SMp

Expanded Form
DIALECT

SMD Surface Mount Devices (active, passive and electromechanical components)

SMT Surface Mount Technology (assembling and montage technology)

SMA Surface Mount Assembly (module assembled with SMT)

SMC Surface Mount Components (components for SMT)

SMP Surface Mount Packages (SMD case forms)

SME Surface Mount Equipment (SMT assembling machines)

SO Small Outline (4 to 28 pins)

VSO Very Small Outline (40 pins)

SOP Small Outline Package (case)

SOD Small Outline Diode

SOT Small Outline Transistor

SOIC Small Outline Integrated Circuit

CC Chip Carrier

LCC Leadless Chip Carrier

PLCC Plastic Leadless Chip Carrier

LCCC Leadless Ceramic Chip Carrier

MELF Metal Electrode Face Bonding

MINI MELF Mini Metal Electrode Face Bonding

MICRO MELF Micro Metal Electrode Face Bonding

Main advantages
The main advantages of SMT over the older through-hole technique are:

 Smaller components. Smallest is currently 0.4 x 0.2 mm. (.01" x .005" - 01005)
 Much higher number of components and many more connections per component.
 Fewer holes need to be drilled through abrasive boards.
 Simpler automated assembly.
 Small errors in component placement are corrected automatically (the surface tension of the
molten solder pulls the component into alignment with the solder pads).
 Components can be placed on both sides of the circuit board.
 Lower resistance and inductance at the connection (leading to better performance for high
frequency parts).
 Better mechanical performance under shake and vibration conditions.
 SMT parts generally cost less than through-hole parts.
 Fewer unwanted RF signal effects in SMT parts when compared to leaded parts, yielding better
predictability of component characteristics.
 Faster assembly. Some placement machines are capable of placing more than 136,000
components per hour.
Main disadvantages

 The manufacturing processes for SMT are much more sophisticated than through-hole boards,
raising the initial cost and time of setting up for production.
 Manual prototype assembly or component-level repair is more difficult (more so without a steady
hand and the right tools) given the very small sizes and lead spacings of many SMDs.
 SMDs can't be used directly with breadboards (a quick snap-and-play prototyping tool), requiring
a either a custom PCB for every prototype or the mounting of the SMD upon a pin-leaded carrier. For
prototyping around a specific SMD component, a less-expensivebreakout board may be used.
Additionally, stripboard style protoboards can be used, some of which include pads for standard sized
SMD comportments.
 SMDs' solder connections may be damaged by potting compounds going through thermal
cycling.
Two-terminal packages

 Rectangular passive components (mostly resistors and capacitors):

 01005 (0402 metric) : 0.016" × 0.008" (0.4 mm × 0.2 mm) Typical power rating for
resistors 1/32 watt
2512 (6332 metric) : 0.25" × 0.12" (6.35 mm × 3.0 mm) Typical power rating for resistors 1 watt

Tantalum capacitors [2]:

 EIA 3216-12 (Kemet S, AVX S): 3.2 mm × 1.6 mm × 1.2 mm

 EIA 3216-18 (Kemet A, AVX A): 3.2 mm × 1.6 mm × 1.8 mm
Aluminium capacitors [3] [4] [5]:

 (Panasonic/CDE A, Chemi-Con B): 3.3 mm × 3.3 mm

 (Panasonic B, Chemi-Con D): 4.3 mm × 4.3 mm
Three terminal packages

 SOT: small-outline transistor, with three terminals

 SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body - four terminals, one of which is a large heat-
transfer pad[8]
Five and six terminal packages

 SOT: small-outline transistor, with more than three terminals

 SOT-23-5: 2.9 mm × 1.3/1.75 mm × 1.3 mm body - five terminals [18]
Packages with higher terminal count (drawings of most of the following packages can be found
on  [23])

 Dual-in-line
 Small-outline integrated circuit (SOIC) - small-outline integrated circuit, dual-in-line, 8 or
more pins, gull-wing lead form, pin spacing 1.27 mm
 J-Leaded Small Outline Package (SOJ) - the same as SOIC except J-leaded [24]