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Advanced Electronics
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First Edition: 2017

Second Edition: 2018

© All rights reserved by MADE EASY PUBLICATIONS. No part of this book may be reproduced or utilized in any form without the
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Contents
Advanced Electronics
Chapter 1
Introduction to VLSI Technology............. 1
1.1 Historical Perspective................................................... 1
1.2 Introduction to IC Technology................................... 2
1.3 Types of IC Technologies............................................. 3
1.4 Fabrication Process Flow: Basic Steps..................... 4
1.5 Basic Monolithic Integrated Circuit......................... 5
1.6 CMOS Fabrication Process Sequence..................... 6
1.7 BJT Process Fabrication Sequence.........................10
1.8 Design Rules-Between the Designer
and the Process Engineer..........................................11
1.9 Technology Scaling.....................................................11
Student Assignments....................................................12
Chapter 2
Crystal Growth, Wafer Fabrication and
Basic Properties of Silicon Wafers.........14
2.1 Introduction...................................................................14
2.2 Crystal Structure...........................................................15
2.3 Density of Atoms in Plane of Silicon......................17
2.4 Defects in Crystal..........................................................18
2.5 Single Crystal Growing for Wafer Production....21
Student Assignments....................................................26
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Chapter 3
Oxidation.................................................28
3.1 Introduction...................................................................28
3.2 Oxidation.........................................................................28
3.3 Oxide Growth................................................................28
3.4 Deal-Grove Model for Oxidation............................30
3.5 Furnace System for Oxidation.................................32
Student Assignments....................................................34
Chapter 4
Epitaxy, Diffusion & Ion Implantation..... 36
4.1 Epitaxy: An Introduction...........................................36
4.2 Diffusion: An Introduction........................................39
4.3 Ion Implantation...........................................................41
Student Assignments....................................................44
Chapter 5
Lithography and Etching.......................46
5.1 Lithography: An Introduction..................................46
5.2 Optical Lithography....................................................47
5.3 Electron Beam Lithography (EBL)...........................53
5.4 Ion Beam Lithography................................................54
5.5 X-Ray Lithography.......................................................54
5.6 Etching.............................................................................55
Student Assignments....................................................58
Chapter 6 7.6 Packaging Design Consideration...........................64

7.7 VLSI Assembly Technologies....................................67

Metallization and Interconnection.......59
Student Assignments....................................................70
6.1 Metallization: An Introduction................................59

6.2 Choice of Metals...........................................................59 Chapter 8

6.3 Methods of Metallization..........................................60 VLSI Testing.............................................71
Student Assignments....................................................61 8.1 Introduction...................................................................71

Chapter 7 8.2 Importance of Testing................................................71

8.3 Testing During the VLSI Life Cycle..........................72

Assembly Techniques and Packaging.... 62
8.4 Challenges in VLSI Testing.........................................73
7.1 Introduction...................................................................62
8.5 Test Principles................................................................73
7.2 Packaging........................................................................62
8.6 Design for Testability (DFT)......................................76
7.2 Number of Terminals...................................................63
8.7 Design Economics........................................................82
7.3 Types of IC Packages...................................................63
8.8 Yield and Reject Rate..................................................82
7.4 Types of Packages Based on Shape of Die..........64
Student Assignments....................................................84
7.5 Types of Packages Based on Package Material.64

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