CYPRESS SEMICONDUCTOR CORPORATION

Internal Correspondence

Date: August 23, 2019 WW:19XX

To: RELL, JBO, RODP, ATB, HLKU
Author: K N KAUSHIK SHARMA (KNKS)
Author File#: KNKS#XXX
Closure memo on Second Assembly Site Qualification
Subject: for Automotive PSoC4A-S1(28SSOP) and PSoC4A-S2
(28SSOP)
Category: Dual Sourcing, PSoC4A-S1, PSoC4A-S2
JHMU, THOR, SNPR, VMAD, AMBU, VAU, JSO, PVAS,
Distribution:
FMJ, TTO, MHH, HLKU, CDJM

Purpose:
This memo documents the qualification closure of CML auto lines as a second source for
the PSoC4A-S1 and PSoC4A-S2 in 28SSOP package.

Background:
During NPP launch, Manufacturing Review Board (MFRB) approved OSE and Amkor
as the assembly site for these two new products. The unit cost for automotive 28ld
SSOP package at OSE, Amkor and CML auto lines are XXXX, XXXX & XXXX. Hence
automotive Business unit obtained manufacturing approval to utilize CML auto lines
for PSoC4 products in Q2’17 and correspondingly CML auto line qualification project
was launched as a cost reduction effort from Business unit on these two products.

Now, the CML auto line qualification on these products with reference QTP#XXXXX
(PSoC4AS1-28SSOP) and QTP#XXXX(PSoC4AS2-28SSOP) and this memo serves as
reference document to complete this project as there was no PM project launched to
track the qualification.

The data presented in the below table are the cost breakdown based on the actual
assembly test and finish yield at PR4. The process cost is based on the Q1’19 cost per
site (Transfer price)

Unit cost breakdown for PSoC4A-S1 and PSoC4A-S2

Include unit cost breakdown table

Manufacturing flow for PSoC4A-S1 and PSoC4A-S2

Details:
The table below shows the milestones and status of CML Auto lines qualification.

 MFRB approval to qualify Auto lines for S1 =

 PDR1 Project launch =
 PDR2/3 =
 QTP plan =

 Reliability stress Test =

 PDR4.1 =
 PDR4.2 =
 BOM (LF, Epoxy, Wire, Mold compound) =
 Build Kit (ECOXXX) =
 PDR5 =

 MFRB approval to qualify Auto lines for S2 =

 PDR1 Project launch =
 PDR2/3 =
 QTP plan =
 Reliability stress Test =
 PDR4.1 =
 PDR4.2 =
 BOM (LF, Epoxy, Wire, Mold compound) =
 Build Kit (ECOXXX) =
 PDR5 =

Conclusion:
We didn’t launch a PM project to track the project qualification as these was the cost
reduction effort from automotive BU and the existing NSO & NPP project type are not
built to support these types of projects. So, approval of this memo will be considered
as an acceptance from the Manufacturing review board (MRFB), CML auto line
manufacturing, Product Engineering and Packaging to open the part for mass
production.
========================== END OF MEMO ==========================