COATING AND DEPOSITION

PROCESSES
Mauricio Salas - 1624612
Sebastian Salgado - 1628103
Esteban Vélez - 1624745
Sergio Yepez - 1631547
INDEX
1. Plating processes.
a. Electrochemical
b. Electroforming
c. Plating without electricity
d. Hot dipping
2. PVD
a. Vacuum evaporation
b. Sputtering
c. Ion plating.
3. CVD.
a. Low pressure
b. High pressure
c. Heating
4. HVOF.
 PLATING PROCESSES
Coating a thin metal layer on a surface of substrate
material.

Substrate material can be metal, ceramic or plastic.

Enhance electrical conductivity and surface lubricity.

ELECTROCHEMICAL COATING
Electrodeposition or electroplating is an
electrolytic process.

Coating metal connects to anode and the substrate

piece to cathode.

By passing an electric current between the anode

and the cathode, through the electrolytic solution
(aqueous solution acids, salts, or bases),
electrodeposition is performed.

Most common metals for coating are: Zn, Ni, Sn, Cu

and Cr. Steel is the most common substrate metal.
In jewelry, precious metals (Au, Ag and Pt) are also
plated.
 PHYSICAL PRINCIPLES
Electrochemical coating is based on Faraday laws: the mass released in
electrolysis is proportional to the current that passes through the cell:

V=C*I*t
 METHODS AND APPLICATIONS
Coating equipment depends on the geometry and size
of the pieces, requirements and metal coating.

1. Drum
plating.
2. Shelf
plating.
3. Strips
plating.
 DRUM PLATING
Horizontal rotating drums or at an
oblique angle (35 °).

Convenient method for many small

parts in a batch.

Electrical contact is given by the

frontage between the pieces.

Soft metal parts, sharp edges or

threaded components can be
damaged
 SHELF PLATING
Used for large, heavy or
complex parts.

Shelves made of high

caliber copper wire to hold
the pieces and conduct the
electricity.

Shelves are covered with

insulation to prevent the
coating.
 STRIPS PLATING
high production method.
consists of a continuous
strip that is pulled
through the electrolytic
solution.

The method is practical

for coating specific part
zones, for example, gold-
plated contact points on
electrical connectors
 ELECTROFORMING
Process virtually equal to
electroplating: involves the electrolytic
deposition of material in a pattern until
the required thickness is reached, then
the pattern is removed (removable or
disposable).

Electroformed pieces are thicker than

in the common plating, then the Patterns used in the electroforming are
production cycle is longer. solid or disposable. Solids have a geometry
that allows the removal of the
Electroformed pieces are
electroplated part. Disposables are
manufactured with Cu, Ni and Ni-Co
destroyed during the removal of the piece;
alloys. Applications include thin molds
they can be fuses (plastic, wax) or soluble
for lenses, compact discs (CD) and
(aluminum dissolves in (NaOH)).
video (DVD)
 PLATING WITHOUT ELECTRICITY
Coating process completely by chemical
reactions.

The deposition of the metal on the

surface of the piece occurs in an aqueous
solution containing metal ions from the
plating. A reducing agent is used and the
surface acts as a catalyst

The most common metal for plating is

nickel (resistance to wear and corrosion),
also copper (printed circuits, decoration)
 HOT DIPPING
The metallic substrate is immersed in a molten bath of a
second metal.

The submerged metal (fe, steel) must have a melting point

of greater than the coating metal.

In the substrate there are intermetallic layers that provide

an excellent adhesion of the coating.

main purpose is protection against corrosion (barrier,

sacrifice).

Common coating metals are: Zn (corrosion protection); Al

(corrosion protection, greater than Zn); Sn (non-toxic
corrosion protection, ideal base for food); Pb-Sn (lower cost,
low protection against corrosion).
HOT DIPPING
PHYSICAL VAPOUR DEPOSITION
A group of processes in which a material is converted on its vapour phase
in a vacuum camera and it is condensed over a substrate surface as a
thin film.

PVD is used to apply to a lot of material as metals, alloys, ceramics, on

some polymers and inorganic composites. Substrates can be metals,
glass or plastic.

PVD is a very versatile coating technology applicable to a great

combination almost unlimited of coating substances and substrates
materials.

Applications of PVD include decorative coatings over plastic or metals

pieces as trophies, toys, pencils, pens, packing for watches, etc...
APPLICATIONS OF PVD
● Coatings are made of an Aluminium thin film (150 nm) that is
coated with transparent varnish to proportionate a silver or chrome
aspect.

● Other use is the application of anti-reflective coating of Magnesium

Fluoride (MgF2) over the optical lens.

● PVD is used for the manufacture of electronic items, mainly on the

metals deposition that have as purpose to form electric
connections on integrated circuits.

● PVD is used to coating Titanium Nitride (TiN) over the cutting tools
or plastic injection molds to resist wear.
PROCESSES
As usual, PVD is made inside a vacuum chamber, for that reason, the chamber must be
evacuated in a real PVD process.

1) Synthesis of coating vapour.

2) Transport of vapour to substrate.
3) Condensation of vapors on the substrate surface

Synthesis of vapour can be obtained in different ways as heating for electrical resistance
or Ion bombardment to vaporize an existing solid.

PVD process can be:

1) Vacuum evaporation.
2) Sputtering.
3) Magnetron Sputtering.
VACUUM EVAPORATION
● Vapour atoms leave the source and follow a
Vacuum
straight line path until they crash with a gas Chamber
molecule or a solid surface.
Support of
substrate
Substrate
● Vacuum inside the chamber eliminates other gas Vapour
molecules to reduce the probability of collisions atoms Source
with vapour atoms from the source.
Resistance heater Source container

● Substrate surface that will be covered is put on Electric current

for heating
relation to source to ensure the atoms deposition
on the complete surface.
Vacuum system
 SPUTTERING
The best way to use high energy particles is with an ionized gas, for Vacuum
example Argon, energized by an electric field to make Plasma. Chamber

Source is made by a cathodic material and cathodic particles are Support of

bombarded with Argon ions give as result that source surface atoms substrate
escape and deposit themselves in the substrate forming a thin film on its Substrate
surface. Plasma

Material to evaporate
Substrate is near of the cathode and it is heated to improve the union of (Cathode)
the coating atoms. Valve
Energy
Sputtering can be used in all kind of materials, for example, metallics source Supply of
Argon
and non metallic elements, alloys, ceramics, composites and polymers.
Vacuum system
Disadvantages of PVD with Sputtering can be that deposition velocities
are slow and some particles of gas can be obtained on the coating and
those can be affected mechanical properties of the element.
MAGNETRON SPUTTERING
Magnetron Sputtering uses a closed magnetic field to catch electrons,
improve the efficiency of the initial ionization process and allowing a
plasma to be generated at lower pressures which reduces both
background gas incorporation in the growing film and energy losses in
the sputtered atom through gas collisions.

Because ions are charged particles, magnetic fields can be used to

control their velocity and behavior.

Rectangular magnetrons are most commonly used in larger scale “In-

line” systems.

Circular sputtering magnetrons are more commonly found in smaller

scale “Confocal” batch systems or single wafer stations.
 REACTIVE SPUTTERING
Reactive sputtering is a process that allows compounds to be deposited by
introducing a reactive gas (oxygen or nitrogen) into the plasma which is typically
formed by an inert gas such as argon (most common), xenon, or krypton.

In this process the reactive gas is “activated” by the plasma and chemically
reacts with the target material which is subsequently deposited on the substrate.

By controlling the relative amounts of the inert and reactive gases, composition
control of the resultant film is achievable.

Oxides, nitrides, carbides and mixtures of all three are typically generated by
reactive sputtering .

The object of the reactive sputtering process is to create thin films of closely
controlled stoichiometry and structure.
ION PLATING
Ionic plating uses a sputtering and vacuum evaporation combination to
deposit a thin film on the substrate.

1) Substrate is prepared to work as cathode on the superior piece of the

chamber and the source material is put down.
2) A vacuum is established on the chamber.
3) Argon or inert gas is injected and is applied an electric field to
ionizing Argon and made a Plasma.
4) It is produced an ionic bombarded on the substrate for its surface is
rubbed until atomic cleaning condition.
5) Source material is heated to generate coating vapours (Resistance
heater or sputtering).
6) Vapour molecules pass across Plasma and coat the substrate.

Films produced have an uniform thickness and an excellent adhesion to the

substrate. The process have high deposition velocities and densities of the
film.

It is ideal to irregular geometries pieces. This process has the ability to coat
internal hole walls.
CHEMICAL VAPOR DEPOSITiON

Chemical vapor deposition (CVD) is a process in which films of

materials are deposited from the vapor phase by the
decomposition of chemicals on the surface of a substrate. Most
frequently the process is thermally driven but photo- and
plasma-assisted methods are also used. The deposition of the
film is controlled by a chemical reaction. The method is hence
more versatile than many traditional methods.
RELATED PROCESSES
CVD and related processes are employed in many thin film
applications, including dielectrics, conductors, passivation layers,
oxidation barriers, conductive oxides, tribological and corrosion-
resistant coatings, heat-resistant coatings, and epitaxial layers for
microelectronics. Other CVD applications are the preparation of
high-temperature materials (tungsten, ceramics, etc.) and the
production of solar cells, high-temperature fiber composites and
particles of well-defined sizes. Recently, high Tc superconductors,
and more recently carbon nanotubes, have also been made by this
technique. Since oxygen activity in the vapor can be precisely
controlled during the deposition, no annealing in oxygen is needed
to achieve superconductivity.
CVD REACTORS
ADVANTAGE OF CVD PROCESSES
● Uniform step coverage
● Precise control of composition and structure
● Low temperature processing (low-pressure)
● Fast deposition rates
● High throughput
● Low processing costs
● High throughput
● Good uniformity
● Ability to handle large diameter wafers
● High capacity
● Low deposition temperature
DISADVANTAGES

● Low deposition rate

● Frequent use of toxic corrosive or flammable gases
● Fast gas flows are required
● Reactors must be cleaned frequently
● Wafers may be contaminated by loose adhering
deposits falling on them
● Particles can be formed while the electrode
assembly is being inserted
● Wafers must be individually handled during loading
and unloading
DIAMONDS CVD
THERMAL SPRAY COATING
Is the process in that a metallic
or non-metallic coating is
applied using the deposition of
accelerated and high
pressured melted particles in
the surface of a base material.
There are several different
processes used to apply a
thermal sprayed coating, they
are: Conventional flame spray,
Electric arc wire spray, Plasma
spray and High velocity oxy-
fuel spray (HVOF).
HIGH VELOCITY OXY-FUEL (HVOF)
This is one of the most
important processes of coating
due to it uses a supersonic jet,
setting it apart from
conventional flame spray, the
speed of particle impact on the
substrate is much higher,
resulting in improved coating
characteristics. Is a relatively
recent addition to the family of
thermal spray processes. HVOF
coating process also has two
variants: Gas-Fuel HVOF and
Liquid-Fuel HVOF.
BENEFITS
DISADVANTAGES
❏ Costs reduction. ❏ Higher temperatures.
❏ Performance improvement. ❏ Careful quality control.
❏ Electrical properties improvement. ❏ Not used on low fusion
❏ Higher operation temperatures. point materials.
❏ Better chemical-resistant behavior. ❏ Low failure resistance.
❏ Life use improvement.
❏ Efficiency improvement.
❏ Finest surface finish.
❏ Economic process in comparison.
❏ Reduced impact on the environment.
❏ Better coating on irregular shapes.
BIBLIOGRAPHY
● GROOVER, M. (2007). Fundamentos de manufactura moderna [Ebook] (3rd ed., pp. 675 - 679). México D.F.: McGraw-Hill.
● Norm Hardy - Process Engineer - Semicore Equipment, I. (2019). What are Planar Magnetrons in PVD Coatings?. Retrieved from
http://www.semicore.com/news/66-planar-magnetron-pvd-coating
● Magnetron Sputtering Deposition – magnetron sputtered thin films. (2019). Retrieved from
https://www.angstromsciences.com/magnetron-sputtering-deposition
● Norm Hardy - Process Engineer - Semicore Equipment, I. (2019). What is Reactive Sputtering?. Retrieved from
http://www.semicore.com/news/67-reactive-sputtering-basics
● https://www.sciencedirect.com/topics/materials-science/chemical-vapor-deposition
● https://es.wikipedia.org/wiki/Deposici%C3%B3n_qu%C3%ADmica_de_vapor
● https://sites.google.com/site/nanomodern/Home/CNT/syncnt/cvd
● http://www.raquelserrano.com/wp-content/files/procesos_otros_5.pdf

● https://www.bodycote.com/es/servicios/tecnologia-de-superficies/proyeccion-termica-de-alta-velocidad-hvof/

● https://www.cwst.es/proyeccion-termica-hvof-plasma-spray/

● https://www.fst.nl/systems/hvof-high-velocity-oxygen-fuel-thermal-spray/

● https://www.oerlikon.com/metco/en/products-services/coating-equipment/thermal-spray/processes/hvof-gas-fuel/