Radio Frequency Over Fiber

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Basics of Fiber Optic communication

Fiber-optic communication is a method of transmitting information from one place to another by sending
pulses of light through an optical fiber .The light forms an electromagnetic carrier wave that is
modulated to carry information. Fiber is preferred over electrical cabling when high bandwidth, long
distance or immunity to electromagnetic interference are required. Fiber optics, which is the science of
light transmission through very fine glass or plastic fibers, continues to be used in more and more
applications due to its inherent advantages over copper conductors.

Advantages of Optical fiber over RF transmission medium:

Fiber optics has many advantages over copper wire

 Increased bandwidth: The high signal bandwidth of optical fibers provides


significantly greater information carrying capacity. Typical bandwidths for
multimode (MM) fibers are between 200 and 600MHz-km and >10GHz-km for
single mode (SM) fibers. Typical values for electrical conductors are 10 to
25MHz-km.

 Electromagnetic/Radio Frequency Interference Immunity: Optical fibers are


immune to electromagnetic interference and emit no radiation.

 Decreased cost, size and weight: Compared to copper conductors of equivalent


signal carrying capacity, fiber optic cables are easier to install, require less duct
space, weigh 10 to 15 times less and cost less than copper.

 Lower loss: Optical fiber has lower attenuation (loss of signal intensity) than
copper conductors, allowing longer cable runs and fewer repeaters.

 No sparks or shorts: Fiber optics do not emit sparks or cause short circuits,
which is important in explosive gas or flammable environments.

 Security: Since fiber optic systems do not emit RF signals, they are difficult to
tap into without being detected.

 Grounding: Fiber optic cables do not have any metal conductors; consequently,
they do not pose the shock hazards inherent in copper cables.

 Electrical Isolation: Fiber optics allow transmission between two points without
regard to the electrical potential between them.

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Fiber Optic Link Components

There are four main components in a fiber optic link .

 Optical Transmitter
 Optical Fiber/Cable
 Connectors
 Optical Receiver

figure 1: Simple Fiber Optic Link

Transmitter

The transmitter converts the electrical signals to optical. A transmitter contains a light
source such as a Light Emitting Diode (LED) or a Laser (Light Amplification by
Stimulated Emission of Radiation) diode, or a Vertical Cavity Surface Emitting Laser
(VCSEL).

LED: Is used in multimode applications and has the largest spectral width that carries
the least amount of bandwidth.

LASER: Has the smallest spectral width, carries the most bandwidth, and is used in
single mode applications.

These sources produce light at certain wavelengths depending upon the materials from
which they are made. Most fiber optic sources use wavelengths in the infrared band,
specifically 850nm (1nm=10-9m), 1300nm and 1550nm. For reference, visible light
operates in the 400-700nm range

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figure 2: Electromagnetic Spectrum

Receiver

The optical receiver converts the received optical light in to Electrical equivalent by using photo diode
which act as a photo detector.

Photo Diode
A photodiode is one type of light detector, used to convert the light into current or voltage based on the
mode of operation of the device. It comprises of optical filters, built-in lenses and also surface areas.
These diodes have a slow response time when the surface area of the photodiode increases. Photodiodes
are alike to regular semiconductor diodes, but that they may be either visible to let light reach the
delicate part of the device. Several diodes intended for use exactly as a photodiode will also use a PIN
junction somewhat than the usual PN junction.

Some photodiodes will look like a light emitting diode. They have two terminals coming from the end.
The smaller end of the diode is the cathode terminal, while the longer end of the diode is the anode
terminal. See the following schematic diagram for the anode and cathode side. Under forward bias
condition, conventional current will flow from the anode to the cathode, following the arrow in the diode
symbol. Photocurrent flows in the reverse direction.

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The required materials to make a photodiode and the range of electromagnetic spectrum wavelength
range includes the following

 For silicon material, the electromagnetic spectrum wavelength range will be (190-1100) nm
 For Germanium material, the electromagnetic spectrum wavelength range will be (400-1700) nm
 For Indium gallium arsenide material, the electromagnetic spectrum wavelength range will be
(800-2600) nm
 For Lead (II) sulfide material, the electromagnetic spectrum wavelength range will be <1000-
3500) nm
 For Mercury, cadmium Telluride material, the electromagnetic spectrum wavelength range will
be (400-14000) nm

Working of Photo Diode


The working principle of a photodiode is, when a photon of ample energy strikes the diode, it makes a
couple of an electron-hole. This mechanism is also called as the inner photoelectric effect. If the
absorption arises in the depletion region junction, then the carriers are removed from the junction by
the inbuilt electric field of the depletion region. Therefore, holes in the region move toward the anode,
and electrons move toward the cathode, and a photocurrent will be generated. The entire current
through the diode is the sum of the absence of light and the photocurrent. So the absent current must
be reduced to maximize the sensitivity of the device.

Optical Fiber Cable

In this section, we discuss the structure and properties of an optical fiber, how it guides
light, and how it is cabled for protection.

An optical fiber is made of 3 concentric layers (see Figure 3):

 Core: This central section, made of silica or doped silica, is the light transmitting
region of the fiber.

 Cladding: This is the first layer around the core. It is also made of silica, but not
the same composition as the core. This creates an optical waveguide which
confines the light in the core by total internal reflection at the core-cladding
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interface.

 Coating: The coating is the first non-optical layer around the cladding. The
coating typically consists of one or more layers of polymer that protect the silica
structure against physical or environmental damage. The coating is stripped off
when the fiber is connectorized or fusion spliced.

Figure 3: Optical Fiber Construction

 Buffer (not pictured): The buffer is an important feature of the fiber. It is 900
microns and helps protect the fiber from breaking during installation and
termination and is located outside of the coating.

The light is "guided" down (see Figure 4) the core of the fiber by the optical "cladding"
which has a lower refractive index (the ratio of the velocity of light in a vacuum to its
velocity in a specified medium) that traps light in the core through "total internal
reflection."

figure 4: Diagram showing Total Internal Reflection

Total Internal Reflection (TIR) is the phenomenon that makes the water-to-air surface in a fish-tank
look like a perfectly silvered mirror when viewed from below the water level (Fig. 1). Technically, TIR
is the total reflection of a wave incident at a sufficiently oblique angle on the interface between two
media, of which the second ("external") medium is transparent to such waves but has a higher wave
velocity than the first ("internal") medium. TIR occurs not only with electromagnetic waves such as light
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waves and microwaves, but also with other types of waves, including sound and water waves. In the case
of a narrow train of waves, such as a laser beam, we tend to speak of the total internal reflection of a
"ray".

Refraction is generally accompanied by partial reflection. When a wave train is refracted from a medium
of lower propagation speed (higher refractive index) to a medium of higher propagation speed (lower
refractive index), the angle of refraction (between the refracted ray and the normal to the refracting
interface) is greater than the angle of incidence (between the incident ray and the normal to the
interface). Hence, as the angle of incidence approaches a certain limit, called the critical angle, the angle
of refraction approaches 90°, at which the refracted ray becomes tangential to the interface. As the angle
of incidence increases beyond the critical angle, the conditions of refraction can no longer be satisfied.

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Propagation of light in optical fibers
In fiber optic communications, single mode and multimode fiber constructions are used
depending on the application. In multimode fiber (Figure 5), light travels through the
fiber following different light paths called "modes." In single mode fiber, only one mode
is propagated "straight" through the fiber (Figure 6).

Figure 5: Multimode Fiber Light Propagation

Figure 6: Single Mode Fiber Light Propagation

Typical multimode fibers have a core diameter/cladding diameter ratio of 50 microns/125


microns (10-6 meters) and 62.5/125 (although 100/140 and other sizes are sometimes used
depending on the application). Single mode fibers have a core/cladding ratio of 9/125 at
wavelengths of 1300nm and 1550nm.

Core

Cladding

Popular Optical Fiber Core/Cladding Diameters

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Light is gradually attenuated when it travels through fiber. The attenuation value is
expressed in dB/km (decibel per kilometer). Attenuation is a function of the wavelength
(λ) of the light. Figure 8 shows the attenuation as a function of the wavelength.

Figure 8: Attenuation vs. Wavelength of Optical Fiber


The typical operating wavelengths are 850nm (nanometers) and 1300nm in multimode,
and 1300nm or 1550nm in single mode. Note that there are natural "dips" in the
attenuation graph at these wavelengths. For example, at an 850nm operating wavelength,
there is 3dB attenuation after 1km propagation (according to the graph). 3dB of
attenuation means that 50% of light has been lost.

Bandwidth is a measure of the data-carrying capacity of an optical fiber. It is expressed as


the product of frequency and distance. For example, a fiber with a bandwidth of
500MHz-km (Megahertz kilometer) can transmit data at a rate of 500MHz along one
kilometer of fiber. The bandwidth of single mode fibers is much higher than in
multimode fibers. The main reason for the lower bandwidth in multimode fibers is modal
dispersion.

In multimode fibers, information (ABC) is propagated in fiber according to N modes or


paths (see Figure 9), as if it were "duplicated" N times (for example, in the diagram, the
mode 3 path is longer than the mode 2 path, which are both longer than the mode 1 path).
If information is too close, there is a risk of overlapping ("smearing") the information,
and then it will not be recoverable at the end of the fiber. It is necessary to space the data
sufficiently to avoid overlap, i.e., to limit the bandwidth.

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Figure 9: Modal Dispersion in Multimode Fibers

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Modal dispersion can be alleviated to a large extent by grading the index of refraction
from the middle of the core to the cladding (graded index fiber), thereby equalizing the
paths (Figure 10).

In a step index fiber, the index of refraction changes abruptly from the core to the
cladding. To help reduce modal dispersion, fiber manufacturers created graded-index
fiber. Graded-index fiber has an index of refraction which gradually increases as it
progresses to the center of the core. Light travels slower as the index of refraction
increases. Thus, a light path propagating directly down the center of the fiber has the
shortest path but will arrive at the receiver at the same time as light that took a longer
path due to the graded-index of the fiber.

Figure 10: Graded Index in Multimode Fibers

Of course, modal dispersion is not an issue in single mode fiber because only a single
mode is propagated (Figure 11).

Figure 11: Single Mode Propagation

Unfortunately, the optical fiber construction shown in Figure 3 is fragile. Thus, for most
applications, the fiber must be made into a cable. There are many ways to construct a
cable (tight buffer, loose tube, gel filled, distribution, breakout, etc). However, in our
single fiber cable example (see Figure 12), the 250 micron coating is jacketed with a 900
micron buffer and built into a 3.0mm outer sheath cable with aramid yarn (KevlarTM ) as
a strength member. As a typical example, Figure 13 portrays a cable with multiple optical
fibers.

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Figure 12: Construction of a Single Fiber Cable

Figure 13: Example of the Construction of a Multi- Fiber Cable

Connectivity

Fiber optic links require a method to connect the transmitter to the fiber optic cable and
the fiber optic cable to the receiver. In general, there are two methods to link optical
fibers together.

Fusion Splice

The first method is called a fusion splice. This operation consists of directly linking two
fibers by welding with an electric arc or a fusion splicer (see Figure 14). The advantages
of this approach are that the linking method is fast and simple and there is very little
insertion loss (the loss of light generated by a connection is called Insertion Loss [IL]).
The disadvantages are that the link is relatively fragile, is permanent, and the initial cost
(of the fusion splicer) is high.

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Figure 14: Fiber-optic Fusion Splicer
Connectors

The second method involves the uses of fiber optic connectors. A connector terminates
the optical fiber inside a ceramic ferrule, using epoxy to hold the fiber in place. The
connectors can be mated and unmated at any time. The advantages of this approach are
that the connection is robust, the connector can be chosen according to the application,
and the connector can be connected and disconnected hundreds or even thousands of time
without damaging the connectors. The disadvantages of this approach are that the
connectorization takes longer than fusion splicing, requires special tools, and the insertion
loss can be higher when compared with fusion splicing.

There are two types of fiber optic connectors: physical contact and expanded beam.

Physical Contact Connectors

Physical contact connectors utilize fiber in a tightly toleranced ceramic ferrule. This
allows easy handling of the fiber and protects it from damage. The principle of physical
contact connectors involves the direct contact of polished fibers within two ceramic
ferrules. The ferrules are aligned using a ceramic alignment sleeve (see Figure 15).
Insertion loss is a function of the alignment accuracy and the polish quality. There are
springs behind the ferrule to ensure that the two ferrules are in constant contact even in
high vibration and shock environments.

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Figure 15: Physical Contact

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Physical contact connectors are the most common type of fiber optic connection. They are
rugged, repeatable, easy to clean, cost-effective, and perform well. In addition, for physical
contact connectors, the insertion loss is generally low (approximately 0.3dB). There are
many types of fiber optic connectors used in various applications. The most popular
single fiber connectors are (see Figure 16):

 FC-Ferrule Connector: Although the FC connector is being replaced in many


applications (telecom and datacom) by LC and SC connectors, it is still used in
measurement equipment. The connector has a screw threading and is keyed
allowing the ferrule to be angle polished providing low backreflection (light is
reflected back to the transmitter, most often at the connector interface due to an
index of refraction change).

 LC-Lucent Connector: LC connectors are supplanting SC connectors because of


their smaller size and excellent panel packing density and push-pull design. They
are also used extensively on small form-factor pluggable transceivers.

 SC-Subscriber Connector: SC connectors also offer a push-pull design (which


reduces the possibility of end-face damage when connecting) and provide good
packing density. They are still used in datacom and telecom applications.

 ST-Straight Tip Connector: ST connectors are engaged with a bayonet lock which
is engaged by pushing and twisting the connector. The bayonet interlock
maintains the spring-loaded force between the two fiber cores.

Figure 16: Popular Single Fiber Connectors

These physical contact connectors perform well against particle contaminates (dust, mud,
etc) and are usually less sensitive to liquid contaminates (water or oil). The physical
contact pushes liquid out of the way and the liquid does not degrade the connection.
Physical contact connectors are cleaned by wiping the ferrule with a clean cloth or wipe,
spraying with a cleaner or washing with water.

It is also common to provide multiple fibers in a single connector. An example is the


MPO (Multiple Fiber Push-On/Pull-Off-see Figure 17) connector which supports 12
fibers in a single ferrule. Another example is the TFOCA-II® connector which provides 4
or 12 fiber optic channels for harsh environment fiber-optic applications (see Figure 18).

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Figure 17: MPO Multi-fiber Connector

Radio frequency over optical fiber

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1. Radio over Fiber Specification

RF Over Fiber Link (Tx-Rx) 500MHz


Parameters Value Units
Frequency Range 500 MHz
RF Link Gain (0 dB optical Loss) >0 dB
1 dB Compression Point -10 dBm
SFDR 60 dB
Noise Figure 25* dB
No damage RF I/P level -35 dBm
Unit Impedance 50 Ohm
Optical Specification
Operating Wave Length (Tx) 1550 Nm
Optical Out Put 3(min) dBm
Operating Wave Length (Rx) 1110-1610 Nm
General Specifications
Supply Voltage 230 AC-12 DC V
Panel mount SMA
RF Input & Output Connector type -
Optical Connector SC/APC -
Operating Temperature -20 to +55 ˚C
Transmitter Dimensions 235X160X60 Mm
Receiver Dimensions 235X160X60 Mm

2. SCOPE

The RoF link consists of Optical Transmitter and Optical receiver in the frequency 500 MHz. The main
aim of this module is to maintain Amplitude tracking over the band.

3. TECHNICAL DESCRIPTION

Basic Principle of RF over Fiber (RoF) is RF Signals are used to modulate the light and transmit
the signals over the fiber to enable wireless access. A Typical link consists of an Optical Transmitter that
receives the RF signal, transmits it over a single Mode fiber to an Optical Receiver which converts the
optical signal back to RF.

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Optical Transmitter (Tx) will convert the RF signals into Optical signals. The optical Transmitter
works on the principle of direct modulation.

This RF over Fiber (RoF) Modules is suitable for Telecommunications, Remote Antenna
systems, Optical Delay lines, Radar applications. These modules can be used as Optical Distributed
Systems in Radar Applications. By using these modules communication can be established from meters
to few kilometers long distances. Transceiver modules have the form factor therefore they can be easily
accommodated in less space.

Receiver Module is used to convert the Optical back to RF signal. Photo diode is used to convert
the Optical signal to Electrical Signal which will be in analog form. In this case, we use high speed
planar PIN photo diode which is highly reliable and is a high power photo diode component. This type
of package is well suited for receiver applications with optical Pre amplification. The Diode is well
matched over the microwave frequency band, thereby amplifying high speed integration.

4. BLOCK DIAGRAM:

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5. DETAILED TX BLOCK DIAGRAM:

5.1 Power Supply for TX :

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6. RX BLOCK DIAGRAM:

6.1 Power Supply For RX:

7. TEST EQUIPMENT USED:


NAME OF
S.NO MODEL NO MAKE
EQUIPMENT
01 Signal Generator N5173B Agilent
R&S FSL SPECRUM
02 Spectrum Analyzer R&S
ANALYZER
03 Oscilloscope RTO 1014 R&S
04 Multi meter M29A(H) MASKTECH
06 Power Supply RS-15-12 Meanwell

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Advantages of ROF Technology

Some of the advantages and benefits of the RoF technology are discussed follow:

(i) Low Attenuation Loss: Electrical distribution of high-frequency microwave signals either in free
space or through transmission lines is problematic and costly [8]. Therefore, distributing high frequency
radio signals electrically over long distances requires expensive regenerating equipment.

(ii) Large Bandwidth: Optical Fibers offer enormous bandwidth. There are three main transmission
windows, which offer low attenuation, namely the 850 nm, 1310 nm, and 1550 nm wavelengths.

(iii)Immunity to Radio Frequency Interference: Immunity to Electromagnetic Interference (EMI) is a


very attractive property of optical Fiber communications, especially for microwave transmission. This is
so because signals are transmitted in the form of light through the Fiber[9]. Because of this immunity,
fiber cables are preferred even for short connections at mm-waves.

(iv) Easy Installation and Maintenance: In RoF systems, complex and expensive equipment is kept at the
head end, thereby making the RAUs simpler. For instance, most RoF techniques eliminate the need for a
LO and related equipment at the RAU. In such cases a photo detector, an RF amplifier, and an antenna
make up the RAU. Modulation and switching equipment is kept in the headend and is shared by several
RAUs. This arrangement leads to smaller and lighter RAUs, effectively reducing system installation and
maintenance costs.
(v) Multi-Operator and Multi-Service Operation: RoF offers system operational flexibility. Depending
on the microwave generation technique, the RoF distribution system can be made signal-format
transparent [9]. For instance the Intensity Modulation and Direct Detection (IM-DD) technique can be
made to operate as a linear system and therefore as a transparent system.

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8. LIST OF ELECTRICAL TESTS:

The following Electrical tests have to be conducted.

 Gain Variation Measurement


9. TEST PROCEDURES:
9.1 GAIN VARIATION MEASUREMENT:
1. The test setup is to be made as shown in figure-1.
2. Set the following parameters on Signal Generator and Spectrum Analyzer.
Signal Generator settings:
 Frequency: Test Frequency from 20 MHz-3 GHz
 Modulation: INT MOD off.
 Power level: - 75dBm.
Spectrum Analyzer settings:
 Frequency: Test Frequency from 20 MHz-3 GHz
 Span: 100 MHz
 Reference Level: 0dBm.
 Resolution BW: 3KHz
3. Now feed the RF at input with power level -65dBm at the required test frequencies.
4. Record the output power for the different frequencies with spectrum analyzer and note down the
readings in the TDR-1.
5. Calculate the gain i.e. Po (output power) - Pi (input power).
6. Repeat the same procedure for all test frequencies and note down in the TDR-1.

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TANTALUM CAPACITOR:
A tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic
circuits. It consists of a pellet of tantalum metal as an anode, covered by an insulating oxide layer
that forms the dielectric, surrounded by liquid or solid electrolyte as a cathode. Because of its
very thin and relatively high permittivity dielectric layer, the tantalum capacitor distinguishes
itself from other conventional and electrolytic capacitors in having high capacitance per volume
(high volumetric efficiency) and lower weight.

PI ATTENUATOR:
Pi-pad Attenuators or π-pad attenuators are commonly used in radio frequency and microwave
transmission lines, and can be balanced or unbalanced designs

The Pi-pad attenuator is so called because its basic layout and design resembles that of the Greek letter
pi ( π ), meaning that it has one series resistor and two parallel shunt resistors to ground at the input and
the output.

The Pi-pad attenuator is another fully symmetrical purely resistive network that can be used as a fixed
attenuator between equal impedances or for impedance matching between unequal impedances. The
circuit configuration of the Pi-pad attenuator is given below
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BASIC Pi-pad Attenuator Circuit:

We can see that the standard pi-pad attenuator is symmetrical looking at the attenuator from either end
and this type of attenuator design can be used to impedance match either equal or unequal transmission
lines. Generally, resistors R1 and R3 are of the same value but when designed to operate between
circuits of unequal impedance these two resistor can be of different values.

TRANSMITTER IC DESCRIPTION:

1.NBB310:

Features:
􀂄 Reliable, Low-Cost HBT Design
􀂄 13dB Gain
􀂄 High P1dB of +15.2dBm at
6GHz
􀂄 Single Power Supply Operation
􀂄 50Ω I/O Matched for High Freq.
Use

PRODUCT DESCRIPTION:
The NBB-310 cascadable broadband InGaP/GaAs MMIC amplifier is a low-cost,
high-performance solution for general purpose RF and microwave amplification
needs. This 50Ω gain block is based on a reliable HBT proprietary MMIC design,
providing unsurpassed performance for small-signal applications. Designed with an
external bias resistor, the NBB-310 provides flexibility and stability. The NBB-310 is
packaged in a low-cost, surface-mount ceramic package, providing ease of assembly
for high-volume tape-and-reel requirements. It is available in either packaged or
chip (NBB-310-D) form, where its gold metallization is ideal for hybrid circuit
designs.
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HMC 424LP3e:

GENERAL DESCRIPTION:

The HMC424LP3 & HMC424LP3E are broadband 6-bit GaAs IC digital attenuators in low cost leadless
surface mount packages. Covering DC to 13 GHz, the insertion loss is less then 4 dB typical. The
attenuator bit values are 0.5 (LSB), 1, 2, 4, 8, and 16 dB for a total attenuation of 31.5 dB. Attenuation
accuracy is excellent at ± 0.5 dB typical step error with an IIP3 of +32 dBm. Six control voltage inputs,
toggled between 0 and -5V, are used to select each attenuation state. A single Vee bias of -5V allows
operation at frequencies down to DC.

FEATURES:

0.5 dB LSB Steps to 31.5 dB


Single Control Line Per Bit
± 0.5 dB Typical Bit Error
9mm2 Leadless SMT Plastic Package

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BIAS VOLTAGE AND CURRENT:

CONTROL VOLTAGE:

FUNCTIONAL DIAGRAM

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TRUTH TABLE:

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ABSOLUTE MAXIMUM RATING

PIN DESCRIPTION:

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LM117 IC DESCRIPTION:

GENERAL DESCRIPTION:

The LM1117 is a low power positive-voltage regulator designed to meet 1A output current and comply
with SCSI-II specifications with a fixed output voltage of 2.85V. This device is an excellent choice for
use in battery-powered applications, as active terminators for the SCSI bus, and portable computers.
The LM1117 features very low quiescent current and very low dropout voltage of 700mV at a full load
and lower as output current decreases. LM1117 is available as an adjustable or fixed 1.5V, 1.8V, 2.5V,
2.85V,3.0V, 3.3V, and 5.0V output voltages.
The LM1117 is offered in a 3-pin surface mount package SOT-223 & TO-263. The output capacitor of
10㎌ or larger is needed for output stability of LM1117 as required by most of the other regulator
circuits.

FEATURES:

Output Current up to 1 A
● Low Dropout Voltage ( 700mV at 1A Output Current )
● Three Terminal Adjustable or Fixed 1.5V, 1.8V, 2.5V, 2.85V,
3.0V, 3.3V, 5.0V
● 2.85V Device for SCSI-II Active Terminator
● 0.04% Line Regulaion, 0.1% Load Regulation
● Very Low Quiescent Current
● Internal Current andTerminal Limit
● Logic-Controlled Electronics Shutdown
● Surface Mount Package SOT-223 & TO-263 (D2-Pack)
● 100% Thermal Limit Burn-In

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ABSOLUTE MAXIMUM RATING :

TYPICAL APPLICATION:

APPLICATIONS:
● Active SCSI Terminators
● Portable/Plan Top/Notebook Computers
● High Efficiency Linear Regulators
● SMPS Post Regulators
● Disk Drives
● Battery Chargers

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LTC1983-5 IC :

DESCRIPTION:

The LTCR1983-3 and LTC1983-5 are inverting charge pump DC/DC converters that produce negative
regulated outputs. The parts require only three tiny external capacitors and can provide up to 100mA of
output current. The devices can operate in open loop mode (creating a –VIN supply) or regulated output
mode depending on the input supply voltage and the output current.
The LTC1983-3/LTC1983-5 have many useful features for portable applications including very low
quiescent current (25μA typical) and a zero current shutdown mode programmed
through the SHDN pin.
The LTC1983-3/LTC1983-5 are over-temperature and short-circuit protected. The parts are available in
a 6-pin low profile (1mm) ThinSOT package.

FEATURES:

 Fixed Output Voltages: –3V, –5V or Low Noise VIN


to –VIN Inverted Output
 ±4% Output Voltage Accuracy
 Low Quiescent Current: 25μA
 100mA Output Current Capability
 2.3V to 5.5V Operating Voltage Range
 Internal 900kHz Oscillator
 “Zero Current” Shutdown
 Short-Circuit and Over-Temperature Protected
 Low Profile (1mm) ThinSOTTM Package

PIN CONFIGURATION:

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ABSOLUTE MAXIMUM RATING:

VIN to GND = –0.3V to 6V


SHDN Voltage = –0.3V to 6V
VOUT to GND (LTC1983-3) = 0.2V to VOUT Max
VOUT to GND (LTC1983-5) = 0.2V to VOUT Max
IOUT Max =125mA
Output Short-Circuit Duration= Indefinite
Operating Temperature Range (Note 2) =–40°C to 85°C
Storage Temperature Range =–65°C to 125°C
Lead Temperature (Soldering, 10 sec) =300°C

PIN FUNCTIONS:

VIN (Pin 1): Charge Pump Input Voltage. May be between 2.3V and 5.5V. VIN should be bypassed
with a ≥4.7Μf low ESR capacitor as close as possible to the pin for best performance.
VOUT (Pin 2): Regulated Output Voltage for the IC. VOUT should be bypassed with a ≥4.7μF low
ESR capacitor as close as possible to the pin for best performance.
C+ (Pin 3): Charge Pump Flying Capacitor Positive Terminal. This node is switched between VIN and
GND (It is connected to VCC during shutdown).
C– (Pin 4): Charge Pump Flying Capacitor Negative Terminal.This node is switched between GND and
VOUT (It is connected to GND during shutdown).
GND (Pin 5): Signal and Power Ground for the 6-Pin SOT‑23 package. This pin should be tied to a
ground plane for best performance.
SHDN (Pin 6): Shutdown. Grounding this pin shuts down the IC. Tie to VIN to enable. This pin should
not be pulled above the VIN voltage or below GND.

APPLICATIONS:

 –3V Generation in Single-Supply Systems


 Portable Equipment
 LCD Bias Supplies
 GaAs FET Bias Supplies

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TS922( RAIL TO RAIL OP-AMP):

DESCRIPTION:
The TS922 is a RAIL TO RAIL dual BiCMOS operational amplifier optimized and fully specified for
3V and 5V operation. High output current allows low load impedances to be driven. The TS922exhibitsa
very low noise, low distortion,low offsetand high output current capabilitymaking this device an
excellent choice for high quality, low
voltage or battery operated audio systems.The device is stable for capacitive loads up to 500pF.

FEATURES:
 .RAIL TO RAIL INPUT AND OUTPUT .LOWNOISE : 9nV/`/`(H``z) .LOWDISTORTION
HIGH OUTPUT CURRENT : 80mA
 .(able to drive 32W loads) .HIGH SPEED : 4MHz, 1.3V/ms .OPERATINGFROM 2.7V to 12V
LOW INPUT OFFSET VOLTAGE : 900mV max
 .(TS922A) .ESD INTERNAL PROTECTION : 2KV .LATCH-UP IMMUNITY
MACROMODEL INCLUDED IN THIS SPECIFICATION

PIN CONFIGURATION:

ABSOLUTE MAXIMUM RATING:

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OPERATING CONDITIONS:

APPLICATION :

 piezoelectric speaker driver


 sound cards, multimedia systems
 line driver, actuator driver
 servo amplifier
 mobile phone and portable equipment instrumentation with low noise as key factor

RSB16VATR(5.1V ZENER DIODE):

GENERAL DESCRIPTION:
RSB16VA is a bi-directional zener diode having two zeners confronted in one package, aimed to absorb
the surge in plus and minus directions arising from the signal line in mobile phone, consumer electronics
such as PC, and automotive applications. In general, two pieces of zener diodes are used as ESD
protector to absorb the surge in +/ - directions. Paying attention to this point and using its original
technology, ROHM succeeded to incorporate 2 zeners in one die/package for benefit of space-saving on
the circuit board.

FEATURES:

 Absorption of plus & minus surge with one package


 Decrease of components and space-saving on the
circuit board.

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ABSOLUTE MAXIMUM RATING (Ta=25°C):

Electrical characteristics (Ta=25°C):

TVS DIODE(Transient Voltage Suppressors):

1955 F/R/W Coaxial DFB Laser Diode:


DESCRIPTION :
EMCORE’s Model 1955 DFB lasers offer a low cost solution for linear fiber optic links. These
components can be cooled with external thermo-electric coolers for high stability, or run without TEC’s
to reduce power consumption. The DFB laser builds upon Ortel’s long history of high performance,
leading edge designs in CATV, wireless, and high speed digital applications. The laser diode devices are
packaged in a compact hermetic assembly together with monitor photodiode and isolator, for flexible
integration into various transmitter configurations.

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PERFORMANCE HIGHLIGHTS:

ABSOLUTE MAXIMUM RATING :

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These
are absolute stress ratings only. Functional operation of the device is not implied at these or any other
conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute
maximum ratings for extended periods can adversely affect device reliability.

35
Schematic and Pinout:

36
Laser Safety:

This product meets the appropriate standard in Title 21 of the Code of Federal Regulations (CFR).
FDA/CDRH Class 1 laser
product. This device has been classified with the FDA/CDRH under accession number 0220191.
All version of this laser are Class 1 laser product, tested according to IEC 60825-1:2007/EN 60825-
1:2007
Single-mode fiber pigtail with SC/APC connectors (standard).
Wavelength = 1.3 μm.
Maximum power = 50 mW.
Because of size constraints, laser safety labeling (including an FDA class 1 label) is not affixed to the
module, but attached
to the outside of the shipping carton. Product is not shipped with power supply.
Caution: Use of controls, adjustments and procedures other than those specified herein may result
in hazardous
laser radiation exposure.

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MAX 4007 IC(CURRENT MONITER):

DESCRIPTION:

The MAX4007/MAX4008 precision, high-side, high-voltage current monitors are specifically designed
for monitoring photodiode current in fiber applications. They offer a connection point for the reference
current and a monitor output that produces a signal proportional to the reference current. The monitor
output of the MAX4007 is a current proportional to the reference current. The monitor output of the
MAX4008 is a voltage proportional to the reference current. The current monitors have six decades of
dynamic range and monitor reference currents of 250nA to 2.5mA with better than
5% accuracy. The photodiode current can be monitored from 10nA to 10mA with reduced accuracy. The
MAX4007/MAX4008 accept a supply voltage of +2.7V to +76V, suitable for APD or PIN photodiode
applications.
Internal current limiting (20mA, typ) protects the devices against short circuit to ground. A clamp diode
protects the monitor output from overvoltage. Additionally, these devices feature thermal shutdown if
the die temperature reaches +150°C.The MAX4007/MAX4008 are available in tiny, spacesaving 6-pin
SOT23 packages, and operate over the
extended temperature range of -40°C to +85°C.

FEATURES:
 Wide Reference Current Dynamic Range
 Guaranteed 250nA to 2.5mA with 5% Monitor
 Accuracy
 Extended 10nA to 10mA with 10% Monitor
 Accuracy
 _ Current (MAX4007) or Voltage (MAX4008) Monitor
Outputs
 _ Reference Current-Limit Protection (20mA, typ)
 _ Voltage Clamp Protects Subsequent Output
Circuitry
 _ +2.7V to +76V Wide Voltage Range Operation
 _ 6-Pin SOT23 Packages

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PIN CONFIGURATION :

ABSOLUTE MAXIMUM RATING:

CLAMP to GND ......................................................-0.3V to +80V


BIAS, REF to GND ..................................................-0.3V to +80V
OUT to GND .........................................-0.3V to (VCLAMP + 0.6V)
Short Circuit, REF to GND ..........................................Continuous
Current into Any Pin..........................................................±30mA
Continuous Power Dissipation (TA = +70°C)
6-Pin SOT23 (derate 8.7mW/°C above +70°C)............696Mw
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C

APPLICATION:

 Photodiode Current-Monitoring Systems


 Portable Instrumentation
 Medical Instrumentation
 Laboratory Instrumentation
 Consumer Electronics
 Current-to-Voltage Conversion

2651A/2651E Broadband Photodiode:


39
DESCRIPTION:

The 2651 provides the proven high performance of EMCORE’s photodiode technology in a very
practical, cost effective package. The 2651A features high linearity and low capacitance over a 1 GHz
bandwidth. The extended bandwidth 2651E offers high linearity and low capacitance up to 3 GHz. These
broadband photodiodes are housed in a small, environmentally rugged coaxial package. The 2651
broadband photodetector is designed to provide the performance and flexibility needed to meet the
expanding applications of two-way communications networks. This photodiode is used today in
forward-and return-path applications, including AM-VSB CATV, QAM 64/256, PON, FTTC and FTTH
receivers. The 2651A and 2651E photodiodes are compliant with all criteria of the Restriction of the Use
of Hazardous Substances in Electrical and Electronic Equipment
(RoHS) guidelines 2002/95/EC

Performance Highlights:

FEATURES:

 Low Cost Package


 Low Capacitance, < 0.4 pF
 Low Dark Current < 50 nA at +85°C
 1 GHz Flat Response, + 0.5 dB
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 Extended Bandwidth Option
 High Responsivity
- > 0.90 A/W at 1310 nm, typ.
- > 0.98 A/W at 1550 nm, typ.
 RoHS Compliant

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These
are absolute stress ratings only. Functional operation of the device is not implied at these or any other
conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute
maximum ratings for extended periods can adversely affect device reliability.

BLOCK DIAGRAM AND PIN OUT :

APPLICATIONS:

 Forward-Path and Return-Path


 Broadband Video Transport
 FTTx Receivers
 EDFA and Network Monitors

41
CONCLUSION
In this paper the review of the ROF technology has been explained in which some techniques which use
radio over fiber technology are also explained. The main advantages of the ROF technology are low
attenuation loss, large bandwidth and easy installation and maintenance. The main drawback of the ROF
technology is signal impairments such as noise and distortion which should be eliminated in the future

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