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TA B L E 2.1. Overview of The Ion Generation Methods Described in This Chapter
TA B L E 2.1. Overview of The Ion Generation Methods Described in This Chapter
TA B L E 2.1. Overview of The Ion Generation Methods Described in This Chapter
ION SOURCES 17
TA B LE 2 . 1. Continued
Method Acronym Category Ion type Applicationsa
Desorption DESI Spray Nonvolatile Direct, preparation-free
electrospray molecular analysis of samples
ionization ions
Direct analysis in real DART Discharge Nonvolatile Direct, preparation-free
time molecular analysis of samples
ions
Secondary ion (mass SIMS Particle induced Nonvolatile Semiconductors;
spectrometry) desorption/ molecular Surface analysis;
ionization ions Imaging
Fast atom FAB Particle induced Nonvolatile Soft method; Large
bombardment desorption/ molecular molecules
ionization ions
Plasma desorption PD Particle induced Nonvolatile Soft method; Large
desorption/ molecular molecules
ionization ions
Laser desorption/ LDI Photon induced Nonvolatile Isotope ratio; Trace
ionization desorption/ atomic and analysis
ionization molecular
ions
Matrix-assisted laser MALDI Photon induced Nonvolatile Soft method; Large
desorption/ desorption/ molecular molecules
ionization ionization ions
Atmospheric pressure AP- Photon induced Nonvolatile Soft method; Large
matrix-assisted laser MALDI desorption/ molecular molecules
desorption/ ionization ions
ionization
a
The “applications” column does not cover all applications, but some examples.
Figure 2.1. Schematic of a thermal ionization (TI) source. Each filament consists of two pins
connected by a wire.
TA B LE 2.2. A Rough Comparison of Some Features of the Mass Analyzers
Analyzer TOF Sector Q filter QIT Orbitrap FTICR Accelerator
Resolution Low –high Very high Low –medium Low –high Very high Highest Very high
Mass accuracy High Very high Low Low –medium Very high Very high Very high
a
m/z range Very high Medium Low Low –medium Low Medium Very low
Sensitivity High High High High Medium Medium High
Dynamic Medium Very high High Low –medium Medium Medium Very high
range
Quantification Medium –good Very good Good –very Poor Medium Medium Very good
good
Speed Fast Slow Medium –fast Medium –fast Slow –medium Slow – medium Slow
Ion-source Pulsed/ Continuous Continuous Pulsed/ Pulsed/ Pulsed/ Continuous
continuous continuous continuous continuous
Handling Easy –medium Medium – Easy Easy Medium Demanding Very
demanding demanding
a
There is presently only one instrument type available, and its maximum m/z is set to 4000 Th.
39
2 Carbon Isotopic Patterns 501
Read out the PM+1/PM ratio from a mass spectrum to calculate the approximate
number of carbon atoms. Provided no other element contributing to M+1 is pres-
ent, an M+1 intensity of 15 %, for example, indicates the presence of 14 carbons.
(For the risk of overestimation due to autoprotonation cf. Chap. 7.2.1)
Fig. A.1. Calculated isotopic patterns for carbon. Note the steadily expanding width of the
pattern as X+2, X+3, X+4,... become visible. At about C90 the X+1 peak reaches the same
intensity as the X peak. At higher carbon number it becomes the base peak of the pattern.
502 Appendix
Fig. A.2. Isotopic patterns for silicon and sulfur. The peak at zero position corresponds to
the monoisotopic ion at m/z X. The isotopic peaks are then located at m/z = X+1, 2, 3, ...
5 Characteristic Ions 503
Fig. A.3. Calculated isotopic patterns for combinations of bromine and chlorine. The peak
shown at zero position corresponds to the monoisotopic ion at m/z X. The isotopic peaks
are then located at m/z = X+2, 4, 6, ... The numerical value of X is given by the mass num-
ber of the monoisotopic combination, e.g., 70 u for Cl2.
5 Characteristic Ions
Remember that care should be taken when using tables of characteristic ions and
neutral losses, because the values listet represent only a minor fraction of the
fragmentations possible. There is a substantial risk of getting fixed on a certain
fragment or structure too early.
504 Appendix
6 Frequent Impurities
m/z Source
18, 28, 32, 40, 44 residual air
149, 167, 279 phthalic acid esters (plasticizers)
149, 177, 222 diethyl phthalate (plasticizers)
73, 147, 207, 281, 355, 429 silicon grease or GC column bleed
(Six isotopic pattern)
27, 29, 41, 43, 55, 57, 69, 71, 83, 85, hydrocarbons from grease or from
97, 99, 109, 111, 113, suspensions in paraffin
125, 127, ..., up to m/z 500
32, 64, 96, 128, 160, 192, 224, 256 sulfur (Sx isotopic pattern)
51, 69, 119, 131, 169, 181, 219, 231, background from PFK
243, 281, 317, 331, ...