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Peak Clamp: Application Specific Discretes Asd™
Peak Clamp: Application Specific Discretes Asd™
Peak Clamp: Application Specific Discretes Asd™
FEATURES
■Protection of the Mosfet in flyback power supply
■TRANSIL™ and blocking diode in a single
package
BENEFITS
■Accurate voltage clamping regardless load
■Reduced current loop
■Reduced EMI emission
■High integration
■Fast assembly
■Reduced losses in stand by mode DO-15
BASIC CONNECTION
Lf Io
T
Vo
D
V BR (Tj ) = V BR ( 25 °C ) + ∆V BR (2)
Value
Symbol Parameter Tests conditions Unit
Min. Typ. Max.
IR Reverse leakage current VR = VRRM Tj = 25°C 3 µA
Tj = 125°C 3 20
VRRM Repetitive Peak Reverse Tj = 25°C 700 V
Voltage
trr Reverse Recovery Time IF = 1A dIF / dt = -50A/µs 45 ns
VR = 30V
VFP Peak Forward Voltage IF = 3A Tj = 25°C 12 V
dIF / dt = 100A/µs Tj = 125°C 18
CAPACITANCE
Symbol Parameter Typical Value Unit
C Total Parasitic capacitance 1MHz 30mV 35 pF
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PKC-136
THERMAL RESISTANCES
Fig. 1: Peak pulse power versus exponential pulse Fig. 2: Relative variation of peak pulse power
duration. versus initial junction temperature.
Pp(kW) %
1.E+02 110
Tj initial=25°C 100
90
80
1.E+01
70
60
50
40
1.E+00
30
20
10 Tj(°C)
tp(ms)
1.E-01 0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0 25 50 75 100 125 150 175
Fig. 3: Average power dissipation versus ambient Fig. 4: Variation of thermal impedance junction to
temperature. ambient versus pulse duration (printed circuit
board epoxy FR4)
1.4
1.2 100.0
1.0
0.8
Printed circuit board
0.6 10.0
0.4
0.2
Tamb(°C) tp(s)
0.0 1.0
0 25 50 75 100 125 150 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
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PKC-136
Fig. 5: Thermal resistance junction to ambient Fig. 6-1: Reverse leakage current versus reverse
versus copper surface under each lead. voltage applied (typical values, for Transil).
Rth(j-a) IR(µA)
110 1.E+00
Lleads=10mm
100 Tj=150°C
90 1.E-01
Tj=125°C
80
70 1.E-02 Tj=100°C
60
1.E-03
50
40
1.E-04 Tj=25°C
30
20
1.E-05
10 S(cm²)
VR(V)
0 1.E-06
0 1 2 3 4 5 6 7 8 9 10 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Fig. 6-2: Reverse leakage current versus reverse Fig. 7: Transient peak forward voltage versus
voltage applied (typical values, for diode). dIF/dt (90% confidence).
IR(µA) VFP(V)
1.E+02 50
IF=3A
Tj=150°C
45 Tj=125°C
1.E+01 40
Tj=125°C
35
1.E+00 Tj=100°C 30
25
1.E-01 20
Tj=25°C
15
1.E-02 10
VR(V) 5 dIF/dt(A/µs)
1.E-03 0
0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 0 50 100 150 200 250 300 350 400 450 500
Fig. 8: Clamping voltage versus peak pulse Fig. 9: Junction capacitance versus reverse
current (maximum values). voltage applied on clamping characteristic (typical
values).
Ipp(A) C(pF)
10.0 100
tp<500ns F=1MHz
Vosc=30mVRMS
Tj=25°C
Tj=25°C
Tj=125°C
1.0
Vcl(V) VR(V)
0.1 10
160 165 170 175 180 185 190 195 200 205 210 215 220 1 10 100 1000
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PKC-136
REF. DIMENSIONS
C A C Millimeters Inches
Delivery
Ordering type Marking Package Weight Base qty
mode
PKC136 Partnumber DO-15 0.4g 1000 Ammopack
Diode cathode ring
PKC136-RL Partnumber DO-15 0.4g 6000 Tape and reel
Diode cathode ring
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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