SURFACE MOUNT

TECHNOLOGY
INTERNSHIP REPORT
BRIEF OVERVIEW OF INDUSTRY AND INTERN DEPARTMENT
National Institute of Electronics (NIE) an autonomous organization under the
Administrative control of Ministry of Science & Technology (MoST) has
been established in 1979 through the Presidential Ordinance No. III for the
promotion of electronics at the national level. The Institute has highly
trained/experienced pool of engineers, scientists and technicians, Qualified
from the leading universities/institutions of the world. The institute is a
premier design and development organization in the field of electronics in
Pakistan. Since its inception in 1980 the Institute has developed considerable
expertise in the area of Digital Electronics, Power Electronics, Computer
Hardware/Software and Computer Training.

SMTPL:
Surface mount technology is a technology in which the components are placed
onto the electronic circuits (PCB). These circuits are first printed and then the
components are mounted on them with the help of automatic machines known
as pick and place machines. This technology has currently replaced the
through hole technology in which the components are first put into the holes
of the printed PCB through wires and then are soldered onto the board. Both
technologies can be used on the same board for components not suited to
surface mounting such as large transformers and heat-sink power
semiconductors. Usually the size of an SMT component is much smaller than
the through hole components because it may have very fine pitched and
smaller leads or may contain no leads.

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LIST OF SOFTWARE AND TOOLS:
 Software
 ePlace
 proteus 8 professional
 tools
 Vernier caliper
 Machines
 Automatic optical inspection
 Samsung PCB loader
 Tucano printer
 Essemtec’s cobra pick and place
 Paraquda pick and place
 Samsung work table
 ePlace reflow oven
 Samsung PCB unloader

LEARNING AS AN INTERN:
Career Exploration

 Learnt about a career field from the inside and decide what is the right
career field for me

Leadership and Skill Development

 Learnt new skills and added to my knowledge base while gaining

confidence in my abilities
 Opportunity to practice communication and teamwork skills
 Gained industry knowledge first hand from an organization and
professionals
 Provided evidence that I have initiative, reliability, and have a sense of
responsibility

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  Applied some of the ideas learned in school and provide a bridge
between school and the professional world
 Achieved a sense of accomplishment by contributing to an organization

Networking and Establishing Mentors and References

 Met new people and practiced networking skills while establishing a

network of professional contacts, mentors, and references
 Open to door to advice on the next steps to take on your career path

Resume Enhancements

 Gain valuable experience and accomplishments to add to my resume

and enhance my application to graduate school
 Create an advantage over other job or graduate school applicants
 Potential for a full-time job offer at the end of the internship

Work hard no matter what you’re doing

Always work hard even if your task is small and seems unimportant. It will
help you build a good work ethic, and people will notice the effort you put in.
It’s not nice being told what to do all the time, but your superiors (mostly)
know better. Following the rules and instructions they give you makes it easier
for everyone.
Independence
Often, we think being spoon-fed is the way to learn, but working
independently has proved to be very important. My internship taught me to
make my own decisions and do things on my own.
Being able to work independently with little guidance is very important in the
working world.

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Taking constructive criticism well
Naturally, no one likes to be criticized and performance evaluations can be
quite scary. we probably make a few mistakes and receive constructive
criticism about our work from both our colleagues and our boss.
Always remind ourselves that it’s not personal. It is for our own good and
growth and it will improve the quality of your work.

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TABLE OF CONTENTS
Introduction ..................................................................................................... 0
smd’s ............................................................................................................... 8
surface mount assembly process ................................................................... 10
machine programming .................................................................................. 11
solder paste printing ...................................................................................... 12
Component placement .................................................................................. 14
Reflow soldering ........................................................................................... 15
references ...................................................................................................... 18

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TABLE OF FIGURES
Figure 1 SMT ASSEMBLER .......................................................................................................... 7
Figure 2 SMD PACKAGES ............................................................................................................ 9
Figure 3 COMPONENT TYPES................................................................................................... 10
Figure 4 ePlace WORKSCREEN .................................................................................................. 11
Figure 5 SOLDER PASTE UNDER MICROSCOPE ................................................................... 13
Figure 6 PICK AND PLACE PROCESS ...................................................................................... 15
Figure 7 ESSEMTEC’s COBRA................................................................................................... 16
Figure 8 PARAQUADA ............................................................................................................... 17
Figure 9 REFLOW PROCESS ...................................................................................................... 18

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 INTRODUCTION
Surface Mount Technology is an area of electronic assembly used to mount
electronic components to the surface of the printed circuit board (PCB) as
oppose to inserting components through holes as with conventional
assembly. SMT was developed to reduce manufacturing costs and, also to
make more efficient use of PCB space. Because of the introduction of surface
mount technology, it is now possible to build highly complex electronic
circuits into smaller and smaller assemblies with good repeatability due to the
higher level of automation.

Figure 1 SMT ASSEMBLER

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SMD’S
Surface mount device or SMD is the term used for the electronic
components used within the surface mount assembly process. There is
a wide range of SMD component packages available on the market and
come in many shapes and sizes.

 Two-terminal packages:
 Small outline diode (SOD)
 Metal electrode leadless face (MELF)
 DO-214 (Schottky and other diodes)

 Three- and four-terminal packages:

 Small-outline transistor (SOT)
 Packages with more than six terminals (dual-in-line):
 Small-outline integrated circuit (SOIC)
 Small-outline package, J-leaded (SOJ)
 Thin small-outline package (TSOP)
 Shrink small-outline package (SSOP)
 Thin shrink small-outline package (TSSOP)
 Quarter-size small-outline package (QSOP)
 Very small outline package (VSOP)
 Dual flat no-lead (DFN)

 Packages with more than six terminals (quad-in-line):

 Plastic leaded chip carrier (PLCC)

 Quad flat package (QFP)

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  Low-profile quad flat-package (LQFP)
 Plastic quad flat-pack (PQFP)
 Ceramic quad flat-pack (CQFP)
 Metric quad flat-pack (MQFP)
 Thin quad flat-pack (TQFP)
 Quad flat no-lead (QFN)
 Leadless chip carrier (LCC)
 Micro leadframe package (MLP, MLF)
 Power quad flat no-lead (PQFN)

 Grid arrays:
 Ball grid array (BGA)
 Fine-pitch ball grid array (FBGA)
 Ceramic column grid array (CCGA)
 Lead less package (LLP)

 Non-packaged devices:
 Chip-on-board (COB)
 Chip-on-flex (COF)
 Chip-on-glass (COG)

Figure 2 SMD PACKAGES

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SURFACE MOUNT ASSEMBLY PROCESS
The surface mount assembly process starts during the design phase when the
many different components are selected, and the PCB is designed using a
software package.
It is important to realize that the process starts at this stage as this is the best
time to incorporate as many design features as possible that will make
production straight forward and head-ache free. Quite often circuits are taken
from the schematic design phase to PCB layout with the main considerations
being the functionality, which of course is very important, but design for
manufacture(DFM) should ideally be incorporated.
Once the PCB design has been finalized and components selected the next
phase is to send the PCB data away to a PCB manufacturing company and
components bought in the most
suitable way to facilitate
automation. The PCB panel
design should be considered and
specification created to ensure
that the format that the PCB's are
received is as expected and
suitable for the machines to be
used.
Components are available
packaged in many ways such as
on reels, in tubes or in trays as can
been seen below. Most are Figure 3 COMPONENT TYPES
available on reels which is
preferred but sometimes due to 'Minimum Order Quantities (MOQ's)'
components are quite often supplied in tubes or in short strips of tape. Both
packaging types can be used but do need appropriate feeder types.

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MACHINE PROGRAMMING
Having received the PCB panels and components the next step is to setup the
various machines used with the manufacturing process. Machines such as the
placement machine will require to be programed to use. A software named
EPLACE is used for the following purpose.

ePlace:
ePlace is a newly designed software based on the Essemtec software
architecture “eez-Technology”.
 Fingertip operation
 Easy to use
 Universal CAD input
 Zoom of camera windows

ePlace Simplifies Complexity:

ePlace defines a new standard of a user-friendly software for the operation of
a complex machine. The software is graphically intuitive, features multi-
language support and makes complex things easy to understand.

 Intuitive Operation
 Graphical real-time display
 Multi-language support
 Tool tips and context-sensitive
help
 Unlimited zooming function
 Optimized display for reduced
scrolling and clicking
 Integrated training lessons
 Intelligent searching functions
 Automatic entry completion Figure 4 ePlace WORKSCREEN
 Soft links and memorizing
functions

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 User management and rights system
 Job and quality management system
 Component management and setup optimization

Easy operation of complex machines:

ePlace makes controlling a complex machine an easy task. Because not every
operator speaks English and a staff with language skills is expensive, the
software uses graphical representations to create clarity, and when text is
unavoidable, the support for multiple languages is prepared. Education
lessons are integrated as well, allowing new staff to be trained quickly.

Avoiding setup and placement errors:

ePlace is based on a job management with archiving system on which other
functions build up, such as a job planning module, a setup optimization
routine, a setup list generator, component storage management and more. For
feeder setup and retrofitting, a bar code reader is used, which is the safest and
fastest way to assign a component to a feeder. Setup errors are excluded, and
the stock of available components is updated automatically.

SOLDER PASTE PRINTING

The first machine to setup in the manufacturing process is the solder paste
printer which is designed to apply solder paste using a stencil and squeegees
to the appropriate pads on the PCB. This is the most widely used method for
applying solder paste. Keeping control of this process is critical as any
printing defects, if undetected, will lead to defects further down the line. With
assemblies becoming more complex the design of the stencil is key and care
must be taken to ensure a repeatable and stable process. It is done by Tucano
printer. After the Samsung PCB loader loads the PCB.

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Solder paste:
It is a material used in the
manufacture of printed circuit
boards to connect surface
mount components to pads on the
board. The paste initially adheres
components in place by being
sticky, it is then heated (along with
the rest of the board) melting the
paste and forming a mechanical
bond as well as an electrical
connection. The paste is applied to
the board by jet printing, stencil
Figure 5 SOLDER PASTE UNDER MICROSCOPE
printing or syringe and then the
components are put in place by a pick-and-place machine.
Composition:
A solder paste is essentially powder metal solder suspended in a thick medium
called flux. Flux is added to act as a temporary adhesive, holding the
components until the soldering process melts the solder and fuses the parts
together. The paste is a gray, putty-like material. The composition of the
solder paste varies, depending upon its intended use. For example, when
soldering plastic component packages to an FR-4 glass epoxy circuit board,
the solder compositions used are eutectic Sn-Pb (63 percent tin, 37
percent lead) or SAC alloys (tin/silver/copper, named for the elemental
symbols Sn/Ag/Cu). If one needs high tensile and shear strength, tin-
antimony (Sn/Sb) alloys might be used with such a board. Generally, solder
pastes are made of a tin-lead alloy, with possibly a third metal alloyed,
although environmental protection legislation is forcing a move to lead-free
solder.

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Classification:

 By size:
The size and shape of the metal particles in the solder paste determines
how well the paste will "print". A solder ball is spherical in shape, this
helps in reducing surface oxidation and ensures good joint formation
with the adjoining particles. Irregular particle sizes are not used, as they
tend to clog the stencil, causing printing defects. To produce a quality
solder joint, it's very important for the spheres of metal to be very
regular in size and have a low level of oxidation. Solder pastes are
classified based on the particle size by IPC standard J-STD 005.

 By flux:
According to IPC standard J-STD-004 "Requirements for Soldering
Fluxes", solder pastes are classified into three types based on the flux
types:
Rosin based pastes are made of rosin, a natural extract from pine trees.
These fluxes can be cleaned if required after the soldering process using
a solvent (potentially including chlorofluorocarbons).
Water-soluble fluxes are made up of organic materials and glycol
bases. There is a wide variety of cleaning agents for these fluxes.
A no-clean flux is made with resins and various levels of solid
residues. No-clean pastes save not only cleaning costs, but also capital
expenditures and floor space. However, these pastes need a very clean
assembly environment and may need an inert reflow environment.

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COMPONENT PLACEMENT
Once the printed PCB has been confirmed to have the correct amount of solder
paste applied it moves into the next part of the manufacturing process which
is component placement. Each component is picked from its packaging using
either a vacuum or gripper nozzle, checked by the vision system and placed
in the programed location at high speed. There is a large variety of machines
available for this process and it depends greatly on the business to what type
of machine is selected. For example, if the business is focused around large
build quantities then the placement rate will be important however if the focus
is small batch/high mix then flexibility will be more important. ESSEMTEC
COBRA and ESSEMTEC PARAQUADA are used for following purpose.

Figure 6 PICK AND PLACE PROCESS

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  ESSEMTEC’s Cobra:
Cobra is the second generation of assembly systems based on ePlace, the new
software designed entirely by Essemtec based on the company’s eez-
technology. ePlace has been fully developed in .net, uses an integrated
database, and offers a modern, interactive, intelligent and intuitive tool for
controlling all parameters. Additionally, Cobra is the world’s most modern
SMD pick-and-place machine and the first SMD pick-and-place system to
combine the advantages of a highly flexible pick-and-place with the
throughput of a multi-axes placer.
The system is equipped with the best
that today's drive and material
technologies have to offer. Linear
motors, a high-speed bus and signal
processing system, carbon fiber
parts, and a mineral compound base
are a selection of the many features
that make Cobra fast, reliable and
extremely precise. Cobra offers an
8-axes placement head in which Figure 7 ESSEMTEC’s COBRA
each of the axes can place the full
range of components that range from 01005 to 80x70 mm. Additionally, the
system has a capacity of up to 240 feeders with 220 feeders in inline mode.
The placement area is specified at 23.6 x 31.5" and placement speed is rated
at 20,000 cph (IPC-9850). Cobra is not only fast, but flexible as well. 75% of
placement is done by COBRA.

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  Paraquda
Paraquda placement machine
enables precise and process-
optimized work and fits in well with
our usual high-quality standards. In
addition, it is characterized by its
flexibility of component parts and
PCB formats, as well as the ease of
programming and the reliability of
the assembly. Optionally,
the Paraquda is available with
dispensing and jet-dispensing Figure 8 PARAQUADA
valves for solder paste and/or
adhesive applications. The integration of various systems directly into an
automatic pick-and-place machine allows all the requirements for a flexible
production of prototypes. the Paraquda can pick and place components with
the dimensions 80x70mm and a height up to 25mm. the number of feeders
was also a prerequisite for AVM-TEC, who looked at upgrading the old
machine to a system that would be able to hold at least 30 more 8mm single
feeders, largely due to the time it took to set up a new program. The Paraquda
holds up to 240 components when 8mm double feeders are used on every
feeder space. With the capability of placing over 15,000 surface mounted parts
an hour, the Paraquda platform offers the ability to combine placement and
dispensing, and processes all types of components, from 01005 to large
components or connectors. Unmatched changeover times and a highly flexible
assembly are ensured by the highest number of feeder slots per square meter
in the market, intelligent, servo-driven kitting without production stop and an
intuitive, touch screen-based operation. Paraquda combines two different
production steps within one machine platform (solder paste jetting and SMD
assembly). With this unique combination, the multifunctional center allows
an unprecedented flexibility in the market. Remaining 25% placement is done
with the help of PARAQUDA.

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REFLOW SOLDERING
Once all component placements
have been checked on the Samsung
work table, the PCB assembly
moves into the reflow soldering
machine where all the electrical
solder connections are formed
between the components and PCB
by heating the assembly to
sufficient temperature. This would
appear to be one of the less
complicated parts of the assembly Figure 9 REFLOW PROCESS
processes but the correct reflow
profile is key to ensure acceptable solder joints without damaging the parts or
assembly due to excessive heat. When using lead-free solder, a carefully
profiled assembly is even more important as the required reflow temperature
can often be very close to many components maximum rated temperature.
The hard part is the baking that follows. While there are several possible
techniques, the board must be precisely raised to temperatures in excess of
200 degrees, to properly melt the solder. Much like when cooking dinner, too
little or too much heat can quickly ruin the project.
Modern manufacturers utilizing surface mounted technology use all-in-one
devices called Reflow Soldering Ovens to ensure proper circuit boards. These
marvels of engineering can automatically handle the heating and cooling of
each circuit board, sending it through a series of internal chambers for
treatment.

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The Zones of a Reflow Soldering Oven

1 - Preheating

The first and lengthiest stage is the pre-heating of the circuit, which requires
bringing it up to a given temperature slowly. The heat distribution must be
uniform, or the board could warp. This stage can last several minutes, as the
temperature is only raised by about 3-5 degrees Fahrenheit per second.

2 - Thermal Soak

Having reached the desired pre-heating point, the board passes to the second
chamber for a thermal soak at that temperature, for 60-120 seconds. This
ensures even heat distribution, as well as activating chemicals in the solder
paste that prevent the solder from turning into microbeads, which it otherwise
would.

Once the thermal soak is finished and the piece moves on, the board should
be at thermal equilibrium.

3 - Reflow

The heart of the reflow soldering process happens here, where the circuit
board is rapidly heated to maximum temperatures to fully melt the solder and
bond it to the circuit board. Several heating methods can be used here,
although conventional convection baking is still the most common.

Timing is crucial here, as the solder must melt fully without having time to
flow off the board or start vaporizing. This process generally takes 30-40
seconds.

4 - Cooling

The fourth chamber quickly cools the board, down to temperatures of 86

Degrees Fahrenheit. The cooling is more rapid than the heating, as fast

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cooling encourages the solder to form into a crystalline structure which creates
a superior bond to the underlying board.

5 - Washing

Not all manufacturing centers include a washing process, but they should - it's
now commonly accepted by standards agencies such as the IPC. Most forms
of solder paste leave a chemical residue, even those considered "no
clean." Additionally, microscopic grit could have made its way onto the board
during the manufacturing process.

So, the final step is washing the finished circuit, usually with simple deionized
water and a mild detergent followed by air-drying. In some cases, special
solvents may be used.

After this the PCB is unloaded by Samsung PCB unloader.

SMT CREATES SUPERIOR CIRCUIT BOARDS

The result of all this is a finished SMT circuit board which is smaller, more
efficient, and more resistant to vibrations than older through-hole circuit
boards. Precision computer-controlled reflow ovens guarantee superior final
products, again and again.

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REFRENCES
 https://smtnet.com/news/index.cfm?fuseaction=view_news&
news_id=10710&company_id=44056
 http://info.zentech.com/blog/the-five-stages-of-smt-reflow-
ovens
 https://www.electronics-
notes.com/articles/electronic_components/surface-mount-
technology-smd-smt/packages.php
 https://en.wikipedia.org/wiki/Solder_paste
 http://www.electronicsandyou.com/blog/solder-paste-and-its-
application-in-smt.html
 http://www.123seminarsonly.com/EC/Surface-Mount-
Technology.html
 https://www.ourpcb.com/surface-mount.html
 https://en.wikipedia.org/wiki/Surface-mount_technology

The End

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