Professional Documents
Culture Documents
General FEA Theory, Numerical Methods
General FEA Theory, Numerical Methods
Structural Dynamics
Hurty, W.C., Rubinstein, M.F., "Dynamics of Structures", 1964
[STI: very useful book on dynamics, uses matrix methods, so easily extendable
to FEA]
Thomson, W.T., Dahleh, M.D., "Theory of Vibration with Applications", 5th ed,
1998
Heat and Mass Transfer
Holman, J.P., "Heat Transfer", 8th ed, 1997
[STI: good heat transfer text]
Incropera, F.P., DeWitt, D.P., "Fundamentals of Heat and Mass Transfer", 4th
ed, 1996
[STI: good heat transfer text]
White, F.M., "Fluid Mechanics", 4th ed, 1999
[STI: good fluid dynamics text]
Welty, J.R., Wicks, C.E., Wilson, R.E., "Fundamentals of Momentum, Heat, and
Mass Transfer", 3rd ed, 1984
Materials
Lemaitre, J., Chaboche, J.L., "Mechanics of Solid Materials", 1994
[STI: very thorough text on materials]
Dowling, N.E., "Mechanical Behavior of Materials", 2nd ed, 1999
[STI: good text on materials, easy reading]
Treloar, L.R.G., "The Physics of Rubber Elasticity", 1958
[STI: great reference on rubber elasticity]
Ogden, R.W., "Non-linear Elastic Deformations", 1997
Simo, J.C., Hughes, T.J.R., "Computational Inelasticity", 2004
Kojic, M., Bathe, K.J., "Inelastic Analysis of Solids and Structures", 2004
Acoustics
Kinsler, L.E., Frey, A.R., Coppens, A.B., Sanders, J.V., "Fundamentals of
Acoustics", 3rd ed., 1982
[STI: good intro text on acoustics]
Pierce, A.D., "Acoustics: An Introduction to Its Physical Principles and
Applications", 1991
[STI: good intro text on acoustics]
Morse, P.M., Ingard, K.U., "Theoretical Acoustics", 1968
[STI: very good overall text on acoustics; for me, it's a bit tough but very
worthwhile reading]
Electronics Packaging
Christiansen, D., "Electronics Engineers' Handbook", 4th ed., 1996
[STI: good, thorough text. Can think of it as a "Mark's Handbook" for
Electronics]
Steinberg, D.S., "Cooling Techniques for Electronic Equipment", 2nd ed., 1991
[STI: A must for electronics packaging, thermal issues]
Steinberg, D.S., "Vibration Analysis for Electronic Equipment", 2nd ed., 1988
[STI: A must for electronics packaging, structural issues, mainly related for
military applications -- shock & vibe, etc.]