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MSOFTX3000 Maintenance Manual-Routine Maintenance
MSOFTX3000 Maintenance Manual-Routine Maintenance
MSOFTX3000 Maintenance Manual-Routine Maintenance
1-1
1.1 Definition of Routine Maintenance ......................................................... 1-1
1.2 Routine Maintenance Suggestions......................................................... 1-1
1.2.1 Basic Principles for Equipment Maintenance................................. 1-1
1.2.2 Purposes of Routine Maintenance ................................................. 1-2
1.3 Requirements on Equipment Room Environment .................................. 1-3
1.3.1 Overview of Environment Requirements ....................................... 1-3
1.3.2 Temperature .................................................................................. 1-3
1.3.3 Temperature Variation ................................................................... 1-4
1.3.4 Relative Humidity ........................................................................... 1-4
1.3.5 Air Cleanness................................................................................. 1-5
1.3.6 Electromagnetic Radiation Resistance .......................................... 1-6
1.3.7 Electrostatic Discharge Prevention ................................................ 1-7
1.3.8 Grounding ...................................................................................... 1-9
Chapter 2 Routine Maintenance Tasks .......................................................... 2-1
2.1 Daily Maintenance Tasks ....................................................................... 2-1
2.1.1 Equipment Room Environment ...................................................... 2-1
2.1.2 Power Supply System .................................................................... 2-2
2.1.3 Terminal System ............................................................................ 2-3
2.1.4 Alarm System................................................................................. 2-4
2.1.5 Billing System ................................................................................ 2-5
2.1.6 Equipment Operation ..................................................................... 2-6
2.1.7 Service Implementation ................................................................. 2-8
2.1.8 Performance Measurement ........................................................... 2-8
2.2 Monthly Maintenance Tasks:.................................................................. 2-9
2.2.1 Cabinets ......................................................................................... 2-9
2.2.2 Terminal System ............................................................................ 2-10
2.2.3 Spare Parts .................................................................................... 2-12
2.3 Yearly Maintenance Tasks: .................................................................... 2-12
Chapter 3 Guide to Maintenance Operations ................................................ 3-1
3.1 Maintaining Grounding System .............................................................. 3-1
3.1.1 Checking Grounding System ......................................................... 3-1
3.1.2 Measuring Grounding Resistance .................................................. 3-2
3.2 Removing Dust from Equipment ............................................................ 3-3
3.2.1 Cleaning Air Filter Frame ............................................................... 3-3
3.2.2 Cleaning Air Filter Gauze ............................................................... 3-4
3.2.3 Cleaning Fan Frame ...................................................................... 3-5
3.2.4 Cleaning Air Deflector .................................................................... 3-6
3.2.5 Cleaning Board .............................................................................. 3-7
Chapter 4 Guide to Dangerous Operations ................................................... 4-1
4.1 Dangerous Operations on Hardware...................................................... 4-1
4.1.1 Dangerous Operations on Boards ................................................. 4-1
4.1.2 Dangerous Operations on Cables .................................................. 4-2
4.1.3 Dangerous Operations on Power................................................... 4-3
4.2 Dangerous Operations on Software ....................................................... 4-3
4.2.1 Overview of Dangerous Operations on Software........................... 4-3
4.2.2 Dangerous Operations on Files of BAM and iGWB ....................... 4-3
4.2.3 Dangerous Operations on Windows 2000 Server .......................... 4-4
4.2.4 Dangerous Operations on BAM Manager ...................................... 4-4
4.3 Dangerous Operations on Commands ................................................... 4-5
4.3.1 Overview of Dangerous Operations on Commands ...................... 4-5
4.3.2 Dangerous Operations on System Management Commands ....... 4-5
4.3.3 Dangerous Operations on Equipment Management
Commands .............................................................................................. 4-6
4.3.4 Dangerous Operations on Local Office Information
Management ........................................................................................... 4-7
4.3.5 Dangerous Operations on Charging Data Management ................ 4-8
4.3.6 Dangerous Operations on Gateway Management Commands ..... 4-8
4.3.7 Dangerous Operations on Signaling and Protocol Commands ..... 4-8
4.3.8 Dangerous Operations on Route and Trunk Commands............... 4-9
4.3.9 Dangerous Operations on Number Analysis Commands .............. 4-10
Chapter 5 Maintenance Record Table............................................................ 5-1
5.1 Daily Maintenance Record of MSOFTX3000 ......................................... 5-1
5.2 Monthly Maintenance Record of MSOFTX3000 ..................................... 5-3
5.3 Yearly Maintenance Record of MSOFTX3000 ....................................... 5-4
5.4 Data Modification Record of MSOFTX3000 ........................................... 5-5
5.5 Fault Handling Record of MSOFTX3000................................................ 5-6
5.6 Board Replacement Record of MSOFTX3000 ....................................... 5-7
Chapter 6 Common Maintenance Commands .............................................. 6-1
Index .................................................................................................................
HUAWEI
V100R002
HUAWEI MSOFTX3000 Mobile SoftSwitch Center
Maintenance Manual
BOM 31033554
Huawei Technologies Co., Ltd. provides customers with comprehensive technical support
and service. Please feel free to contact our local office or company headquarters.
Website: http://www.huawei.com
Email: support@huawei.com
Copyright © 2004 Huawei Technologies Co., Ltd.
Trademarks
All other trademarks mentioned in this manual are the property of their respective
holders.
Notice
The information in this manual is subject to change without notice. Every effort has
been made in the preparation of this manual to ensure accuracy of the contents, but
all statements, information, and recommendations in this manual do not constitute
the warranty of any kind, express or implied.
Summary of Updates
This section provides the update history of this manual and introduces the contents of
subsequent updates.
Update History
This manual is updated for a major product version to maintain consistency with system
hardware or software versions and to incorporate customer suggestions.
Updates of Contents
None
About This Manual
Release Notes
Organization
The manual describes the maintenance principles, routine maintenance tasks and
operations in MSOFTX3000 V100R002.
Intended Readers
Conventions
The manual uses the following conventions:
I. General conventions
Convention Description
Arial Normal paragraphs are in Arial.
Arial Narrow Warnings, Cautions, Notes and Tips are in Arial Narrow.
Boldface Headings are in Boldface.
Convention Description
Boldface The keywords of a command line are in Boldface.
Convention Description
Button names are inside angle brackets. For example, click the <OK>
<>
button.
Window names, menu items, data table and field names are inside square
[]
brackets. For example, pop up the [New User] window.
Action Description
V. Symbols
Eye-catching symbols are also used in the manual to highlight the points worthy of
special attention during the operation. They are defined as follows:
Table of Contents
i
Maintenance Manual-Routine Maintenance
MSOFTX3000 Mobile SoftSwitch Center Table of Contents
ii
Maintenance Manual-Routine Maintenance
MSOFTX3000 Mobile SoftSwitch Center Chapter 1 Overview of Routine Maintenance
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Depending on the period, routine maintenance can be divided into two types: daily
maintenance and periodic maintenance.
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To enable MSOFTX3000 to work safely and stably for a long term and lower the rate
of failure caused by environment factors, you need to improve the environment
conditions of the equipment room by taking effective measures and make the
conditions meet the basic requirements presented in this manual.
1.3.2 Temperature
I. Basic requirements
Install ventilating arrangement and air-conditioner in the equipment room to keep the
indoor temperature in range of 5°C to 45°C. In the temperature range of –5°C to +5°C
and 45°C to 55°C, which are regarded as the short-term working conditions, it is
prohibited that the equipment works for over 48 hours continuously and the
accumulated working duration each year exceeds 15 days.
Note:
The measurement of temperature and humidity must be conducted at the point two meters above the
floor and 0.4 meters away from the front side of the equipment (without protection boards in both front
and back sides).
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When the temperature is overly high, ions in the integrated circuits will diffuse or
drift increasingly. The electrons move faster to multiply the penetrating current,
which finally leads to damage of circuits caused by thermal breakdown.
When the temperature is overly high, the resistance value and the capacity of
electrolysis and capacitance in the communication equipment will change, which
causes the alteration of circuit parameters and finally leads to deterioration of
equipment performance.
When the temperature is overly high, sockets, plugs, and switches are prone to
back contact with each other due to heat caused flatulence or cold caused shrink,
which jeopardizes the reliable operation of the equipment.
When the temperature is overly high or low, the master clock frequency of the
crystal oscillator circuits will change, which affects the synchronization between
different equipment and leads to rise of bit error rate and slip rate.
Overly high temperature will accelerate the aging speed of insulating material,
while overly low temperature will make insulating material fragile. Both will
decrease the lifespan of the equipment.
I. Basic requirements
Take proper temperature control measures in the equipment room to avoid great
variation of indoor temperature. Keep the temperature variation rate per hour not
more than ±5°C.
Temperature variation affects the heat capacity of various parts of the equipment. Due
to different materials and volumes, the heat capacity of various parts varies a lot;
therefore, their sensibility to temperature variation is different, too.
The higher the heat capacity is, the greater the effect imposed by temperature
variation on the components will be. It is the same case reversely. In addition, when
the temperature changes dramatically, different stresses will be generated on different
components due to heat caused flatulent and cold caused shrink, which will
jeopardize the mechanical structure of the equipment and even lead to break of circuit
boards or fall-apart of components.
I. Basic requirements
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hours continuously and the accumulated working duration each year exceeds 15
days.
Note:
The measurement of temperature and humidity must be conducted at the point two meters above the
floor and 0.4 meters away from the front side of the equipment (without protection boards in both front
and back sides).
When the relative humidity is overly high, a layer of water membrane will be
absorbed on the surface of electronic components. According to the research,
when the relative humidity is over 65%, the water membrane can be as thick as
0.001 µm to 0.01 µm. The water membrane will result in conductivity and affect
the electrical performance of the integrated circuits.
When the relative humidity is overly high, magnetoconductivity rate of the
magnetic materials will be affected and connecting pieces and leads will be
prone to oxidization and rustiness, thus leading to bad contact or short-circuiting.
When the relative humidity is overly low, static will be generated due to the
friction between running machine, raised floor, and operation personnel in the
equipment room.
When the relative humidity is overly low, electriferous dust and particles in the air
will increase greatly, which deteriorates air cleanness in the equipment room and
imperils the stable operation of the equipment.
I. Basic requirements
There are two items for judging the air cleanness level: thickness of mechanical active
substance and that of chemical active substance. Take proper protection measures in
the equipment room to meet the following requirements:
There is no explosive, conductive, magnetoconductive, or erosive dust.
The thickness of mechanical active substance must comply with the
specifications listed in Table 1-1.
Mechanical active
Unit Content Diameter
substance
Dust particles Particle/m³ =3×105 ≤ 5 µm
Suspended dust mg/m³ =0.2 ≤ 75 µm
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Mechanical active
Unit Content Diameter
substance
Deposited dust mg/m²·h =1.5 75 µm–150 µm
Grit mg/m³ ≤30 150 µm–000 µm
The thickness of chemical active substance must comply with the specifications
listed in Table 1-2.
When the thickness of dust particles in the air is overly high, they will be attached
on the surface of electronic components and integrated circuits, thus weakening
heat dissipation ability of them. When conductive dust falls into the components,
insulation performance of the components will decline, and even short-circuiting
will occur.
Chemical active substance also imposes great effect on the communication
equipment. For example, if acidic gas such as SO2 is overly thick in the air, the
communication equipment will be rusted, leading to bad contact or
short-circuiting. If CO is overly thick in the air, explosion will be caused.
I. Basic requirements
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I. Basic requirements
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temperature and humidity, walking speed, and so on. For example, less electrostatic
charges will be generated when you wear ESD-preventive clothes than wearing
clothes made of chemical fiber. Human body will generate less electrostatic charges if
the floor is well grounded and the indoor humidity is high.
Harm on equipment
The ESD can be a great menace to all communication equipment. The instantaneous
electrostatic voltage can be several thousand or more than ten thousand volts;
therefore, when electrostatic charges contact with such electronic components using
CMOS technique as large-scale integrated circuits, ESD will occur, which will damage
the electronic components or even the equipment will fail to run normally.
60% of faulty boards are caused by ESD. ESD can also lead to software failures and
failure of electronic switches.
The following diagram shows the rising tendency of the voltage in human body within
40 seconds in three different situations. It is dangerous for human body if the voltage
exceeds 12 kV.
8
6 Standing on polypropylene
floor with leather shoes
4
2
Time (second)
0 10 20 30 40
Figure 1-1 Diagram showing the relation between ESD and time
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Figure 1-1 and Table 1-4 show the harm of ESD to hardware components. When a
man is walking in a room without any ESD-preventive measure taken, electrostatic
charges of more than 12 kV will be generated after only 12 seconds. At this time, if the
man touches any electronic equipment, the equipment might be damaged.
1.3.8 Grounding
I. Basic requirements
Grounding mode: joint grounding, which means the working ground, protection
ground, and lightning protection ground of the equipment share one grounding
body.
Grounding resistance should be not more than one ohm.
Grounding wire: Determine the cross-sectional area of various grounding wires
based on the possible maximum current load. Use conducting wire such as
copper wire. Do not use bare wire.
Good grounding is one of the important measures to ensure the stable operation of
the communication equipment. It is crucial in guaranteeing human safety and
preventing ESD, electromagnetic interference, and lightning interference.
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Note:
The section is intended to guide skilled maintenance personnel only. If you want to know the detailed
operations of specific maintenance task, refer to the related contents in Huawei MSOFTX3000
Mobile SoftSwitch Center Operation Manual-Routine Operation.
Necessary tools should be prepared in the equipment room, such as straight screwdrivers,
crossover screwdrivers, pliers, spanners, nippers of various models, electric iron, multimeter,
ESD-preventive wrist strap, and ESD-preventive brush.
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Note:
To improve efficiency, it is suggested to compile a script file containing all the MML commands needed
for daily maintenance. In this way, you can execute all MML commands in batch by running this script
file.
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Note:
For detailed operations about performance measurement, refer to HUAWEI MSOFTX3000 Mobile
SoftSwitch Center Operation Manual-Performance Measurement.
2.2.1 Cabinets
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Note:
The yearly maintenance tasks listed in this section are all major tasks. Refer to Chapter 3 of this manual
for the detailed operations.
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Remove the air deflector from the rack, and then wipe
the dust from it with clean cloth made of cotton yarn,
ESD-preventive soft brush, and vacuum cleaner.
Cleaning of All air deflectors should be
(1) Install the cleaned air deflector back into the
air deflector dust free.
rack.
(2) Clean the other air deflectors in the rack in the
same manner.
It is suggested to clean the boards once every two
Cleaning of years. All boards should be dust
boards For the detailed operations on cleaning boards, refer free.
to 3.2.5 of this manual.
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MSOFTX3000 adopts joint grounding, that is, working ground (GND), protection
ground (PGND), and backhaul ground (BGND) share one grounding body, the
grounding cables of all cabinets are connected firmly to form an equipotential system.
Depending on the installation or connecting positions, the grounding cables (in olivine
normally) of MSOFTX3000 are classified as the following:
Installation or connecting
Description
position
The grounding cable of a cabinet is connected from the grounding
Between a cabinet and the
terminal of the power distribution frame to the grounding copper
grounding system
busbar of the DC power distribution cabinet.
The grounding cables between two cabinets are connected from the
Between two cabinets
grounding copper busbar of cabinet A to that of cabinet B.
Between components in a The grounding cable of the power distribution frame is connected from
cabinet and the grounding the power distribution frame to the grounding copper busbar.
copper busbar of the cabinet
The grounding cable of the service frame is connected from a service
frame to the grounding copper busbar.
The grounding cables of the cabinet are connected from the door, top
cover, and bottom of a cabinet to the grounding copper busbar.
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Installation or connecting
Description
position
The grounding cables of peripheral equipment are connected from the
alarm box, emergency workstation, or other equipment to the
grounding system.
Outside a cabinet
1) Check whether the grounding cables in a cabinet are damaged, aged, eroded, or
burned by electrical arc.
2) Check whether the connecting terminals and captive screws of all grounding
cables in the cabinet are connected firmly and no erosion occurs to them.
3) Use a multimeter to test whether all components in a cabinet are well grounded.
Adjust the multimeter to the ohm range, connect one probe to a fixed grounding
point in the equipment room (lengthen the probe cable if it is not long enough),
and then use the other probe to measure the grounding points in the cabinet one
by one. In view of the measurement precision of the multimeter, the resistance
measured at each grounding point should be about one ohm. If the resistance
measured at a grounding point is more than one ohm apparently, check the
grounding cable, grounding terminal, and captive screw of this grounding point
immediately, and then take appropriate measures accordingly.
4) Use an earth resistance tester to measure the grounding resistance of the
grounding network in the equipment room. The grounding resistance should be
not more than one ohm. Refer to 3.1.2 for the detailed measurement method.
PGND: the protection ground for cabinets and metal cases of various devices in
a cabinet.
BGND: the backhaul ground for DC power supply of cabinets. Generally, the
positive pole of –48 VDC power is grounded in the power distribution cabinet.
GND: the working ground for circuits in various devices in a cabinet. It is the joint
name for the digital ground and analog ground of boards and backplane.
I. Measurement method
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d1
The current pole is distanced from the edge of the grounding network with d1,
which is four to five times of the maximum diagonal length (D) of the grounding
network.
The voltage pole is distanced from the edge of the grounding network with d2,
which is 50% to 60% of the distance d1 between the current pole and the
grounding network.
When measuring the resistance, move the voltage pole three times along the line
between the current pole and the grounding network. The distance moved each
time is 5% of d1. If the resistance values measured for three times are relatively
close, take the average value of these three values as the grounding resistance
of the grounding network.
If d1 cannot be four to five times of D, set d1 to 2D and d2 to D in areas with
relatively even earth resistance rate, and set d1 to 3D and d2 to 1.7D in areas
with uneven earth resistance rate.
II. Cautions
Place the current pole and voltage pole vertical to the line or underground metal
pipe.
Do not measure the grounding resistance immediately after rain.
The air filter frame is located at the bottom of an N68-22 cabinet, responsible for
filtering the wind entering the frame at the bottom of the cabinet for heat dissipation
purposes. During the operation of the equipment, the dust in the air will be attached
on the air filter frame. The accumulated dust will deteriorate the wind penetration
capability through the air filter frame, thus affecting heat dissipation efficiency and
equipment stability.
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To ensure long-term stability of the equipment, be sure to clean the air filter frame of
each cabinet periodically (once a month is recommended). Proceed as follows:
Caution:
Do not insert the wet air filter frame into the cabinet; otherwise, the equipment will be damaged due to
short-circuit occurring after water is absorbed into the cabinet.
III. Installing the air filter frame back into the cabinet
1) Push the cleaned air filter frame aslant and downward along the guide rails into
the cabinet. Do not push it forcedly.
2) After positioning the air filter frame, use a crossover screwdriver to screw the two
screws used for fixing the air filter frame into the side posts of the cabinet.
The air filter gauze is located at the inner side of the front door of an N68-22 cabinet,
responsible for filtering the wind entering the cabinet for heat dissipation purposes.
During the operation of the equipment, the dust in the air will be attached on the air
filter gauze. The accumulated dust will deteriorate the wind penetration capability
through the air filter gauze, thus affecting heat dissipation efficiency and equipment
stability.
To ensure long-term stability of the equipment, be sure to clean the air filter gauze of
each cabinet periodically (once a month is recommended). Proceed as follows:
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1) Open the front door of an N68-22 cabinet. You can see a layer of black network
gauze attached at the inner side of the front door.
2) Rip the air filter gauze out of the front door with the help of a ladder.
1) Rub the metal wall at the inner side of the front door with clean and dry cloth
made of cotton yarn.
2) Wash the air filter gauze with water.
3) Dry it with a spin-drier.
4) Finally, air it in a ventilating place.
Caution:
Do not install the wet air filter gauze back to the front door; otherwise, the equipment will be damaged
due to short-circuit occurring after water is absorbed into the cabinet.
III. Installing the air filter gauze back into the front door
Stick the cleaned air filter gauze onto the inner side of the front door with the help of a
ladder.
As a part of a service frame, the fan frame is located at the bottom of the service frame,
functioning in providing drive for heat dissipation in the service frame. During
equipment operation, dust will be attached on fan blades and circuit boards in the fan
frame. The accumulated dust will affect the operation of the fan frame and even the
service frame, thus menacing the stability of the equipment.
To ensure long-term stability of the equipment, be sure to clean each fan frame of
each cabinet periodically (once a year is recommended). Proceed as follows:
Wipe the dust off the fan blades and circuit boards in the backup fan frame with clean
cotton yarn, ESD-preventive soft brush, and vacuum cleaner. After being cleaned, the
fan frame should be dust free.
II. Replacing the fan frame to be cleaned with the backup one
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Caution:
Be sure to complete the replacement of a fan frame within five minutes; otherwise, the security and
stability of the service frame will be affected fatally.
Wipe the dust off the fan blades and circuit boards in the replaced fan frame with
clean cotton yarn cloth, ESD-preventive soft brush, and vacuum cleaner. After being
cleaned, this fan frame serves as the backup one.
Replace and clean the other fan frames in turn according to steps 2 and 3 until all of
them are cleaned.
In an N68-22 cabinet, except the service frame installed at the bottom, the other
service frames are equipped with an air deflector at the bottom of themselves. An air
deflector functions as a channel for sending wind to the above service frame for heat
dissipation purposes. During the operation of the equipment, the dust in the air will be
attached on the air deflectors. The accumulated dust will affect the performance of the
service frames and even equipment stability.
To ensure long-term stability of the equipment, be sure to clean each air deflector
periodically (once a year is recommended). Proceed as follows:
Wipe the dust off the air deflector with clean cotton yarn cloth, ESD-preventive soft
brush, and vacuum cleaner. After being cleaned, this air deflector should be dust free.
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Caution:
To reduce maintenance risks, be sure to clean the boards during the time period with light traffic, for
example, 2:00–4:00.
During the operation of the equipment, the charged ions or dust in the air will be
attached on the boards due to their electrical feature and cross-ventilation during heat
dissipation of the equipment. The attachment will be more powerful if the air is less
pure and the relative humidity is lower. The accumulated dust will affect the heat
dissipation and insulation performance of the boards fatally, thus menacing the
equipment stability. To ensure long-term stability of the equipment, be sure to clean all
boards in a cabinet periodically (once every two years is recommended). Proceed as
follows:
Before cleaning all the boards in a service frame, prepare a backup board for each
type of board in the frame first. Suppose a service frame is inserted with the following
boards, as shown in Figure 3-2.
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0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
W W W W W W W W W W W W U U
Back boards B B B B S H S H B B C C P P
F F A A I S I S F F K K W W
I I I I U C U C I I I I R R
W W W W W W W W W W W W W W W U U
C C I I A A S S I I M M C C A P P
Front boards D D F F F F M M F F G G D D L W W
B B M M M M U U M M C C B B U R R
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
B B E E S H S H C C U U
Back boards F F P P I S I S K K P P
I I I I U C U C I I W W
I I I I I I I I I I R R
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
I I F F F F S S B B M M C C A U U
F F C C C C M M S S S S D D L P P
Front boards
M M C C S S U U G G G G B B U W W
I I U U U U I I I I I I I I I R R
As shown in the figure, you need to prepare the backup boards for the WIFM, WBFI,
WBAI, WAFM, WSMU, WSIU, WHSC, WMGC, WCDB, WCKI, WALU, and UPWR..
To avoid faults during maintenance, you must replace the board to be cleaned with a
backup board according to the board replacement flow strictly. You can proceed to
clean the placed board only after the backup board runs normally. For the board
replacement flow, refer to HUAWEI MSOFTX3000 Mobile SoftSwitch Center
Maintenance Manual-Parts Replacement.
You can clean the boards in several ways. The principal principle of these methods is
to prevent the physical and electrical characteristics of the boards from being
damaged. This manual describes two commonly used methods.
Use of a vacuum cleaner
Use a clean and dry ESD-preventive soft brush to slightly wipe the dust off the board
surface, and at the same time point the suction nozzle of a vacuum cleaner at the
brush to suck.
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Use of a vacuum cleaner is simple in operation and cheap in cost, but it fails to
remove the harmful gas absorbed on the board surface.
Use of cleaning agent
Use the dedicated anhydrous, nonerosive, nonconductive, and high-volatility cleaning
agent to clean the boards, for example, isopropanol (IPA).
Cleaning agent can not only remove the dust from the boards completely, but also
remove most of the harmful gas absorbed on the surface of the boards. However, this
method is relatively complicated in operations and high in cost.
Caution:
ESD-preventive measures must be taken strictly during the operation. For example, be sure to wear
ESD-preventive clothes and wrist strap when operating on the ESD-preventive workstation.
Select the cleaning agent according to the related national standards strictly; otherwise, boards may
be damaged.
Restricted by the quantity of spare parts, it is impossible to replace all the boards to be
cleaned in one time. In this case, you can replace a board to be cleaned with the
already cleaned one of the same type.
Caution:
Because the settings of the DIP switch S3 are different when the WSIU is inserted in different frames, be
sure to check whether the settings of S3 are the same as the original one before replacing the WSIU.
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MSOFTX3000 Mobile SoftSwitch Center Chapter 3 Guide to Maintenance
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MSOFTX3000 Mobile SoftSwitch Center Chapter 3 Guide to Maintenance
Table 4-4 Operations on the files in the hard disk of the BAM and iGWB
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Maintenance Manual-Routine Maintenance
MSOFTX3000 Mobile SoftSwitch Center Chapter 3 Guide to Maintenance
Caution:
Only the trained maintenance engineers are allowed to execute the dangerous MML commands.
Use the LST type commands to query and record the original system configuration before executing the
MOD and SET type commands to modify the configuration data. When the modification fails, change
back to the original configuration and consult the Technical Support Department of Huawei Technologies
Co., Ltd.
Command Command
Possible consequence of maloperation
name function
Modifying If the maximum tuple number is set improperly, some boards
MOD MAXT maximum tuple might not be able to load data or repeatedly trying to load data.
number The board becomes abnormal.
If the public parameter is set improperly, some boards might not
MOD Modifying public
be able to load data or repeatedly trying to load data. The board
PUBPRM parameter
becomes abnormal.
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MSOFTX3000 Mobile SoftSwitch Center Chapter 3 Guide to Maintenance
Command Command
Possible consequence of maloperation
name function
If the module parameter is set improperly, some boards might
Modifying module
MOD MPRM not be able to load data or repeatedly trying to load data. The
parameter
board becomes abnormal.
Because the software parameters are widely used and
Modifying mobile referenced in many other commands and parameters, and each
MOD MSFP software bit has its specific meaning, an incorrect configuration in
parameter software parameter will result in abnormalities in multiple
functions.
This command is only used by the professional engineer during
Modifying internal
MOD TIMER deployment or upgrading. Otherwise, it will cause a series of
timer value
severe unpredictable consequences
The patch is usually integrated into other components. Some
RMV patches are important to the stable running of the system. If you
Remove patch
PATCH remove a patch by mistake, it will affect a specific function of the
system, and even harm the stable running of the system.
DEA
Deactivate patch Same as above
PATCH
Be cautious when using this command because setting the
SET TIME Set system time system time will affect the accuracy of interim charge settlement.
It is recommended to use this command when the traffic is low.
Command Command
Possible consequence of maloperation
name function
Be cautious when using this command. Do not use this
command when the standby board of the reset board is faulty,
RST BRD Resetting board offline or in the backup process. Otherwise, it will fully interrupt
the traffic of related modules. Under such circumstances, if you
reset a WCDB or WIFM, the global traffic will be blocked.
Be cautious to use this command when executing level-3 reset
RST MDU Resetting module or level-4 reset. It might block some or even all calls of the entire
office.
Be cautious when using this command. If the setting of the soft
Modifying soft
switch of board loading is invalid, it will change the board loading
MOD LSS switch of board
strategy and possibly hinder the quick-recovery mechanism
loading
when accidents happen.
Be cautious when using this command. After the FE port
configuration is modified, you must reset the WIFM and WBSG
MOD Modifying FE port
manually to make the modification become effective. Therefore,
FECFG configuration
it will affect the running of the system greatly. Generally, it will
interrupt the service.
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Command Command
Possible consequence of maloperation
name function
If you remove the CDB function data by mistake, you might have
RMV Remove CDB disabled some CDB functions. For instance, you might not be
CDBFUNC function able to locate a subscriber, or hunt a trunk. This can block the
traffic fully.
The command is used to set the overloading control mechanism
SET Setting CPU
of the system. Incorrect setting will affect the strategy of call
CPUTHD threshold
barring on overloading and overload recovery.
Command Command
Possible consequence of maloperation
name function
The command defines the important information such as the
Setting local office signaling point code of the local office and the signaling network
SET OFI
information structure. Setting this information incorrectly will cause abnormal
interworking between the MSOFTX3000 and SS7 network.
The command defines the important information such as MSC
number, VLR number, and mobile country code (MCC). When
SET Setting MSC office
setting any of the parameters incorrectly, the MSOFTX3000 will
INOFFMSC information
not interoperate with other network elements in the mobile
network.
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Command Command
Possible consequence of maloperation
name function
This command defines the important information such as the
Modifying
MOD payer, charging method and meter table number during
charging case
CHGANA charging. Modifying the charging case data incorrectly will cause
analysis
abnormal charging.
This command defines the important information such as meter
MOD Modifying mode and charging rate. Modifying the charging mode data
CHGMODE charging mode incorrectly will cause abnormality to the meter table bill and
instant charging.
Modifying
MOD
charging case Incorrect data will cause wrong charging results or bill loss.
CHGIDX
index
Command Command
Possible consequence of maloperation
name function
Deactivating If you deactivate the wrong media gateway, all traffic through the
DEA MGW
media gateway media gateway will be blocked.
RMV Removing internal If you remove the internal tone type by mistake, corresponding
TONECFG tone type service will play the tone abnormally.
Command Command
Possible consequence of maloperation
name function
If you modify the “Link set selection mask” parameter in the
Modifying M3UA M3UA destination entity data incorrectly, “uniform swing” will
MOD M3DE
destination entity happen to the signaling link selection from this office to the
destination entity.
If you modify the “Link selection mask” parameter in the M3UA
MOD Modifying M3UA
link set data incorrectly, “uniform swing” will happen to the
M3LKS link set
signaling link selection from this office to the destination entity.
The M3UA route data defines the route priority of various M3UA
Modifying M3UA link sets. If you modify the M3UA route data incorrectly, the
MOD M3RT
route signaling route set network between this office and the related
destination entity will be changed.
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Command Command
Possible consequence of maloperation
name function
If you modify the “link set selection mask” parameter in the MTP
Modifying MTP
MOD destination signaling point (DSP) data incorrectly, “uniform
destination
N7DSP swing” will happen to the signaling link selection from this office
signaling point
to the DSP.
If you modify the “link selection mask” parameter in the MTP link
MOD Modifying MTP
set data incorrectly, “uniform swing” will happen to the signaling
N7LKS link set
link selection from this office to the DSP.
The MTP route data defines the route priority of various MTP link
Modifying MTP sets. If you modify the MTP route data incorrectly, the signaling
MOD N7RT
route route set network between this office and the related DSP will be
changed.
Command Command
Possible consequence of maloperation
name function
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Command Command
Possible consequence of maloperation
name function
The MSOFTX3000 finds, analyzes and processes the call prefix
in the call prefix table that is most similar to the called number
ADD Adding called
according to the maximum matching principle. Therefore, wrong
CNACLD number analysis
call prefix data will cause undesired connection and charging
results.
The number change data defines important information such as
number change type and number change content. Modifying the
Modifying number
MOD DNC number change data incorrectly will cause call failure of the
change
subscriber of this office and the incoming subscriber that use the
change index.
Modifying caller The caller number discrimination group data defines important
MOD number information such as caller address nature and discrimination
CLRDSG discrimination type. Modifying the caller number discrimination group data
group incorrectly will cause call failure of related office direction.
Modifying called The called number barring group data defines the black and
MOD
number barring white list of the called prefix. Modifying the called number barring
CLDGRP
group group data incorrectly will cause related call failure.
The inter-group call barring indication data defines the barring
Setting inter-group attribute between the barring groups (including the black and
SET GAC call barring white barring list). Modifying the inter-group call barring
indication indication data incorrectly will cause chaotic call barring
relationship.
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MSOFTX3000 Mobile SoftSwitch Center Chapter 5 Maintenance Record Table
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Exceptions
and
handling
methods
Unsolved
exceptions
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Exceptions
and
handling
methods
Unsolved
exceptions
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Exceptions
and
handling
methods
Unsolved
problem
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Modification
Modification cause Modified contents Modifier
time
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MSOFTX3000 Mobile SoftSwitch Center Chapter 6 Common Maintenance Commands
Function
Function of command MML command
category
Backing up BAM database and registry BKP DB
Backup New Supplementary Services data BKP NSV
Displaying module version DSP EXVER
System
Displaying board version DSP BRDVER
management
Displaying patch status DSP PATCH
Listing log information LST LOG
Displaying exchange time DSP EXTM
Displaying power distribution box (PDB) status DSP PDB
Displaying environment status DSP ENVSTAT
Displaying frame status DSP FRM
Displaying fan statues DSP FAN
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Function
Function of command MML command
category
Displaying SCTP association status DSP SCTPAM
Displaying running SCTP association status DSP SCTPAR
Displaying BICC SCTP link state DSP BSCTP
Displaying BICC SCTP link state by office
DSP BSCTPOFC
direction
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MSOFTX3000 Mobile SoftSwitch Center Chapter 7 Acronyms and Abbreviations
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MSOFTX3000 Mobile SoftSwitch Center Chapter 7 Acronyms and Abbreviations
W
WAFM ATM Forward Module
WALU Alarm Unit
WBAI Back Insert ATM Interface Unit
WBFI Back insert FE Interface Unit
WBSG Broadband Signaling Gateway
WCDB Central Database Board
WCKI Clock Interface Unit
WEPI E1_Pool Interface Unit
WCCU Wireless Calling Control Unit
WCSU Wireless Calling Control Unit and signaling process Unit
WHSC Hot-Swap and Control Unit
WIFM IP Forward Module
WMGC Media Gateway Control Unit
WSGU Signaling Gateway Unit
WSIU System Interface Unit
WSMU System Management Unit
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MSOFTX3000 Mobile SoftSwitch Center Index
Index
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MSOFTX3000 Mobile SoftSwitch Center Index
i-2
Maintenance Manual-Routine Maintenance
MSOFTX3000 Mobile SoftSwitch Center Index
daily maintenance task, 2-6 check whether the link is normal, 2-8
check backup state of bill files, 2-6 yearly maintenance task, 2-12
i-3
Maintenance Manual-Routine Maintenance
MSOFTX3000 Mobile SoftSwitch Center Index
service frame, daily maintenance task check the backup of BAM database, 2-11
check operation state, 2-6 check the hard disk space of BAM, 2-11
check power supply, 2-2 check and adjust the BAM system time, 2-11
service implementation, daily maintenance task check and adjust the emergency workstation
check whether the Mc interface link is normal, 2-8 check and adjust the iGWB system time, 2-11
i.
i-4