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SPD08P06P

Preliminary data SPU08P06P

SIPMOS  Power-Transistor
Features Product Summary
· P-Channel Drain source voltage VDS -60 V
· Enhancement mode Drain-source on-state resistance RDS(on) 0.3 W

· Avalanche rated
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Continuous drain current ID -8.8 A
· dv/dt rated
· 175°C operating temperature

Type Package Ordering Code Pin 1 PIN 2/4 PIN 3


SPD08P06P P-TO252 Q67040-S4153 G D S
SPU08P06P P-TO251-3-1 Q67040-S4154

Maximum Ratings,at T j = 25 °C, unless otherwise specified


Parameter Symbol Value Unit
Continuous drain current ID A
T C = 25 °C -8.8
T C = 100 °C -6.2
Pulsed drain current ID puls -35.2
T C = 25 °C
Avalanche energy, single pulse EAS 70 mJ
I D = -8.8 A , VDD = -25 V, R GS = 25 W
Avalanche energy, periodic limited by Tjmax EAR 4.2
Reverse diode dv/dt dv/dt 6 kV/µs
I S = -8.8 A, V DS = -48 , di/dt = 200 A/µs,
T jmax = 175 °C
Gate source voltage VGS ±20 V
Power dissipation Ptot 42 W
T C = 25 °C
Operating and storage temperature Tj , Tstg -55...+175 °C
IEC climatic category; DIN IEC 68-1 55/175/56

Page 1 1999-11-22
SPD08P06P
Preliminary data SPU08P06P
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - case RthJC - - 3.6 K/W
Thermal
www.DataSheet4U.com resistance, junction - ambient, leaded RthJA - - 100
SMD version, device on PCB: RthJA
@ min. footprint - - 75
@ 6 cm 2 cooling area 1) - - 50

Electrical Characteristics, at T j = 25 °C, unless otherwise specified


Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain- source breakdown voltage V(BR)DSS -60 - - V
VGS = 0 V, I D = -250 µA
Gate threshold voltage, VGS = VDS VGS(th) -2.1 -3 -4
I D = -250 µA, Tj = 25 °C
Zero gate voltage drain current IDSS µA
VDS = -60 V, V GS = 0 V, T j = 25 °C - -0.1 -1
VDS = -60 V, V GS = 0 V, T j = 150 °C - -10 -100
Gate-source leakage current IGSS - -10 -100 nA
VGS = -20 V, VDS = 0 V
Drain-source on-state resistance RDS(on) - 0.23 0.3 W

VGS = -10 V, I D = -6.2 A

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2 1999-11-22
SPD08P06P
Preliminary data SPU08P06P

Electrical Characteristics, at T j = 25 °C, unless otherwise specified


Parameter Symbol Values Unit
min. typ. max.

Dynamic Characteristics
Transconductance gfs 1.5 3.6 - S
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VDS³2*I D*RDS(on)max , ID = -6.2 A
Input capacitance Ciss - 335 420 pF
VGS = 0 V, V DS = -25 V, f = 1 MHz
Output capacitance Coss - 105 135
VGS = 0 V, V DS = -25 V, f = 1 MHz
Reverse transfer capacitance Crss - 65 95
VGS = 0 V, V DS = -25 V, f = 1 MHz
Turn-on delay time td(on) - 16 24 ns
VDD = -30 V, V GS = -10 V, ID = -6.2 A,
RG = 6 W
Rise time tr - 46 69
VDD = -30 V, V GS = -10 V, ID = -6.2 A,
RG = 6 W
Turn-off delay time td(off) - 48 72
VDD = -30 V, V GS = -10 V, ID = -6.2 A,
RG = 6 W
Fall time tf - 14 21
VDD = -30 V, V GS = -10 V, ID = -6.2 A,
RG = 6 W

Page 3 1999-11-22
SPD08P06P
Preliminary data SPU08P06P

Electrical Characteristics, at T j = 25 °C, unless otherwise specified


Parameter Symbol Values Unit
min. typ. max.

Dynamic Characteristics
Gate to source charge Qgs - 1.4 2.1 nC
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VDD = -48 , ID = -8.8 A
Gate to drain charge Qgd - 4 6
VDD = -48 V, ID = -8.8 A
Gate charge total Qg - 10 15
VDD = -48 V, ID = -8.8 A, VGS = 0 to -10 V
Gate plateau voltage V(plateau) - -3.85 - V
VDD = -48 , I D = -8.8 A

Parameter Symbol Values Unit


min. typ. max.
Reverse Diode
Inverse diode continuous forward current IS - - -8.8 A
T C = 25 °C
Inverse diode direct current,pulsed ISM - - -35.2
T C = 25 °C
Inverse diode forward voltage VSD - -1.17 -1.55 V
VGS = 0 V, I F = -8.8 A
Reverse recovery time trr - 60 90 ns
VR = -30 V, IF=I S , di F/dt = 100 A/µs
Reverse recovery charge Qrr - 100 150 nC
VR = -30 V, IF=l S , diF/dt = 100 A/µs

Page 4 1999-11-22
SPD08P06P
Preliminary data SPU08P06P
Power dissipation Drain current
Ptot = f (TC) ID = f (TC )
parameter: VGS ³ 10 V
SPD08P06P SPD08P06P
50 -10

W A

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40 -8

35 -7
Ptot

ID
30 -6

25 -5

20 -4

15 -3

10 -2

5 -1

0 0
0 20 40 60 80 100 120 140 160 °C 190 0 20 40 60 80 100 120 140 160 °C 190
TC TC

Safe operating area Transient thermal impedance


I D = f ( VDS ) ZthJC = f (tp )
parameter : D = 0 , T C = 25 °C parameter : D = tp /T
SPD08P06P SPD08P06P
-10 2
10 1

K/W
tp = 12.0µs
A
10 0
Z thJC

-10 1
100 µs
ID

10 -1
D
/I
DS
V

D = 0.50
=

1 ms -2
)

0.20
on

10
(
DS
R

0 0.10
-10 10 ms
0.05
DC single pulse
0.02
10 -3
0.01

-10 -1 -1 0 1 2
10 -4 -7 -6 -5 -4 -3 -2 0
-10 -10 -10 V -10 10 10 10 10 10 10 s 10
VDS tp

Page 5 1999-11-22
SPD08P06P
Preliminary data SPU08P06P
Typ. output characteristic Typ. drain-source-on-resistance
I D = f (VDS); T j=25°C RDS(on) = f (ID )
parameter: tp = 80 µs parameter: VGS
SPD08P06P SPD08P06P
-21 Ptot = 42.00W 1.0
A W a b c d e f g h
j i VGS [V]
-18
a -4.0
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b -4.5
0.8
-16 h c -5.0

RDS(on)
d -5.5 0.7
-14
g e -6.0
ID

f -6.5 0.6
-12
f g -7.0
h -7.5 0.5
-10
i -8.0
e
j -10.0 0.4
-8
d
-6 0.3
c
-4 0.2
b VGS [V] =
-2 0.1 a b c d e f g h i j i
a j
-4.0 -4.5 -5.0 -5.5 -6.0 -6.5 -7.0 -7.5 -8.0 -10.0

0 0.0
0 -2 -4 -6 -8 V -11 0 -2 -4 -6 -8 -10 -12 -14 A -18
VDS ID

Typ. transfer characteristics I D= f ( V GS ) Typ. forward transconductance


VDS³ 2 x I D x RDS(on)max gfs = f(ID); Tj=25°C
parameter: tp = 80 µs parameter: gfs
-30 6
A

S
-24
-22
-20 4
gfs
ID

-18
-16
3
-14
-12
-10 2
-8
-6
1
-4
-2
0 0
0 -1 -2 -3 -4 -5 -6 -7 -8 V -10 0 -2 -4 -6 -8 -10 -12 -14 -16 A -20
VGS ID

Page 6 1999-11-22
SPD08P06P
Preliminary data SPU08P06P
Drain-source on-state resistance Gate threshold voltage
RDS(on) = f (Tj) VGS(th) = f (Tj)
parameter : I D = -6.2 A, V GS = -10 V parameter: VGS = VDS , ID = -250 µA
SPD08P06P
1.0 -5.0

W V
98%
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0.8 -4.0
RDS(on)

V GS(th)
0.7 -3.5

typ
0.6 -3.0

0.5 -2.5
2%
98%
0.4 -2.0

typ
0.3 -1.5

0.2 -1.0

0.1 -0.5

0.0 0.0
-60 -20 20 60 100 140 °C 200 -60 -20 20 60 100 °C 180
Tj Tj

Typ. capacitances Forward characteristics of reverse diode


C = f (VDS) IF = f (VSD )
parameter: VGS=0V, f=1 MHz parameter: Tj , tp = 80 µs
SPD08P06P
3
10 -10 2

pF Ciss

-10 1
IF
C

10 2
Coss

Crss
-10 0
Tj = 25 °C typ
Tj = 175 °C typ
Tj = 25 °C (98%)
Tj = 175 °C (98%)

10 1 -10 -1
0 -5 -10 -15 -20 -25 -30 V -40 0.0 -0.4 -0.8 -1.2 -1.6 -2.0 -2.4 V -3.0
VDS VSD

Page 7 1999-11-22
SPD08P06P
Preliminary data SPU08P06P
Avalanche energy Typ. gate charge
EAS = f (Tj) VGS = f (QGate )
para.: I D = -8.8 A , VDD = -25 V, R GS = 25 W parameter: ID = -8.8 A pulsed
SPD08P06P
80 -16

mJ V
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60 -12
E AS

VGS
50 -10

40 -8
0,2 VDS max 0,8 VDS max

30 -6

20 -4

10 -2

0 0
25 45 65 85 105 125 145 °C 185 0 2 4 6 8 10 12 nC 15
Tj QGate

Drain-source breakdown voltage


V(BR)DSS = f (Tj)

SPD08P06P

-72

-68
V(BR)DSS

-66

-64

-62

-60

-58

-56

-54
-60 -20 20 60 100 140 °C 200
Tj

Page 8 1999-11-22
SPD08P06P
Preliminary data SPU08P06P

Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.

Attention please!
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The information herein is given to describe certain components and shall not be considered as warranted
characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

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For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).

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Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
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of the user or other persons may be endangered.

Page 9 1999-11-22

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