voltage is generated.
V L = V IN VL
+ - - + I D =I L
VOUT SD VOUT
I S W =I L + +
L L
V IN V IN
SW:O R
CL R SW:OFF CL
N
- -
(a) Energy accumulates at the coil (b) Coil’s energy released
Diagram A-1. Step-up Principles
3. Control Systems
The step-up switching regulator has 2 control systems ; Pulse Width
Modulation (PWM) and Pulse Frequency Modulation (PFM).
3-1. Pulse Width Modulation (PWM) Control

With oscillation frequency fixed, pulse width (namely, step-up switch
ON time) is controlled and output voltage can be maintained at a
constant level by regulating the ‘ON’ duty ratio. Since oscillation
frequency is fixed, output ripple noise can be excluded comparatively
easily and in continuous mode, high efficiencies can be achieved.
54
3-2. Pulse Frequency Modulation (PFM) Control
By altering oscillation frequency, the step-up switch’s ON duty ratio is
changed and output voltage can be maintained at a constant level. In
terms of PFM control with this series, please note that ON time is fixed
and only OFF time changes.
IO U T
Time
T O N :variable
SW:ON
PWM
SW:OFF
T:constant
T :variable
SW:ON
PFM
SW:OFF
T O N :constant
Diagram A-2. PWM and PFM Control

(SW ON/OFF Time Chart vs. Output Current)
Note :
The duty ratio during PWM operation with the PWM/PFM switching
XC6372 Series changes from PFM duty ratio to max. duty ratio.
4. Operating Mode
The step-up switching regulator has 2 operating modes ; a ‘continuous
mode’ during which current flows continuously through the coil, and a
‘discontinuous mode’ during which current flowing through the coil
ceases.
When drawing the same output current (IOUT), diagram A-3 shows
how, in comparison to the discontinuous mode, the coil’s peak current
can be reduced in the continuous mode. Should output current become
large, the mode will switch from discontinuous to continuous.
The relationship between the output current (IOUTC) and the coil’s
inductance (L) at that time can be explained as follows :
IOUTC α VIN ÷ L
55
IL IL
4I O U T
2I O U T
IO U T IO U T
0 0
TON T OFF Time TON TD TI Time
T T
T OFF =T D+T I
(a) Continuous Mode (b) Discontinuous Mode

Diagram A-3. Coil current (IL) in relation to operating mode
(IOUT constant, L changing)
Should inductance (L) increase, the operation mode will be
continuous and efficiency will therefore be improved.
A2. Step-up switching regulator functional explanation
1. Slow-Start
With the slow-start function, output voltage rises slowly when the
step-up switching regulator’s power supply is turned on. Output
voltage overshoot (that occurs when the power supply is turned on)
will thus be controlled and rush current minimized.
Slow-start time (TSS) represents the time from the moment power is
turned on until output voltage reaches the established voltage level.
V IN
V IN
V OUT
VOUT
V IN
Time
T SS
Diagram A-4. Slow-start operating time VIN, VOUT waveforms
56
2. Stand-by Function (CE)
With the stand-by function, consumption current can be controlled as
the IC’s operations are shutdown (CE pin ‘L’ level). In stand-by, input
voltage VIN can be output via the Schottky Diode SD.
CE
High Level
Low Level
0
Time
VOUT
VOUT
V IN
0
Time
TSS
Diagram A-5. Stand-by VOUT waveform
57

PWM Controlled Step-Up DC-DC Converter

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AN010699

XC6371 Series PWM controlled step-up DC/DC converter

Torex Semiconductor Ltd.

Wish to reduce output

Table 2. Inductance Value Selection

Medium Loads 220µH 100µH 47µH

Heavy Loads 100µH 47µH 22µH

1 ÷ (2π CL • ESR) ≤ 25kHz

4-1. N-Channel Power MOSFET

4-2. Bipolar Transistor

4-3. Bipolar Transistor’s RB, CB values

4-3-1. Base Resistance (RB)

4-3-2. Speed–up Capacitor (CB)

XC6371A, XC6372A, XC6373A Series

XC6371B, XC6372B Series

EXT VOUT VSS

Diagram 1. PCB layout example

XC6373A300 (3.0V, 30kHz, PWM)

XC6372D332 (3.3V, 180kHz, PWM/PFM switching, CE function)

3. LCD use power supply (Input : 2 ∼ 3 cells, Output : 12V, 2mA)

XC6371F501 (5.0V, 100kHz, PWM, VDD separate)

1. Output voltage (RFB1, RFB2) set-up :

RFB1 ÷ (RFB1 + RFB2) = (Output Voltage) ÷ (IC’s set-up Voltage)

2. Speed–up capacitor (CFB) set-up :

1 ÷ (2π RFB1 • CFB) ≤ 1kHz

1-1 : Output Voltage vs. Output Current

1.2V 1.5V 2.0V

Output Voltage VOUT (V)

3.05 VIN=1.0V 1.8V 5.1 VIN=0.9V 3.0V

3.00 2.7V 5.0 4.0V

Output Voltage VOUT (V)

3.00 2.7V 5.0

Efficiency EFFI (%)

40 1.2V 1.5V 40 1.2V 1.5V

Efficiency EFFI (%)

Ripple Voltage Vr (mVp-p)

Input Current IIN (µA)

Input Current IIN (µA)

Output Voltage VOUT (V)

3.1 1.2V 3.3

2.9 1.5V 3.1

Note : CIN = 220µF (Electrolytic)

Efficiency EFFI (%)

Output Current IOUT (mA) Output Current IOUT (mA)

Efficiency EFFI (%)

Output Current IOUT (mA) Output Current IOUT (mA)

Note : CIN = 220µF (Electrolytic)

Ripple Voltage Vr (mVp-p)

100 1.8V 100

Output Current IOUT (mA) Output Current IOUT (mA)

Note : CIN = 220µF (Electrolytic)

Output Voltage VOUT (V)

7 : Operating Start Voltage vs. Ambient Temp. 8 : Operating Retain Voltage

Ambient Temp. Topr (OC) Ambient Temp. Topr ( C)

Supply Current 2 IDD2 (µA)

Ambient Temp. Topr ( C) O Ambient Temp. Topr (OC)

Lx Leak Current ILXL (µA)

Maximum Duty Ratio MAXDTY (%)