MEGAPOSIT™ SPR™700

SERIES PHOTORESIST
For i-Line Applications

DESCRIPTION Figure 1. Masking Linearity SEMs

i-Line
MEGAPOSIT SPR700 Series Photoresists are positive
multiwavelength photoresists that are optimized to pro-
vide robust process latitudes and high throughput with
excellent thermal stability. SPR700 resists are compati-
ble across a wide variety of developer families. This ver-
satility makes SPR700 photoresists ideal for a number of
applications, especially mix and match lithography. As
with all Rohm and Haas Electronic Materials i-Line pho-
toresists, SPR700 has been formulated with safer solvent
alternatives. 0.350 µm Lines/Spaces
Thickness: 9,680Å (E0 max)
Exposure: GCA XLS 7200 (0.55 NA), 135 mJ/cm2

ADVANTAGES
• Multiwavelength (i-Line, g-Line and broadband) g-Line
• Compatible across a wide variety of developer families
(0.26N, 0.24N and 0.21N)
• Excellent process latitudes and robust process
• High throughput for stepper and develop processes:
• Es 110 mJ/cm2 for 60 SSP (0.500 µm L/S)
• Es 125 mJ/cm2 for 40 SSP (0.500 µm L/S)
• Thermal stability greater than or equal to 135°C
• Excellent DoF: 1.80 µm for 0.500 µm L/S
0.650 µm Lines/Spaces
≥1.20 µm for 0.400 µm L/S Thickness: 10,425Å (E0 max)
Exposure: GCA ALS 200 (0.42 NA), 228 mJ/cm2

Table 1. Process Conditions (Refer to Figure 1)

Ultratech*
Photoresist MEGAPOSIT SPR700-1.0

Thickness As Indicated

Softbake 95°C/60 sec. Contact Hotplate

Exposure As Indicated

PEB 115°C/60 sec. Contact Hotplate

Develop MF™-701/60 sec. single spray puddle @ 21°C

(TCU) 0.650 µm Lines/Spaces
Thickness: 9,680Å (E0 max)
Exposure: Ultratech 2244i (0.31 NA), 170 mJ/cm2

*Wavelength range of 355–375 nm

© 2004 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, ME04N102, Rev. 0
in whole or part, without the express permission of Rohm and Haas Electronic Materials. May 2004
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MEGAPOSIT SPR700 SERIES PHOTORESIST

Table 2. Lithographic Performance

Property Sizing Energy, Masking Resolution @ Exposure Focus Photospeed, Es/E0 Ratio
Es (mJ/cm2) Linearity @ Es (µm) Latitude Latitude E0 (mJ/cm2)
Es (µm) (%) (µm)

σ)
i-Line (0.55 NA, 0.54σ

40 SSP, 0.50 µm L/S 125 0.350 0.325 41.1 1.80 — —

40 SSP, 0.40 µm L/S 125 — — 31.4 ≥1.20 — —

60 SSP, 0.50 µm L/S 110 0.350 0.350 40.5 1.65 — —

60 SSP, 0.40 µm L/S 110 — — 31.5 ≥1.20 — —

40 SSP, 0.50 µm CH 156 — — ≥38.5 1.70 — —

40 SSP, 0.40 µm CH 239 — — ≥25.1 1.10 — —

g-Line (0.42 NA)

60 SSP, 0.70 µm L/S 215 0.550 0.550 ≥39.7 ≥2.80 119 1.80

60 SSP, 0.60 µm L/S 215 — — 15.1 ≥2.80 119 1.80

Figure 2. i-Line Interference Curve Figure 4. Spin Speed Curve

1.000 90 30000
SPR700-0.8
0.900 SPR700-1.2 E 28000
0 80
26000 SPR700-1.0
0.800 70
(Dense Lines/Spaces)
X-Sectioned CD (µm)

24000
Resist Thickness (Å)

SPR700-1.2
22000
Bulk E0 (mJ/cm2)

0.700 60 SPR700-1.5
20000
0.600 SPR700-1.8
50 18000
0.500 40 16000
14000
0.400 30 12000
0.300 20 10000

SPR700-1.2 Nominal 0.500µm L/S @ 130 mJ/cm

2 8000
0.200 10
SPR700-1.2 Nominal 0.400µm L/S @ 130 mJ/cm
2 6000
0.100 0 4000
1000 2000 3000 4000 5000 6000 7000 8000
9500

10500

11000

11500

12000

12500

13000
10000
9000

Spin Speed (rpm)

Resist Thickness (Å)

Figure 3. g-Line Interference Curve

Figure 5.Absorbance Curve
1.500 140 1.00
1.400 SPR700 - 1.2 E
0 130
1.300 0.90
120
1.200 110
(Dense Lines/Spaces)
X-Sectioned CD (µm)

0.80
1.100 100
Bulk E0 (mJ/cm2)

1.000 0.70
Refractive Index

90
0.900
80 0.60 Unexposed
0.800
70
0.700 0.50
0.600 60
0.500 50 0.40
0.400 40
SPR700-1.2 Nominal 0.800µm L/S @ 200 mJ/cm
30 0.30
0.300 2
SPR700-1.2 Nominal 0.700µm L/S @ 200 mJ/cm
0.200 2 20 0.20
SPR700-1.2 Nominal 0.650µm L/S @ 200 mJ/cm Exposed
0.100 2 10
0.000 0 0.10
10000

10500

11000

11500

12000

12500

13000
9000

9500

0.00
300 320 340 360 380 400 420 440 460 480 500
Resist Thickness (Å)
Wavelength (Å)
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MEGAPOSIT SPR700 SERIES PHOTORESIST

Table 3. Dill Parameters Figure 6. Hardbake Thermal Characteristics

(3 Minute Contact Hotplate)
365 nm 405 nm 436 nm

Dill A 0.918 µm-1 1.073 µm-1 0.538 µm-1

130°C
Dill B 0.061 µm-1 0.039 µm-1 0.028 µm-1

Table 4. Approx. Cauchy Coefficients—Prometrix SM300

n1 1.6210
135°C
n2 1.473e+006

n3 -1.656e+010

140°C

Figure 7. Dispersion Curve

1.72
Prometrix SM300 Cauchy Coefficients
N1
N N2
N NN3
1 2 3
1.70
1.6210 1.473e+006 -1.656e+010
Refractive Index

1.68

1.66

1.64

1.62

1.60
4500 5000 5500 6000 6500 7000 7500 8000 8500
Wavelength (Å)
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MEGAPOSIT SPR700 SERIES PHOTORESIST

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For Industrial Use Only.This information is based on our experience and is, to the best of our knowledge, true and accurate. However, since conditions for use and handling of
products are beyond our control, we make no guarantee or warranty, expressed or implied, regarding the information, the use, handling, storage or possession of the products,
or the applications of any process described herein or the results sought to be obtained. Nothing herein shall be construed as a recommendation to use any product in viola-
tion of any patent rights.