CSTD 104 570 - MW Antenna Module Complete PDF

Welcome to CST !
CST STUDIO SUITE™

Training Class
MW & Antenna Module
CST – COMPUTER SIMULATION TECHNOLOGY | www.cst.com

Agenda
Welcome
Summary of Core Training

Waveguide Ports – Advanced
Coffee Break
Workflow Example 1
Meshing Overview
Lunch Break
Workflow Example 2
High Performance Computing
Coffee Break
Post-Processing & Special Features for Antennas

Open Discussion
Choose from one of the following workflow examples:

 Horn antenna + reflector (farfield source)  Patch antenna array
 PIFA antenna & matching network  RCS calculation
 RFID-NFC + mobile phone
Summary of first Training Day
Built-In Help Mechanisms

Basic Modeling
Solver Overview & Solver Choice
Definition of Ports
Basic Material Models
Boundary & Symmetry Conditions
Postprocessing & Result Handling
Optimizer Overview
Workflow Examples


 Summary – Waveguide port basics
 Frequency dependent modes (inhomogeneous ports)
 Port mode information
 Mode polarization
 Reference plane – Phase de-embedding
 Boundary conditions of waveguide port edges
 Accuracy / Adaptive port mesh refinement
 Hexahedral meshing
 Multipin waveguide ports
 Homogeneous multipin ports
 Inhomogeneous multipin ports
 Single-ended multipin ports

Summary – Waveguide Port Basics
 Waveguide ports are used to excite electromagnetic fields with the
modes given by an infinitely long waveguide, e.g.
 a rectangular waveguide,
 a coaxial cable or
 a microstrip line.
 Waveguide ports match the real mode pattern better & yield higher
accuracy in S-parameters than discrete ports.
 The signal of waveguide ports is normalized to 1 sqrt(Watt) peak
power.

Frequency Dependent Modes
 Frequency dependent mode patterns occur for all kind of
inhomogeneous waveguide ports.
 A waveguide port will be classed as inhomogeneous if more than one
different dielectric material exists in the cross-section of the port.
 Examples are
 microstrip lines (QTEM mode)
 coplanar lines (QTEM mode)
 two or more dielectrically loaded waveguides (no QTEM mode)
Loaded Waveguide Microstrip Line

 Different behavior of the solvers
 The frequency domain solvers automatically calculate
the modes for each frequency point.
 The transient solver calculates the mode only at the
mode calculation frequency by default.

 Using the inhomogeneous port accuracy enhancement the port modes
will be calculated in the frequency range for a given number of
frequency samples (QTEM modes). This must be activated in the
transient solver dialog first.

 For no QTEM modes a broadband enhancement feature is available.

 Alternatively, a generalized port mode solver is available which
automatically analyze the broadband characteristics of each mode
(QTEM modes and no QTEM modes).

Port Mode Information
 Using the transient solver, port mode information is easily available.
It offers the possibility to calculate the properties of the port modes
at one frequency or at a few sample frequencies using the sweep
functionality.

Mode Polarization
 When two or more port modes are
degenerated, the orientation of these
modes can be defined.
 A polarization angle between 0° and
360° can be defined which refers to the
main direction of the E-field for the first
of the degenerated modes.
 The second mode will be calculated
orthogonal to the first mode.
Polarization angle
Electric field (mode 1) Electric field (mode 2)

Reference Plane – Phase De-embedding
 Using the ‘Distance to reference plane’
feature, the correct phase information for
the S-parameters (de-embedding) is
obtained.
 Positive values move the reference
plane outwards, negative inwards.
 The de-embedding can also be
performed after the calculation run.
See Results->S-Parameter Calculations->
Deembed S-Parameter.
Reference plane of interest

Boundary Conditions at Waveguide Port Edges
 Boundary conditions at the port edges are required to calculate the
port modes
 The boundary conditions at the port’s edges will adopt the
settings from the 3D model. In case of an ”open” boundary in
the 3D model, a ”magnetic” port boundary will be used.
Open
3D model boundary
conditions
Symmetry plane Magnetic

Electric
Magnetic
Resulting boundary
conditions for the port
Electric

Boundary Conditions at Waveguide Port Edges
 An electric shielding for the port can be enforced.
 In addition, for the Frequency Domain solver, it is possible
to consider periodic port boundaries with a nonzero phase
shift (Floquet ports).
If this option is selected

electric boundary
conditions will be applied
to the selected port. All port boundaries
are electric now.

Accuracy / Adaptive Port Mesh Refinement
 The accuracy of the port mode solver is displayed in the
information text of the 2d-pattern view.
 In the T-solver, an adaptive port

meshing feature is available which
refines the mesh to make a line
impedance adaptation (by default).

Hexahedral Meshing
 For an accurate simulation of the waveguide port in the transient
solver, it is necessary to have a region of longitudinal homogeneous
material in front of the port (width: 3 mesh steps).
 This condition is automatically checked during the start of the
simulation. It can't be deactivated.
 If this condition is not fulfilled by the mesh generation, it is
useful to apply local mesh settings to achieve it.
Top view
3 mesh steps
Port for a microstrip line
Port mapped onto the mesh

Multipin Waveguide Ports
 A multipin waveguide port is characterized by having more than
two conductors in the port region (incl. shielding).
 The main application is given by homogeneous multiple coaxial or
connector ports.
 The multipin port can also be applied to inhomogeneous ports if
the propagation constants of the modes differ only slightly.
Shielding
Conductors
Coax with multiple inner conductors Multiple microstrip lines

 Definition, e.g. two differential pairs
Pick face.
Press ‘OK‘, and

double-click pin

 Definition, e.g. two differential pairs
Repeat with other pins
Set number = 2
...
Press ‘Close‘ to finish.

 Labeling of Multipin ports
‘Set’= mode number
1(2,+) = port number (mode number, potential)
 A ‘Set‘ corresponds to a particular definition of a mode via the

potential distribution for the conductors.
 Therefore, a ‘Set‘ represents a given superposition of the port‘s
eigenmodes.
 Pins without a potential definition are treated as a ground
conductor, and potential definitions on pins for another ‘Set‘ are
set to zero.
 Homogeneous multipin modes
 The occurring TEM modes are degenerated (having the same
propagation constant).
 The TEM modes are orthogonal to each other, so that they can
be superimposed to new (desired) mode patterns.
 The definition of multipin modes allows you to define exactly
the mode pattern that you want to excite.
Mode 1 Mode 2
Meshing Overview

How to Get a Good Mesh?
1. Use Project Templates
 For several classes of applications (e.g. antennas, PCB boards,
etc.) there are some common properties for a "good" mesh.
 Project templates apply some basic settings for the particular area
of application, including global mesh settings.
2. Use Automatic Default Settings
 Make use of automatic settings to let the software choose the
most appropriate algorithm (e.g. order of curved elements).
3. Use Adaptive Mesh Refinement
 Typically the most efficient way to get a refined mesh is using the
automatic mesh refinement which refines the initial mesh
wherever needed according to solver error estimators.

Mesh Generation - A Typical Workflow
This adjusts the global mesh
Project properties to values which we
Template found to be a good starting point
for a certain area of application.
Global Mesh Optimize the global mesh settings

Settings for the geometry of your model.
Start the solver and perform a

Automatic Mesh Perform
convergence study (e.g. using
Refinement Groups Simulation adaptive mesh refinement).
no Simulations and mesh studies

Results provide insight about the
dependency of the results on the
yes mesh settings.
Automation

Mesh Types
 Each algorithm is well suited to a certain type of mesh:
Hexahedral Mesh Tetrahedral Mesh Surface Mesh

• Transient simulations • Frequency domain • Integral equation
simulations methods
• Eigenmode calculations
The mesh type can be changed using the drop-down

menu of the button in the toolbar.

Hexahedral Meshing for
Transient Simulations

Mesh View
Mesh lines in one
mesh plane are shown
in the 3D view.
View mesh.
Mesh controls are
displayed in the mesh
view.
Information about mesh plane.
The total number of mesh cells Corner Fixpoints

is displayed in the status bar. Correction

Global Settings (I)
Absolute and frequency

dependent setting to
determine the largest
mesh step.
Automatically create
Settings to limit the and use mesh controls.
size of the smallest Strongly recommended!
mesh step.

Global Settings (II)
"Lines per wavelength" is based on

the upper limit of the frequency
range.
Thus, increasing the upper frequency
limit usually leads to a finer mesh.
"Lower Mesh Limit" is based on the

dimensions of the computational
domain.
The diagonal of the smallest
boundary face of the comp. domain
is divided by this number. The result
is used as the max. mesh step width
allowed in the model.
Global Settings (III)
 The time needed to complete a time domain simulation strongly
depends on the size of the smallest mesh step.
The "Mesh Line Ratio Limit" specifies the

maximum value allowed for the ratio of
the maximum mesh step width to the Mesh Line Ratio Limit
minimum mesh step width.
The "Smallest Mesh Step" specifies the minimum

value allowed for the minimum mesh step width
in terms of the units defined in the project.
Note: If the settings for "Steps per Wavelength"
or "Lower Mesh Limit" lead to a smaller value Smallest Mesh Step
then the "Smallest Mesh Step" setting is ignored.
Mesh Groups
 Local mesh settings can be applied to single
objects by defining a mesh group and assigning the
object to the specific group, e.g. per drag&drop.
 The maximum mesh step width can be defined for
each coordinate direction in a mesh group.
 Pre-defined groups are available for
 "Excluding from Simulation" and
 "Excluding from Bounding Box".
Solid1 is
ignored in the
simulation but Only the sphere is
considered for considered for
the mesh. bounding box creation.
Special Enhancements
 CST has extended the numerical algorithms with enhanced material
approximation techniques.
Continuous material
distribution
(object with curved
boundaries)
Developed by CST
Hexahedral mesh with PBA material
approximation for metallic objects
Hexahedral mesh with TST material

Hexahedral mesh with simple
approximation for metallic objects
"staircase" approximation
Adaptive Mesh Refinement
 Adaptation stop criteria

 S-parameters
 0D result template
 Two refinement strategies
 Expert system based
 Energy based
 Adaptation results are shown in the
navigation tree

Representative Meshes (I)
The gap between inner and outer
conductor should be resolved by at
least one mesh cell.
Partially filled cells are handled with
PBA technique.
Coaxial Line
Depending on the thickness and the

2 mesh cells permittivity of the substrate the
number of mesh lines should be at
least as shown in the picture.
3 mesh cells It is NOT necessary to resolve the
(depends on thickness)
thickness of the microstrip line by the
Microstrip Line mesh.

Representative Meshes (II)
The gap between multiple strip lines

should be resolved by at least two
mesh cells.
Parallel Microstrip Lines
A discrete port must be discretized by

at least one mesh cell.
Please note that these are minimal

requirements and possibly a finer
mesh is needed for the desired
Discrete Ports accuracy of the results!
Staircase Cells
 Cells which contain more than two
metallic material boundaries are
completely filled with PEC.
 Staircase cells are shown in the mesh
view and a warning is shown by the
solver to inform you of this
modification.
 Staircase cells must be avoided if they
influence the electrical behaviour of the
model, i.e. if they introduce shortcuts.
 Solution: Increasing the resolution of the
mesh removes the shortcut.
 If they do not change the electrical
behaviour, they are usually OK.
 Example: Staircase cell at a wire in free
space.

Online Help - PBA and TST
PBA TST
Whenever a mesh cell cuts more than two metallic material boundaries, the cell
is filled with PEC material (staircase cell). Quite often such cells do not
influence the simulation result much, but if they introduce shortcuts (as shown
on the previous slide) this might be critical.

Connectivity Check
 The connectivity check helps to detect unintended short-circuited
shapes or unintended unconnected shapes which may be caused by
inaccurate CAD imports, wrong layout design, too coarse meshing,
etc.
 It depends on the solver choice, so the matrix must be generated

beforehand.
Shows elements which have

an electrical connection
with the selected object.

Tetrahedral and Surface Meshing
for Frequency Domain Simulations

Global Settings
Steps per wavelength: This value refers to the

highest frequency of the simulation. It defines
the minimum number of mesh cells that are
used for a distance equal to this wavelength.
Minimum number of steps: This value controls

the global relative mesh size and defines a
lower bound for the number of mesh cells
independently of the wavelength. It specifies
the minimum number of mesh edges to be used
for the diagonal of the model bounding box.
Note: A tetrahedral mesh requires a valid ACIS model.

Mesh Groups
 Local mesh settings can be applied to single
objects by defining a mesh group and assigning the
object to the specific group, e.g. per drag&drop.
 The maximum mesh step width can be defined for
each mesh group.
 Pre-defined groups are available for
 "Excluding from Simulation" and
 "Excluding from Bounding Box".
Solid1 is
ignored in the
simulation but Only the sphere is
considered for considered for
the mesh. bounding box creation.
Curvature Refinement
 Elements of higher order should be used to mesh curved objects
accurately.
 Automatic curved elements are the default setting
(recommended).

Adaptive Mesh Refinement
 Multi-frequency adaptive mesh refinement
 The adaptation frequency samples are sequentially processed before
the broadband sweep.
 If no adaptation frequency is given, the algorithm searches for a
frequency point with small reflection coefficient.
Mesh adaptation at 75.1 GHz and 77 GHz.
Initial mesh Optimized mesh

Troubleshooting
 What to do if the default tetrahedral mesh generation fails?
 Check the new TET mesher by selecting "Tetrahedral (preview)".
1. Choose the meshing method "Default (surface based)".
2. Choose the meshing method "Octree (volume based)".

High Performance Computing
Overview

Hardware Based Acceleration Techniques
Multithreading GPU Computing
Distributed Computing MPI Computing

Multicore / Multiprocessor Parallelization
- Key Facts -
Licensing: Up to 48 threads included
CST Product Solver Special Limitations

CST MICROWAVE STUDIO® None
Max. number of threads (iterative): 2 x num. of sockets
None
New eigenmode solver is fully multithreading parallelized
None
CST PARTICLE STUDIO® None
None
Not all preconditioners are parallelized.

CST EM STUDIO® All
Only parts of the solver process is parallelized.
Limitation for all: Hyperthreading (HT) is not used. Hyperthreading

deteriorates the performance of the solvers!

Multithreading Performance
The bottleneck which limits the perfor-
Typical Speedup mance of the transient solver is the
7 memory bandwidth of the system
(i.e. how fast can data be copied
Transient Solver
6 from/to RAM).
I-Solver (Direct)
4
Speedup
CPU CPU
3 Core Core
2 CPU CPU
Core Core
1
Memory Controller
0
1 2 4 8
Number of Threads Many CPU cores are competing for memory access.
Widen this bottleneck!  GPU Computing
Measured on a system with dual Intel Xeon E5520 (2.27 GHZ), 24 GB RAM, Windows Server 2003 R2


GPU Computing
- Extensive Documentation -
Solvers supported:
Extensive documentation (hardware, supported drivers, setup instructions for all

platforms...) of the GPU Computing feature is available via a link in the CST online help.

Supported GPU Devices
Recent Tesla GPU Devices "Kepler"
Tesla K10/K20/K20X External rack mounted devices

Tesla K20 (passive cooling/typically are available from "Cubix",
(for workstations) integrated in rack mounted servers) "Dell", etc.

GPU Computing
- Performance -
Simulation Time Total Speedup

18000 14
16000
12
14000
10
12000
Port 4
10000 8
Port 3
Solver Loop
Port2
8000 6 Total Time
Port1
6000 Matrix Calc
4
4000
2
2000
0 0
CPU 1 GPU 2 GPUs 4 GPUs CPU 1 GPU 2 GPUs 4 GPUs
Model: 40 million mesh cells, 4 ports

CPU: Dual Intel Xeon E5-2650, 128 GB RAM
GPU: NVIDIA Tesla 20 series

GPU Computing
- Conclusion -
 GPU Computing provides a very good performance improvement for

simulations of a limited size.
 The maximum model size (number of mesh cells) which can be

handled by GPU Computing is limited by the amount of memory
available on the GPU hardware (currently max. 6 GB per GPU).
 For larger models combined MPI Computing and GPU Computing can
be used to overcome the memory limit of the GPU hardware.
 For models with many ports or for parameter sweeps/optimization

runs Distributed Computing can further shorten the simulation time.


Distributed Computing (DC)
- Overview -
 Some parts of a simulation task are independent of each other:

 Computation of different frequency samples for F-solver and I-solver
 Simulations performed during a parameter sweep
 Simulations performed during an optimization
 Excitation from different ports
 DC allows the distribution of such

independent simulation tasks on
different workstations in a LAN.
The DC functionality is part of each standard license for up

to two simultaneous frequency sample calculations or port
excitations runs.
DC – Working Principle
User can switch off his workstation. CST STUDIO SUITE™
The DC Main Controller takes care Frontend
of the job.
connects to
Users send simulation jobs
to the DC Main Controller.
DC Main Controller
The DC Main Controller
selects solver servers for
the jobs and sends the
simulation tasks to them.
It manages a simple FIFO connects to
queue.
DC Solver Servers

CST STUDIO SUITE™
Frontend
connects to
As soon as a solver server

has finished its work the DC Main Controller
results are automatically Results are saved by MC if
transferred back to the frontend is not connected.
frontend.
connects to
DC Solver Servers

CST STUDIO SUITE™
Frontend
connects to
As soon as a solver server

has finished its work the DC Main Controller
results are automatically Results are saved by MC if
transferred back to the frontend is not connected.
frontend.
connects to
DC Solver Servers

DC – Inhomogeneous Clusters
CST STUDIO SUITE™

Frontend
If you have very complex policies or

Additional constraints can requirements such as:
- priorities for users/jobs,
be defined which allows a - hardware is not dedicated to CST,
"fine grained" DC Solver - both MPI and DC jobs must run on your
cluster,
Server selection. you may integrate the DC system now into your
favorite queuing system.
1 GPU
24 GB RAM 24 GB RAM 48 GB RAM 96 GB RAM

DC Simulation Time Improvement
Speedup (Total Time)

30
25 CPU
1 GPU (Tesla 20)

20
Speedup
15
10
• Model has
0
16 ports.
1 2 4 8
• Only 8 ports need to be computed if Solver
Number of DC defining
Servers symmetry conditions).
• Distribute the 8 simulation runs to different solver servers with GPU acceleration.
Dual Intel Xeon X5675 CPUs (3.06 GHz), fastest memory configuration, 1 Tesla 20 GPU per node,
1 Gb Ethernet interconnect, 40 million mesh cells
Distributed Computing
- Conclusion -
 Distributed Computing provides the possibility to distribute

independent parts of a simulation or a series of simulations to a
network of servers.
 This provides a very good speedup for multiport models or parameter

sweeps.
 Each of the simulation servers could be accelerated by GPU

Computing. Providing even a better speedup.
 Efficient solution for multi-user environments.
 Distribution of frequency samples (freq. domain solvers) and

distribution of port excitation is included in each standard license for
up to two ports/samples!


MPI Computing
- Area of Application -
MPI Computing is a way to handle very large models efficiently.

Some application examples for MPI Computing:
Electrically very large structures Extremely complex structures

(e.g. RCS or lightning strike simulation) (e.g. SI simulation for a full package)

MPI Computing – Working Principle
Node 4 CST STUDIO SUITE™
Node 1
Frontend
Node 3
connects to
Node 2
MPI Client Nodes
Domain decomposition
is shown in mesh view.
High speed/low latency interconnection network (optional)
• Based on a domain decomposition of the simulation domain.

• Each cluster computer works on its part of the domain.
• Automatic load balancing ensures an equal distribution of the workload.
• It works cross-platform on Windows and Linux systems.

A Solution for Challenging Problems
3D transient simulation of a lightning strike hitting an airplane.
Subdomain boundary
Magnetic field
1 billion mesh cells (absolute values on 2D plane)
Combined MPI Computing and GPU Computing

System: 8 compute nodes with dual Intel Xeon E5530, 2.4 GHz, Infiniband (QDR, 40 Gb/s),
2 Tesla 10 GPUs per node
Model was provided by "Institut für Theorie Elektromagnetischer Felder" (www.temf.de)

Cloud Computing for HPC Workloads
If you're not continuously dealing with HPC workloads you may want
to rent hardware with preinstalled CST simulation software.
CST provides application

+ license for the setup.
HPC hardware provider CST works together with
allows access to HPC the HPC hardware
cluster-system. provider to install and
CST software is preinstalled configure CST STUDIO
and configured for the
SUITE for use on the
system.
cluster system.
Some providers of HPC hardware on demand:
Please contact your CST sales representative for more information.

MPI Computing
- Conclusion -
 MPI Computing provides the possibility to solve extremely large

problems (> 1 billion mesh cells for transient solver).
 MPI Computing is the way to go when a problem is just too large for
GPU Computing.
 Combined MPI Computing and GPU Computing provides a good

possibility to accelerate an MPI simulation.
 If your HPC simulation workload is not sufficient to justify the

investment into an own cluster system CST you may go for a cloud
offering.

Acceleration Features
- Which Acceleration Technique should I use? -
Number of
Solver Model Size Acceleration Technique
Simulations
Transient below memory limit
low GPU Computing
of GPU hardware
Transient below memory limit

medium/high GPU Computing on a DC Cluster
of GPU hardware
Transient
above memory limit
- MPI or combined MPI+GPU Computing
of GPU hardware
Frequency can be handled by a

medium/high Distributed Computing (DC)
Domain single machine
Integral can't be handled by

- MPI Computing
Equation a single machine
Integral can be handled by a

medium/high Distributed Computing
Equation single machine
Besides the special acceleration features, the CST developers work to improve the
performance of the solvers on normal workstations (multithreading, memory
layout optimizations, workflow improvements...).
Supported Acceleration Methods
Acceleration methods supported by the solvers of CST STUDIO SUITE®.
Distributed
Solver Multithreading GPU Computing MPI Computing
Computing
direct
solver
direct CPU only
solver no GPU
on one
GPU card
Most other solvers support Multithreading and Distributed Computing for

parameter sweeps and optimization.
Acceleration Token Concept
- Unified License for all Acceleration Features -
GPU Computing

- Basic Concept -
Basic Concept:
 Invest into a basket rather than a single feature.

 Basket includes GPU Comp., MPI Comp. , DC, simPorts, simFreqs.
 Check out on demand (for each single run!).
 Availability of tokens limit the volume of functionality accessible.
 Tokens do not expire and are released again after usage
of related feature has been stopped.
Most flexible – Most cost effective – High safety for investment

- Token Table / Example -
Example:

Performance Training
A Training Course dedicated to Simulation Acceleration is available.
Hardware based
acceleration techniques
as well as solver settings
influencing simulation
performance are covered
by the course.

Post-Processing & Special
Features for Antennas

Total Radiated Power (TRP)
There are three possibilities to calculate the TRP value.
 Macros → Results → Farfield → Show Total Radiated Power (TRP)
Specify power
level in Watt
or dBm.
Choose linear
or logarithmic
TRP output.
 Post Processing: 2D/3D Field Post Processing → Combine Results

 Template Based Postprocessing → Farfield & Antenna Properties →
Farfield Result → Evaluation Range: 3D → Result value: TRP

Full System TRP
TRP calculations are possible from CST DESIGN STUDIO™ as well as
for combined results from multiple ports.

Total Isotropic Sensitivity (TIS)
TIS handling is very similar to TRP.
Specify receiver  Only one (TIS or TRP) can

sensitivity in be displayed at the time.
Watt or dBm.  TIS can also be applied to
CST DESIGN STUDIO™ full
Specify linear or system or multi-port
logarithmic TIS combined results.
output.
TIS far-field monitors are created.
TIS is also displayed in the far-field plot.

Communication Networks
Communication antennas need to cope with a complex environment.
All base-station antennas are Multi-path signal trans-

placed near the horizontal mission may lead to
plane destructive signal overlay,
 specific power weighting resulting in local deep dips
(called Rayleigh-Fading)
 Diversity/MIMO
Tilted reflecting planes

change signal polarization
 Cross Polarization Rate
(XPR)

Mean Effective Gain
 TBP → Farfield & Antenna Properties → Farfield Result (Advanced) →
MIMO
Define Cross Define (and visualize)

Polarization Rate the power distribution
(XPR) function

Diversity / MIMO Antennas
Multiple antennas (antenna diversity) may overcome problem of fading dips.
Antenna 1  TBP → Farfield & Antenna Properties
→ Farfield Result (Advanced) → MIMO
Select from:
• Diversity Gain
• Envelope Correlation
Coefficient
Antenna 2 • Multiplexing
Efficiency
“best of“ (diversity gain)

Load farfield of
second antenna
Set XPR & power

distribution
 For lossless antennas in isotropic environment

the correlation and diversity gain can also be
calculated from S-Parameters.
SAR Results
Opens logfile containing all results.

2D or 3D plot including
information about the
Visualization of position of the maximum.
max. SAR cube
Macros → Results → 2D 3D Results → Plot

Averaging Volume for maximum SAR value

Hearing Aid Compatibility (HAC)
Requirements for HAC evaluation:
Define and store a working

coordinate system (WCS) at
the speaker point, aligned
with the phone.
Define E- and H-field monitors
for all frequencies of interest.

Hearing Aid Compatibility (HAC)
TBP → 2D and 3D Field Results → HAC
Field plots and

HAC segments

Antenna Array Wizard

MOR Spice Model Extraction
Post Processing: Signal Post Processing → Model Order Reduction
P1
P2
P3
P4
P5
Example: Component BGA

integrated circuit package
(5 port spice network)  No limitations due to a fixed network topology.
 Ensuring stability and passivity.
 Net lists include controlled voltage sources.

Open Discussion

Workflow Example
Horn Antenna
Purpose 1: Create a horn

antenna model and
analyze its far field
properties.
Purpose 2: Compute the

far field of a parabolic
reflector antenna which
uses the horn as a feed.

CST MWS - Standard Workflow
 Choose a project template.

 Set the frequency range.
 Create your model.
 parameters + geometry + materials
 Define ports.
 Specify boundary and symmetry
conditions.
 Define monitors.
 Check the mesh.
 Run the simulation.
Cylindrical Horn Antenna 8 – 12 GHz
0.5
0.5
dia=2, rad=1
zlength=2
units: inch
0.25 waveguide: 1.0 in x 0.5 in x 0.5 in
aperture radius: 1.0 in, length: 0.25 in
shell thickness: 0.01 in (outside)
monitors: E-field, H-field & far field at 10 GHz

New Project Template
 At the beginning, choose "Create Project" to create a new
project.
 This starts the configuration wizard in order to help you to
choose the appropriate module, main project settings and result
recorders for the particular application.
 We choose
 Microwave & RF
 Antennas
 Waveguide (Horn, Cone, etc.)
 The recommended solvers for the selected workflow
are T, I and F. We choose the Time Domain solver.
 Change the dimensions to inch.

New Project Template - Summary
Finally, verify your settings for the template and save it.

Background Material, Set Frequency
Background material
Antennas should be modeled with

vacuum as background material.
PEC is very practical for closed structures

(e.g. waveguides, connectors, filters).
Set the frequency range.

Horn Antenna – Constructions (I)
Define a brick (1.0 x 0.5 Pick face.

x 0.5 in) made of PEC. Align the WCS with the
face.
Define a cylinder (outer radius: 1.0

in, height: 0.25 in) made of PEC. Move the WCS by 2.0 inches.
Horn Antenna – Constructions (II)
Pick two opposite faces. Perform a loft.

Horn Antenna – Construction (III)
Perform a
Boolean add.
Select multiple objects

(ctrl or shift + left mouse button).
Shell solid: 0.01 in

(outside). Pick two faces.

Port Definition
Pick point Define a waveguide port.
inside corner.
Pick edge.
Define the port on the internal profile.

Boundary Conditions and Symmetry
Planes

3D Monitors
Add field monitors for E-field, H-field, and Farfield at 10 GHz.

Mesh View
Mesh properties
TST at work!

Transient Solver: Start Simulation
The accuracy defines the

steady-state monitor.
The simulation is finished
when the electromagnetic
energy in the computational
domain falls below this level.

Analyze 1D Results
Port signals
S-parameter
Energy

Analyze 2D/3D Results
Port information:
 cut-off frequency
 line impedance
 propagation constant

Electric Field at 10 GHz

Farfield at 10 GHz

Polar Plot for Farfield at 10 GHz
phi=90 phi=0
Copy 1D results to create a folder for comparison.

Parameterization (I)
2*r1
Change outer radius

value to variable r1.

Parameterization (II)
Outer diameter 2*r1
Select solid, then

right-click and
select Properties.

Result Processing Templates (Shift+P)
Farfield and Antenna Properties Define gain(theta) at phi=0.
Postprocessing templates provide a convenient way to calculate

derived quantities from simulation results.
Each template is evaluated for each solver run.

General 1D Define max. of gain (theta)
Read the online help to learn more

about the postprocessing in CST MWS.
Parameter Sweep - Settings
Define a new parameter
sweep sequence from 1
to 1.5 with 3 samples
1 for the parameter r1.

Parameter Sweep - Settings
Add an S-parameter watch.
The results will be automatically listed

in the “Tables” folder.

Parameter Sweep – Table Results
Right click on plot
window and select
“Table Properties…”.
Choose the result curve for each

parameter value with the slider.
Parameter Sweep – Table Results
parameter values parameter values

Farfield Postprocessing
 Broadband farfield analysis

 Co-/cross-polarization
 Phase center
 Tips and tricks

Broadband Farfield Monitors
Create a broadband farfield

monitor from the available
monitors.
After monitor definition, start T-solver again

with -40dB accuracy setting.
Broadband Farfield Monitors
Farfield 3D pattern

Farfield and Antenna Properties
Define maximum value of gain.
After template definition evaluate the results!

“Tables” -> “1D Results” ->
“Gain (IEEE),3D,Max Value”

Co- / Cross-Polarization
The co-polarized farfield component has the same polarization

as the excitation (y-oriented in our case).
The cross-polarized farfield component is orthogonal to the

co-polarized component and main lobe direction.
In order to use different polarizations for transmitting/receiving,

an antenna design goal might be to maximize the co-polarized
and minimize the cross-polarized component.
1. Select the tab “Axes“.
2. Click “Main lobe alignment“.
3. Choose the “Ludwig 3“
coordinate system.
Polarization vector direction

(arbitrary user input
possible).
If “Main lobe ... “ is not selected,

the user can enter arbitrary
directions for:
 polarization plane normal (z‘)
(= theta axis),
 cross-polarized component (x‘)
(= phi axis).

Co-polarized = Ludwig 3 vertical Cross-polarized = Ludwig 3 horizontal

Phase Center Calculation
Finding the best location to place
the horn inside a parabolic
antenna. The best position is to
match the focal point of the dish
= y‘z‘ plane with the phase center of the horn.
= x‘z‘ plane

Check Phase Center
Check the phase center by plotting the Ludwig 3 vertical phase.
Plotting the phase of Ludwig 3 vertical (=dominant component

of co-polarized fields) does not result in a 180° jump of the
phase (=color jump) at theta=0.
Check Phase Center
Check the phase center by moving the origin to the phase center.
See also article (Phase Center comparison with measurements)

on www.cst.com -> application article ID=256.
Tips & Tricks for an Accurate Farfield
Tip 1: Choose sufficient accuracy.
The accuracy level in the T-solver should be -40 dB.

For larger frequency bands (e.g. 0-3 GHz) or bad radiation it is
better to use -60 dB so that the E- and H-fields on the bounding
box do not suffer from FFT/DFT truncation errors.

Tip 2: Set appropriate boundary conditions.
The ”open (add space)“ boundary condition ensures λ/8

space at the center frequency. For lower frequencies (bigger λ)
the space needs to be increased accordingly.
Tip 3: Check the energy balance.
At 4.5 GHz the farfield may be inaccurate.
Farfield values become inaccurate, if S-parameter balance ≈1

(no power is radiated). In this case directivity and gain are
calculated from dividing ≈0/0, which is numerically critical.
A good measure for total radiated power is: (1 - balance).

Farfield Source - Workflow
 Calculate farfield of sender.

 Export farfield to file.
 Create model of reflector (macro).
 Import farfield as “Farfield-Source”.
 Calculate farfield of parabolic antenna using
the I-solver.

Simulation Task
Compute directivity of a
parabolic antenna at 10 GHz. The reflector is
assumed to be
Sender
in farfield
region of the
sender.
Empty space
Reflector

Possible Approaches
1. Full 3D time-domain analysis (T-solver ). Requires 3D discretization
of free space between sender and reflector.
2. Frequency domain analysis of full structure using the integral
equation solver (I-solver). Moderate runtime of the simulation.
3. Proposed workflow: Two separate models for horn antenna and
reflector coupled by farfield excitation. Only a surface mesh is
required. The results of the horn simulation can be reused.
Farfield result for horn

antenna (from T-solver)
Export Farfield of Horn Antenna
Export the farfield (10 GHz) of the horn to a file (for “r1=1.0”).
Set “Step=1” to sample the farfield with sufficient accuracy.
Set the origin to the phase center.

Exporting Farfields
There are three possibilities to export farfield sources:
 Farfield Plot Properties → Save As Source

 Template Based Postprocessing →
Farfield & Antenna Properties →
Export Farfield as Source
 Check “Export farfield source”
when defining a farfield monitor.
Note: In the first two cases the farfield will be exported with
respect to the origin set in the farfield plot properties, while it will
be with respect to the global coordinate system in the last case!

Create a New Project
Choose “File” -> “New and Recent” and select the previously
defined template to create a new project.

Modeling of The Reflector
A macro allows the creation of a fully parameterized model of a
parabolic reflector. Project template “Antenna” is automatically
selected by the macro.
Set the diameter and the focus.
Boundary conditions, units Focal point

and background material are
set by the macro.
Define Farfield Excitation
In the model of the reflector, define the farfield of the sender
antenna as excitation.
Specify the position of the

coordinate system of the farfield
in terms of the coordinate
system of the reflector dish
model:
1. Set the position of the origin
to the coordinates of the
focal point.
2. Set the orientation of the z-
and the x-axis.
Specify Solver and Frequency Range
Select the I-Solver from

the solver dropdown menu
in the “Home” ribbon.
Frequency of
interest is 10 GHz.
The frequency of the imported farfield must be inside the

specified frequency range.
Create Surface Mesh for I-Solver
Only the surface of the reflector is discretized,

not the surrounding space.
Define Farfield Monitor at 10 GHz
Note: The mesh view has to be switched off

before a monitor can be defined.

Start the I-solver
Click “Select” to
choose the far field
source.
The farfield source frequency must be

within the frequency range.
Farfield Result

Workflow Example
PIFA Antenna
Purpose 1: S-parameter determination of
a PIFA-antenna using:
 transient solver (T-solver)
 transient solver + AR-filter
 frequency domain solver (F-solver)
Purpose 2: Create a matching network for

the antenna using CST DESIGN STUDIO™.
CST – COMPUTER SIMULATION TECHNOLOGY | www.cst.com | Nov-13

CST MWS – Standard Workflow
 Define ports.
 Specify boundary and symmetry conditions.
 Check the mesh.

New Project Template
 Select "Create Project" to create a new project.
 We choose
 Microwave & RF
 Antennas
 Waveguide (Horn, Cone, etc.)
 The recommended solvers for the selected workflow
are T and F. We choose the Time Domain solver.
 Change the units to GHz and ns.

Click on Finish to save the new project template.

Workflow Example PIFA Antenna
Import CAD File
Import CAD-file of mobile phone.

- Correct Material Properties / Create Port -
Assign materials: Load from material  Hide “pcbBoard”.
library or set manually (FR4: ε = 4.9).
 Pick edge (e).
 Pick top face

of “groundPlane” (f).
 Define discrete face port (50 Ω).

- Frequency Range / Monitors -
Set field monitors at

Set frequency range 0.9 GHz and 1.8 GHz
0 – 2.5 GHz.  E-Field,
 Far field.

- Global Mesh Settings -
Open special mesh

properties window.

- Local Mesh Settings -
Exclude solids from

automesh: groundPlane,
pcbBoard, pcbPlane
Right click to access
Start the T-Solver.

- T-Solver Results -
Ripples: truncation error (from DFT)
Energy Level: -30 dB
Time signal is not completely decayed.
Remedy:
• Higher accuracy (lower energy level)
• AR-filter

- AR-Filter Settings -
[Post Processing: Signal Post Processing->Time Signals->

AR Filter for Port Signals]
An auto-regressive (AR) filter

is a linear predictor which is
used to approximate the
time signals.
It may reduce the truncation

error for the S-parameter
calculation.
First time step of AR filter: Filter order: May be Energy error: Should be
Excitation should be increased if “Energy 1e-8 or below for reliable
completely over (the larger error” is too large. S-parameters.
the more robust the filter).
The AR filter can be employed online during the simulation (T-solver Specials).

- AR-Filter Results -
Add a new tree folder (subfolder of “1D Results”) and copy your S-parameter curves
there for comparison.

- AR-Filter Versus Lower Energy Limit -
Simulation
Times
• online AR: 46s
• -30 dB: 35s
• -40 dB: 50s
• -60 dB*: 88s
Dual Intel Xeon E5520

(2.27 GHz, 8 Cores)
* “Maximum Number of Pulses”

needs to be increased in
“T-Solver Specials Steady State”. The curves of “AR filter” and “-60 dB”
are overlaying each other.
Warning: The AR filter only improves S-Parameters but NOT the 3D fields!

- F-Solver Settings -
Change the Solver type
The Solver related configuration will be

made in all the ribbon menus upon changing
the Solver type in the Home ribbon.

- F-Solver Settings -
Mesh Types Broadband Sweep
Note: You can easily

switch (without recal-
culating) between both
frequency diagrams.

- F-Solver/T-Solver Comparison -
Differences can be explained by the finite mesh, different treatment of

rounding (TET/HEX), and adaptive meshing around 2.5 GHz for TET.

- Adaptive Mesh Refinement -
Mesh adaption for TET mesh is crucial. Default: maximum frequency
Results can be improved by adaptive meshing for important frequencies.
Warning: For resonant structures, typically only parts of the structure will be refined for one adaption
frequency.
Recommendation: For resonant structures more than one adaption

frequency should be used!

- F-Solver/T-Solver Comparison / Optimized Results -
Results computed with

adaptive mesh refinement
enabled for both solvers and
additional refinements
around resonance peaks for
F-solver.

- Setup T-solver for Accurate Far Field Computation -

- Antenna Matching in CST DESIGN STUDIO™ -
Goal: Move the marked frequency point to the center of the Smith Chart.
CST DESIGN STUDIO™

1.8 GHz canvas is used to
implement the
Perfect Match matching network.
2. Serial Inductor
1. Phase Shifter 123°

- Antenna Matching in CST DESIGN STUDIO™ -
Switch to CST DESIGN STUDIO™ canvas and build the

matching network as shown below.
Ideal Phase
Shifter
Results from CST

MWS (3D EM)
External Port Inductor
50 Ω
The matching network can also

be described as a Touchstone file.
- Setup DS S-Parameter Task -
Define new
S-parameters
simulation task.
Update task.

- Results of S-Parameter Task -
Original Return Loss Matched Antenna (at 1.8 GHz)

- AC Task Settings -
New Task
Consider impact of matching

network on field monitors.
There are 3 different types of sources:

 Voltage source
 Current source
 Signal source  Similar to MWS with sqrt(1 Watt)
magnitude

- Far Field Result for Matched Antenna -
Far field monitors:
monitors including
matching network
unmatched
matched

- E-Field Result for Matched Antenna -
3D field monitors:
Monitors including
matching network
matched unmatched
Plot range clamped to 0..1e4 V/m.

Workflow Example
Patch Antenna Array
Purpose 1: Use Antenna Magus to obtain

short wave radar Patch Antenna. Analyze
different boundary conditions for array
analysis.
Purpose 2: Generate full finite array using

CST Array Wizard. Create conformal Radar
Array.

Part 1 – Array Element Creation

Launch Antenna Magus
The ‘Ribbon’ is where features can be accessed
The ‘Palette’ The ‘Workspace’

searches and where Antenna
designs are details are viewed
performed
The ‘Collection’ is where your Antennas are saved.

Search for Antenna
In the Antenna Finder search box, type ‘Radar’ and hit enter. The workspace will
list the suitable antenna candidates.
Repeat for ‘Patch’ as keyword.

Select Antenna
For this example, a

Rectangular edge-fed patch
antenna will be used.
Select it from the list, and

hit the ‘Design’ button.
The antenna is then

automatically added to the
collection, and Magus moves
to Design mode

Design Antenna
Design antenna for 3 GHz center frequency (S Band Radar), 50 ohm input
resistance and go to the material library to select a substrate

Substrate Selection
Select (double click) Rogers RT/duroid 6006 1.27 mm Substrate

Design Antenna
Generate automatic Design

Estimate Performance

Export Antenna

Open Microwave Studio Model
Fully parametric Microwave Studio Model

Generated

EM Settings Already Configured

Reduce Mesh Density
Magus models validated for full range of parameter variation. Highly reliable,
accurate settings, but excessive in this case
Delete Port PEC Backing
In legacy versions of CST, the frequency domain solver required internal

waveguide ports be backed by PEC. Delete this now unnecessary geometry.

Launch Transient Solver

Farfield Results

S11
Initial Magus design is close to operating frequency, but requires accurate

3D optimization finalized design

Optimize Antenna

Optimization Parameters
Optimize the patch

length to adjust the
resonant frequency of
the antenna
Prior run’s data can be

utilized as optimization
sample point

Optimization Goal
Add an Optimization Goal
S1,1 is default Result; move the location of its minimum magnitude to 3 GHz

Launch Optimization

Optimization Results
Optimization takes
several simulation
iterations
If you would prefer to

move on, feel free to
abort the
optimization and
enter the optimized
patch_length value,
18.847, directly
rather than waiting
Info Slide
Optimization Results

Part 2 - Large Array Analysis
Large array designs can be accurately simulated using periodic boundary

conditions, since the contribution of edge elements are relatively low
Ex. 1 x 10 linear array

Periodic Boundary

Add Field Monitors
Add E and H Field Monitors at 3 GHz


Mutual Coupling
Periodic boundary models the

coupling from adjacent elements
on internal element. Check for
detuning.

Array Factor Based Radiation Pattern
Home->Macros->Wizard->Array Wizard
Obtain 1x10 farfield pattern using Array Factor post processing in CST Array Wizard
Farfield
Reference comparison to actual

finite 1x10 array

Deactivate Array Factor
The farfield array factor settings can

also be manually adjusted via the
Farfield Plot Properties
Since we have completed the large

array analysis, we now deactivate
the pattern adjustment

Discussion on Decoupling Planes
Normal antenna simulation uses ‘Open – Add

Space’ boundary conditions
Antenna floating in free space with a finite

ground plane
Info Slide
Discussion on Decoupling Planes
For infinite ground plane simulation, a decoupling
plane can be used
Microwave Studio will automatically detect a

decoupling plane when a conducting plane is in
contact with an open boundary
Info Slide
Part 3 – Finite Array

Synthesize Array
Return to Antenna Magus to
conduct initial array synthesis

Synthesize Array
Element layout and isotropic element pattern

Synthesize Array
Select Rectangular Patch Antenna pattern aligned along Z axis

Synthesize Array
Final Synthesized pattern

Construct 1x3 Array using Array Wizard
Macros->Wizard->Array Wizard
Return to Patch Antenna

Model in Microwave Studio

1x3 Finite Array
Array Wizard automatically adjusts boundary settings to be

appropriate for finite array
Geometry and ports of array automatically transformed and setup

Remove Post Processing
Post Processing->Template Based Post Processing
S matrix is undefined for simultaneous port excitation, delete the post-

processing steps
Excitation Settings
Amplitude and phase weighting set automatically by Array Wizard

Excitation Settings Note
For Transient solver, phase shifts are

translated into a time delay
The length of the time shift is

calculated according to the period of
the signal at the Phase reference
frequency
By default this is defined at the

center frequency


Results – F parameters
S parameters undefined
when ports are
simultaneously excited
F parameters are generated

instead, and can be used to
obtain coupling information
Note amplitude scaling in

results

Results - Farfield
Select Gain (IEEE) plot mode type

in the Farfield Plot Properties

Results - Farfield
Good initial approximate

results obtained from Magus
Synthesis

Part 4 - Conformal Array

Array Creation – Create sheet
Delete the ground, substrate and ports
Set metal thickness parameter to 0

Boolean Add Metal Sheets
Add the remaining sheet metal objects together
This will make the (future) bend operation simpler

Array Creation – Align WCS
Set to ‘front’ view
Pick right corner of rightmost element, align WCS with point

Array Creation – Align WCS
Transform WCS
Move -15 along W
WCS->Rotate WCS 90 degrees about V axis

Array Creation – Create Core
Create Cylinder

Array Creation – Bend Antennas
Objects->Bend Sheet
Select ‘Dielectric’ as object to bend toward

Pick outer face of cylinder as face to bend on
Hit ‘enter’ key to finalize

Array Creation – Thicken Sheets
Modeling->Shape Tools->Shell Solid or Thicken Sheet
Create metal thickness

by using Thicken Sheet

Array Creation – Create Ground Core
Pick inner face of cylinder Extrude to make ground
plane

Port Creation
Hide the substrate dielectric
Select the outer ground cylinder face
Select the midpoint of the lower microstrip feed edge

Port Creation
Solve->Discrete Ports

Port Creation
Pick mid point of original and adjacent strip

Port Creation

Transient Solver Setup

Reactivate Ports


Farfield Results

Summary
- Obtained array element from Antenna Magus
- Optimize model with high accuracy in
Microwave Studio
- Large array simulation with periodic
boundaries/array factor
- Finite array synthesis for initial design in
Antenna Magus
- Array Wizard used to generate finite array
- Created conformal array with bend tool

Workflow Example
RCS Calculation
 Bistatic Scattering
 Monostatic Scattering
 Broadband Scattering
 Application of Radar Absorbant Material

Global Hawk (RQ-4A)

Bistatic Scattering Analysis

RCS Project Template (I)
 At the beginning, choose "Create Project" to create a new
project.
 We choose
 Microwave & RF
 Radar Cross Section
 Bi-static RCS + Large Objects
 The recommended solvers for the selected
workflow are I, A and T. We choose the
Integral Equation solver.
 Choose the following units: ft, GHz, ns and
Kelvin.

 Finally, verify your choices on the summary page.

RCS Project Template (II)
Due to the chosen project template, a plane wave is automatically
defined.

Save Project

SAT Model Import
Go to the 'Modeling' ribbon tab and import the CAD model.

Units and Frequency Range Settings
Just for information. The units have been

set correctly by the project template.

Far-field and Surface Current Monitors

Save and Save As New Project
Save

Incident Plane Wave Direction
 Set the incident plane wave direction and update the
parameteric change.

Simulation Settings
Leave the default settings in the solver dialog and start the simulation.

Bistatic RCS Results

Induced Surface Current

Monostatic Scattering Analysis

Save As New Project
Open “globalh.cst”

Incident Plane Wave Direction
 Set the incident plane wave direction and update the
parameteric change.

Far-field Template Setup

Parameter Sweep Setup
Presentation only
Simulation will not be run in

class due to time constraints.
Monostatic RCS Results
Run simulation at home

Integral Solver Monostatic RCS Setup

Integral Solver Monostatic RCS Setup (II)

Run Simulation

Polar to Cartesian View Change

Result Comparison
for Fast_RCS_Sweep

Method Comparison
 Parameter sweep option

 Ability to store field/surface current results for each
calculation point in cache
 Simulation may take a long time for large/complex models
 Fast monostatic routine (Integral Equation Solver only)

 Much shorter simulation time

Asymptotic Solver Setup

Results Comparison
Monostatic Scattering RCS Abs (Phi=270)
97 MB for A solver
700 MB for I solver

Broadband Scattering Analysis

Broadband RCS Calculations
 Option 1
 Define Broadband RCS probes at specific locations and run
the simulation with the Transient Solver.
 Option 2
 Define a Broadband far-field monitor and run the
simulation with the Transient Solver.
 Option 3
 Define far-field monitors at discrete frequencies and run
the simulation with any of the solvers.

Broadband Probes Setup
Presentation only

Broadband Probe Locations & Results
Presentation only

Application of Radar Absorbant
Material (RAM)

Open File
Close “globalh_monostatic_rcs.cst”
Open “globalh_bistatic_rcs.cst”
Save as “globalh_bistatic_rcs_ram_coating.cst”

RAM Definition

Pick Edge of Left Wing

Rotate WCS 90 Degrees Around U Axis
Align WCS with Rotate WCS

or
selected edge +90°around U axis

Slice by UV Plane
Solids need to be selected before slice
operation can be performed.
Select solid1 in
navigation tree

Repeat Procedure for Right Wing
Rotate WCS
Pick edge Align WCS with edge
around U-axis
Slice by UV plane

Select Split Solids and Separate Shape

Add Tail Fins to Body
Select solids shown

Define Coated PEC Material

Change Materials to RAM Coated PEC

Run Simulation
Simulation will not be run in
class due to time constraints.

Induced Surface Current

Comparison With Non-Coated Case
Without coating
With coating

Workflow Example
RFID - NFC
Purpose 1: Design an RFID coil, S-parameter

determination using:
 frequency domain solver (F-solver)
 transient solver (T-solver)
Purpose 2: Matching Network and post-processing

RFID Classification
 Inductive Coupling  Microwave Coupling
(125 kHz – 15 MHz) (868 MHz – 5.8 GHz)
 Tag typically a planar coil  Typically a regular
 Electrically small antenna (e.g. folded
dimensions. dipole).
 Coupling only through  Matching network
magnetic field. important to keep antenna
 Best simulated in small.
frequency domain.  Best simulated in time
domain.

RFID Coil 13.56MHz
r=5mm
r=15mm
length =70mm width= 35mm
Gap = 0.35mm
0.15mm
0.5mm

CST MWS – Standard Workflow
 Define ports.
 Specify boundary and symmetry conditions.
 Check the mesh.

Project Template
1) 2)
3) 4)
Change frequency
to MHz.

Create Parameterised Curve
3D curve: first and last
points have different
positions.
Input_point = 10
length=70
width=35
dd = 0.35
Input_point represents the excitation position.
Blend Curve Edges
Pick points on corners to blend them.
Large blend radius = 15 Small blend radius = 5
Input point

Transform and Copy Curve
Select the curve in the Navigation Tree

Complete the Feed Point
1) Pick the edge point and place the 2) Create a new line: U1 = 0, V1 = 0,
WCS on curve end point. U2 = -1, V2 = 0
3) Repeat for the other end of 4) Blend the feed input corners.
the curve. (Blend radius = 0.3)

Coil Cross Section: General Cross Section
1) Place WCS on line end point and
rotate it around v-axis by 90°. Working plane u-v
perpendicular to the
path
2) Define a new curve – rectangle.
thickness = 0.15
xsec_width = 0.5
Sweep Coil Curve
In Curves -> Curve Tools, select Sweep Curve. First select the profile
curve (rectangle), then the path curve (coil).

Coil 3D View

Define Discrete Face Port
Pick two edges at the excitation Define discrete face port.

point.

Boundary Conditions
Change boundary conditions to Open. Add 100mm surrounding space in
each coordinate direction in
background material settings.
 Boundary conditions are very important for low frequency

RFIDs.
 RFID project template uses Open (Add Space), which works
well for high frequency RFIDs, but makes the computational
domain very large for low frequency RFIDs.
Set Frequency Range and Define Monitors

Solver Choice: Electrical Size
Electrically Small Electrically Large
With MPI also very large

problems can be solved.
RCS calculations for electrically

very large structures

Solver Choice: Frequency Band
Narrowband Broadband
RFIDs at low frequency are electrically small structures and

require narrow band analysis.

Postprocessing Templates and Solver
Settings
1) Define two post-processing templates 3) Change solver frequency
to calculate coil parameters L and Q. samples and start the solver.
2) Check mesh (curved elements

used by default).

S- and Coil Parameter Results

Matching Network
Generate a matching network at 13,56MHz via the Mini Match macro, and
place the elements in the CST DS canvas (automatic placement by macro).
Also possible to use a

complex value or a
Touchstone file for
port impendance.

Define S-Parameter Task

Matched S-Parameter Results
With the matching network,

the S-parameter results show
a marked improvement at
13,56 MHz.

Summary of Simulation Setup
 For NFC simulations F-solver is recommended.

 Frequency range 0 – 100 MHz (in order to study
self-resonances).
 Discrete face ports should be used.
 Boundary conditions Open with 100mm
added space in background material.

Mobile Phone Antenna Coupling
with RFID/NFC Coil

Subproject import
1) Import the PIFA-antenna as
a sub-project.
2) Select PIFA-antenna and port 2 in

the navigation tree, and translate
them: X = 0, Y = 5, Z = -12.

Mesh View and Solver Settings
Change frequency range to 10-1000 MHz
in order to study antenna coupling.
Mesh after adaptive refinement.
Simulation time 30-40 minutes.

S-Parameter Results

Coil Parameter Results
Use post-processing templates to

check the coil parameters.

Time Domain Solver Settings
 Frequency range 0 – 1000 MHz (in order to

study self-resonances).
 Discrete face ports should be used.
 Local Mesh Properties for NFC coil: setting
step size in x, y and z directions is necessary.
 Boundary condition Open with 100mm
added space in background material.
 Energy level -60dB.

Refine Mesh
Select the coil components and use

the local mesh properties to refine
the mesh as shown.

Results Comparison S-Parameters

Results Comparison Coil Parameters
Good agreement between F-

and T-solver results for the coil
parameters.
The NFC coil is very resonant.

Using AR-filter after the
simulation can improve the coil
parameter results.
Refining the mesh further or

using adaptive meshing can
improve T-solver results
accuracy. (F-solver uses
adaptive meshing by default.)

Meander UHF RFID Tag

Meander UHF RFID Tag
 Use CST DESIGN STUDIO to construct a meander UHF RFID
tag antenna.
 First use microstrip blocks to create the schematic layout,
then automatically generate the 3D layout and use System
Assembly and Modeling to simulate the 3D model.

Build Microstrip Layout
Reference block
1 2 3
Microstrip gap
Microstrip meander line
Microstrip open end

Microstrip Reference Block
First define the parameter list below,
then enter the parameter values in the
microstrip reference block properties
(right click on the block -> properties).

Microstrip Meander Line Blocks
Right-click on meander line blocks, select
properties, and fill them out as shown.

Microstrip Stubs and Gap
Microstrip Stubs: Open Ends Microstrip Discontinuities: Gap

Check Schematic and 3D Layout

System Assembly and Modelling
1) Create a new simulation project:
4) Enter project settings:
2) Select components and click on 3D Model:
3) Close selection mode:

Simulation Project Model Setup
1) Delete the ground. 2) Define frequency range.
3) Pick two edges at the gap and define a discrete port.

Refine Mesh Settings

S-Parameter Results

Bending Tag on 3D Object

Create New Simulation Project
for Bending
 Delete ground and
substrate layer.
 Define/import solids for
bending.
 Bend the tag antenna on
solid.
 Define port as before.
 Define frequency range as
before (0 – 1GHz).
 Solver accuracy -60dB.
NB. Mesh settings are taken
from the reference model.

Define a Cylinder for Bending
1) Pick middle point of outside edge: 3) Create a cylinder (radius 20,
vmin = -30, vmax = 30):
2) Align WCS with picked point, then

translate it -20mm in W-direction:

Simulation Setup
1) Select the tag, then use bend shape
command to bend it along the cylinder.
2) Define discrete face port in the tag gap.
3) Refine mesh settings as shown below and
start T-solver (-60dB accuracy).

S-Parameter Result

CSTD 104 570 - MW Antenna Module Complete PDF

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Welcome to CST !

CST STUDIO SUITE™

MW & Antenna Module

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Summary of Core Training

Post-Processing & Special Features for Antennas

Choose from one of the following workflow examples:

Built-In Help Mechanisms

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Loaded Waveguide Microstrip Line

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Electric field (mode 1) Electric field (mode 2)

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Reference plane of interest

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Symmetry plane Magnetic

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If this option is selected

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 In the T-solver, an adaptive port

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Port for a microstrip line

Port mapped onto the mesh

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Coax with multiple inner conductors Multiple microstrip lines

Press ‘OK‘, and

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Repeat with other pins

Press ‘Close‘ to finish.

‘Set’= mode number

1(2,+) = port number (mode number, potential)

 A ‘Set‘ corresponds to a particular definition of a mode via the

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Global Mesh Optimize the global mesh settings

Start the solver and perform a

no Simulations and mesh studies

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Hexahedral Mesh Tetrahedral Mesh Surface Mesh

The mesh type can be changed using the drop-down

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Information about mesh plane.

The total number of mesh cells Corner Fixpoints

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Absolute and frequency

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"Lines per wavelength" is based on

"Lower Mesh Limit" is based on the

The "Mesh Line Ratio Limit" specifies the

The "Smallest Mesh Step" specifies the minimum

Hexahedral mesh with TST material

 Adaptation stop criteria

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Depending on the thickness and the