Multiple customer benefits

Moulding
•reduces Mould Cleaning Frequency
•shortens Cleaning Time
•reduces incomplete and package
crack rejects
•improves package visual quality

Trim/Form
• reduces solder pick up
• improves tool life
• wear indicator
Properties of
BALINIT®

BALINIT® A BALINIT® C BALINIT® D

• Microhardness (HV 0.05) 2300 1000-1500 1750

• Deliverable Film Thicknesses [µm] 1) (1-2/3-4) µm 2-3 µm (2/3-4) µm

• Coating Temperature [°C] 350/500 250 500

• Colour gold-yellow black-grey silver-grey

• Maximum Service Temperature [°C] 550 300 700

• Friction coefficient (µ)against steel 0.4 0.2 0.4

Properties of BALINIT® versus chrome plating

Properties Chrome BALINIT® Remark

Hardness HV900 HV1700 - BALINIT® is more resistant
2300 to abrasive wear

Thickness 1-10 µm 3-4 µm BALINIT® is well within

design tolerance

Microstructure uneven even BALINIT® is smooth.

Minimises staining and
package crack
Edge buildup yes no No regrinding needed after
BALINIT® coating
Chrome Plating
TiN Coating
Balinit® Coating
 BGA

• Extend cleaning frequency from 180

shots to ~290 shots. Package: BGA
• Improve productivity by 4% -additional
Moulding Compound: Plaskon
41.65k/wk for 360L and 37.95k/wk for
SMTB1-FX
421L.
• The company will save a total of Original : Balinit A Coating
US$52.50k for year 2002 - US$16.21k for
cleaning materials and US$36.29k for
dummy substrate.
• Manning ratio will change
from 1:1.5 to 1:2.
• FWP presentation is ww14.4. Full
implementation is ww18.
TO3PH

•Package: TO3PH
•Moulding Compound : Nitto
MP4100WP, Toshiba KE550SP, Nais
CV3300ZTS
•Original: Chrome Plating

•Cleaning Frequency
•Cr = 1100 shots
•TiN = 1157 shots
•Balinit D = 2300 shots

•Savings:
•Cleaning Material = RM40,400/yr
•Downtime: RM660,000/yr
SOIC 8LD
Moulding Compound: Cookson AMC-2P
Mould Cleaning: 2 rubclean, 3 nikalet, 1 elastowet, 1 KNR-2, 3 dummy
Original Condition (Hard Chrome)
• Cleaning Frequency: 2 X/day
• Package Crack rejects
Balinit D Coating
• Cleaning Frequency: 1 X/day
• Zero Package Crack rejects
• Package release without conditioning during coating buy-off
• No difference in package surface quality for 2X/day(Chrome) and 1X/day cleaning

2X/day mould After implementation of After implementation of

cleaning(Chrome) 1x/day (1st day) 1x/day (10th week)
Polyled
•Package: Polyled
•Moulding Compound : Hysol MG18 clear

•Original Condition(Chrome)
•Mould Cleaning twice per day
•Delamination and rough surface rejects

•Balinit D
•Mould cleaning once per day (stretched to 1
week)
•Reduce rough surface and delamination
rejects

•Savings
•Cleaning Materals = RM102,600/yr
•Downtime: USD135,00/yr (900 hrs/yr)
 SOIC 8L Matrix
• Moulding Compound : Sumitomo EME 6300/6600/6730 & KMC
184-8

• Original (Chrome Plating)

• Cleaning 1 X per day
• Incomplete, void, package chip rejects
• Balinit D Coating
• Cleaning 1 X per 2 days (stretched to 3 days)
• Zero defects due to incomplete, void and package chip
 QFP 14 X 20
• Moulding Compound : Nitto MP8000C / Sumitomo EME6300HG

• Original: TiN coating

• Cleaning : 1 X per day
• Cleaning Procedures : 8 cleaning shots + 2 conditioning shots
• Balinit D Coating
• Cleaning : 1 X per 2 days
• Cleaning Procedures : 7 cleaning shots + 2 conditioning shots
• Zero defect ppm for void / package contamination/ package chip
Balinit® Coating Track Record
• Customer Package
• QFP 14 x 20
• LQ 28 x 28
• LQ 100L
• SOIC 8L
• SC 70
• TQFP 14 x 20
• Polyled
• Rose
• FLA
• SOIC 8L Matrix
• BGA 31X31
• BGA23 X 23
• 44PSOP
• TO3PH
• SOIC8LD
• TSOP54
• FAM-F1, SIM60(minimold)
• LQFP 10 X 10
• TSOP48
• TSSOP 8LD HD
• SPM32-AA/SPM27-AA
• TO-3PF(TO-247)
Balinit Mold compound
D Nitto MP8000
D Nitto MP8000, Sumitomo EME7320
D Nitto MP8000, Sumitomo EME6300, EME7351
D COOKSON AMC-2P
A Nitto MP8000ANF
A Ciba Geigy 1284va-8
D Hysol MG 18 clear
D Hysol MG 18 clear
D Plaskon SMT-B-1N
D EME6300/6600HR/6730 (Sumitomo) &
Shinetsu KMC 184-8
D Plaskon SMTB1-FX
D Plaskon SMTB1-FX
A Shinetsu KMC 6600
D Nitto MP4100WP, Toshiba KE550SP, Nais
CV3300ZTS
D Nitto MP8000, EME6600
D Hitachi 6000 series
D Nitto
A Hitachi RM590/690
D
A
D KTMC 5400 SM/SW
D KTMC 7100S
Structure of the BALINIT C - coating
Total coating structure Balinit C-Section

coating 0.1 µm

white lamella:

black lamella:
interlayer

substrate material
 BALINIT® C means Consistency

Advantages of Balinit® C vs other DLC/DFC

• multi-layer coating. Each layer is about 0.1 micron allows the

coating to wear gradually and lowers the risk of peeling off
• Balinit ® C is very consistent in performance due to its nature of
low stress compared to other DLC coating.

• a layer of coating(about 0.5micron) which is gold in colour below

the Balinit ® C serves as a wear indicator and provides response
time for end user to react.

• Balinit ® C is a conductor. Other DLCs (insulator) will cause

ESD problems.
• Attractive price and delivery time as Balzers is a coating service
provider and coating systems/machines maker located nearest to
you.
INSPECTION CRITERIA FOR IC FORM
PUNCH AND DIE
Incoming Inspection under 20X magnification
• The lapping or grinding roughness of functional surface
for critical IC form punch and die should be Ra
0.025µm (N1) or less than Ra 0.05µm (N2) depend
on customer specification.

• The lapping roughness of functional surface for less-

critical IC form punch and die should be less than Ra
0.1µm (N3).

• Functional surface should not have any pitting,

scratches, dent crack and stain.
INSPECTION CRITERIA FOR IC FORM
PUNCH AND DIE

Outgoing Inspection (naked eye)

• No flaking at functional

• Rework if uncoated dot > Ø0.25mm or uncoated line >

1mm (length) x 0.25mm (width) at functional

Outgoing inspection will be checked with naked eye unless

specified by customer.