Intel Core

This article is about the Intel processor brand name. For the Intel micro architecture that is the basis for the Core 2
processor family.

Bottom of an Intel Core i7-970

Top of an Intel Core i5-2500

Intel Core is a line of mid-to-high end consumer, workstation, and enthusiast central processing units (CPU) marketed by
Intel Corporation. These processors displaced the existing mid-to-high end Pentium processors of the time, moving the
Pentium to the entry level, and bumping the Celeron series of processors to low end. Identical or more capable versions of
Core processors are also sold as Xeon processors for the server and workstation markets.
As of June 2017, the lineup of Core processors included the Intel Core i9, Intel Core i7, Intel Core i5, and Intel Core i3,
along with the Y - Series Intel Core CPUs.[1][2]
In early 2018, news reports indicated that security flaws, referred to as "Meltdown" and "Spectre", were found "in virtually
all Intel processors [made in the past two decades] that will require fixes within Windows, macOS and Linux". The flaw
also affected cloud servers. At the time, Intel was not commenting on this issue.[3][4] According to a New York Times report,
"There is no easy fix for Spectre ... as for Meltdown, the software patch needed to fix the issue could slow down computers
by as much as 30 percent".[5]

Contents

 1Outline
 2Overview
 3Enhanced Pentium M
o 3.1Core Solo
o 3.2Core Duo
 464-bit Core microarchitecture
o 4.1Core 2 Solo
o 4.2Core 2 Duo
o 4.3Core 2 Quad
o 4.4Core 2 Extreme
 5Nehalem microarchitecture (1st generation)
o 5.1Core i3
o 5.2Core i5
 o 5.3Core i7
 6Sandy Bridge microarchitecture (2nd generation)
o 6.1Core i3
o 6.2Core i5
o 6.3Core i7
 7Ivy Bridge microarchitecture (3rd generation)
o 7.1Core i3
o 7.2Core i5
o 7.3Core i7
 8Haswell (4th gen) microarchitecture-based
o 8.1Core i3
o 8.2Core i5
o 8.3Core i7
 9Broadwell microarchitecture (5th generation)
o 9.1Core i3
o 9.2Core i5
o 9.3Core i7
o 9.4Core M
 10Skylake microarchitecture (6th generation)
o 10.1Core i3
o 10.2Core i5
o 10.3Core i7
 11Kaby Lake microarchitecture (7th gen)
o 11.1Features
o 11.2List of Kaby Lake processors
o 11.3Desktop processors
o 11.4Mobile processors
 11.4.1High power
 11.4.2Low/Medium power
o 11.5Server processors
o 11.6Kaby Lake Refresh
 12Coffee Lake microarchitecture (8th gen)
o 12.1Coffee Lake Features
o 12.2List of Coffee Lake Processors
 13Cannon Lake microarchitecture (9th gen)
 14Ice Lake microarchitecture (10th gen)
 15See also
 16References
 17External links

Outline[-]
Although Intel Core is a brand that promises no internal consistency or continuity, the processors within this family have
been, for the most part, broadly similar.
The first products receiving this designation were the Core Solo and Core Duo Yonah processors for mobile from
the Pentium M design tree, fabricated at 65 nm and brought to market in January 2006. These are substantially different in
design than the rest of the Intel Core product group, having derived from the Pentium Prolineage that predated Pentium 4.
The first Intel Core desktop processor—and typical family member—came from the Conroe iteration, a 65 nm dual-core
design fabricated brought to market in July 2006, based on the all-new Intel Core microarchitecture with substantial
enhancements in micro-architectural efficiency and performance, outperforming Pentium 4 across the board (or near to it),
while operating at drastically lower clock rates. Maintaining high instructions per cycle (IPC) on a deeply pipelined and
resourced out-of-order execution engine has remained a constant fixture of the Intel Core product group ever since.
The new substantial bump in microarchitecture came with the introduction of the 45 nm Bloomfield desktop processor in
November 2008 on the Nehalem architecture, whose main advantage came from redesigned I/O and memory systems
featuring the new Intel QuickPath Interconnect and an integrated memory controllersupporting up to three channels
of DDR3 memory.
Subsequent performance improvements have tended toward making addition rather than profound change, such as adding
the Advanced Vector Extensionsinstruction set extensions to Sandy Bridge, first released on 32 nm in January 2011. Time
has also brought improved support for virtualization and a trend toward higher levels of system integration and management
functionality through the ongoing evolution of facilities such as Intel Active Management Technology.
Overview[-]

Desktop Mobile
Brand
Code-named Cores Fab Date released Code-named Cores Fab Date released

Core Solo Desktop version not available N/A 1 65 nm January 2006

Core Duo Desktop version not available Yonah 2 65 nm January 2006

Merom-L 1 65 nm September 2007

Core 2 Solo Desktop version not available
Penryn-L 1 45 nm May 2008

Conroe 2 65 nm August 2006

Merom 2 65 nm July 2006
Core 2 Duo Allendale 2 65 nm January 2007
Penryn 2 45 nm January 2008
Wolfdale 2 45 nm January 2008

Kentsfield 4 65 nm January 2007

Core 2 Quad Penryn 4 45 nm August 2008
Yorkfield 4 45 nm March 2008

Conroe XE 2 65 nm July 2006 Merom XE 2 65 nm July 2007

Core 2
Kentsfield XE 4 65 nm November 2006 Penryn XE 2 45 nm January 2008
Extreme
Yorkfield XE 4 45 nm November 2007 Penryn XE 4 45 nm August 2008

September
Core M Desktop version not available Broadwell 2 14 nm
2014[6]

Skylake 2 14 nm August 2015

Core m3 Desktop version not available
Kaby Lake 2 14 nm August 2016

Core m5 Desktop version not available Skylake 2 14 nm August 2015

Core m7 Desktop version not available Skylake 2 14 nm August 2015

January 2010
February 2011
Clarkdale 2 32 nm Arrandale
September 2 32 nm January 2010
Sandy Bridge 2 32 nm Sandy
2012 2 32 nm February 2011
Ivy Bridge 2 22 nm Bridge
September 2 22 nm June 2012
Core i3 Haswell 2 22 nm Ivy Bridge
2013 2 22 nm June 2013
Skylake 2 14 nm Haswell
September 2 14 nm January 2015
Kaby Lake 2 14 nm Broadwell
2015 2 14 nm September 2015
Coffee Lake 4 14 nm Skylake
January 2017
October 2017
 September
Lynnfield 4 45 nm 2009
Clarkdale 2 32 nm January 2010 Arrandale
2 32 nm January 2010
Sandy Bridge 4 32 nm January 2011 Sandy
2 32 nm February 2011
Sandy Bridge 2 32 nm February 2011 Bridge
2 22 nm May 2012
Ivy Bridge 4 22 nm April 2012 Ivy Bridge
2 22 nm June 2013
Ivy Bridge 2 22 nm April 2012 Haswell
Core i5 2 14 nm January 2015
Haswell 4 22 nm June 2013 Broadwell
4 14 nm September 2015
Haswell 2 22 nm June 2013 Skylake
2 14 nm September 2015
Broadwell 4 14 nm June 2015 Skylake
2 14 nm August 2016
Skylake 4 14 nm September Kaby Lake
4 14 nm January 2017
Kaby Lake 4 14 nm 2015 Kaby Lake
Coffee Lake 6 14 nm January 2017
October 2017

November 2008
Bloomfield September
Clarksfield
Lynnfield 45 nm 2009
Arrandale 4 45 nm September 2009
Gulftown 45 nm July 2010
Sandy 2 32 nm January 2010
Sandy Bridge 32 nm January 2011
Bridge 4 32 nm January 2011
Sandy Bridge- 4 32 nm November 2011
Sandy 2 32 nm February 2011
E 4 32 nm February 2012
Bridge 4 22 nm May 2012
Sandy Bridge- 6 32 nm April 2012
Ivy Bridge 2 22 nm May 2012
E 4 22 nm June 2013
Ivy Bridge 4 22 nm June 2013
Core i7 Ivy Bridge 6 22 nm September
Haswell 2 22 nm June 2013
Haswell 4 22 nm 2013
Haswell 2 14 nm January 2015
Ivy Bridge-E 4 22 nm September
Broadwell 4 14 nm June 2015
Ivy Bridge-E 4 22 nm 2013
Broadwell 4 14 nm September 2015
Haswell-E 6 14 nm August 2014
Skylake 2 14 nm September 2015
Broadwell 14 nm June 2015
Skylake 2 14 nm August 2016
Skylake 14 nm September
Kaby Lake 4 14 nm January 2017
Kaby Lake 14 nm 2015
Kaby Lake
Coffee Lake January 2017
October 2017

Bloomfield November 2008

Gulftown 4 45 nm
March 2010 Clarksfield
Sandy Bridge- 6 32 nm 4 45 nm September 2009
November 2011 Sandy
Core i7 E 6 32 nm 4 32 nm January 2011
September Bridge
Extreme -ion Ivy Bridge-E 6 22 nm 4 22 nm May 2012
2013 Ivy Bridge
Haswell-E 8 22 nm 4 22 nm June 2013
August 2014 Haswell
10 14 nm
May 2016
Broadwell-E

Core i9 Skylake-X 18 14 nm June 2017 Mobile version not available

List of Intel Core microprocessors

List of Intel Core 2 microprocessors
List of Intel Core M microprocessors
List of Intel Core i3 microprocessors
List of Intel Core i5 microprocessors
List of Intel Core i7 microprocessors
List of Intel Core i9 microprocessors

Clock speed slowest 1.2 GHz to the fastest 4.2 GHz (Intel Core i7-7700K) (or 4.5 GHz via Intel Turbo Boost Technology)[7]

Enhanced Pentium M[-]

.
The original Core brand refers to Intel's 32-bit mobile dual-core x86 CPUs, which derived from the Pentium M branded
processors. The processor family used an enhanced version of the Intel P6 microarchitecture. It emerged in parallel with
the NetBurst microarchitecture (Intel P68) of the Pentium 4 brand, and was a precursor of the 64-bit Core
microarchitecture of Core 2 branded CPUs. The Core brand comprised two branches: the Duo (dual-core) and Solo (Duo
with one disabled core, which replaced the Pentium M brand of single-core mobile processor).
Intel launched the Core brand on January 6, 2006 with the release of the 32-bit Yonah CPU – Intel's first dual-core mobile
(low-power) processor. Its dual-core layout closely resembled two interconnected Pentium M branded CPUs packaged as a
single die (piece) silicon chip (IC). Hence, the 32-bit microarchitecture of Core branded CPUs – contrary to its name – had
more in common with Pentium M branded CPUs than with the subsequent 64-bit Core microarchitecture of Core 2branded
CPUs. Despite a major rebranding effort by Intel starting January 2006, some companies continued to market computers
with the Yonah core marked as Pentium M.
The Core series is also the first Intel processor used as the main CPU in an Apple Macintosh computer. The Core Duo was
the CPU for the first generation MacBook Pro, while the Core Solo appeared in Apple's Mac Mini line. Core Duo signified
the beginning of Apple's shift to Intel processors across their entire line.
In 2007, Intel began branding the Yonah core CPUs intended for mainstream mobile computers as Pentium Dual-Core, not
to be confused with the desktop 64-bit Core microarchitecture CPUs also branded as Pentium Dual-Core.
September 2007 and January 4, 2008 marked the discontinuation of a number of Core branded CPUs including several Core
Solo, Core Duo, Celeron and one Core 2 Quad chip.[8][9]
Core Solo[-]
Intel Core Solo[10] (product code 80538) uses the same two-core die as the Core Duo, but features only one active core.
Depending on demand, Intel may also simply disable one of the cores to sell the chip at the Core Solo price—this requires
less effort than launching and maintaining a separate line of CPUs that physically only have one core. Intel used the same
strategy previously with the 486 CPU in which early 486SX CPUs were in fact manufactured as 486DX CPUs but with
the FPUdisabled.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)

Core Solo T1xxx 27–31 W

Yonah 2 MB Socket M
Core Solo U1xxx 5.5–6 W

Core Duo[-]
Intel Core Duo[11] (product code 80539) consists of two cores on one die, a 2 MB L2 cache shared by both cores, and an
arbiter bus that controls both L2 cache and FSB (front-side bus) access.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)

Core Duo T2xxx 31 W

Yonah Core Duo L2xxx 2 MB Socket M 15 W

Core Duo U2xxx 9W

64-bit Core microarchitecture[-]

The successor to Core is the mobile version of the Intel Core 2 line of processors using cores based upon the Intel Core
microarchitecture,[12] released on July 27, 2006. The release of the mobile version of Intel Core 2 marks the reunification
of Intel's desktop and mobile product lines as Core 2 processors were released for desktops and notebooks, unlike the first
Intel Core CPUs that were targeted only for notebooks (although some small form factor and all-in-one desktops, like
theiMac and the Mac Mini, also used Core processors).
Unlike the Intel Core, Intel Core 2 is a 64-bit processor, supporting Intel 64. Another difference between the original Core
Duo and the new Core 2 Duo is an increase in the amount of Level 2 cache. The new Core 2 Duo has tripled the amount of
on-board cache to 6 MB. Core 2 also introduced a quad-core performance variant to the single- and dual-core chips, branded
Core 2 Quad, as well as an enthusiast variant, Core 2 Extreme. All three chips are manufactured at a 65 nm lithography, and
in 2008, a 45 nm lithography and support Front Side Bus speeds ranging from 533 MHz to 1600 MHz. In addition, the
45 nm die shrink of the Core microarchitecture adds SSE4.1 support to all Core 2 microprocessors manufactured at a 45 nm
lithography, therefore increasing the calculation rate of the processors.
Core 2 Solo[-]
The Core 2 Solo,[13] introduced in September 2007, is the successor to the Core Solo and is available only as an ultra-low-
power mobile processor with 5.5 Watt thermal design power. The original U2xxx series "Merom-L" used a special version
of the Merom chip with CPUID number 10661 (model 22, stepping A1) that only had a single core and was also used in
some Celeron processors. The later SU3xxx are part of Intel's CULV range of processors in a smaller µFC-BGA 956
package but contain the same Penryn chip as the dual-core variants, with one of the cores disabled during manufacturing.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)

Merom-L Mobile Core 2 Solo U2xxx 1 MB FCBGA 5.5 W

Penryn-L Mobile Core 2 Solo SU3xxx 3 MB BGA956 5.5 W

Core 2 Duo[-]
The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo[14][15] with two processor cores on a
single Merom, Conroe, Allendale, Penryn, orWolfdale chip. These come in a wide range of performance and power
consumption, starting with the relatively slow ultra-low-power Uxxxx (10 W) and low-power Lxxxx (17 W) versions, to the
more performance oriented Pxxxx (25 W) and Txxxx (35 W) mobile versions and the Exxxx (65 W) desktop models. The
mobile Core 2 Duo processors with an 'S' prefix in the name are produced in a smaller µFC-BGA 956 package, which
allows building more compact laptops.
Within each line, a higher number usually refers to a better performance, which depends largely on core and front-side bus
clock frequency and amount of second level cache, which are model-specific. Core 2 Duo processors typically use the full
L2 cache of 2, 3, 4, or 6 MB available in the specific stepping of the chip, while versions with the amount of cache reduced
during manufacturing are sold for the low-end consumer market as Celeron or Pentium Dual-Core processors. Like those
processors, some low-end Core 2 Duo models disable features such as Intel Virtualization Technology.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)

Mobile Core 2 Duo U7xxx 2 MB 10 W

BGA479
Mobile Core 2 Duo L7xxx 4 MB 17 W
Merom
Mobile Core 2 Duo T5xxx 2 MB
Socket M
Socket P 35 W
BGA479
Mobile Core 2 Duo T7xxx 2–4 MB

Core 2 Duo E4xxx 2 MB

Conroe and
LGA 775 65 W
Allendale
Core 2 Duo E6xxx 2–4 MB
 Mobile Core 2 Duo SU7xxx
3 MB 10 W
Mobile Core 2 Duo SU9xxx
BGA956
Mobile Core 2 Duo SL9xxx 17 W
6 MB
Mobile Core 2 Duo SP9xxx 25 W

Mobile Core 2 Duo P7xxx

3 MB
Penryn Mobile Core 2 Duo P8xxx 25 W

Mobile Core 2 Duo P9xxx 6 MB

Socket P
FCBGA6
Mobile Core 2 Duo T6xxx 2 MB

Mobile Core 2 Duo T8xxx 3 MB 35 W

Mobile Core 2 Duo T9xxx 6 MB

Mobile Core 2 Duo E8xxx 6 MB Socket P 35-55 W

Core 2 Duo E7xxx 3 MB

Wolfdale LGA 775 65 W

Core 2 Duo E8xxx 6 MB

Core 2 Quad[-]
Core 2 Quad[16][17] processors are multi-chip modules consisting of two dies similar to those used in Core 2 Duo, forming a
quad-core processor. This allows twice the performance of a dual-core processors at the same clock frequency in ideal
conditions.
Initially, all Core 2 Quad models were versions of Core 2 Duo desktop processors, Kentsfield derived from Conroe
and Yorkfield from Wolfdale, but later Penryn-QCwas added as a high-end version of the mobile dual-core Penryn.
The Xeon 32xx and 33xx processors are mostly identical versions of the desktop Core 2 Quad processors and can be used
interchangeably.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)

Kentsfield Core 2 Quad Q6xxx 2×4 MB LGA 775 95–105 W

 Core 2 Quad Q8xxx 2×2 MB
Yorkfield 65–95 W
Core 2 Quad Q9xxx 2×3–2×6 MB

Penryn-QC Mobile Core 2 Quad Q9xxx 2×3–2×6 MB Socket P 45 W

Core 2 Extreme[-]
Core 2 Extreme processors[18][19] are enthusiast versions of Core 2 Duo and Core 2 Quad processors, usually with a higher
clock frequency and an unlocked clock multiplier, which makes them especially attractive for overclocking. This is similar
to earlier Pentium processors labeled as Extreme -ion. Core 2 Extreme processors were released at a much higher price than
their regular version, often $999 or more.

Codename
Brand name (list) L2 Cache Socket TDP
(main article)

Merom Mobile Core 2 Extreme X7xxx 4 MB Socket P 44 W

Conroe Core 2 Extreme X6xxx 4 MB LGA 775 75 W

Kentsfield Core 2 Extreme QX6xxx 2×4 MB LGA 775 130 W

Penryn Mobile Core 2 Extreme X9xxx 6 MB Socket P 44 W

Penryn-QC Mobile Core 2 Extreme QX9xxx 2×6 MB Socket P 45 W

Yorkfield Core 2 Extreme QX9xxx 2×6 MB LGA 775 / LGA 771 130–150 W

Nehalem microarchitecture (1st generation)[-]

With the release of the Nehalem microarchitecture in November 2008,[20] Intel introduced a new naming scheme for its
Core processors. There are three variants, Core i3, Core i5 and Core i7, but the names no longer correspond to specific
technical features like the number of cores. Instead, the brand is now divided from low-level (i3), through mid-range (i5) to
high-end performance (i7),[21] which correspond to three, four and five stars in Intel's Intel Processor Rating[22] following on
from the entry-level Celeron (one star) and Pentium (two stars) processors.[23] Common features of all Nehalem based
processors include an integrated DDR3 memory controller as well as QuickPath Interconnect or PCI Express and Direct
Media Interface on the processor replacing the aging quad-pumped Front Side Bus used in all earlier Core processors. All
these processors have 256 KB L2 cache per core, plus up to 12 MB shared L3 cache. Because of the new I/O interconnect,
chipsets and mainboards from previous generations can no longer be used with Nehalem-based processors.
Core i3[-]
Intel intended the Core i3 as the new low end of the performance processor line from Intel, following the retirement of
the Core 2 brand.[24][25]
The first Core i3 processors were launched on January 7, 2010.[26]
The first Nehalem based Core i3 was Clarkdale-based, with an integrated GPU and two cores.[27] The same processor is also
available as Core i5 and Pentium, with slightly different configurations.
The Core i3-3xxM processors are based on Arrandale, the mobile version of the Clarkdale desktop processor. They are
similar to the Core i5-4xx series but running at lower clock speeds and without Turbo Boost.[28] According to an
Intel FAQ they do not support Error Correction Code (ECC) memory.[29] According to motherboard manufacturer
Supermicro, if a Core i3 processor is used with a server chipset platform such as Intel 3400/3420/3450, the CPU supports
ECC with UDIMM.[30] When asked, Intel confirmed that, although the Intel 5 series chipset supports non-ECC memory only
with the Core i5 or i3 processors, using those processors on a motherboard with 3400 series chipsets it supports the ECC
function of ECC memory.[31] A limited number of motherboards by other companies also support ECC with Intel Core ix
processors; the Asus P8B WS is an example, but it does not support ECC memory under Windows non-server operating
systems.[32]

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)

Clarkdale Core i3 4 MB LGA 1156 73 W

Direct Media Interface,
Integrated GPU
Core i3-3xxM 2 3 MB rPGA-988A 35 W
Arrandale
Core i3-3xxUM 3 MB BGA-1288 18 W

Core i5[-]
The first Core i5 using the Nehalem microarchitecture was introduced on September 8, 2009, as a mainstream variant of the
earlier Core i7, the Lynnfield core.[33][34]Lynnfield Core i5 processors have an 8 MB L3 cache, a DMI bus running at 2.5
GT/s and support for dual-channel DDR3-800/1066/1333 memory and have Hyper-threading disabled. The same processors
with different sets of features (Hyper-Threading and other clock frequencies) enabled are sold as Core i7-8xx and Xeon
3400-series processors, which should not be confused with high-end Core i7-9xx and Xeon 3500-series processors based
on Bloomfield. A new feature called Turbo Boost Technology was introduced which maximizes speed for demanding
applications, dynamically accelerating performance to match the workload.
The Core i5-5xx mobile processors are named Arrandale and based on the 32 nm Westmere shrink of the Nehalem
microarchitecture. Arrandale processors have integrated graphics capability but only two processor cores. They were
released in January 2010, together with Core i7-6xx and Core i3-3xx processors based on the same chip. The L3 cache in
Core i5-5xx processors is reduced to 3 MB, while the Core i5-6xx uses the full cache and the Core i3-3xx does not support
for Turbo Boost.[35] Clarkdale, the desktop version of Arrandale, is sold as Core i5-6xx, along with related Core i3 and
Pentium brands. It has Hyper-Threading enabled and the full 4 MB L3 cache.[36]
According to Intel "Core i5 desktop processors and desktop boards typically do not support ECC memory",[37] but
information on limited ECC support in the Core i3 section also applies to Core i5 and i7.[citation needed]

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)

Core i5-7xx 95 W
Lynnfield 4 8 MB Direct Media Interface
Core i5-7xxS LGA 1156 82 W

Clarkdale Core i5-6xx 4 MB 73–87 W

Core i5-5xxM
Direct Media Interface,
2 rPGA-988A 35 W
Integrated GPU
Arrandale Core i5-4xxM 3 MB

Core i5-5xxUM BGA-1288 18 W

 Core i5-4xxUM[38]

Core i7[-]
Intel Core i7 as an Intel brand name applies to several families of desktop and laptop 64-bit x86-64 processors using
the Nehalem, Westmere, Sandy Bridge, Ivy Bridge, Haswell, Broadwell, Skylake, and Kaby Lake microarchitectures. The
Core i7 brand targets the business and high-end consumer markets for both desktop and laptop computers,[39] and is
distinguished from the Core i3 (entry-level consumer), Core i5 (mainstream consumer), and Xeon (server and workstation)
brands.
Intel introduced the Core i7 name with the Nehalem-based Bloomfield Quad-core processor in late 2008.[40][41][42][43] In 2009
new Core i7 models based on theLynnfield (Nehalem-based) desktop quad-core processor and the Clarksfield (Nehalem-
based) quad-core mobile were added,[44] and models based on the Arrandaledual-core mobile processor (also Nehalem-
based) were added in January 2010. The first six-core processor in the Core lineup is the Nehalem-based Gulftown, which
was launched on March 16, 2010. Both the regular Core i7 and the Extreme -ion are advertised as five stars in the Intel
Processor Rating.
In each of the first three microarchitecture generations of the brand, Core i7 has family members using two distinct system-
level architectures, and therefore two distinct sockets (for example, LGA 1156 and LGA 1366 with Nehalem). In each
generation, the highest-performing Core i7 processors use the same socket and QPI-based architecture as the medium-end
Xeon processors of that generation, while lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI
architecture as the Core i5.
"Core i7" is a successor to the Intel Core 2 brand.[45][46][47][48] Intel representatives stated that they intended the moniker Core
i7 to help consumers decide which processor to purchase as Intel releases newer Nehalem-based products in the future.[49]

Code L3 Release
Brand name Cores Socket TDP Process Busses
name Cache Date

Mar
Core i7-9xxX Extreme -ion
2010
Gulftown 6 12 MB 32 nm

Core i7-970 Jul 2010

QPI,
130
LGA 1366 3
W
× DDR3
Core i7-9xx Extreme -ion
Nov
Bloomfield
2008
Core i7-9xx (except Core i7-
970/980)

Core i7-8xx 95 W Sep 2009

8 MB
Lynnfield LGA 1156
4 45 nm
Core i7-8xxS 82 W Jan 2010

DMI,
PCI-e,
Core i7-9xxXM Extreme -ion 55 W
2
× DDR3
rPGA-
Clarksfield Core i7-8xxQM Sep 2009
988A
45 W
Core i7-7xxQM 6 MB
 Core i7-6xxM 35 W
DMI,
PCI-e,
Arrandale Core i7-6xxLM 2 4 MB 25 W 32 nm FDI, Jan 2010
2
BGA-1288 × DDR3
Core i7-6xxUM 18 W

Sandy Bridge microarchitecture (2nd generation)[-]

In early 2011, Intel introduced a new microarchitecture named Sandy Bridge. This is the second generation of the Core
processor microarchitecture. It kept all the existing brands from Nehalem, including Core i3/i5/i7, and introduced new
model numbers. The initial set of Sandy Bridge processors includes dual- and quad-core variants, all of which use a single
32 nm die for both the CPU and integrated GPU cores, unlike the earlier microarchitectures. All Core i3/i5/i7 processors
with the Sandy Bridge microarchitecture have a four-digit model number. With the mobile version, the thermal design
power can no longer be determined from a one- or two-letter suffix but is encoded into the CPU number. Starting with
Sandy Bridge, Intel no longer distinguishes the code names of the processor based on number of cores, socket or intended
usage; they all use the same code name as the microarchitecture itself.
Ivy Bridge is the codename for Intel's 22 nm die shrink of the Sandy Bridge microarchitecture based on tri-gate ("3D")
transistors, introduced in April 2012.
Core i3[-]
Released on January 20, 2011, the Core i3-2xxx line of desktop and mobile processors is a direct replacement of the 2010
"Clarkdale" Core i3-5xx and "Arrandale" Core i3-3xxM models, based on the new microarchitecture. While they require
new sockets and chipsets, the user-visible features of the Core i3 are largely unchanged, including the lack of support
for Turbo Boost and AES-NI. Unlike the Sandy Bridge-based Celeron and Pentium processors, the Core i3 line does
support the new Advanced Vector Extensions. This particular processor is the entry-level processor of this new series of
Intel processors.

Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)

Core i3-21xx 65 W
Sandy Bridge (Desktop) LGA 1155
Core i3-21xxT
Direct Media Interface,
2 3 MB 35 W
Integrated GPU
rPGA-988B
Core i3-2xx0M
BGA-1023
Sandy Bridge (Mobile)

Core i3-2xx7M BGA-1023 17 W

Core i5[-]
In January 2011, Intel released new quad-core Core i5 processors based on the "Sandy Bridge" microarchitecture at CES
2011. New dual-core mobile processors and desktop processors arrived in February 2011.
The Core i5-2xxx line of desktop processors are mostly quad-core chips, with the exception of the dual-core Core i5-2390T,
and include integrated graphics, combining the key features of the earlier Core i5-6xx and Core i5-7xx lines. The suffix
after the four-digit model number designates unlocked multiplier (K), low-power (S) and ultra-low-power (T).
The desktop CPUs now all have four non-SMT cores (like the i5-750), with the exception of the i5-2390T. The DMI bus is
running at 5 GT/s.
The mobile Core i5-2xxxM processors are all dual-core and hyper-threaded chips like the previous Core i5-5xxM series,
and share most of the features with that product line.
 Codename
Brand name (list) Cores L3 Cache Socket TDP I/O Bus
(main article)

Core i5-2xxx
95 W
Core i5-2xxxK

4 6 MB
Core i5-2xxxS 65 W
Sandy Bridge (Desktop) LGA 1155

Core i5-25xxT 45 W
Direct Media Interface,
Integrated GPU
Core i5-23xxT

35 W
rPGA-988B
Core i5-2xxxM 2 3 MB
BGA-1023
Sandy Bridge (Mobile)

Core i5-2xx7M BGA-1023 17 W

Core i7[-]
The Core i7 brand was the high-end for Intel's desktop and mobile processors, until the announcement of the i9 in 2017. Its
Sandy Bridge models feature the largest amount of L3 cache and the highest clock frequency. Most of these models are very
similar to their smaller Core i5 siblings. The quad-core mobile Core i7-2xxxQM/XM processors follow the previous
"Clarksfield" Core i7-xxxQM/XM processors, but now also include integrated graphics.

Codename L3 Release
Brand name (list) Cores Socket TDP Process I/O Bus
(main article) Cache Date

Core i7-39xxX 15 MB
6
Sandy Bridge-E LGA 130 Direct Media November
Core i7-39xxK 12 MB
(Desktop) 2011 W Interface 2011

Core i7-38xx 10 MB

Core i7-2xxxK, i7-

95 W 32 nm
2xxx
Sandy Bridge LGA
(Desktop) 1155
4
Core i7-2xxxS 65 W Direct Media
January
8 MB Interface,
2011
Integrated GPU
Core i7-2xxxXM rPGA- 55 W
Sandy Bridge 988B
(Mobile) BGA-
Core i7-28xxQM 1023 45 W
 Core i7-2xxxQE, i7-
26xxQM, i7- 6 MB
27xxQM

Core i7-2xx0M 35 W

February
Core i7-2xx9M 2 4 MB 25 W
2011
BGA-
1023
Core i7-2xx7M 17 W

Ivy Bridge microarchitecture (3rd generation)[-]

Ivy Bridge is the codename for a "third generation" line of processors based on the 22 nm manufacturing process developed
by Intel. Mobile versions of the CPU were released on April 2012 following with desktop versions on September 2012.

Core i3[-]

The Ivy Bridge-based Core-i3-3xxx line is a minor upgrade to 22 nm process technology and better graphics.

Codename L3
Brand name (list) Cores Socket TDP I/O Bus
(main article) Cache

Core i3-32xx 55 W

Ivy Bridge (Desktop) LGA 1155

Core i3-32xxT

35 W
rPGA-988B Direct Media Interface,
Core i3-3xx0M 2 3 MB
BGA-1023 Integrated GPU

Ivy Bridge (Mobile)

Core i3-3xx7U 17 W
BGA-1023
Core i3-3xx9Y 13 W

Core i5[-]

Codename L3
Brand name (list) Cores Socket TDP I/O Bus
(main article) Cache

Core i5-3xxx
77 W
Core i5-3xxxK
Direct Media Interface,
Ivy Bridge (Desktop) 4 6 MB LGA 1155
Integrated GPU
Core i5-3xxxS 65 W
 Core i5-35xxT 45 W

Core i5-34xxT

35 W
rPGA-988B
Core i5-3xx0M
BGA-1023
2 3 MB

Ivy Bridge (Mobile)

Core i5-3xx7U 17 W
BGA-1023
Core i5-3xx9Y 13 W

Core i7[-]

Codename L3 Release
Brand name (list) Cores Socket TDP Process I/O Bus
(main article) Cache Date

Core i7-4960X 15MB

6
Ivy Bridge-E LGA 130 Direct Media September
Core i7-4930K 12MB
(Desktop) 2011 W Interface 2013

Core i7-4820K 10MB

Core i7-37xx, i7-

77 W
37xxK

Ivy Bridge
(Desktop) Core i7-37xxS 65 W

8 MB
Core i7-37xxT 45 W 22 nm

Core i7-3xxxXM 4 55 W
Direct Media
LGA
Interface, April 2012
1155
Integrated GPU
Core i7-38xxQM

Ivy Bridge Core i7-36x0QM, i7- 45 W

(Mobile) 3xx0QE, i7-36x5QM,
i7-3xx5QE, i7-
37xxQM
6 MB

Core i7-3xx2QM, i7-

35 W
3xx2QE
 Core i7-3xxxM

Core i7-3xxxLE 25 W

2 4 MB
Core i7-3xx7U, i7-
17 W
3xx7UE

January
Core i7-3xx9Y 13 W
2013

Haswell (4th gen) microarchitecture-based[-]

Haswell is the fourth generation Core processor microarchitecture, and was released in 2013.
Core i3[-]

Codename Brand name L3 GPU Release

Cores Socket TDP Process I/O Bus
(main article) (list) Cache Model Date

Core i3-43xx 54 W

HD
4 MB
Core i3- 4600
43xxT, Core 35 W
Haswell-DT i3-4xxxTE LGA
(Desktop) 1150

Core i3-41xx 54 W
HD
4400 September
Core i3-41xxT 35 W 2013

Core i3-4xx2E 25 W
BGA Direct Media
2 1364 22 nm Interface,
Core i3-4xx0E HD Integrated GPU
4600
37 W
Core i3- 3 MB Socket
4xxxM G3

Haswell-MB
(Mobile)
Core i3- Iris
28 W
4xx8U 5100

BGA
Core i3- June 2013
HD 1168
4xx0U, Core 15 W
4400
i3-4xx5U

Core i3- HD 11.5

 4xxxY 4200 W

Core i5[-]

Codename
Brand name L3 GPU Release
(main Cores Socket TDP Process I/O Bus
(list) Cache Model Date
article)

Core i5-
4xxx, i5- 84 W
46xxK

Core i5- 4 6 MB
65 W
4xxxS
HD LGA
4600 1150
Haswell-DT Core i5-
45 W June 2013
(Desktop) 46xxT

Core i5-
45xxT, Core 2 35 W
i5-45xxTE
4 MB

Core i5- Iris Pro

4 65 W
4xxxR 5200

Core i5-
47 W Direct Media
4xxxH
22 nm Interface,
BGA
Integrated GPU
1364
Core i5-
25 W
4xx2E
HD September
4600 2013
Core i5-
4xx0E
37 W

Haswell-MB Core i5- Socket

2 3 MB
(Mobile) 4xxxM G3

Core i5- Iris

28 W
4xx8U 5100

Core i5- HD
BGA1168 June 2013
4x50U 5000
15 W
Core i5- HD
4x00U 4400
 Core i5- HD 11.5
4xxxY 4200 W

Core i7[-]

Codename Brand name L3 GPU Release

Cores Socket TDP Process I/O Bus
(main article) (list) Cache Model Date

Core i7-5960X 8 20 MB

Haswell-E LGA 140 Direct Media September

Core i7-5930K N/A
(Desktop)[50] 2011-3 W Interface 2014
6 15 MB
Core i7-5820K

Core i7-47xx,
84 W
i7-47xxK

Core i7-47xxS 65 W
HD LGA
8 MB
4600 1150
Haswell-DT
(Desktop) Core i7-47x0T 45 W

Core i7-47x5T 35 W

Core i7-47xxR 65 W
22 nm

Core i7- Iris Pro

4x50HQ, Core 5200 Direct Media
i7-4x60HQ
4 47 W Interface, June 2013
Core i7-
Integrated GPU
4x50EQ, Core
BGA
i7-4x60EQ
1364

Core i7- 6 MB
47x2HQ, Core
i7-47x2EQ 37 W
Haswell-MB Core i7- 47 W
(Mobile) 470xHQ, Core
i7-470xEQ

HD
4600
Core i7-
47x2MQ 37 W
Core i7- 47 W
470xMQ Socket
G3

Core i7- 8 MB 57 W
49xxMQ, Core
 i7-4xxxXM

September
Core i7-4xxxM 35 W
2013

Iris
Core i7-4xx8U 28 W
5100

HD
Core i7-4x50U 2 4 MB
5000
BGA
15 W June 2013
1168
HD
Core i7-4x00U
4400

HD 11.5
Core i7-4xxxY
4200 W

Broadwell microarchitecture (5th generation)[-]

Broadwell is the fifth generation Core processor microarchitecture, and was released by Intel on September 6, 2014, and
began shipping in late 2014. It is the first to use a 14 nm chip.[51] Additionally, mobile processors were launched in January
2015[52] and Desktop Core i5 and i7 processors were released in June 2015.[53]
Core i3[-]

Codename Brand name L3 GPU Release

Cores Socket TDP Process I/O Bus
(main article) (list) Cache Model Date

Iris 28
Core i3-5xx7U
6100 W
Direct Media
Broadwell-U BGA January
2 3 MB 14 nm Interface,
(Mobile) 1168 2015
Core i3- Integrated GPU
HD 15
5xx0U, Core
5500 W
i3-5xx5U

Core i5[-]

Codename Brand L3 GPU Release

Cores Socket TDP Process I/O Bus
(main article) name (list) Cache Model Date

Core i5-
5675C
Broadwell-DT LGA 65 June
4 4 MB Iris 6200 Direct Media
(Desktop)[53] Core i5- 1150 W 2015
14 nm Interface,
5675R
Core i5- Integrated GPU
5575R
Broadwell-U Core i5- BGA 28 January
2 3 MB Iris 6100
(Mobile) 5xx7U 1168 W 2015
 Core i5- HD
5x50U 6000 15
Core i5- HD W
5x00U 5500
Core i7[-]

Brand
Codename L3 GPU Release
name Cores/Threads Socket TDP Process I/O Bus
(main article) Cache Model Date
(list)

Core i7-
Broadwell-DT 5775C Iris LGA 65 June
4/8 6 MB
(Desktop)[53] 6200 1150 W 2015
Core i7-
5775R Direct Media
Interface,
Core i7- Iris 28
5xx7U 6100 W Integrated GPU
Broadwell-U Core i7- HD BGA January
2/4 4 MB
(Mobile) 5x50U 6000 1168 15 2015
W 14 nm
Core i7- HD
5x00U 5500
Core i7-
6800K
6/12 15 MB
Core i7-
Broadwell-E 6850K LGA 140 Direct Media
N/A Q2'16
(Desktop) Core i7- 2011-3 W Interface
8/16 20 MB
6900K
Core i7-
10/20 25 MB
6950X
Core M[-]

Brand
Codename L3 GPU Release
name Cores Socket TDP Process I/O Bus
(main article) Cache Model Date
(list)

Direct Media
Broadwell-Y Core M- HD BGA September
2 4 MB 4.5 W 14 nm Interface,
(Mobile) 5Yxx 5300 1234 2014
Integrated GPU

Skylake microarchitecture (6th generation)[-]

Skylake is the sixth generation Core processor microarchitecture, and was launched in August 2015. Being the successor to
the Broadwell line, it is a redesign using the same 14 nm manufacturing process technology; however the redesign has
better CPU and GPU performance and reduced power consumption. Intel also disabled overclocking non -K processors.
Core i3[-]

Codename
Brand L3 GPU Release
Cores/Threads Socket TDP Process I/O Bus
(main name Cache Model Date
article)

Skylake-DT Core i3- HD LGA Direct Media December

2/4 3 MB 54 W 14 nm
(Desktop) 6098P 510 1151 Interface, 2015
 Core i3-
51 W Integrated GPU
6100
Core i3-
35 W
6100T
Core i3- HD
6300 530
51 W
Core i3-
4 MB
6320 September
Core i3- 2015
35 W
6300T
Core i3- HD
15 W
6100U 520
Skylake-U Core i3- HD FBGA
3 MB 35 W
(Mobile) 6100H 530 1356
Core i3- HD
28 W
6167U 550
Core i5[-]

Codename
Brand L3 GPU Release
Cores/Threads Socket TDP Process I/O Bus
(main name Cache Model Date
article)

Core i5-
6400
Core i5-
65 W
6500
Core i5- September
6600 2015
HD 530
Skylake-DT Core i5- LGA
4/4 6 MB 91 W
(Desktop) 6600K 1151
Core i5-
6xx0T
35 W
Core i5- Direct Media
Interface, June 2016
6xx0R
14 nm
Core i5- Integrated December
HD 510 65 W GPU
6402P 2015
Core i5-
3 MB HD 520
6200U
15 W
Core i5-
Iris 540
6260U
Skylake-U Core i5- FCBGA September
2/4 Iris 550 28 W
(Mobile) 62x7U 1356 2015
4 MB
Core i5-
HD 520 15 W
6300U
Core i5- 9.5
Iris 540
6360U W
Core i7[-]

Codename Brand L3 GPU Release

Cores/Threads Socket TDP Process I/O Bus
name Cache Model Date
(main article)

Skylake-DT Core i7- LGA Direct Media September

4/8 8 MB HD 530 65 W 14 nm
(Desktop) 6700 1151 Interface, 2015
 Core i7-
35 W Integrated
6700T
GPU
Core i7- August
91 W
6700K 2015
Core i7- Iris Pro
65 W May 2016
6785R 580
Core i7-
HD 520
6x00U
15 W
Core i7-
Iris 540
6x60U
Skylake-U Core i7- FCBGA September
2/4 4 MB Iris 550 28 W
(Mobile) 6567U 1356 2015
Core i7-
HD 520 25 W
6600U
Core i7-
Iris 540 15 W
6650U

Kaby Lake microarchitecture (7th gen)[-]

Kaby Lake is the seventh generation Core processor microarchitecture, and was launched in October 2016 (mobile
chips)[54] and January 2017 (desktop chips).[55]With the latest generation of microarchitecture, Intel decided to produce Kaby
Lake processors without using their "tick tock" manufacturing and design model.[56]Similar to Skylake, Kaby Lake
processors are produced using a 14 nanometer manufacturing process technology.[56]
Features[-]
Built on an improved 14 nm process (14FF+), Kaby Lake features faster CPU clock speeds, clock speed changes, and
higher Turbo frequencies. Beyond these process and clock speed changes, little of the CPU architecture has changed
from Skylake, resulting in identical IPC
Kaby Lake features a new graphics architecture to improve performance in 3D graphics and 4K video playback. It will add
native HDCP 2.2 support, along with fixed function decode of H.264, HEVC Main and Main10/10-bit, and VP9 10-bit and
8-bit video. Hardware encode is supported for H.264, HEVC Main10/10-bit, and VP9 8-bit video. VP9 10-bit encode is not
supported in hardware. OpenCL 2.1 is now supported
Kaby Lake is the first Core architecture to support hyper-threading for the Pentium-branded desktop CPU SKU. Kaby Lake
also features the first overclocking-enabled i3-branded CPU.
List of Kaby Lake processors[-]
Features common to desktop Kaby Lake CPUs:

 LGA 1151 socket

 DMI 3.0 and PCIe 3.0 interfaces
 Dual channel memory support in the following configurations: DDR3L-1600 1.35 V (32 GiB maximum) or DDR4-
2400 1.2 V (64 GiB maximum)
 A total of 16 PCIe lanes
 The Core-branded processors support the AVX2 instruction set. The Celeron and Pentium-branded ones support only
SSE4.1/4.2
 350 MHz base graphics clock rate
 No L4 cache (eDRAM).
 A release date of January 3, 2017
Desktop processors[-]
CPU Turbo clock rate Maxim
Targe Cores Processor CPU GP um L3 Pric
t Du Qu U TD e
(threa branding clockr Sin GPU cac
al ad mo P (US
ds) and model ate gle clock he
segme cor cor del D)
core rate
nt e e

7700 4.5 G 4.4 G 4.4 G

4.2 GHz 91 W $350
K Hz Hz Hz
Performa Core 4.2 G 4.1 G 4.0 G
4 (8) 7700 3.6 GHz 8 MB 65 W
nce i7 Hz Hz Hz
$312
7700 3.8 G 3.7 G 3.6 G 1150 MH
2.9 GHz 35 W
T Hz Hz Hz z
7600 4.2 G 4.1 G 4.0 G
3.8 GHz 91 W $243
K Hz Hz Hz
4.1 G 4.0 G 3.9 G
7600 3.5 GHz 65 W
Hz Hz Hz
$224
7600 3.7 G 3.6 G 3.5 G
2.8 GHz 35 W
T Hz Hz Hz
Core 3.8 G 3.7 G 3.6 G 1100 MH
4 (4) 7500 3.4 GHz 6 MB 65 W
i5 Hz Hz Hz z
$202
7500 3.3 G 3.2 G 3.1 G
2.7 GHz 35 W
T Hz Hz Hz
3.5 G 3.4 G 3.3 G
7400 3.0 GHz 65 W $182
Hz Hz Hz 1000 MH
7400 3.0 G 2.9 G 2.7 G z
2.4 GHz 35 W $187
T Hz Hz Hz HD
630
7350
4.2 GHz 60 W $179
K
1150 MH
7320 4.1 GHz z $157
4 MB 51 W
7300 4.0 GHz
7300 $147
3.5 GHz 35 W
Mainstre T
Core
am 7100 3.9 GHz 51 W
i3
7100
3.4 GHz 35 W
T
7101 $117
3.9 GHz 1100 MH 54 W
E
z
2 (4)
7101
3.4 GHz 35 W
TE
N/A
G462
3.7 GHz $93
0 3 MB
51 W
G460
3.6 GHz $82
0
Pentiu G460
3.0 GHz 35 W $75
m 0T
G456
3.5 GHz 54 W
0
1050 MH $64
G456
2.9 GHz HD z 35 W
0T
610
G395
Celer 3.0 GHz $52
2 (2) 0 2 MB 51 W
on
G393 2.9 GHz $42
 CPU Turbo clock rate Maxim
Targe Cores Processor CPU GP um L3 Pric
t Du Qu U TD e
(threa branding clockr Sin GPU cac
al ad mo P (US
ds) and model ate gle clock he
segme cor cor del D)
core rate
nt e e

0
G393 1000 MH
2.7 GHz 35 W
0T z
Mobile processors[-]
High power[-]
CPU Turbo cloc GPU clock M
cTDP
k rate rate a
Ta C x P
Proc C L L
rg or S . R ri
essor P D Q 3 4
et es i P el c
U u u
bran n G c c C T ea e
(t a a D
se ding clo gl P B M a a I D se (
hr l d U o
g and ck e U a ax c c e P d U
ea c c p w
m mod ra c se . h h l at S
ds o o n
en el te o e e a e D
) r r
t r n )
e e e
e
s
79
4.1 3.9 3.7
20 3.1 G $56
GH GH GH
H Hz 8
z z z
Q
78
20 8
H MB
Perfo Co Q 2.9 G 3.9 3.7 3.5 1100
rman 4 (8) re GH GH GH MH
ce i7 78 Hz z z z z
20 $37
H 8
K 45 35
77 350 W W
HD N/ Q1
00 MH N/A 16
630 A 2017
H z
Q 2.8 G 3.8 3.6 3.4
GH GH GH
74 Hz z z z
40 6
H MB
Co Q 1000
$25
4 (4) re MH
Main 73 0
i5 3.5 3.3 3.1 z
strea 00 2.5 G
GH GH GH
m H Hz
z z z
Q
Co 71
3.0 G 950 3 35 $22
2 (4) re 00 N/A N/A
Hz MHz MB W 5
i3 H
Low/Medium power[-]
CPU Turb G M T Re P
Co Proc CP GPU clock L L
Ta o clock P a D cTDP le ri
res essor U rate 3 4
rge rate U x. P as ce
 t D P e (
(th bran clo c c
Si u C da U
rea ding ckr a a
seg n a I D te S
ds) and ate B M c c
me gl l e U o D
mod as ax h h
nt e c la p w )
el e . e e
co o n n
re r e
e s
76 Iris
2.5 G 4.0 1100 64 N/ 9.5
60 Plus ?
Hz GHz MHz MB A W
U 640 15
76 W
2.8 G 3.9 HD 25 7.5
00 N/A $393
Hz GHz 620 W W
U 1150 Q1
75 Iris MHz 2017
3.5 G 4.0 28 23
67 Plus 12
Co Hz GHz W W
Premi U 650 4 64 N/
re ?
um 75 Iris MB MB A
i7 2.4 G 3.8 9.5
60 Plus
Hz GHz W
U 640 15
75 W
2.7 G 3.5 HD 1050 25 7.5
00
Hz GHz 620 MHz W W
U Q3
N/A $393
7 2016
1.3 G 3.6 HD 4.5 7 3.5
Y 10
Hz GHz 615 W W W
75
73 Iris
2.3 G 3.6 1000 4 64 15 N/ 9.5
60 Plus 12 ?
Hz GHz MHz MB MB W A W
U 640
73
2.6 G 3.5 HD 3 15 25 7.5
00 N/A $281
Hz GHz 620 MB W W W
U 1100
300 MHz
2 (4) 72 ?
3.3 G 3.7 MHz Q1
87
Hz GHz Iris 2017
U 28 23
Plus
72 W W
3.1 G 3.5 650 1050 4 64 N/
67 12 ?
Co Hz GHz MHz MB MB A
U
re
i5 72 Iris
2.2 G 3.4 950 9.5
60 Plus
Hz GHz MHz W
U 640 15
Main
strea 72 W
2.5 G 3.1 HD 1000 3 25 7.5 Q3
m 00
Hz GHz 620 MHz MB W W 2016
U
7
3.3 Q1
Y N/A $281
GHz 2017
57 1.2 G HD 950 4 4.5 7 3.5
10
7 Hz 615 MHz MB W W W
3.2 Q3
Y
GHz 2016
54
71 Iris
2.8 G 64 28 23 Q1
67 Plus ?
Co Hz MB W W 2017
U 650 1000 N/
re N/A 3 12
71 MHz A
i3 2.4 G HD MB 15 7.5
00 N/A Q3
Hz 620 W W $281
U 2016
Co 7 1.0 G 2.6 HD 900 4 10 4.5 7 3.5
 CPU Turb M
GPU clock
o clock a cTDP
Proc rate L L P
rate x.
Ta Co essor CP 3 4 Re ri
rge D P
res U le ce
t bran Si u G c c C T
as (
(th ding clo n a P a a I D D
B M e U
seg rea and ckr gl l U c c e P U o
as ax da S
me ds) mod ate e c h h la p w
e . te D
nt el co o e e n n )
re r e
e s
re Y Hz GHz 615 MHz MB W W W
m3 30
7
1.1 G 3.0 Q2
Y
Hz GHz 2017
32
Server processors
Proce CPU Turbo clock GPU clock
Ta rate rate L L4
Co ssor CP G Pr
rge 3 cac Re
res U Q P ic
t bran Si D E he T lea
u U ca e
(th ding clo ng u U B D se
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seg rea and ckr le al s as P da
d od ax. h RA S
me ds) mode ate co co e te
co el e M) D)
nt l re re
re
E3
-
3.9 G 72
12 N/A $612
Hz W
80
v6
E3
-
4.2 HD 350 1150 73
12 ? $339
GHz P630 MHz MHz W
75
v6 3.8 G
E3 Hz
-
72
12 N/A $328
W
70
v6
4 (8)
E3
Serve Xe - 8 Q1
? ? HD 350 1150 N/A 73
r on 12 ? MB 2017 $284
P630 MHz MHz W
45
v6 3.7 G 4.1
E3 Hz GHz
-
12 $272
40
v6 72
N/A
E3 W
-
3.5 G 3.9
12 $250
Hz GHz
30
v6
E3
- 3.3 G 3.7 HD 350 1150 73
4 (4) ? $213
12 Hz GHz P630 MHz MHz W
25
 Proce CPU Turbo clock GPU clock
Ta rate rate L L4
Co ssor CP G Pr
rge 3 cac Re
res U Q P ic
t bran Si D E he T lea
u U ca e
(th ding clo ng u U B D se
a m M c (eD (U
seg rea and ckr le al s as P da
d od ax. h RA S
me ds) mode ate co co e te
co el e M) D)
nt l re re
re
v6
E3
-
3.0 G 3.5 72
12 N/A $193
Hz GHz W
20
v6
E3
-
15 3.1 G 4.2 4.1 3.9
$623
35 Hz GHz GHz GHz
M
Mobil v6 1100 45
e E3 MHz W
-
15 3.0 G 4.0 3.8 3.6 HD 350
4 (8) ? $434
05 Hz GHz GHz GHz P630 MHz
M
v6
E3
-
Embe 15 2.2 G 3.0 1000
? ?
dded 05 Hz GHz MHz
L
v6
Kaby Lake Refresh[-]

CPU Turbo clock GPU

M cTDP
C rate clock rate
a
P P
Pr L L x.
U Re ri
oce Co 3 4 P
M cl D Q le ce
sso res G c c C T
o o Si u u as (
r (th P a a I D
de c n a a B D e U
bra rea U M c c e P
l k gl l d a U o da S
ndi ds) a h h la
r e c c s p w te D
ng x. e e n
a co o o e n )
e
te re r r s
e e

1.9
8650 3.9
GH 4.2 GHz
U GHz
z 115
UH 300
Core 0 8 15 25 10 Q3
4 (8) D MH N/A 12 $409
i7 MH MB W W W 2017
620 z
1.8 z
8550 3.7
GH 4.0 GHz
U GHz
z
 CPU Turbo clock GPU
M cTDP
C rate clock rate
a
P P
Pr L L x.
U Re ri
oce Co 3 4 P
M cl D Q le ce
sso res G c c C T
o o Si u u as (
r (th P a a I D
de c n a a B D e U
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l k gl l d a U o da S
ndi ds) a h h la
r e c c s p w te D
ng x. e e n
a co o o e n )
e
te re r r s
e e

1.7
8350
GH 3.6 GHz
U
z 110
Core 0 6
$297
i5 MH MB
1.6 z
8250
GH 3.4 GHz
U
z

Coffee Lake microarchitecture (8th gen)

Coffee Lake is the eighth generation Intel Core micro-architecture and was launched in October 2017. For the first time in
the ten year history of Intel Core processors, the Coffee Lake generation features an increase in core counts across the
desktop lineup of processors, a significant driver of improved performance versus previous generations despite similar per-
clock performance.

Increase in number of CPU cores in Desktop Coffee Lake processors

Coffee Lake (8th Generation) Kaby Lake (7th Generation)

Physical Logical Physical Logical

Cores* Cores Cores*
Cores

Core i3 4 4 2 4
Core i5 6 6 4 4
Core i7 6 12 4 8
* Intel Hyper-threading capabilities allow an enabled processor to execute two threads per physical core

Coffee Lake Features

Coffee Lake features largely the same CPU core and performance per MHz as Skylake/Kaby Lake.[57][58] Features specific to
Coffee Lake include:

 Following similar refinements to the 14nm process in Skylake and Kaby Lake, Coffee Lake is the third 14 nm process
refinement ("14nm++") and features increased transistor gate pitch for a lower current density and higher leakage
transistors which allows higher peak power and higher frequency at the expense of die area and idle power.
 Coffee Lake will be used in conjunction with the 300-series chipset and is incompatible with the older 100- and 200-
series chipsets.
 Increased L3 cache in accordance to the number of cores
 Increased turbo clock speeds across i5 and i7 CPUs models (increased by up to 200 MHz)
 Increased iGPU clock speeds by 50MHz
 DDR4 memory support updated for 2666MHz (for i5 and i7 parts) and 2400MHz (for i3 parts); DDR3 memory is no
longer supported
List of Coffee Lake Processors
This table shows the current CPUs based on Coffee Lake and their specifications. More Coffee Lake CPUs will be released
in the first half of 2018 along with more chipsets.[61]

Turbo clock
rate[62] [GHz]

Proces max iG Memo Pric

Cores CPU L3
sor Mod PU TD ry e
(threa clock Number of cores GPU cach Socket
brandi el clock P suppo (US
ds) rate used e
ng rate rt D)

1 2 3 4 5 6

8700 3.7 G 4. 4. 4. 4. 95
4.4 $359
K Hz 7 6 5 3 W
1.20 GH 12 M
Core i7 6 (12)
z B
3.2 G 4. 4. 4. 65
8700 4.3 $303
Hz 6 5 4 W
DDR4
-2666 LGA
8600 3.6 G 4. 1.15 GH 95 1151[63]
4.2 4.1 UHD $257
K Hz 3 z W
Graphi (Only
9M
Core i5 6 (6) cs compatible
B
630 with 300
2.8 G 4. (GT2) 1.05 GH 65 series
8400 3.9 3.8 $182
Hz 0 z W motherboa
rds)

8350 4.0 G 1.15 GH 8M 91

$168
K Hz z B W
DDR4
Core i3 4 (4) N/A
-2400
3.6 G 1.10 GH 6M 65
8100 $117
Hz z B W

Cannon Lake microarchitecture (9th gen)

Main article: Cannon Lake (microarchitecture)
Cannon Lake (formerly Skymont) is Intel's codename for the 10-nanometer die shrink of the Kaby
Lake microarchitecture. As a die shrink, Cannon Lake is a new process in Intel's "Process-Architecture-Optimization"
execution plan as the next step in semiconductor fabrication.[64] Cannon Lake are the first mainstream CPUs to include
the AVX-512 instruction set. In comparison to the previous generation AVX2 (AVX-256), the new generation AVX-512
most notably provides double the width of data registers and double the number of registers. These enhancements would
allow for twice the number of floating point operations per register due to the increased width in addition to doubling the
overall number of registers, resulting in theoretical performance improvements of up to four times the performance of
AVX2.[65][66]
At CES 2018, Intel announced that they had started shipping mobile Cannon Lake CPUs at the end of 2017 and that they
would ramp up production in 2018.[67][68][69]No further details were disclosed.

Ice Lake microarchitecture (10th gen)

Ice Lake is codename for Intel's 10th generation microarchitecture, representing an enhancement of the 'Architecture' of the
preceding generation Kaby Lake/Cannon Lake processors (as specified in Intel's Process-Architecture-
 Optimization execution plan). With Cannon Lake having successfully moved from a 14nm to 10nm manufacturing process,
Ice Lake is also expected to feature an enhanced 10nm process (10nm+).
Ice Lake will be the first Intel CPU to feature in-silicon mitigations for the hardware vulnerabilities discovered in
2017, Meltdown and Spectre. These side-channel attacks exploit branch prediction's use of speculative execution. These
exploits may cause the CPU to reveal cached private information which the exploiting process is not intended to be able to
access as a form of timing attack.

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 Intel
 Intel Core (microarchitecture)
 List of Intel graphics processing units
 List of Intel microprocessors
 List of Intel Core i3 microprocessors
 List of Intel Core i7 microprocessors
 List of Intel Core i9 microprocessors
 List of Intel chipsets