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3D Printing / Additive Manufacturing Using Polymers - Complete Guide
3D Printing / Additive Manufacturing Using Polymers - Complete Guide
Plastic
...and advancements in polymeric materials con nue to offer new possibility for the manufacturing industry.
Explore what is addi ve manufacturing, what are the various addi ve manufacturing processes in detail along with the types of polymers that are generally used in each p
Addi ve manufacturing may be a more appropriate term to use than 3D prin ng because it includes all
processes that are “addi ve”. The term “3D prin ng” applies more specifically to addi ve
manufacturing processes that use a printer-like head for deposi on of the material (e.g. material
je ng), and 3D prin ng is now only one of the processes that is part of the addi ve manufacturing
universe.
Technical ar cles and standards generally use the term “addi ve manufacturing” to emphasize this
broader meaning.
Addi ve manufacturing applica ons appear to be almost limitless. Early use of 3D prin ng in the form
of rapid prototyping focused on preproduc on models. However, addi ve manufacturing is now being Back to Top
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4/5/2019 Additive Manufacturing/3D Printing: Introduction and Applications
used to fabricate:
...and today’s materials include not only polymers but also metals and ceramics.
According to Wohlers Report 20171, 97 manufacturers produced and sold industrial addi ve
manufacturing (AM) systems in 2016. This is up from 62 companies in 2015 and 49 in 2014.
The AM industry grew by 17.4% in worldwide revenues in 2016, down from 25.9% the year before,
according to the new report. Wohlers representa ves say that much of the downturn came from
declines by the two largest system manufacturers in the business. Together, they represent $1.31 billion
(21.7%) of the $6.063 billion AM industry, according to Wohlers Report 2017. If these two companies
were excluded from the analysis, the industry would have grown by 24.9%.
Overall, the demand in the global 3D Prin ng market1a. is gaining trac on from a number of factors
such as:
Today, some of the producers providing 3D prin ng polymers include: 3D Systems, ADVANC3D
Materials, Materialise, SABIC, BASF, DSM and many more.
» View >800 Commercially Available 3D Prin ng Grades & >45 Suppliers in Omnexus Plas cs
Database
This plas c database is available to all, free of charge. You can filter down your op ons by technology,
property (mechanical, electrical…), applica ons, and many more dimensions.
The growing success of addi ve manufacturing is due to its advantages over conven onal
manufacturing. However, these strengths o en come along with certain weaknesses. The weaknesses
provide opportuni es for correc ve ac on through the development of new polymeric materials.
General Strengths and Weaknesses of Addi ve Manufacturing Over Conven onal Manufacturing
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The seven major addi ve manufacturing processes as classified per ASTM F42 are:
1. Photopolymeriza on
2. Material je ng
3. Binder je ng
4. Material extrusion
5. Powder Bed Fusion
6. Sheet Lamina on
7. Direct Energy Deposi on
The end-user generally first chooses an addi ve manufacturing process that best meets his needs, and
then the most appropriate material for the process and applica on.
As far as polymers are concerned, the most popular addi ve manufacturing processes are
photopolymeriza on, material je ng, powder bed fusion, and material extrusion. The materials used
in these processes can be in the form of liquid, powder, or solid (formed materials such as polymer film
or filament).
The method of consolida on and applicable addi ve manufacturing process is illustrated in the figure
below.
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Addi ve Manufacturing Processes Along with Classes of Materials and Method of Deposi on
The specific chemical types and forms of the polymer materials that are used in each process are
iden fied later in this guide. Print materials made of plas cs and polymers are defined by the
parameters of their parent 3D prin ng processes.
Now let's see the various types of polymer materials used in addi ve manufacturing process and the
method by which they are consolidated into a three-dimensional shape. For a more detailed
descrip on of the technologies behind computer technology and the specific equipment used, you can
refer to other references.2,3
The specific chemical types and forms of the polymer materials that are used in each process are
iden fied in the table below. Although at first glance, this may seem to be an abundance of materials,
there is a growing need to develop and process a much greater variety of materials than currently
possible.
The general feeling is that the materials that now exist for addi ve processing processes do not meet
the requirements of the majority of industrial products, and materials need to be developed specifically
for addi ve manufacturing processes and end-user applica ons.
Polymeric
Powder Selec ve
Materials for Photo- Material Binder Material Sheet
Bed Heat
Building 3D polymeriza on Je ng Je ng Extrusion Lamina on
Fusion Sintering
Parts
Liquids:
Epoxy resin X X X
Acrylic resin X X X
Binder /
powder X
hybrids
Powder:
PA 12 X X
PA 11 X
PC X X X
PS X X X
ABS X Back to Top
ABS – PC X
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blend
PP X
PPSU X
Starch X X
Elastomer /
X X
cellulose
PLA X X
TPU X X X
HDPE X
PEEK X X
PEI X
Solid Sheet:
Polyester film X
Polyolefin film X
Polyvinyl
copolymer X
film
Other
thermoplas c X
film
Other
thermose ng X
film
Melt (Molten Liquid):
ABS X
ABS – PC
X
blend
PPS X
A er understanding, addi ve manufacturing basics, now let's discuss seven major addi ve
manufacturing processes one by one in detail...
Photopolymeriza on
The polymeric materials used in the photopolymeriza on process are mainly radia on curing acrylics
and acrylic hybrids.
The light ac vated polymer quickly solidifies wherever the beam strikes the surface of the liquid.
Once one layer is traced, it is lowered a small distance into the vat and a second layer is traced on
top of the first layer.
The self-adhesive property of the photopolymer causes the layers to bond to one another, and
eventually a complete three-dimensional object is fully deposited and hardened. Designs are then
immersed in a chemical bath in order to remove any excess resin and post-cured in an ultraviolet oven.
It is also possible to print objects "bo om up" by using a vat with a somewhat flexible, transparent Back to Top
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bo om, and focusing the UV upward through the bo om of the vat.
Photopolymeriza on generally provides the greatest accuracy and best surface finish of any AM
prototyping technology. Over the years, a wide range of materials with proper es mimicking those of
engineering thermoplas cs have been developed. Other characteris cs of the photopolymeriza on
process include:
Support structures are required during build
Post-processing is required to wash and post cure parts
Advantages: high resolu on and accuracy, ability to produce complex parts, smooth surface,
accommodates large build areas
Weaknesses: parts are not as durable as those manufactured with other AM processes
Major applica ons: prototyping, consumer toys, electronics, guides and fixtures.
Although photopolymeriza on can be used to produce virtually any design, it is o en costly. The cost of
resin and stereolithography machines was once very high. Recently, interest in 3D printable products
has inspired the design of several models of 3D printers which feature dras cally reduced prices (less
than $10,000 for an industrial sized printer. Several companies are now producing photopolymerizable
resins at prices as low as $80 per liter.
Photopolymers used in 3D imaging processes must be designed to have a low volume shrinkage on
polymeriza on in order to avoid distor on of the solid object.
Common monomers u lized include mul func onal acrylates and methacrylates combined with a
non-polymeric component in order to reduce volume shrinkage.
A compe ng composite mixture of epoxide resins with ca onic photoini ators is becoming
increasingly used since their volume shrinkage upon ring-opening polymeriza on is significantly
below those of acrylates and methacrylates Free-radical and ca onic polymeriza ons composed of
both epoxide and acrylate monomers have also been employed, gaining the high rate of
polymeriza on from the acrylic monomer and be er mechanical proper es from the epoxy matrix.
Although stereolithography was originally touted as a fast process for building prototype models, it is
not fast enough for most full-produc on manufacturing. Conven onal 3D prin ng processes are in
reality only two-dimensional prin ng that is done over and over again. Full parts may take many hours
or even days to produce. Very recently, a new photopolymerizaton technology, called Con nuous
Liquid Interface Produc on (CLIP), was introduced that claims speeds 25-100 mes faster than
tradi onal 3D prin ng.4
The CLIP process works by carefully balancing the interac on of UV light (which ini ates
photopolymeriza on) and oxygen (which inhibits the reac on). Part produc on is achieved with an
oxygen-permeable window below the UV image projec on plane. This creates a “dead-zone” where
photopolymeriza on is inhibited between the window and the eleva ng polymerizing part (Figure). In
this way parts that usually take hours to manufacture can be made in minutes.
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Material Je ng
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As material must be deposited in drops, the number of materials available to use is limited.
Photopolymerizable resins are suitable and commonly used due to their viscous nature and ability to
form drops. However, molten polymers can also be used with an elevated temperature prin ng head,
and the molten polymers then solidify at ambient temperature.
One dis nct advantage of this process is that it allows changing of product material during a build. In
this way graded material proper es are possible. Other characteris cs of the material je ng process
are:
Major sub-classifica on is “3D prin ng” using low viscosity ink.
Light curable materials are generally used; however, molten thermoplas c materials, polymer
solu ons, and dispersions can also be used.
Wax is o en used as a support.
Advantages: good surface finish, high resolu on, allows full color parts, enables mul ple materials.
Weaknesses: Part may have low strength and durability, low viscosity prevents fast build-up.
Major applica ons: high resolu on prototypes, circuit boards and other electronics, consumer
products, tooling.
Binder Je ng
In binder je ng, a thin layer of powder (polymer, metal, or ceramic) is rolled across the building
pla orm.
A printer head then sprays a liquid adhesive binder to fuse the powder par cles together.
The binder is applied only in the places specified in the digital computer program.
This process repeats un l the three-dimensional object is formed and the excess powder that
supported the object during the build is removed and saved for later use.
Other addi ve techniques u lize a heat source which can create residual stresses in the parts. These
stresses must be relieved in a secondary post-processing opera on.
Addi onally, the parts produced via binder je ng are supported by the loose powder, thus elimina ng
the need for a build-plate. Spreading speeds for binder je ng outperform other processes. Binder
je ng has the ability to print large parts and is o en more cost-effec ve than other addi ve
manufacturing methods. Other notable characteris cs of the binder je ng process are:
Uses fine polymer powders (100 mm) and je ng of a liquid polymeric binder to bind the powder,
subsequent infiltra on is possible
Advantages: low waste, rela vely fast and simple process, allows for full color, uses a wide range of
materials
Weaknesses: rough surfaces
Major applica ons: prototyping, tooling.
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Material Extrusion
Polycarbonate
High density polyethylene
Polycarbonate/ABS blends
Polyphenylsulfone, and
High impact polystyrene
In addi on parts have been produced from biopolymers such as polylac c acid and from processed
plas c waste (See table below).
Material extrusion is somewhat restricted in the varia ons of shapes that can be fabricated. Other
notable characteris cs include:
Material extrusion addi ve manufacturing is also known as fused deposi on modeling (FDM) or
fused filament fabrica on (FFF)
Thermoplas c filament (3mm in diameter) has become a commonly
available build material
Mul ple materials can be used for both the product build and support
Advantages: mul ple materials and colors can be used, availability of
equipment, parts have good structural proper es, inexpensive and
economical
Weaknesses: surface quality may require post processing, rela vely
slow build mes, requires strong filament and high processing
temperatures
Major applica ons: prototyping, tooling, office manufacturing.
Materials extrusion is one of the simplest and least expensive addi ve manufacturing process. In fact a
toy 3D printer5 including so ware that will be on the market in the fall of 2016 for a price of $299.
Because thermoplas cs are environmentally stable, part accuracy (or tolerance) doesn’t change with
ambient condi ons or me. This enables FDM parts to be among the most dimensionally accurate.
Once an object comes off the FDM printer, its support materials are removed either by soaking the
object in a water and detergent solu on or, in the case of thermoplas c supports, snapping the support
material off by hand. Objects may also be sanded, milled, painted or plated to improve their func on
and appearance.
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Materials and their Characteris cs
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An ABS prototype has up to 80% of the strength of injec on molded; this means that ABS printed
products using FDM is extremely suitable for func onal applica ons.
ABSi is an ABS type with high impact strength. The semi-translucent material is USP Class VI
approved. It has a good blend of mechanical and aesthe c proper es.
ABS-M30 is 25-75% stronger than the standard ABS material and provides realis c func onal test
results along with smoother parts with finer feature details. It is a biocompa ble (ISO 10993 and
an ideal material for medical, pharmaceu cal and food packaging industries. It is sterilizable using
gamma radia on or ethylene oxide (EtO) steriliza on methods.
ABS-ESD7 is a durable and electrosta c dissipa ve material suited for electronic products,
industrial equipment and jigs and fixtures for assembly of electronic components.
Polylac de (PLA)
Polycarbonate is the most widely used industrial thermoplas c. In FDM products it is accurate,
durable, and stable for strong parts. PC has superior mechanical proper es, heat resistance, and high
tensile strength
PC-ABS is a blend of polycarbonate and ABS plas c which combines the strength of PC with the
flexibility of ABS. It has Superior mechanical proper es and heat resistance of PC, excellent
feature defini on and surface appeal of ABS, and high impact strength.
PC-ISO is a strong, heat-resistant engineering plas c commonly used in food and drug packaging
and medical device manufacturing. It is biocompa ble, gamma and EtO sterilizable and complies
with ISO 10993 and USP Class VI. The material gets its name from being a polycarbonate (PC)
material with ISO cer fica on.
Polyimide (PI)
ULTEM 9085 is a high flow polyetherimide blend that is strong, lightweight and flame retardant (UL
94-V0 rated). It was developed primarily for the aerospace industry and also has applica ons in other
niche industries.
ULTEM 9085 is an ideal candidate for func onal prototyping and end use parts applica ons. in the
aerospace. It has a high strength to weight ra o and a high heat deflec on temperature (160°C).
Polyphenylsulfone (PPSU)
PPSU is a thermoplas c with the highest heat and chemical resistance of all FDM Materials.
It has great strength and is sterilizable by all processes. PPSU is ideal for applica ons in caus c and
high heat environments.
Powder fusion is similar to binder je ng, except the layers of powder are fused together using a heat
source, such as a laser or elec on beam. This process is also known as selec ve laser mel ng (SLM) or
electron beam mel ng (EBM) when using metal powder. An alterna ve method to liquefying the
powder by heat is to use sintering.
Selec ve laser sintering (SLM) is the process of compac ng and forming a solid mass of material by
heat and/or pressure without mel ng it to the point of liquefac on
All processes involve the spreading of the powder material over previous layers usually with a roller or
a blade as shown in Figure below. A hopper or a reservoir below of aside the bed provides fresh
material supply.
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Some other addi ve manufacturing processes, such as stereolithography (SLA) and fused deposi on
modeling (FDM), o en require special support structures to fabricate overhanging designs. While SHS
does not need a separate feeder for support material because the part being constructed is surrounded
by unsintered powder at all mes, this allows for the construc on of previously impossible geometries.
Polymer powders used in powder bed fusion processes can be either amorphous or crystalline
thermoplas c par cles. Typical polymers are:
Polyamide
Glass filled polyamide
Polyetheretherketone
and Polystyrene
Polyamide 12, either pure or blended is the major op on. The u liza on of polyamide 11, polyamide 6,
and elastomeric polymers such as TPE and TPU are growing. Thermose ng powders such as epoxy
have also been used to produce pure plas c parts or as a binder to use with metal or ceramic par cles.
Kruth6 , et. al., provides an excellent disserta on on the consolida on of polymer powders by selec ve
laser sintering, and Schmid7, et. al., provides informa on regarding the combina on of intrinsic and
extrinsic polymer proper es necessary to generate a polymer powder likely for SLS applica on.7
Polymeric powders are commonly produced by ball milling. However, most SLS machines use two-
component powders, typically either coated powder or a powder mixture. In single-component
powders, the laser melts only the outer surface of the par cles (surface mel ng), fusing the solid non-
melted cores to each other and to the previous layer.
Shape and surface of the par cles determine the behavior of the resul ng powder to a great extent. In
case of SLS powders the par cles should be at least as feasible formed spherical. This is in order to
induce an almost free flowing behavior on the part bed of an SLS machine. A certain par cle size and
distribu on is necessary to be processable on SLS equipment. This distribu on is favorably between 20
μm and 80 μm for commercial systems.
Powder bed fusion (and selec ve laser sintering specifically) is considered a forward-looking addi ve
processing technology mainly because parts with high mechanical strength can be created
However, a major disadvantage has been the limited spectrum of suitable materials due to the high
cost for cryogenic processing of powder and the available powder proper es (size, molecular weight,
melt flow, etc.) required for manufacturing. Other notable characteris cs of the powder bed fusion
process are:
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Part is embedded in a block of unsintered powder which acts as a support that must be removed.
Part can be produced in a vacuum to reduce porosity.
Various thermal energy sources can be used, and as a result there are several varia ons of this
process: Direct Metal Laser Sintering (DMLS), Electron Beam Mel ng (EBM), Selec ve Heat Sintering
(SHS), Selec ve Laser Mel ng (SLM), Selec ve Laser Sintering (SLS).
Advantages: low waste, rela vely fast, complex structures are possible, wide range of materials, no
support required, high heat and chemical resistant materials
Weakness: high equipment cost.
Major applica ons: Aerospace, Automo ve, Medical products, Tooling, Dental implants.
Sheet Lamina on
In the sheet lamina on addi ve manufacturing process, thin sheets of material are bonded together
using adhesives or a heat source to form a three-dimensional product. The sheet lamina on processes
are also known as:
Ultrasonic addi ve manufacturing (UAM) when ultrasonic bonding is used to laminate thermoplas c
sheets together, and
Laminated object manufacturing (LOM) when adhesives are used for lamina on
Polymers are o en used but paper or metal foils are also typically processed and find applica on in
cases where heat sensi ve materials cannot be used and low costs must be
realized. Almost any polymer can be used as long as it is available in thin
sheet form and can be bonded by either adhesives or heat.
Directed energy deposi on processes generally do not use polymeric materials but employ metal wire
or powder. High energy hea ng sources such as a laser are directed at the material to melt it and build-
up the product.
Directed energy deposi on is considered to be a more complex and expensive addi ve manufacturing
process, but it is commonly used to repair or add addi onal materials to exis ng components. Other
characteris cs of directed energy deposi on include:
Similar to powder bed fusion except material is first injected into an energy field
Common substrates are metal, metal wire, glass, and ceramics
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The table below provides a quick recap and descrip on of these processes...
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The development of innova ve, advanced addi ve manufacturing technologies has progressed quickly
yielding broader and high value applica ons. This accelera ng trend has been due to the benefits of
addi ve manufacturing compared to more conven onal manufacturing processes. Some of these
benefits are:
The industries that will benefit most in the immediate future from addi ve manufacturing and the
value provided are:
Automo ve
<
Electronics
Medical
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materials that are available. The proper es of new materials must be compa ble with the deposi on
tool as well as the applica on. Some of the proper es for new, sought-a er polymeric materials
include:
Mechanical Stability: The material should maintain its form during processing including the support
of subsequent layers. High mechanical stability of the final part allows it to be handled quickly and
provides property imita on of conven onally processed materials (e.g. by injec on molding).
Chemical Stability: The material has to have a consistent chemical structure and it must be inert
when in contact with other materials during and a er processing. This will allow possible
combina on with other materials without undesirable reac ons.
Thermal Stability: The material should have proper es (melt flow, par cle size, adhesion, etc.) that
are required for the addi ve manufacturing processes chosen. It should also have thermal
proper es (glass transi on temperature, creep resistance, low and high temperature strength, etc.)
required for the end-use applica on.
Biocompa bility: Biocompa bility will become important in AM parts that are manufactured for
biological applica ons such as bodily implants and orthodon cs. It will also become significant in
parts that must be recycled or deposited in a waste facility. The parts should have low or no toxic
effect on the environment and be biodegradable when necessary.
As is the case with any newly developing industry, adequate informa on and its dissemina on to the
material and machine suppliers and end-users are paramount. Especially needed in the addi ve
manufacturing industry is the:
1. Development of a shared, standardized third-party data repository that contains material property
data that leads to the proper choice of materials and
2. Standards and protocol for part manufacture independent of region or me and standards for
material and part tes ng.
Join the course - 3D Prin ng Resins: Latest Development Opportuni es to stay updated with the
current trends and innova ons in 3D prin ng market.
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Arnitel® ID 2045 by DSM is a highly flexible, high performance thermoplas c copolyester grade
present as filament and containing greater than 50% renewable content. Exhibits excellent UV
and... view more
Arnitel® ID2060-HT by DSM is a 100% recyclable thermoplas c copolyester (TPC) grade for flexible
3D prin ng using fused filament fabrica on (FFF). Arnitel® ID2060-HT offers unique balance of...
view more
Novamid® ID 1030 by DSM is a strong, duc le and easy to print polyamide (PA 6/66) grade.
Novamid® ID 1030 is suitable for processing by 3D prin ng using fused filament fabrica on (FFF)
equipment... view more
Novamid® ID 1030-CF10 by DSM is a polyamide 6/66 grade filled with 10% carbon-fiber. It is 3D
printable at same speed as unreinforced plas cs. It creates parts that are stronger, tougher and...
view more
Novamid® ID 1070 by DSM is a very duc le and strong, high performance, high value polyamide
copolymer grade present as filaments. It can withstand harsh environments and high temperatures
of up to... view more
References:
1. Wohlers Report 2017, Wohlers Associates & 1a. Transparency Market Research, 3D Prin ng Market, Global Industry
Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2025
2. Wendel, B., et. al., “Addi ve Processing of Polymers”, Macromolecular Materials and Engineering, Vol. 293, 2008,
pp. 799-809.
3. Negi, S., et. al., “Basic Applica ons and Future of Addi ve Manufacturing Technologies: A Review”, Journal of
Manufacturing Technology Research, Vol. 5, No. 1/2 , 2013, pp. 75-95.
4. Tumbleston, J.R., et. al., “Con nuous Liquid Interface Produc on of 3D Objects”, Science, Vol. 347, March 20, 2015.
5. Ma el, ThingMaker 3D Printer, h p://www.pocket-lint.com/review/136836-ma el-thingmaker-preview-3d-
prin ng-for-the-minecra -genera on
6. Kruth, J-P, et. al., “Consolida on of Polymer Powders by Selec ve Laser Sintering”, Proceedings of the 3rd
Interna onal Conference on Polymers and Moulds Innova ons. 2008.
7. Schmid, M, et. al., “Polymer Powders for Selec ve Laser Sintering (SLS), AIP Conference Proceedings, 1664, 160009,
2015.
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